WO2018159574A1 - エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 - Google Patents
エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4064—Curing agents not provided for by the groups C08G59/42 - C08G59/66 sulfur containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C08G59/623—Aminophenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Definitions
- the present invention relates to an epoxy resin composition, a prepreg, and a fiber reinforced composite material.
- fiber-reinforced composite materials made of carbon fiber, glass fiber, and other reinforcing fibers and epoxy resins, phenol resins, and other thermosetting resins are lightweight, yet have mechanical properties such as strength and rigidity, heat resistance, and corrosion resistance. It has been applied to many fields such as aviation / space, automobiles, rail cars, ships, civil engineering and sports equipment. Especially in applications where high performance is required, fiber reinforced composite materials using continuous reinforcing fibers are used, carbon fibers with excellent specific strength and specific elastic modulus are used as reinforcing fibers, and thermosetting is used as a matrix resin.
- epoxy resins having adhesiveness to carbon fibers, heat resistance, elastic modulus and chemical resistance and minimal curing shrinkage are used.
- a polymer-based composite material has an advantage of being lightweight, but heat resistance is not high, and applicable applications may be limited.
- An aromatic amine compound, an acid anhydride, or a phenol novolac compound is often used for aerospace applications that require heat resistance as a curing agent for an epoxy resin.
- these curing agents tend to require heating for a long time at a high curing temperature around 180 ° C. during molding.
- a long time will be required for shaping
- Patent Documents 1 and 2 show that the curing time of the epoxy resin can be shortened by using a cationic polymerizable curing accelerator such as boron trifluoride-amine complex or sulfonium salt.
- Patent Document 3 shows that by using a microencapsulated imidazole compound as a curing accelerator, the curing time can be shortened while showing a good pot life at 25 ° C.
- Patent Document 4 a cured product having high heat resistance is obtained while maintaining a good pot life at 50 ° C. by using a microencapsulated phosphorus-based curing accelerator.
- Patent Document 5 shows that by adding a microcapsule type cationic polymerization initiator to an epoxy resin, the curing time can be shortened while maintaining a good pot life.
- Patent Document 4 shortening of the curing time of the epoxy resin composition is not sufficient, and there is a problem in rapid curability.
- an object of the present invention is to obtain an epoxy resin cured product having excellent heat resistance, and having an excellent pot life at a manufacturing process temperature and an excellent curability that cures in a short time. It is to provide a prepreg and a fiber reinforced composite material using the same.
- the epoxy resin composition containing an epoxy resin and an amine curing agent contains the compound of the following component [C] as a curing accelerator.
- the compound of the component [C] contains the compound of the following component [C] as a curing accelerator.
- an epoxy resin composition in which the compounding amount of the constituent element [C] is 1 to 10 parts by mass with respect to 100 parts by mass of the constituent element [A].
- the prepreg of the present invention is obtained by impregnating reinforcing fibers with the above epoxy resin composition.
- the first aspect of the fiber-reinforced composite material of the present invention is obtained by curing the prepreg.
- the second embodiment of the fiber reinforced composite material of the present invention comprises a cured epoxy resin obtained by curing the above epoxy resin composition, and reinforcing fibers.
- an epoxy resin cured product having excellent heat resistance can be obtained, and an epoxy resin composition having a good pot life at a manufacturing process temperature and an excellent curability that cures in a short time, and Can be used to provide prepregs and fiber reinforced composites.
- the epoxy resin composition of the present invention has the following configuration. At least the constituent elements [A] to [C], the functional group equivalent ratio of the amino group of the constituent element [B] and the epoxy group of the constituent element [A] is 0.7 to 1.5, [A] An epoxy resin composition in which the compounding amount of the component [C] is 1 to 10 parts by mass with respect to 100 parts by mass.
- the component [A] used in the present invention is preferably an epoxy resin having two or more glycidyl groups in one molecule.
- an epoxy resin having less than 2 glycidyl groups in one molecule the glass transition temperature of a cured product obtained by heating and curing a mixture mixed with a curing agent described later is not preferable.
- epoxy resin used in the present invention examples include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AD type epoxy resins, bisphenol type epoxy resins such as bisphenol S type epoxy resins, and tetrabromobisphenol A diglycidyl ether.
- Brominated epoxy resins epoxy resins having a biphenyl skeleton, epoxy resins having a naphthalene skeleton, epoxy resins having a dicyclopentadiene skeleton, phenol novolac epoxy resins, novolac epoxy resins such as cresol novolac epoxy resins, N, N, O-triglycidyl-m-aminophenol, N, N, O-triglycidyl-p-aminophenol, N, N, O-triglycidyl-4-amino-3-methylphenol N, N, N ′, N′-tetraglycidyl-4,4′-methylenedianiline, N, N, N ′, N′-tetraglycidyl-2,2′-diethyl-4,4′-methylenedianiline
- Glycidylamine type epoxy resins such as N, N, N ′, N′-tetraglycidyl-m-xylylenediamine, N, N-dig
- the component [A] contains 40 to 100 parts by mass of the glycidylamine type epoxy resin with respect to 100 parts by mass of the total epoxy resin.
