AU2001232341A1 - Iii nitride compound semiconductor element and electrode forming method - Google Patents
Iii nitride compound semiconductor element and electrode forming methodInfo
- Publication number
- AU2001232341A1 AU2001232341A1 AU2001232341A AU3234101A AU2001232341A1 AU 2001232341 A1 AU2001232341 A1 AU 2001232341A1 AU 2001232341 A AU2001232341 A AU 2001232341A AU 3234101 A AU3234101 A AU 3234101A AU 2001232341 A1 AU2001232341 A1 AU 2001232341A1
- Authority
- AU
- Australia
- Prior art keywords
- semiconductor element
- forming method
- compound semiconductor
- iii nitride
- electrode forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
-
- H10D64/0116—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H10P95/50—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0213—Sapphire, quartz or diamond based substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-85932 | 2000-03-27 | ||
| JP2000085932A JP3846150B2 (en) | 2000-03-27 | 2000-03-27 | Group III nitride compound semiconductor device and electrode forming method |
| PCT/JP2001/001178 WO2001073829A1 (en) | 2000-03-27 | 2001-02-19 | Iii nitride compound semiconductor element and electrode forming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001232341A1 true AU2001232341A1 (en) | 2001-10-08 |
Family
ID=18602177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001232341A Abandoned AU2001232341A1 (en) | 2000-03-27 | 2001-02-19 | Iii nitride compound semiconductor element and electrode forming method |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6806571B2 (en) |
| JP (1) | JP3846150B2 (en) |
| AU (1) | AU2001232341A1 (en) |
| WO (1) | WO2001073829A1 (en) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3778765B2 (en) * | 2000-03-24 | 2006-05-24 | 三洋電機株式会社 | Nitride-based semiconductor device and manufacturing method thereof |
| US7928424B2 (en) * | 2004-03-11 | 2011-04-19 | Epistar Corporation | Nitride-based light-emitting device |
| US9524869B2 (en) | 2004-03-11 | 2016-12-20 | Epistar Corporation | Nitride-based semiconductor light-emitting device |
| US8562738B2 (en) | 2004-03-11 | 2013-10-22 | Epistar Corporation | Nitride-based light-emitting device |
| TWI249255B (en) * | 2004-04-07 | 2006-02-11 | Epitech Corp Ltd | Nitride light-emitting diode and mthod for manufacturing the same |
| JP5015417B2 (en) * | 2004-06-09 | 2012-08-29 | 住友電気工業株式会社 | GaN crystal manufacturing method |
| JP4841844B2 (en) | 2005-01-05 | 2011-12-21 | 三菱電機株式会社 | Semiconductor element |
| JP4925601B2 (en) * | 2005-04-18 | 2012-05-09 | 三菱電機株式会社 | Semiconductor device |
| DE102005041643A1 (en) * | 2005-08-29 | 2007-03-01 | Forschungsverbund Berlin E.V. | Semiconductor method for producing an isolated semiconductor substrate uses a masking layer with holes and an output layer |
| JP2007134388A (en) * | 2005-11-08 | 2007-05-31 | Sharp Corp | Nitride-based semiconductor device and manufacturing method thereof |
| JP4738999B2 (en) * | 2005-12-06 | 2011-08-03 | 豊田合成株式会社 | Semiconductor optical device manufacturing method |
| US7772604B2 (en) | 2006-01-05 | 2010-08-10 | Illumitex | Separate optical device for directing light from an LED |
| JP5068020B2 (en) * | 2006-02-20 | 2012-11-07 | シャープ株式会社 | Manufacturing method of nitride semiconductor light emitting device |
| JP5047508B2 (en) * | 2006-02-27 | 2012-10-10 | シャープ株式会社 | Manufacturing method of nitride semiconductor light emitting device |
| US20070240631A1 (en) * | 2006-04-14 | 2007-10-18 | Applied Materials, Inc. | Epitaxial growth of compound nitride semiconductor structures |
| WO2008042351A2 (en) | 2006-10-02 | 2008-04-10 | Illumitex, Inc. | Led system and method |
| JP2010507262A (en) * | 2006-10-18 | 2010-03-04 | ナイテック インコーポレイテッド | Vertical deep ultraviolet light emitting diode |
| KR20100122485A (en) | 2008-02-08 | 2010-11-22 | 일루미텍스, 인크. | System and method for emitter layer shaping |
| KR101515100B1 (en) * | 2008-10-21 | 2015-04-24 | 삼성전자주식회사 | Light emitting diode and method for manufacturing the same |
| TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
| JP4886766B2 (en) * | 2008-12-25 | 2012-02-29 | 株式会社東芝 | Semiconductor light emitting device |
| US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
| US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
| JP5526712B2 (en) * | 2009-11-05 | 2014-06-18 | 豊田合成株式会社 | Semiconductor light emitting device |
| JP5437114B2 (en) * | 2010-03-02 | 2014-03-12 | 次世代パワーデバイス技術研究組合 | Manufacturing method of semiconductor transistor |
| FR2972563B1 (en) * | 2011-03-07 | 2013-03-01 | Altis Semiconductor Snc | METHOD FOR TREATING AN OXIDIZED METAL NITRIDE LAYER |
