AU2001234169A1 - Group iii nitride compound semiconductor and method for manufacturing the same - Google Patents
Group iii nitride compound semiconductor and method for manufacturing the sameInfo
- Publication number
- AU2001234169A1 AU2001234169A1 AU2001234169A AU3416901A AU2001234169A1 AU 2001234169 A1 AU2001234169 A1 AU 2001234169A1 AU 2001234169 A AU2001234169 A AU 2001234169A AU 3416901 A AU3416901 A AU 3416901A AU 2001234169 A1 AU2001234169 A1 AU 2001234169A1
- Authority
- AU
- Australia
- Prior art keywords
- manufacturing
- same
- compound semiconductor
- group iii
- iii nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H10P14/24—
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- H10P14/271—
-
- H10P14/276—
-
- H10P14/278—
-
- H10P14/2921—
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- H10P14/3216—
-
- H10P14/3416—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/12—Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0213—Sapphire, quartz or diamond based substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/8215—Bodies characterised by crystalline imperfections, e.g. dislocations; characterised by the distribution of dopants, e.g. delta-doping
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000071350A JP2001267242A (en) | 2000-03-14 | 2000-03-14 | Group III nitride compound semiconductor and method of manufacturing the same |
| JP2000-71350 | 2000-03-14 | ||
| PCT/JP2001/001396 WO2001069662A1 (en) | 2000-03-14 | 2001-02-23 | Group iii nitride compound semiconductor and method for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001234169A1 true AU2001234169A1 (en) | 2001-09-24 |
Family
ID=18589947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001234169A Abandoned AU2001234169A1 (en) | 2000-03-14 | 2001-02-23 | Group iii nitride compound semiconductor and method for manufacturing the same |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6967122B2 (en) |
| EP (1) | EP1265272A4 (en) |
| JP (1) | JP2001267242A (en) |
| KR (2) | KR100623564B1 (en) |
| CN (2) | CN100461340C (en) |
| AU (1) | AU2001234169A1 (en) |
| WO (1) | WO2001069662A1 (en) |
Families Citing this family (114)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002008985A (en) * | 2000-06-21 | 2002-01-11 | Nichia Chem Ind Ltd | Method for manufacturing nitride semiconductor and nitride semiconductor substrate |
| JP3556916B2 (en) * | 2000-09-18 | 2004-08-25 | 三菱電線工業株式会社 | Manufacturing method of semiconductor substrate |
| JP4092927B2 (en) * | 2002-02-28 | 2008-05-28 | 豊田合成株式会社 | Group III nitride compound semiconductor, group III nitride compound semiconductor element, and method for manufacturing group III nitride compound semiconductor substrate |
| US7008839B2 (en) | 2002-03-08 | 2006-03-07 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing semiconductor thin film |
| KR100461238B1 (en) * | 2002-03-09 | 2004-12-14 | 엘지전자 주식회사 | Method for forming GaN epitaxy layer |
| JP3968566B2 (en) * | 2002-03-26 | 2007-08-29 | 日立電線株式会社 | Nitride semiconductor crystal manufacturing method, nitride semiconductor wafer, and nitride semiconductor device |
| US20030189215A1 (en) * | 2002-04-09 | 2003-10-09 | Jong-Lam Lee | Method of fabricating vertical structure leds |
| US8294172B2 (en) | 2002-04-09 | 2012-10-23 | Lg Electronics Inc. | Method of fabricating vertical devices using a metal support film |
| US6841802B2 (en) | 2002-06-26 | 2005-01-11 | Oriol, Inc. | Thin film light emitting diode |
| JP2004153090A (en) | 2002-10-31 | 2004-05-27 | Toyoda Gosei Co Ltd | Group III nitride compound semiconductor light emitting device and method of manufacturing the same |
| JP2004153089A (en) | 2002-10-31 | 2004-05-27 | Toyoda Gosei Co Ltd | Group III nitride compound semiconductor light emitting device and method of manufacturing the same |
| JP4211358B2 (en) * | 2002-11-01 | 2009-01-21 | 日亜化学工業株式会社 | Nitride semiconductor, nitride semiconductor device and manufacturing method thereof |