- a cured epoxy resin having a higher glass transition temperature hereinafter sometimes simply referred to as a cured resin
- an cured epoxy resin excellent in heat resistance is obtained. It becomes easy to be done.
- epoxy resins may be used alone or in combination of two or more.
- Use of a combination of an epoxy resin exhibiting fluidity at an arbitrary temperature and an epoxy resin not exhibiting fluidity at an arbitrary temperature is effective for controlling the fluidity of the matrix resin when the resulting prepreg is thermoset. .
- the fluidity shown until the matrix resin is gelled at the time of thermosetting is large, the orientation of the reinforcing fibers is disturbed or the matrix resin flows out of the system, so that the fiber mass content is predetermined. May be out of range.
- the mechanical properties of the fiber-reinforced composite material obtained may be reduced.
- combining a plurality of epoxy resins exhibiting various viscoelastic behaviors at an arbitrary temperature is also effective for making the tackiness and draping properties of the obtained prepreg appropriate.
- the epoxy resin composition of the present invention has an epoxy resin other than the constituent element [A], for example, only one epoxy group in one molecule, as long as the heat resistance and mechanical properties are not significantly lowered.
- a monoepoxy resin having an alicyclic epoxy resin or the like can be appropriately contained.
- Examples of the amine curing agent of the component [B] included in the present invention include dicyandiamide, a hydrazide compound, and an amine compound.
- aromatic amine compound examples include 3,3′-diisopropyl-4,4′-diaminodiphenylmethane, 3,3′-di-t-butyl-4,4′-diaminodiphenylmethane, 3,3 ′, 5, 5′-tetraethyl-4,4′-diaminodiphenylmethane, 3,3′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, 3,3′-diisopropyl-4,4′-diaminodiphenylketone, 3,3′- Di-t-butyl-4,4′-diaminodiphenyl ketone, 3,3 ′, 5,5′-tetraethyl-4,4′-di
- a cured product that is excellent in heat resistance and elastic modulus and has a small linear expansion coefficient and a decrease in heat resistance due to water absorption.
- it contains diphenyl sulfone or diaminodiphenyl ketone.
- aromatic amine compounds may be used alone or as a mixture of two or more thereof. When mixing with other components, either powder or liquid form may be used, and powder and liquid aromatic amine compounds may be mixed and used.
- the constituent element [C] in the present invention is a phenol compound composed of one or more of the above (c1) to (c3).
- Component [C] is used as an accelerator for the reaction between the epoxy resin of component [A] and the amine curing agent of component [B]. Since the compound of the constituent element [C] has acidity, it promotes the ring opening of the epoxy group in the constituent element [A], and converts the amino group in the constituent element [B] to the epoxy group in the constituent element [A]. Since the nucleophilic reaction is promoted, it is presumed that the time required for completing the curing reaction can be shortened.
- the phenol compound of the component [C] is not strongly acidic, it is presumed that the reaction promoting effect is moderately suppressed and a good pot life at the prepreg manufacturing process temperature can be obtained.
- a strongly acidic phenol compound is used as a curing accelerator, the curing time can be shortened, but a good pot life at the prepreg manufacturing process temperature cannot be obtained.
- the phenol compound of component [C] has a rigid chemical structure, a cured epoxy resin having high heat resistance can be obtained.
- those corresponding to (c1) include 4,4′-dihydroxybenzophenone, 2,4′-dihydroxybenzophenone, 3,3′-dihydroxybenzophenone, and 3,4′-dihydroxy.
- Benzophenone, 4,4'-dihydroxy-3,3'-dimethylbenzophenone, 2,4'-dihydroxy-3,3'-dimethylbenzophenone, 4,4'-dihydroxy-3,3 ', 5,5'-tetraethyl Examples include benzophenone, 2,4′-dihydroxy-3,3 ′, 5,5′-tetraethylbenzophenone, 4-hydroxybenzophenone, 3-hydroxybenzophenone, 2-hydroxybenzophenone, 4-hydroxy-3-methylbenzophenone.
- those corresponding to (c2) include 2,4-bis (phenylsulfonyl) phenol, 2,5-bis (phenylsulfonyl) phenol, 3,5-bis (phenylsulfonyl) ) Phenol, 2-methyl-4,6-bis (phenylsulfonyl) phenol, and the like.
- those corresponding to (c3) include 3,3′-diphenyl-4,4′-dihydroxydiphenylsulfone, 4,4′-diphenyl-3,3′-dihydroxydiphenyl Examples include sulfone, 3,3′-diphenyl-4-hydroxydiphenyl sulfone, and 4,4′-diphenyl-3-hydroxydiphenyl sulfone.
- the constituent element [C] is preferably a phenol compound composed of the following (c4).
- (C4) Phenol compound having one carbonyl group and one phenolic hydroxyl group in one molecule
- the phenol compound corresponding to (c4) is a part of the phenol compound corresponding to (c1). That is, the phenol compound corresponding to (c4) also corresponds to (c1).