| JP5928366B2 (en) * | 2013-02-13 | 2016-06-01 | 豊田合成株式会社 | Method for producing group III nitride semiconductor |
| TWI577046B (en) * | 2014-12-23 | 2017-04-01 | 錼創科技股份有限公司 | Semiconductor light emitting element and manufacturing method thereof |
| CN113471060B (en) * | 2021-05-27 | 2022-09-09 | 南昌大学 | A kind of preparation method of reducing AlN thin film micro-voids on silicon substrate |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5164850A (en) * | 1990-01-29 | 1992-11-17 | Sanyo Electric Co., Ltd. | Liquid crystal device including tantalum nitride with specific nitriding ratio |
| JP2803742B2 (en) | 1993-04-28 | 1998-09-24 | 日亜化学工業株式会社 | Gallium nitride-based compound semiconductor light emitting device and method for forming electrode thereof |
| DE69433926T2 (en) | 1993-04-28 | 2005-07-21 | Nichia Corp., Anan | A semiconductor device of a gallium nitride III-V semiconductor compound |
| JPH0832115A (en) * | 1994-07-19 | 1996-02-02 | Sharp Corp | Electrode structure and manufacturing method thereof |
| JPH10247747A (en) * | 1997-03-05 | 1998-09-14 | Toshiba Corp | Semiconductor light emitting device and method of manufacturing the same |
| JPH10321954A (en) | 1997-05-15 | 1998-12-04 | Fuji Electric Co Ltd | Group III nitride semiconductor device and method of manufacturing the same |
| TW501160B (en) * | 1998-05-08 | 2002-09-01 | Samsung Electronics Co Ltd | Method of activating compound semiconductor layer to p-type compound semiconductor layer |
| JPH11330546A (en) * | 1998-05-12 | 1999-11-30 | Fuji Electric Co Ltd | Group III nitride semiconductor and method of manufacturing the same |
-
2000
- 2000-03-27 JP JP2000085932A patent/JP3846150B2/en not_active Expired - Fee Related
-
2001
- 2001-02-19 US US10/239,895 patent/US6806571B2/en not_active Expired - Lifetime
- 2001-02-19 WO PCT/JP2001/001178 patent/WO2001073829A1/en not_active Ceased
- 2001-02-19 AU AU2001232341A patent/AU2001232341A1/en not_active Abandoned
-
2004
- 2004-06-04 US US10/860,035 patent/US7018915B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP3846150B2 (en) | 2006-11-15 |
| JP2001274459A (en) | 2001-10-05 |
| US7018915B2 (en) | 2006-03-28 |
| US20040222499A1 (en) | 2004-11-11 |
| US6806571B2 (en) | 2004-10-19 |
| US20030155575A1 (en) | 2003-08-21 |
| WO2001073829A1 (en) | 2001-10-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU2001232341A1 (en) | Iii nitride compound semiconductor element and electrode forming method | |
| AU2001244643A1 (en) | Production method of iii nitride compound semiconductor and iii nitride compoundsemiconductor element | |
| AU2001241108A1 (en) | Production method of iii nitride compound semiconductor and iii nitride compoundsemiconductor element | |
| AU2001234169A1 (en) | Group iii nitride compound semiconductor and method for manufacturing the same | |
| AU2001248803A1 (en) | Method of manufacturing group-iii nitride compound semiconductor device | |
| AU2002222970A1 (en) | Group iii nitride compound semiconductor device | |
| AU2002217545A1 (en) | Semiconductor device and its manufacturing method | |
| AU2001236076A1 (en) | Production method of iii nitride compound semiconductor substrate and semiconductor device | |
| AU2002221142A1 (en) | Semiconductor photocathode | |
| AU2001236820A1 (en) | Semiconductor structure | |
| EP1361614B8 (en) | Semiconductor device manufacturing method | |
| AU2002363469A1 (en) | Sintered polycrystalline gallium nitride | |
| AU2002354254A1 (en) | Method for making nitride semiconductor substrate and method for making nitride semiconductor device | |
| AU2637801A (en) | Methods of forming semiconductor structures | |
| AU2001224025A1 (en) | Group iii nitride compound semiconductor light-emitting device and method for producing the same | |
| EP1202350A3 (en) | Semiconductor device and manufacturing method thereof | |
| AU2001294188A1 (en) | Device and method for manufacturing semiconductor | |
| AU4875601A (en) | Polishing compound for polishing semiconductor device and method for manufacturing semiconductor device using the same | |
| AU2003257718A1 (en) | Nitride semiconductor and fabrication method thereof | |
| EP1249904A3 (en) | Group III nitride compound semiconductor laser and manufacturing method thereof | |
| EP1174914A3 (en) | Semiconductor device and semiconductor device manufacturing method | |
| AU2001257346A1 (en) | Semiconductor device and method for manufacturing the same | |
| AU2001236109A1 (en) | Iii nitride compound semiconductor device | |
| AU2002215217A1 (en) | Semiconductor photocathode | |
| AU6035000A (en) | Semiconductor and manufacturing method for semiconductor |