| US7524691B2 (en) * | 2003-01-20 | 2009-04-28 | Panasonic Corporation | Method of manufacturing group III nitride substrate |
| KR100504180B1 (en) * | 2003-01-29 | 2005-07-28 | 엘지전자 주식회사 | crystal growth method of nitride compound semiconductor |
| US7276423B2 (en) * | 2003-12-05 | 2007-10-02 | International Rectifier Corporation | III-nitride device and method with variable epitaxial growth direction |
| JP4540347B2 (en) * | 2004-01-05 | 2010-09-08 | シャープ株式会社 | Nitride semiconductor laser device and manufacturing method thereof |
| EP1571241A1 (en) * | 2004-03-01 | 2005-09-07 | S.O.I.T.E.C. Silicon on Insulator Technologies | Method of manufacturing a wafer |
| US7928424B2 (en) * | 2004-03-11 | 2011-04-19 | Epistar Corporation | Nitride-based light-emitting device |
| US9524869B2 (en) | 2004-03-11 | 2016-12-20 | Epistar Corporation | Nitride-based semiconductor light-emitting device |
| US8562738B2 (en) | 2004-03-11 | 2013-10-22 | Epistar Corporation | Nitride-based light-emitting device |
| JP2005322786A (en) * | 2004-05-10 | 2005-11-17 | Sharp Corp | Nitride semiconductor device and manufacturing method thereof |
| US7157297B2 (en) * | 2004-05-10 | 2007-01-02 | Sharp Kabushiki Kaisha | Method for fabrication of semiconductor device |
| JP4651312B2 (en) * | 2004-06-10 | 2011-03-16 | シャープ株式会社 | Manufacturing method of semiconductor device |
| US20060017064A1 (en) * | 2004-07-26 | 2006-01-26 | Saxler Adam W | Nitride-based transistors having laterally grown active region and methods of fabricating same |
| KR100638609B1 (en) | 2004-08-04 | 2006-10-26 | 삼성전기주식회사 | Nitride semiconductor crystal growth method and nitride semiconductor device manufacturing method |
| CN100365767C (en) * | 2004-09-17 | 2008-01-30 | 同济大学 | A substrate processing method for improving the quality of gallium nitride-based epitaxial layer |
| US7633097B2 (en) * | 2004-09-23 | 2009-12-15 | Philips Lumileds Lighting Company, Llc | Growth of III-nitride light emitting devices on textured substrates |
| KR100580751B1 (en) * | 2004-12-23 | 2006-05-15 | 엘지이노텍 주식회사 | Nitride semiconductor light emitting device and manufacturing method |
| CN100435360C (en) * | 2004-12-27 | 2008-11-19 | 北京大学 | Preparation method of LED chip with two-dimensional natural light-scattering surface |
| US10374120B2 (en) * | 2005-02-18 | 2019-08-06 | Koninklijke Philips N.V. | High efficiency solar cells utilizing wafer bonding and layer transfer to integrate non-lattice matched materials |
| US20080035052A1 (en) * | 2005-02-23 | 2008-02-14 | Genesis Photonics Inc. | Method for manufacturing a semiconductor substrate |
| CN1697205A (en) * | 2005-04-15 | 2005-11-16 | 南昌大学 | Method for preparing film of indium-gallium-aluminum-nitrogen on silicon substrate and light emitting device |
| JP5364368B2 (en) | 2005-04-21 | 2013-12-11 | エイオーネックス・テクノロジーズ・インコーポレイテッド | Substrate manufacturing method |
| US20060270201A1 (en) * | 2005-05-13 | 2006-11-30 | Chua Soo J | Nano-air-bridged lateral overgrowth of GaN semiconductor layer |
| CN100372137C (en) * | 2005-05-27 | 2008-02-27 | 晶能光电(江西)有限公司 | InGaAlN light-emitting device with upper and lower electrode structure and manufacturing method thereof |
| JP5015440B2 (en) * | 2005-09-29 | 2012-08-29 | 株式会社デンソー | Manufacturing method of semiconductor substrate |
| US20090233414A1 (en) * | 2005-10-20 | 2009-09-17 | Shah Pankaj B | Method for fabricating group III-nitride high electron mobility transistors (HEMTs) |
| CN100474642C (en) * | 2005-10-27 | 2009-04-01 | 晶能光电(江西)有限公司 | Indium gallium aluminium nitrogen semi-conductor luminous element containing metallic chromium substrate and manufacturing method thereof |
| JP2007161525A (en) * | 2005-12-14 | 2007-06-28 | Univ Of Tokushima | Substrate for semiconductor device and method for manufacturing the same |
| JP5187610B2 (en) * | 2006-03-29 | 2013-04-24 | スタンレー電気株式会社 | Nitride semiconductor wafer or nitride semiconductor device and manufacturing method thereof |
| JP4637781B2 (en) * | 2006-03-31 | 2011-02-23 | 昭和電工株式会社 | GaN-based semiconductor light emitting device manufacturing method |