- Examples of the phenol compound corresponding to (c4) include 4-hydroxybenzophenone, 3-hydroxybenzophenone, 2-hydroxybenzophenone, 4-hydroxy-3-methylbenzophenone and the like.
- the epoxy resin composition of the present invention satisfies the following (1) and (2) simultaneously.
- the equivalent ratio of the functional group of the amino group of the constituent element [B] to the epoxy group of the constituent element [A] is 0.7 to 1.5.
- the content of the component [C] is 1 to 10 parts by mass with respect to 100 parts by mass of the component [A].
- the equivalent ratio of the functional group of the amino group of the constituent element [B] and the epoxy group of the constituent element [A] is set to 0.7 or more and 1.5 or less.
- excellent rapid curability and heat resistance can be obtained.
- stimulates hardening reaction of an epoxy resin composition is acquired by making content of structural element [C] with respect to 100 mass parts of structural element [A] 1 mass part or more, and it is 10 mass parts or less. Therefore, deterioration of the pot life of the epoxy resin composition can be suppressed.
- the constituent element [C] is preferably a phenol compound composed of (c4) which is a part of the phenol compound corresponding to (c1). And (c4), and when included, other (c1) (excluding those corresponding to (c4)), (c2) and (c3)
- the amount must be 1 to 10 parts by mass with respect to 100 parts by mass of the element [A].
- the epoxy resin composition may be used in combination with another curing accelerator as long as the heat resistance and thermal stability of the epoxy resin composition are not impaired.
- other curing accelerators include cationic polymerization initiators, tertiary amines, imidazole compounds, urea compounds, and hydrazide compounds.
- thermoplastic resins provide toughness without sacrificing heat resistance and elastic modulus of the resulting fiber-reinforced composite material, controlling the tackiness of the resulting prepreg, controlling the fluidity of the matrix resin when the prepreg is heat-cured.
- a thermoplastic resin a thermoplastic resin composed of a polyaryl ether skeleton is preferable.
- polysulfone, polyphenylsulfone, polyethersulfone, polyetherimide, polyphenylene ether, polyetheretherketone, polyetherethersulfone, etc. Can be mentioned.
- thermoplastic resins composed of a polyaryl ether skeleton may be used alone or in appropriate combination.
- polyethersulfone and polyetherimide can be preferably used because they can impart toughness without deteriorating the heat resistance and mechanical properties of the resulting fiber-reinforced composite material.
- thermoplastic resins composed of these polyaryl ether skeletons include primary amines, secondary amines, hydroxyl groups, carboxyl groups, thiol groups, acid anhydrides and halogen groups (chlorine, bromine), etc. Can be used. Among these, in the case of a halogen group having low reactivity with an epoxy resin, a prepreg excellent in pot life can be obtained. On the other hand, a functional group other than a halogen group is preferable because it has high reactivity with an epoxy resin, and thus an epoxy resin composition excellent in adhesion between the epoxy resin and the thermoplastic resin can be obtained.
- the viscosity when held at 80 ° C. for 2 hours is preferably 4.0 times or less, more preferably 3.0 times or less of the initial viscosity at 80 ° C.
- the lower limit is not particularly limited, but is usually about 1.0 times.
- the thickening ratio when held at 80 ° C. for 2 hours is the viscosity when held at 80 ° C. for 1 minute (initial viscosity at 80 ° C.) ⁇ * 1
- the viscosity ⁇ * when held at 80 ° C. for 2 hours . 120 is measured, and the thickening factor is determined from ⁇ * 120 ⁇ ⁇ * 1 .
- the viscosity is a complex viscosity ⁇ measured using a dynamic viscoelasticity measuring apparatus (ARES rheometer: manufactured by TA Instruments) using a parallel plate with a diameter of 40 mm and a frequency of 0.5 Hz and a gap of 1 mm. * Indicates a point.
- the viscosity increase ratio when held at 80 ° C. can be used as an indicator of the pot life of the epoxy resin composition in the kneading process of the epoxy resin composition or the manufacturing process of the prepreg. That is, the smaller the viscosity increase ratio when held at 80 ° C., the better the pot life.
- the viscosity increase ratio when the epoxy resin composition is held at 80 ° C. for 2 hours is 4.0 times or less, the thermal stability of the epoxy resin composition is high, and the impregnation property of the resin to the reinforcing fiber in the prepreg manufacturing process Is less likely to decrease, and voids are less likely to occur in the molded product.
- the cured epoxy resin When applied to structural materials such as aerospace applications and vehicles, the cured epoxy resin must have high heat resistance. Heat resistance can be evaluated by measuring the glass transition temperature by dynamic viscoelasticity measurement.
- the epoxy resin composition of the present invention preferably has a glass transition temperature of 190 ° C. or higher of a cured product obtained by curing at 180 ° C. for 2 hours.
- the upper limit of the glass transition temperature of the cured product is not particularly limited and is preferably as high as possible, but is usually about 300 ° C.
- a higher glass transition temperature of the epoxy resin composition is preferable because it can be applied to a member that requires higher heat resistance.
- thermoplastic resin particles particles containing a thermoplastic resin as a main component
- thermoplastic resin particles a resin layer formed between layers of reinforcing fibers of the fiber reinforced composite material
- thermoplastic resin of the thermoplastic resin particles a thermoplastic resin that can be used by mixing with an epoxy resin composition can be used.
- polyamide is most preferable.
- polyamides polyamide 12, polyamide 6, polyamide 11, polyamide 6/12 copolymer, and epoxy compounds described in Examples 1 to 7 of JP-A No. 2009-221460 are semi-IPN.
- the (polymer interpenetrating network structure) polyamide (semi-IPN polyamide) gives particularly good adhesive strength with an epoxy resin.
- the shape of the thermoplastic resin particles may be spherical particles, non-spherical particles, or porous particles. Spherical particles are preferred because they do not deteriorate the flow characteristics of the resin, are excellent in viscoelasticity, have no origin of stress concentration, and give high impact resistance.
- polyamide particles include SP-500, SP-10, TR-1, TR-2, 842P-48, 842P-80 (above, manufactured by Toray Industries, Inc.), “Orgasol (registered trademark)” 1002D. , 2001UD, 2001EXD, 2002D, 3202D, 3501D, 3502D, (manufactured by Arkema Co., Ltd.) and the like can be used. These polyamide particles may be used alone or in combination.
- the epoxy resin composition of the present invention is a coupling agent, thermosetting resin particles, silica gel, carbon black, clay, carbon nanotube, graphene, carbon particles, metal powder, etc., as long as the effects of the present invention are not hindered.
- An inorganic filler or the like can be contained.
- the prepreg of the present invention is formed by impregnating reinforcing fibers with the epoxy resin composition of the present invention. That is, the prepreg of the present invention is obtained by using the above-described epoxy resin composition as a matrix resin and combining this epoxy resin composition with reinforcing fibers.
- the reinforcing fiber include carbon fiber, graphite fiber, aramid fiber, and glass fiber. Among these, carbon fiber is particularly preferable.
- Carbon fibers include “Torayca (registered trademark)” T800G-24K, “Torayca (registered trademark)” T800S-24K, “Torayca (registered trademark)” T700G-24K, and “Torayca (registered trademark)” T300- 3T, and “Torayca®” T700S-12K (above, manufactured by Toray Industries, Inc.).
- the form and arrangement of the carbon fibers can be appropriately selected from long fibers or woven fabrics arranged in one direction.
- the carbon fiber is preferably in the form of continuous fibers such as long fibers (fiber bundles) or woven fabrics arranged in one direction.
- the prepreg of the present invention can be produced by various known methods.
- the matrix resin is dissolved in an organic solvent selected from acetone, methyl ethyl ketone, methanol, and the like to lower the viscosity, and the wet method in which the reinforcing fiber is impregnated, or the matrix resin is heated to lower the viscosity without using the organic solvent,
- a prepreg can be produced by a method such as a hot melt method for impregnating reinforcing fibers.
- a prepreg in the wet method, can be obtained by immersing the reinforcing fiber in a liquid containing a matrix resin and then pulling it up and evaporating the organic solvent using an oven or the like.
- a resin film may be used first, and then a resin film is superimposed on the reinforcing fiber side from both sides or one side of the reinforcing fiber, and a method in which the reinforcing fiber is impregnated with a matrix resin by heating and pressurizing is used. it can.
- the method for producing the prepreg of the present invention is preferably a hot melt method in which a matrix resin is impregnated into a reinforcing fiber without using an organic solvent, since substantially no organic solvent remains in the prepreg.
- the prepreg of the present invention preferably has a reinforcing fiber amount per unit area of 30 to 2000 g / m 2 .
- the amount of the reinforcing fiber is 30 g / m 2 or more, the number of laminated layers for obtaining a predetermined thickness can be reduced when forming the fiber-reinforced composite material, and the operation is easy.
- the amount of reinforcing fibers is 2000 g / m 2 or less, the drapeability of the prepreg is easily improved.
- the fiber mass content of the prepreg of the present invention is preferably 30 to 90% by mass, more preferably 35 to 85% by mass, and further preferably 40 to 80% by mass.
- the fiber mass content is 30% by mass or more, the amount of the resin does not increase too much, and the advantages of the fiber reinforced composite material excellent in specific strength and specific elastic modulus can be easily obtained, and the fiber reinforced composite material is molded. At this time, the amount of heat generated during curing is not likely to be too high.
- the fiber mass content is 90% by mass or less, poor resin impregnation is less likely to occur, and voids in the obtained fiber-reinforced composite material tend to decrease.
- the first aspect of the fiber-reinforced composite material of the present invention is obtained by curing the prepreg of the present invention.
- the fiber-reinforced composite material of this aspect can be manufactured by, for example, a method of laminating the above-described prepreg of the present invention in a predetermined form and curing the resin by applying pressure and heating.
- a method for applying heat and pressure for example, a press molding method, an autoclave molding method, a bagging molding method, a wrapping tape method, an internal pressure molding method, or the like is employed.