| US20070243703A1 (en) * | 2006-04-14 | 2007-10-18 | Aonex Technololgies, Inc. | Processes and structures for epitaxial growth on laminate substrates |
| KR101038069B1 (en) | 2006-04-25 | 2011-06-01 | 내셔널 유니버시티 오브 싱가포르 | Method of zinc oxide film grown on epitaxial lateral overgrowth gallium nitride template |
| JP5076656B2 (en) * | 2006-06-19 | 2012-11-21 | 日亜化学工業株式会社 | Nitride semiconductor laser device |
| WO2008073414A1 (en) * | 2006-12-12 | 2008-06-19 | The Regents Of The University Of California | Crystal growth of m-plane and semipolar planes of(ai, in, ga, b)n on various substrates |
| US20080149946A1 (en) * | 2006-12-22 | 2008-06-26 | Philips Lumileds Lighting Company, Llc | Semiconductor Light Emitting Device Configured To Emit Multiple Wavelengths Of Light |
| US7663148B2 (en) * | 2006-12-22 | 2010-02-16 | Philips Lumileds Lighting Company, Llc | III-nitride light emitting device with reduced strain light emitting layer |
| KR101008287B1 (en) * | 2006-12-30 | 2011-01-13 | 주식회사 에피밸리 | Group III nitride semiconductor light emitting device |
| US7732301B1 (en) | 2007-04-20 | 2010-06-08 | Pinnington Thomas Henry | Bonded intermediate substrate and method of making same |
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| KR101459754B1 (en) * | 2007-09-06 | 2014-11-13 | 엘지이노텍 주식회사 | Semiconductor light emitting device and manufacturing method thereof |
| TW200929602A (en) * | 2007-12-28 | 2009-07-01 | Advanced Optoelectronic Tech | Light-emitting device of III-nitride based semiconductor and manufacturing method thereof |
| JP5353113B2 (en) * | 2008-01-29 | 2013-11-27 | 豊田合成株式会社 | Method for producing group III nitride compound semiconductor |
| JP5167974B2 (en) * | 2008-06-16 | 2013-03-21 | 豊田合成株式会社 | Group III nitride compound semiconductor light emitting device and method of manufacturing the same |
| TWI413279B (en) * | 2008-06-20 | 2013-10-21 | 豐田合成股份有限公司 | Group III nitride semiconductor light-emitting device, method of manufacturing the same, and lamp |
| JP2010040867A (en) * | 2008-08-06 | 2010-02-18 | Showa Denko Kk | Group iii nitride semiconductor laminated structure and method of manufacturing same |
| CN101853808B (en) | 2008-08-11 | 2014-01-29 | 台湾积体电路制造股份有限公司 | Method of Forming Circuit Structure |
| US8803189B2 (en) * | 2008-08-11 | 2014-08-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | III-V compound semiconductor epitaxy using lateral overgrowth |
| US8680581B2 (en) | 2008-12-26 | 2014-03-25 | Toyoda Gosei Co., Ltd. | Method for producing group III nitride semiconductor and template substrate |
| JP5293592B2 (en) * | 2008-12-26 | 2013-09-18 | 豊田合成株式会社 | Group III nitride semiconductor manufacturing method and template substrate |
| JP5293591B2 (en) * | 2008-12-26 | 2013-09-18 | 豊田合成株式会社 | Group III nitride semiconductor manufacturing method and template substrate |
| CN101840971B (en) * | 2009-03-17 | 2012-09-05 | 展晶科技(深圳)有限公司 | Light-emitting diode and manufacturing method thereof |
| EP2439316A4 (en) * | 2009-06-01 | 2014-01-29 | Mitsubishi Chem Corp | SEMICONDUCTOR NITRIDE CRYSTAL AND METHOD FOR MANUFACTURING THE SAME |
| WO2010147357A2 (en) * | 2009-06-15 | 2010-12-23 | 전자부품연구원 | Heterogeneous substrate, nitride-based semiconductor device using same and manufacturing method thereof |
| CN101719465B (en) * | 2009-11-27 | 2015-10-21 | 晶能光电(江西)有限公司 | The manufacture method of silicon substrate GaN-based semiconductor material |
| JP5667360B2 (en) * | 2009-12-21 | 2015-02-12 | 住友化学株式会社 | Semiconductor substrate, electronic device, and method for manufacturing semiconductor substrate |
| KR20120103683A (en) | 2009-12-25 | 2012-09-19 | 소코 가가쿠 가부시키가이샤 | Template for epitaxial growth and process for producing same |
| JP2011146589A (en) * | 2010-01-15 | 2011-07-28 | Stanley Electric Co Ltd | Semiconductor light-emitting element and method of manufacturing the same |
| EP2384816B1 (en) * | 2010-05-04 | 2018-04-04 | IMEC vzw | Method of manufacturing a nanochannel device |