- the second embodiment of the fiber reinforced composite material of the present invention comprises a cured epoxy resin obtained by curing the epoxy resin composition of the present invention, and reinforcing fibers.
- the fiber-reinforced composite material of this embodiment is a method in which the epoxy fiber composition of the present invention is directly impregnated into the reinforcing fiber without using a prepreg, and then heat-cured, for example, a hand layup method, a filament winding method, It can be produced by a molding method such as a pultrusion method, a resin injection molding method, or a resin transfer molding method.
- the fiber-reinforced composite material of the present invention can be molded in a shorter time compared to conventional fiber-reinforced composite materials that do not contain a curing accelerator, aircraft structural members, windmill blades, automobile outer plates, and IC trays It is possible to greatly reduce the molding time and molding cost of applied products such as computer applications such as the case of notebook computers and notebook computers.
- the unit “part” of the composition ratio means part by mass unless otherwise specified.
- Various characteristics were measured in an environment at a temperature of 23 ° C. and a relative humidity of 50% unless otherwise specified.
- Component [C] phenolic compound corresponding to (c1) to (c4), 4,4′-dihydroxybenzophenone (corresponding to c1) ⁇ 4-Hydroxybenzophenone (corresponding to c4) ⁇ 2,4-Bis (phenylsulfonyl) phenol (corresponding to c2) -3,3'-diphenyl-4,4'-dihydroxydiphenyl sulfone (corresponding to c3).
- Viscosity of epoxy resin composition when held at 80 ° C. for 1 minute and viscosity when held for 2 hours The viscosity of an epoxy resin composition is determined by a dynamic viscoelasticity measuring device ARES rheometer (TA instrument). Ment Co.). A flat parallel plate with a diameter of 40 mm was used for the upper and lower measuring jigs, and after heating the parallel plate to 70 ° C., the epoxy resin composition was set so that the distance between the upper and lower jigs was 1 mm, and the torsion mode ( Measurement frequency: 0.5 Hz). “Viscosity when heated from 70 ° C. to 80 ° C.
- the viscosity increase ratio is 3.0 times or less A, more than 3.0 times, 4.0 times or less B, more than 4.0 times, 5.0 times or less. C, more than 5.0 times is indicated by D.
- the intersection temperature value between the tangent in the glass state and the tangent in the transition state was defined as the glass transition temperature.
- the measurement was performed at a heating rate of 5 ° C./min and a frequency of 1 Hz.
- glass transition temperatures of 190 ° C. or higher are indicated by A, 180 ° C. or higher and lower than 190 ° C. by B, 170 ° C. or higher and lower than 180 ° C. by C, and 170 ° C. or lower by D.
- the gel time was expressed as A for 80 minutes or less, B for more than 80 minutes, B for 90 minutes or less, C for more than 90 minutes, C for less than 95 minutes, and D for more than 95 minutes.
- Examples 1 to 4 and Comparative Example 1> As a result of using the phenolic compounds (c1) to (c4) listed in Table 1 as the constituent element [C], the viscosity increase ratio compared to Comparative Example 1 (not containing the constituent element [C]) shown in Table 5 The gel time was greatly shortened while suppressing a significant increase in the temperature, and excellent fast curability was exhibited. Regarding the glass transition temperature, Examples 1 to 4 were not significantly reduced as compared with Comparative Example 1, and showed a high value of 190 ° C. or higher.
- Examples 23 to 26 As shown in Table 3, in Examples 23 to 26, as a result of changing the amine curing agent of the component [B] in Examples 1 and 2, the gel time was shortened while suppressing a significant increase in the thickening factor. And showed excellent characteristics.
- Examples 27 to 34 As shown in Tables 3 and 4, as a result of changing the content of the component [C] in Examples 27 to 34, the increase in the content showed a tendency for the viscosity increase rate to increase with a reduction in gel time. It showed excellent characteristics with no practical problems.
- Examples 39 and 40 and Comparative Example 19 As a result of using the phenolic compounds of (c1) and (c4) described in Table 4 as the constituent element [C], in Examples 39 and 40, Comparative Example 19 described in Table 6 (Constituent element [C] not contained) ), The gel time was greatly shortened while suppressing a significant increase in the thickening ratio, and excellent fast curability was exhibited. Regarding the glass transition temperature, both Examples 39 and 40 showed no significant decrease compared to Comparative Example 19, and showed a high value of 190 ° C. or higher.