| WO2011155010A1 (en) * | 2010-06-07 | 2011-12-15 | 創光科学株式会社 | Method of producing template for epitaxial growth and nitride semiconductor device |
| TW201145564A (en) * | 2010-06-14 | 2011-12-16 | Tera Xtal Technology Corp | Method of making light emitting diodes |
| CN102437260B (en) * | 2010-09-29 | 2016-02-10 | 展晶科技(深圳)有限公司 | Gallium nitride based ultraviolet light-emitting diode and manufacture method thereof |
| TWI495155B (en) * | 2010-12-02 | 2015-08-01 | Epistar Corp | Optoelectronic device and method for manufacturing the same |
| TWI419367B (en) * | 2010-12-02 | 2013-12-11 | Epistar Corp | Photoelectric element and method of manufacturing same |
| TWI458129B (en) * | 2010-12-21 | 2014-10-21 | 隆達電子股份有限公司 | Light-emitting diode wafer structure and manufacturing method thereof |
| CN102651438B (en) * | 2011-02-28 | 2015-05-13 | 比亚迪股份有限公司 | Substrate, preparation method thereof and chip with substrate |
| TWI562395B (en) * | 2011-05-25 | 2016-12-11 | Agency Science Tech & Res | Method of forming nanostructures on a substrate and use of the same |
| KR20130035024A (en) | 2011-09-29 | 2013-04-08 | 삼성전자주식회사 | High electron mobility transistor and method of manufacturing the same |
| CN102339919A (en) * | 2011-10-21 | 2012-02-01 | 西安重装渭南光电科技有限公司 | Epitaxial structure and process for LEDs (light-emitting diodes) |
| KR20130047813A (en) * | 2011-10-31 | 2013-05-09 | 삼성전자주식회사 | Semiconductor device comprising iii-v group compound semiconductor layer and method of manufacturing the same |
| CN103247725B (en) * | 2012-02-08 | 2016-01-20 | 郭磊 | A kind of semiconductor structure and forming method thereof |
| CN103247517B (en) * | 2012-02-08 | 2016-06-01 | 郭磊 | A kind of semiconductor structure and forming method thereof |
| KR101381988B1 (en) * | 2012-06-21 | 2014-04-07 | 서울바이오시스 주식회사 | Vertical light emitting diode and method of fabricating the same |
| KR101878754B1 (en) | 2012-09-13 | 2018-07-17 | 삼성전자주식회사 | Method of manufacturing large area gallium nitride substrate |
| US8927398B2 (en) * | 2013-01-04 | 2015-01-06 | International Business Machines Corporation | Group III nitrides on nanopatterned substrates |
| KR101603207B1 (en) | 2013-01-29 | 2016-03-14 | 삼성전자주식회사 | Manufacturing methdo of nano sturucture semiconductor light emitting device |
| TWM459528U (en) * | 2013-02-26 | 2013-08-11 | 德晶科技股份有限公司 | Light-emitting element substrate and light-emitting element |
| TWM460410U (en) * | 2013-02-26 | 2013-08-21 | 德晶科技股份有限公司 | Light-emitting element substrate and light-emitting element |
| CN104603959B (en) * | 2013-08-21 | 2017-07-04 | 夏普株式会社 | Nitride semiconductor light emitting element |
| FR3010228B1 (en) | 2013-08-30 | 2016-12-30 | St Microelectronics Tours Sas | PROCESS FOR TREATING A GALLIUM NITRIDE LAYER HAVING DISLOCATIONS |
| US9064699B2 (en) | 2013-09-30 | 2015-06-23 | Samsung Electronics Co., Ltd. | Methods of forming semiconductor patterns including reduced dislocation defects and devices formed using such methods |
| US9640422B2 (en) * | 2014-01-23 | 2017-05-02 | Intel Corporation | III-N devices in Si trenches |
| WO2015163908A1 (en) * | 2014-04-25 | 2015-10-29 | The Texas State University-San Marcos | Material selective regrowth structure and method |
| WO2015194244A1 (en) * | 2014-06-20 | 2015-12-23 | ソニー株式会社 | Light emitting element and method for manufacturing same |
| JP5869064B2 (en) * | 2014-07-17 | 2016-02-24 | 創光科学株式会社 | Epitaxial growth template and manufacturing method thereof |
| KR101645574B1 (en) * | 2014-08-19 | 2016-08-16 | 주식회사 소프트에피 | Method of growing iii-nitride semiconductor layer |
| CN204243084U (en) * | 2014-09-25 | 2015-04-01 | 中国科学院物理研究所 | Hall Bar Micro Devices |
| CN106018964B (en) * | 2016-05-16 | 2019-02-12 | 云南瑞博检测技术股份有限公司 | A kind of electrical parameter detection platform for thin-film material and micro-nano structure |
| JP6686876B2 (en) * | 2016-12-28 | 2020-04-22 | 豊田合成株式会社 | Semiconductor structure and semiconductor device |
| TWI757331B (en) * | 2017-08-31 | 2022-03-11 | 晶元光電股份有限公司 | Semiconductor device and manufacturing method thereof |
| US10804429B2 (en) | 2017-12-22 | 2020-10-13 | Lumileds Llc | III-nitride multi-wavelength LED for visible light communication |
| JP6998798B2 (en) * | 2018-03-02 | 2022-01-18 | 株式会社サイオクス | GaN laminate and its manufacturing method |
| CN110137323A (en) * | 2019-05-29 | 2019-08-16 | 福建兆元光电有限公司 | LED chip and manufacturing method with AlN buffer layer |
| US11264530B2 (en) * | 2019-12-19 | 2022-03-01 | Lumileds Llc | Light emitting diode (LED) devices with nucleation layer |
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| EP3855530B1 (en) | 2020-01-24 | 2025-04-16 | Epinovatech AB | Solid-state battery |
| US11581450B2 (en) * | 2020-06-11 | 2023-02-14 | Globalfoundries U.S. Inc. | Photodiode and/or pin diode structures with one or more vertical surfaces |
| CN114335173A (en) * | 2020-10-12 | 2022-04-12 | 联华电子股份有限公司 | Semiconductor element and manufacturing method thereof |
| CN115036366A (en) | 2021-03-05 | 2022-09-09 | 联华电子股份有限公司 | Semiconductor device and method for fabricating the same |
| JP7718026B2 (en) * | 2021-08-30 | 2025-08-05 | 住友電工デバイス・イノベーション株式会社 | Semiconductor device manufacturing method |
| EP4389692A1 (en) * | 2022-12-19 | 2024-06-26 | Epinovatech AB | A device and a method for hydrogen storage |
| CN117438515B (en) * | 2023-12-21 | 2024-03-29 | 江西乾照半导体科技有限公司 | LED chip roughening method and LED chip |
Family Cites Families (95)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5143944B2 (en) | 1972-03-15 | 1976-11-25 | ||
| JPS49149679U (en) | 1973-04-27 | 1974-12-25 | ||
| JPS51137393A (en) | 1975-05-22 | 1976-11-27 | Mitsubishi Electric Corp | Manufacturing method for semiconductor light emitting device |
| JPS5534646A (en) | 1978-08-30 | 1980-03-11 | Sumitomo Metal Ind Ltd | Heating method for furnace body in blowing-in of shaft furnace |
| JPS57115849A (en) | 1981-01-12 | 1982-07-19 | Fujitsu Ltd | Manufacture of substrate for semiconductor device |
| JPS5833882A (en) | 1981-08-21 | 1983-02-28 | Mitsubishi Electric Corp | Manufacture of light emitting diode |
| JPH01316459A (en) | 1988-06-15 | 1989-12-21 | Murata Mfg Co Ltd | In-line sputtering device and method |
| JP2768988B2 (en) * | 1989-08-17 | 1998-06-25 | 三菱電機株式会社 | End face coating method |
| JPH06105797B2 (en) | 1989-10-19 | 1994-12-21 | 昭和電工株式会社 | Semiconductor substrate and manufacturing method thereof |
| JP2623464B2 (en) | 1990-04-27 | 1997-06-25 | 豊田合成株式会社 | Gallium nitride based compound semiconductor light emitting device |
| JPH0484418A (en) | 1990-07-27 | 1992-03-17 | Nec Corp | Method of heteroepitaxial development of iii-v group compound semiconductor for different types of substrates |
| JPH04303920A (en) | 1991-03-29 | 1992-10-27 | Nec Corp | Insulating film/iii-v compound semiconductor stacked structure on group iv substrate |
| JP2954743B2 (en) | 1991-05-30 | 1999-09-27 | 京セラ株式会社 | Method for manufacturing semiconductor light emitting device |
| JPH05110206A (en) | 1991-10-16 | 1993-04-30 | Kubota Corp | Method and apparatus for producing light emitting semiconductor element |
| JP3352712B2 (en) | 1991-12-18 | 2002-12-03 | 浩 天野 | Gallium nitride based semiconductor device and method of manufacturing the same |
| JPH05283744A (en) | 1991-12-20 | 1993-10-29 | Toshiba Corp | Semiconductor element |
| JP2751963B2 (en) | 1992-06-10 | 1998-05-18 | 日亜化学工業株式会社 | Method for growing indium gallium nitride semiconductor |
| JPH07249830A (en) | 1994-03-10 | 1995-09-26 | Hitachi Ltd | Method for manufacturing semiconductor light emitting device |
| JPH07273367A (en) | 1994-04-01 | 1995-10-20 | Mitsubishi Cable Ind Ltd | Manufacture of semiconductor substrate and light-emitting device |
| JP3974667B2 (en) | 1994-08-22 | 2007-09-12 | ローム株式会社 | Manufacturing method of semiconductor light emitting device |
| JPH0864791A (en) | 1994-08-23 | 1996-03-08 | Matsushita Electric Ind Co Ltd | Epitaxial growth method |
| JP3326545B2 (en) | 1994-09-30 | 2002-09-24 | ローム株式会社 | Semiconductor light emitting device |