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Abstract
Description
[A]エポキシ樹脂
[B]アミン硬化剤
[C]次の(c1)~(c3)のいずれか1つ以上より構成される、フェノール化合物
(c1)1分子内にカルボニル基を1つ以上有するフェノール化合物
(c2)1分子内にスルホニル基を2つ以上有するフェノール化合物
(c3)1分子内にスルホニル基を1つかつ芳香環を3つ以上有するフェノール化合物。
少なくとも構成要素[A]~[C]を含み、構成要素[B]のアミノ基と構成要素[A]のエポキシ基との官能基の当量比が0.7~1.5であり、構成要素[A]100質量部に対して、構成要素[C]の配合量が1~10質量部であるエポキシ樹脂組成物。
[A]エポキシ樹脂
[B]アミン硬化剤
[C]次の(c1)~(c3)のいずれか1つ以上より構成される、フェノール化合物
(c1)1分子内にカルボニル基を1つ以上有するフェノール化合物
(c2)1分子内にスルホニル基を2つ以上有するフェノール化合物
(c3)1分子内にスルホニル基を1つかつ芳香環を3つ以上有するフェノール化合物。
(c4)1分子内にカルボニル基を1つかつフェノール性ヒドロキシル基を1つ有するフェノール化合物
(c4)に該当するフェノール化合物は、(c1)に該当するフェノール化合物の一部である。すなわち、(c4)に該当するフェノール化合物は、(c1)にも該当する。(c4)に該当するフェノール化合物としては、4-ヒドロキシベンゾフェノン、3-ヒドロキシベンゾフェノン、2-ヒドロキシベンゾフェノン、4-ヒドロキシ-3-メチルベンゾフェノンなどが挙げられる。
(1)構成要素[B]のアミノ基と構成要素[A]のエポキシ基の官能基の当量比が0.7~1.5である。
(2)構成要素[C]の含有量が、構成要素[A]100質量部に対して、1~10質量部である。
当量比=(構成要素[B]の質量部数/構成要素[B]の活性水素当量)/(構成要素[A]の質量部数/構成要素[A]のエポキシ当量)。
当量比=(構成要素[B]成分1の質量部数/構成要素[B]成分1の活性水素当量+構成要素[B]成分2の質量部数/構成要素[B]成分2の活性水素当量)/(構成要素[A]成分1の質量部数/構成要素[A]成分1のエポキシ当量+構成要素[A]成分2の質量部数/構成要素[A]成分2のエポキシ当量)。
(1)構成要素[A]:エポキシ樹脂
・ビスフェノールA型エポキシ樹脂(“jER(登録商標)”825、三菱化学(株)製)エポキシ当量:175(g/eq.)
・ビスフェノールF型エポキシ樹脂(“EPICLON(登録商標)”830、DIC(株)製)エポキシ当量:172(g/eq.)
・テトラグリシジルジアミノジフェニルメタン(“アラルダイト(登録商標)”MY721、ハンツマン・アドバンスト・マテリアルズ社製)エポキシ当量:113(g/eq.)
・トリグリシジル-m-アミノフェノール(“アラルダイト(登録商標)”MY0600、ハンツマン・アドバンスト・マテリアルズ社製)エポキシ当量:106(g/eq.)
・トリグリシジル-p-アミノフェノール(“アラルダイト(登録商標)”MY0500、ハンツマン・アドバンスト・マテリアルズ社製)エポキシ当量:106(g/eq.)
・トリフェニロールメタントリグリシジルエーテル(TACTIX742、ハンツマン・アドバンスト・マテリアルズ社製)エポキシ当量:160(g/eq.)。
・4,4’-ジアミノジフェニルスルホン(セイカキュアS、和歌山精化工業(株)製)活性水素当量:62(g/eq.)
・3,3’-ジアミノジフェニルスルホン(3,3’-DAS、三井化学ファイン(株)製)活性水素当量:62(g/eq.)。
・4,4’-ジヒドロキシベンゾフェノン(c1に該当)
・4-ヒドロキシベンゾフェノン(c4に該当)
・2,4-ビス(フェニルスルホニル)フェノール(c2に該当)
・3,3’-ジフェニル-4,4’-ジヒドロキシジフェニルスルホン(c3に該当)。
・4,4’-ジヒドロキシジフェニルスルホン。
・ポリエーテルスルホン(“スミカエクセル(登録商標)”PES5003P、住友化学(株)社製)。
以下の方法にて各実施例および比較例のエポキシ樹脂組成物を作製、測定した。
混練装置中に、表1~6に記載の構成要素[A]に該当するエポキシ樹脂および必要に応じて熱可塑性樹脂を投入し、加熱混練を行い、熱可塑性樹脂を溶解させた。次いで、混練を続けたまま100℃以下の温度まで降温させ、表1~6に記載の構成要素[B]と構成要素[C](ただし、比較例においては、構成要素[C]を加えない場合や、構成要素[C]の代わりに化合物Xを加える場合もある。)を加えて撹拌し、エポキシ樹脂組成物を得た。
エポキシ樹脂組成物の粘度は、動的粘弾性測定装置ARESレオメーター(TAインスツルメント社製)を用いた。上下部測定冶具に直径40mmの平板のパラレルプレートを用い、パラレルプレートを70℃に加温後、上部と下部の冶具間距離が1mmとなるように該エポキシ樹脂組成物をセットし、ねじりモード(測定周波数:0.5Hz)で測定した。「70℃から80℃まで2℃/分の速度で昇温し、80℃に到達後、1分間保持した時の粘度」をη* 1、「70℃から80℃まで2℃/分の速度で昇温し、80℃に到達後、2時間保持した時の粘度」をη* 120と定め、増粘倍率(ポットライフ)をη* 120÷η* 1より求めた。ここで粘度とは、動的粘弾性測定における複素粘性率η*のことを指す。ポットライフの評価に関し、表1~6において、増粘倍率が3.0倍以下をA、3.0倍超、4.0倍以下をB、4.0倍超、5.0倍以下をC、5.0倍超をDで表記した。