| JPH08222812A (en) | 1995-02-17 | 1996-08-30 | Matsushita Electric Ind Co Ltd | Crystal growth method for gallium nitride-based compound semiconductor |
| JPH08274411A (en) | 1995-03-31 | 1996-10-18 | Hitachi Ltd | Semiconductor laser device |
| AU6946196A (en) | 1995-09-18 | 1997-04-09 | Hitachi Limited | Semiconductor material, method of producing the semiconductor material, and semiconductor device |
| JPH0992882A (en) * | 1995-09-25 | 1997-04-04 | Mitsubishi Electric Corp | Semiconductor light emitting device and manufacturing method thereof |
| JP3396356B2 (en) | 1995-12-11 | 2003-04-14 | 三菱電機株式会社 | Semiconductor device and method of manufacturing the same |
| US5798536A (en) * | 1996-01-25 | 1998-08-25 | Rohm Co., Ltd. | Light-emitting semiconductor device and method for manufacturing the same |
| JPH09307193A (en) | 1996-05-20 | 1997-11-28 | Nichia Chem Ind Ltd | Nitride semiconductor laser device and method of manufacturing the same |
| JP3139445B2 (en) | 1997-03-13 | 2001-02-26 | 日本電気株式会社 | GaN-based semiconductor growth method and GaN-based semiconductor film |
| JPH11191657A (en) | 1997-04-11 | 1999-07-13 | Nichia Chem Ind Ltd | Method for growing nitride semiconductor and nitride semiconductor device |
| ATE550461T1 (en) * | 1997-04-11 | 2012-04-15 | Nichia Corp | GROWTH METHOD FOR A NITRIDE SEMICONDUCTOR |
| DE19715572A1 (en) * | 1997-04-15 | 1998-10-22 | Telefunken Microelectron | Selective epitaxy of III-V nitride semiconductor layers |
| JPH10321954A (en) | 1997-05-15 | 1998-12-04 | Fuji Electric Co Ltd | Group III nitride semiconductor device and method of manufacturing the same |
| JP3551751B2 (en) | 1997-05-16 | 2004-08-11 | 日亜化学工業株式会社 | Method for growing nitride semiconductor |
| JP2002511831A (en) | 1997-07-03 | 2002-04-16 | シービーエル テクノロジーズ | Compensation for thermal mismatch forming free-standing substrates by epitaxial deposition |
| JP3189877B2 (en) | 1997-07-11 | 2001-07-16 | 日本電気株式会社 | Crystal growth method of low dislocation gallium nitride |
| JPH1143398A (en) | 1997-07-22 | 1999-02-16 | Mitsubishi Cable Ind Ltd | Substrate for growing gallium nitride-based crystal and use thereof |
| JP3930161B2 (en) | 1997-08-29 | 2007-06-13 | 株式会社東芝 | Nitride-based semiconductor device, light-emitting device, and manufacturing method thereof |
| JPH11135770A (en) | 1997-09-01 | 1999-05-21 | Sumitomo Chem Co Ltd | Iii-v compd. semiconductor, manufacture thereof and semiconductor element |
| JPH11145519A (en) | 1997-09-02 | 1999-05-28 | Toshiba Corp | Semiconductor light emitting element, semiconductor light emitting device, and image display device |
| US6266355B1 (en) * | 1997-09-12 | 2001-07-24 | Sdl, Inc. | Group III-V nitride laser devices with cladding layers to suppress defects such as cracking |
| JP3491538B2 (en) | 1997-10-09 | 2004-01-26 | 日亜化学工業株式会社 | Method for growing nitride semiconductor and nitride semiconductor device |
| JPH11135832A (en) | 1997-10-26 | 1999-05-21 | Toyoda Gosei Co Ltd | Gallium nitride group compound semiconductor and manufacture therefor |
| JP3036495B2 (en) | 1997-11-07 | 2000-04-24 | 豊田合成株式会社 | Method for manufacturing gallium nitride-based compound semiconductor |
| JP3456413B2 (en) | 1997-11-26 | 2003-10-14 | 日亜化学工業株式会社 | Method for growing nitride semiconductor and nitride semiconductor device |
| US6051849A (en) * | 1998-02-27 | 2000-04-18 | North Carolina State University | Gallium nitride semiconductor structures including a lateral gallium nitride layer that extends from an underlying gallium nitride layer |
| JP3620269B2 (en) | 1998-02-27 | 2005-02-16 | 豊田合成株式会社 | GaN-based semiconductor device manufacturing method |
| JP3839580B2 (en) | 1998-03-09 | 2006-11-01 | 株式会社リコー | Manufacturing method of semiconductor substrate |
| JPH11274082A (en) | 1998-03-24 | 1999-10-08 | Fuji Electric Co Ltd | Group III nitride semiconductor, method of manufacturing the same, and group III nitride semiconductor device |
| US6500257B1 (en) | 1998-04-17 | 2002-12-31 | Agilent Technologies, Inc. | Epitaxial material grown laterally within a trench and method for producing same |
| JP3436128B2 (en) | 1998-04-28 | 2003-08-11 | 日亜化学工業株式会社 | Method for growing nitride semiconductor and nitride semiconductor device |
| JPH11330546A (en) | 1998-05-12 | 1999-11-30 | Fuji Electric Co Ltd | Group III nitride semiconductor and method of manufacturing the same |
| JP4390090B2 (en) | 1998-05-18 | 2009-12-24 | シャープ株式会社 | GaN crystal film manufacturing method |
| JP3460581B2 (en) | 1998-05-28 | 2003-10-27 | 日亜化学工業株式会社 | Method for growing nitride semiconductor and nitride semiconductor device |
| US6265289B1 (en) * | 1998-06-10 | 2001-07-24 | North Carolina State University | Methods of fabricating gallium nitride semiconductor layers by lateral growth from sidewalls into trenches, and gallium nitride semiconductor structures fabricated thereby |
| JP4352473B2 (en) * | 1998-06-26 | 2009-10-28 | ソニー株式会社 | Manufacturing method of semiconductor device |
| US6606335B1 (en) | 1998-07-14 | 2003-08-12 | Fujitsu Limited | Semiconductor laser, semiconductor device, and their manufacture methods |
| US6319742B1 (en) * | 1998-07-29 | 2001-11-20 | Sanyo Electric Co., Ltd. | Method of forming nitride based semiconductor layer |
| JP3316479B2 (en) | 1998-07-29 | 2002-08-19 | 三洋電機株式会社 | Semiconductor device, semiconductor light emitting device, and method of manufacturing semiconductor device |
| JP3987660B2 (en) | 1998-07-31 | 2007-10-10 | シャープ株式会社 | Nitride semiconductor structure, manufacturing method thereof, and light emitting device |
| US6335546B1 (en) * | 1998-07-31 | 2002-01-01 | Sharp Kabushiki Kaisha | Nitride semiconductor structure, method for producing a nitride semiconductor structure, and light emitting device |
| JP2000044121A (en) | 1998-08-03 | 2000-02-15 | Murata Mach Ltd | Sliver guide creel for spinning machine |
| JP3201475B2 (en) | 1998-09-14 | 2001-08-20 | 松下電器産業株式会社 | Semiconductor device and method of manufacturing the same |
| JP3592553B2 (en) * | 1998-10-15 | 2004-11-24 | 株式会社東芝 | Gallium nitride based semiconductor device |
| JP2000150959A (en) | 1998-11-18 | 2000-05-30 | Hitachi Ltd | Gallium nitride based compound semiconductor light emitting device |
| JP2000174393A (en) | 1998-12-04 | 2000-06-23 | Fuji Electric Co Ltd | Group III nitride semiconductor, method of manufacturing the same, and group III nitride semiconductor device |
| JP4304750B2 (en) | 1998-12-08 | 2009-07-29 | 日亜化学工業株式会社 | Nitride semiconductor growth method and nitride semiconductor device |
| JP3659050B2 (en) | 1998-12-21 | 2005-06-15 | 日亜化学工業株式会社 | Nitride semiconductor growth method and nitride semiconductor device |
| JP2000261106A (en) | 1999-01-07 | 2000-09-22 | Matsushita Electric Ind Co Ltd | Semiconductor light emitting device, method of manufacturing the same, and optical disk device |
| JP3594826B2 (en) * | 1999-02-09 | 2004-12-02 | パイオニア株式会社 | Nitride semiconductor light emitting device and method of manufacturing the same |
| JP3770014B2 (en) | 1999-02-09 | 2006-04-26 | 日亜化学工業株式会社 | Nitride semiconductor device |
| EP1501118B1 (en) | 1999-03-17 | 2009-10-07 | Mitsubishi Chemical Corporation | Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method |
| JP4288743B2 (en) | 1999-03-24 | 2009-07-01 | 日亜化学工業株式会社 | Nitride semiconductor growth method |
| JP4231189B2 (en) | 1999-04-14 | 2009-02-25 | パナソニック株式会社 | Method for producing group III nitride compound semiconductor substrate |
| TW464953B (en) * | 1999-04-14 | 2001-11-21 | Matsushita Electronics Corp | Method of manufacturing III nitride base compound semiconductor substrate |
| JP2001044121A (en) | 1999-06-07 | 2001-02-16 | Agilent Technol Inc | Epitaxial layer structure and manufacturing method thereof |
| JP3786544B2 (en) | 1999-06-10 | 2006-06-14 | パイオニア株式会社 | Nitride semiconductor device manufacturing method and device manufactured by the method |
| JP2000357820A (en) * | 1999-06-15 | 2000-12-26 | Pioneer Electronic Corp | Gallium nitride based semiconductor light emitting device and method of manufacturing the same |