エポキシ樹脂組成物を、縦15cm、幅13cm、厚さ2mmのモールドに注入した後、熱風乾燥機中で30℃から速度1.5℃/分で昇温し、180℃で2時間加熱硬化した後、30℃まで速度2.5℃/分で降温して厚さ2mmの樹脂硬化板を作製した。作製した樹脂硬化板から幅12.7mm、長さ55mmの試験片を切り出し、SACMA SRM18R-94に従い、DMA法によりガラス転移温度を求めた。貯蔵弾性率G’曲線において、ガラス状態での接線と転移状態での接線との交点温度値をガラス転移温度とした。ここでは、昇温速度5℃/分、周波数1Hzで測定した。耐熱性の評価に関し、表1~6において、ガラス転移温度が190℃以上をA、180℃以上190℃未満をB、170℃以上180℃未満をC、170℃未満をDで表記した。
回転トルクの経時変化からエポキシ樹脂組成物の硬化反応性を評価した。ここでは、Rubber Process Analyzer RPA2000(ALPHA TECHNOLOGIES社製)を用い、直径4cm、深さ3mmの円孔にエポキシ樹脂組成物を4.5g流し入れ、40℃から180℃まで1.7℃/分の速度で昇温し、180℃で2時間加熱した。ゲルタイムは、40℃で加熱開始時点からトルクが1dNmを超えるまでの時間とした。速硬化性の評価に関し、表1~6において、ゲルタイムが80分以下をA、80分超、90分以下をB、90分超、95分以下をC、95分超をDで表記した。
構成要素[C]として、表1に記載の(c1)~(c4)のフェノール化合物を用いた結果、表5に記載の比較例1(構成要素[C]非含有)と比べ、増粘倍率の大幅な増加を抑制しつつ、ゲルタイムが大きく短縮され、優れた速硬化性を示した。ガラス転移温度に関しては、実施例1~4とも比較例1に比べて大幅な低下はなく、190℃以上の高い値を示した。
表1、2、5に示すように、種々のエポキシ樹脂組成物を用いた。実施例5~9および実施例15~18では、構成要素[C]として(c1)に該当する4,4’-ジヒドロキシベンゾフェノンを含有することにより、比較例2~6(構成要素[C]非含有)に比べて、増粘倍率の大幅な増加を抑制しつつ、ゲルタイムが大きく短縮された。また、実施例10~14では、構成要素[C]として(c4)に該当する4-ヒドロキシベンゾフェノンを含有することにより、(c1)を用いた実施例5~9に比べて、増粘倍率が小さくなっており、好ましい傾向を示した。実施例5~9に比べて、ゲルタイムの若干の増加および耐熱性の若干の低下が見られたが、実用上問題のない優れた値を示した。
実施例5~9および実施例10~14において、1分子中にグリシジル基を3個以上含むエポキシ樹脂であるテトラグリシジルジアミノジフェニルメタンの含有量が増えることで、速硬化性、ポットライフへの悪影響なく、ガラス転移温度の向上が見られ、好ましい傾向を示した。
表2、3、5に示すように、実施例19~22では、比較例7、8(構成要素[C]非含有)に比べて、増粘倍率の大幅な増加を抑制しつつ、ゲルタイムの短縮が見られた。さらに、ガラス転移温度の大幅な低下も抑えられており、好ましい特性であった。実施例1、2、9、14から実施例19~22へ、構成要素[B]のアミン硬化剤を変更した結果、ポットライフおよび耐熱性が若干低下する傾向が見られたが、実用上問題のない優れた値を示した。
表3に示すように、実施例23~26では、実施例1、2における構成要素[B]のアミン硬化剤を変更した結果、増粘倍率の大幅な増加を抑制しつつ、ゲルタイムが短縮しており、優れた特性を示した。
表3、4に示すように、実施例27~34において構成要素[C]の含有量を変更した結果、含有量の増加により、ゲルタイムの短縮と共に増粘倍率が上昇する傾向が見られたが、実用上問題のない優れた特性を示した。
表4に示すように、構成要素[B]のアミン硬化剤の含有量を変更した結果、含有量の増加に伴い、ゲルタイムが短縮される傾向を示した。
表5に示すように、硬化促進剤として構成要素[C]に含まれない化合物Xを用いた結果、増粘倍率が高く、好ましくない特性であった。
表6の比較例11、13、15、17に示すように、構成要素[A]100質量部に対し、構成要素[C]の含有量が1質量部未満であった結果、ゲルタイムの短縮効果が十分ではなく、好ましくない結果であった。比較例12、14、16、18に示すように、構成要素[A]100質量部に対し、構成要素[C]の含有量が10質量部より大きい場合、増粘倍率の上昇が著しく、好ましくない特性であった。
構成要素[C]として、表4に記載の(c1)と(c4)のフェノール化合物を用いた結果、実施例39と40では、表6に記載の比較例19(構成要素[C]非含有)と比べ、増粘倍率の大幅な増加を抑制しつつ、ゲルタイムが大きく短縮され、優れた速硬化性を示した。ガラス転移温度に関しては、実施例39、40とも比較例19に比べて大幅な低下はなく、190℃以上の高い値を示した。
Claims (9)
- 少なくとも次の構成要素[A]~[C]を含み、構成要素[B]のアミノ基と構成要素[A]のエポキシ基との官能基の当量比が0.7~1.5であり、構成要素[A]100質量部に対して、構成要素[C]の配合量が1~10質量部であるエポキシ樹脂組成物。
[A]エポキシ樹脂
[B]アミン硬化剤
[C]次の(c1)~(c3)のいずれか1つ以上より構成される、フェノール化合物
(c1)1分子内にカルボニル基を1つ以上有するフェノール化合物
(c2)1分子内にスルホニル基を2つ以上有するフェノール化合物
(c3)1分子内にスルホニル基を1つかつ芳香環を3つ以上有するフェノール化合物 - 構成要素[A]が、全エポキシ樹脂100質量部に対してグリシジルアミン型エポキシ樹脂を40~100質量部含む、請求項1に記載のエポキシ樹脂組成物。
- 構成要素[B]が、ジアミノジフェニルスルホンまたはジアミノジフェニケトンを含む、請求項1または2に記載のエポキシ樹脂組成物。
- 構成要素[C]が、次の(c4)より構成されるフェノール化合物である、請求項1から3のいずれかに記載のエポキシ樹脂組成物。
(c4)1分子内にカルボニル基を1つかつフェノール性ヒドロキシル基を1つ有するフェノール化合物 - 180℃で2時間硬化して得られる硬化物のガラス転移温度が190℃以上である、請求項1から4のいずれかに記載のエポキシ樹脂組成物。
- 80℃で2時間保持した時の粘度が、80℃における初期粘度の4.0倍以下である、請求項1から5のいずれかに記載のエポキシ樹脂組成物。
- 請求項1から6のいずれかに記載のエポキシ樹脂組成物を強化繊維に含浸させてなるプリプレグ。
- 請求項7に記載のプリプレグを硬化させてなる繊維強化複合材料。
- 請求項1から6のいずれかに記載のエポキシ樹脂組成物を硬化させてなるエポキシ樹脂硬化物、および、強化繊維を含んでなる繊維強化複合材料。
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| EP18761012.6A EP3590991B1 (en) | 2017-03-02 | 2018-02-27 | Epoxy resin composition, prepreg and fiber-reinforced composite material |
| CN201880014364.1A CN110352207A (zh) | 2017-03-02 | 2018-02-27 | 环氧树脂组合物、预浸料坯以及纤维增强复合材料 |
| RU2019129094A RU2019129094A (ru) | 2017-03-02 | 2018-02-27 | Композиция эпоксидной смолы, препрег и армированный волокнами композитный материал |
| US16/478,268 US20190359763A1 (en) | 2017-03-02 | 2018-02-27 | Epoxy resin composition, prepreg and fiber-reinforced composite material |
| JP2018511508A JP7014153B2 (ja) | 2017-03-02 | 2018-02-27 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| KR1020197022535A KR20190120184A (ko) | 2017-03-02 | 2018-02-27 | 에폭시 수지 조성물, 프리프레그 및 섬유 강화 복합 재료 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2022044880A (ja) * | 2020-09-08 | 2022-03-18 | 東レ株式会社 | 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113174183B (zh) * | 2021-04-27 | 2022-07-22 | 福州大学 | 一种无有机溶剂的石墨烯增强水性环氧树脂涂料及其制备方法 |
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- 2018-02-27 WO PCT/JP2018/007114 patent/WO2018159574A1/ja not_active Ceased
- 2018-02-27 JP JP2018511508A patent/JP7014153B2/ja active Active
- 2018-02-27 RU RU2019129094A patent/RU2019129094A/ru not_active Application Discontinuation
- 2018-02-27 KR KR1020197022535A patent/KR20190120184A/ko not_active Withdrawn
- 2018-02-27 EP EP18761012.6A patent/EP3590991B1/en active Active
- 2018-02-27 US US16/478,268 patent/US20190359763A1/en not_active Abandoned
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022044880A (ja) * | 2020-09-08 | 2022-03-18 | 東レ株式会社 | 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP7585671B2 (ja) | 2020-09-08 | 2024-11-19 | 東レ株式会社 | 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20190359763A1 (en) | 2019-11-28 |
| EP3590991A4 (en) | 2020-10-28 |
| RU2019129094A (ru) | 2021-04-02 |
| CN110352207A (zh) | 2019-10-18 |
| JP7014153B2 (ja) | 2022-02-01 |
| EP3590991A1 (en) | 2020-01-08 |
| JPWO2018159574A1 (ja) | 2019-12-19 |
| KR20190120184A (ko) | 2019-10-23 |
| EP3590991B1 (en) | 2024-05-01 |
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