| JP3791246B2 (en) * | 1999-06-15 | 2006-06-28 | 日亜化学工業株式会社 | Nitride semiconductor growth method, nitride semiconductor device manufacturing method using the same, and nitride semiconductor laser device manufacturing method |
| JP4005275B2 (en) * | 1999-08-19 | 2007-11-07 | 日亜化学工業株式会社 | Nitride semiconductor device |
| JP4274504B2 (en) | 1999-09-20 | 2009-06-10 | キヤノン株式会社 | Semiconductor thin film structure |
| JP2001111174A (en) | 1999-10-06 | 2001-04-20 | Fuji Photo Film Co Ltd | Semiconductor element substrate, method of manufacturing the same, and semiconductor element using the semiconductor element substrate |
| JP4055304B2 (en) | 1999-10-12 | 2008-03-05 | 豊田合成株式会社 | Method for producing gallium nitride compound semiconductor |
| JP2001122693A (en) * | 1999-10-22 | 2001-05-08 | Nec Corp | Base substrate for crystal growth and method of manufacturing substrate using the same |
| US6521514B1 (en) * | 1999-11-17 | 2003-02-18 | North Carolina State University | Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on sapphire substrates |
| US20020069816A1 (en) * | 1999-12-13 | 2002-06-13 | Thomas Gehrke | Methods of fabricating gallium nitride layers on textured silicon substrates, and gallium nitride semiconductor structures fabricated thereby |
| JP3518455B2 (en) | 1999-12-15 | 2004-04-12 | 日亜化学工業株式会社 | Method for manufacturing nitride semiconductor substrate |
| US6380108B1 (en) * | 1999-12-21 | 2002-04-30 | North Carolina State University | Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on weak posts, and gallium nitride semiconductor structures fabricated thereby |
| JP2001185493A (en) * | 1999-12-24 | 2001-07-06 | Toyoda Gosei Co Ltd | Method of manufacturing group III nitride compound semiconductor and group III nitride compound semiconductor device |
| JP4432180B2 (en) * | 1999-12-24 | 2010-03-17 | 豊田合成株式会社 | Group III nitride compound semiconductor manufacturing method, group III nitride compound semiconductor device, and group III nitride compound semiconductor |
| US6355497B1 (en) | 2000-01-18 | 2002-03-12 | Xerox Corporation | Removable large area, low defect density films for led and laser diode growth |
| US6403451B1 (en) * | 2000-02-09 | 2002-06-11 | Noerh Carolina State University | Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts |
| JP2001313259A (en) * | 2000-04-28 | 2001-11-09 | Toyoda Gosei Co Ltd | Method for manufacturing group III nitride compound semiconductor substrate and semiconductor device |
| JP3988018B2 (en) | 2001-01-18 | 2007-10-10 | ソニー株式会社 | Crystal film, crystal substrate and semiconductor device |
-
2000
- 2000-03-14 JP JP2000071350A patent/JP2001267242A/en active Pending
-
2001
- 2001-02-23 US US10/221,528 patent/US6967122B2/en not_active Expired - Lifetime
- 2001-02-23 KR KR1020057025175A patent/KR100623564B1/en not_active Expired - Fee Related
- 2001-02-23 KR KR1020027012051A patent/KR100623558B1/en not_active Expired - Fee Related
- 2001-02-23 AU AU2001234169A patent/AU2001234169A1/en not_active Abandoned
- 2001-02-23 CN CNB2004101021001A patent/CN100461340C/en not_active Expired - Lifetime
- 2001-02-23 EP EP01906290A patent/EP1265272A4/en not_active Withdrawn
- 2001-02-23 CN CNB018094791A patent/CN1274008C/en not_active Expired - Lifetime
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2005
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| JP2001267242A (en) | 2001-09-28 |
| WO2001069662A1 (en) | 2001-09-20 |
| US20030162340A1 (en) | 2003-08-28 |
| KR100623564B1 (en) | 2006-09-13 |
| KR100623558B1 (en) | 2006-09-18 |
| CN1429402A (en) | 2003-07-09 |
| EP1265272A4 (en) | 2009-08-05 |
| US7462867B2 (en) | 2008-12-09 |
| EP1265272A1 (en) | 2002-12-11 |
| CN100461340C (en) | 2009-02-11 |
| CN1274008C (en) | 2006-09-06 |
| KR20020084193A (en) | 2002-11-04 |
| KR20060019614A (en) | 2006-03-03 |
| US6967122B2 (en) | 2005-11-22 |
| US20060060866A1 (en) | 2006-03-23 |
| CN1624876A (en) | 2005-06-08 |
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