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WO2009013887A1 - 端部検査装置 - Google Patents

端部検査装置 Download PDF

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Publication number
WO2009013887A1
WO2009013887A1 PCT/JP2008/001941 JP2008001941W WO2009013887A1 WO 2009013887 A1 WO2009013887 A1 WO 2009013887A1 JP 2008001941 W JP2008001941 W JP 2008001941W WO 2009013887 A1 WO2009013887 A1 WO 2009013887A1
Authority
WO
WIPO (PCT)
Prior art keywords
end section
subject
inspecting apparatus
optical system
image forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/001941
Other languages
English (en)
French (fr)
Inventor
Naoshi Sakaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of WO2009013887A1 publication Critical patent/WO2009013887A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

　円板形状の被検査体を回転させながら、被検査体の端部の画像を取得することによって被検査体の端部近傍の状態を検査する端部検査装置において、被検査体の上方に設けられた第１の結像光学系と、被検査体の下方に設けられた第２の結像光学系と、第１の結像光学系、又は第２の結像光学系の少なくともいずれか一方を用いて被検査体の端部を撮像する撮像手段と、を備えたことを特徴とする。
PCT/JP2008/001941 2007-07-25 2008-07-22 端部検査装置 Ceased WO2009013887A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007193345 2007-07-25
JP2007-193345 2007-07-25

Publications (1)

Publication Number Publication Date
WO2009013887A1 true WO2009013887A1 (ja) 2009-01-29

Family

ID=40281148

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001941 Ceased WO2009013887A1 (ja) 2007-07-25 2008-07-22 端部検査装置

Country Status (2)

Country Link
TW (1) TW200917405A (ja)
WO (1) WO2009013887A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111834243A (zh) * 2019-04-16 2020-10-27 株式会社迪思科 检查装置和加工装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112129244B (zh) * 2020-09-21 2022-05-06 北京石晶光电科技股份有限公司 一种晶片倒角检测方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02141847U (ja) * 1989-04-28 1990-11-29
JPH0369238U (ja) * 1989-11-10 1991-07-09
JPH06258231A (ja) * 1991-01-31 1994-09-16 Central Glass Co Ltd 板ガラスの欠点検出装置
JPH0972722A (ja) * 1995-09-07 1997-03-18 Kao Corp 基板外観検査装置
JP2000046537A (ja) * 1998-07-24 2000-02-18 Kobe Steel Ltd 欠陥検査装置
JP2000136916A (ja) * 1998-10-15 2000-05-16 Wacker Siltronic Corp 半導体ウエ―ハ上のエッジ欠陥を検出、モニタ及び特徴付ける方法及び装置
JP2002134575A (ja) * 2000-10-26 2002-05-10 Sony Corp 基板周縁検査方法、電子基板の製造方法および基板周縁検査装置
JP2003139523A (ja) * 2001-11-02 2003-05-14 Nippon Electro Sensari Device Kk 表面欠陥検出方法および表面欠陥検出装置
WO2006059647A1 (ja) * 2004-11-30 2006-06-08 Shibaura Mechatronics Corporation 表面検査装置及び表面検査方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02141847U (ja) * 1989-04-28 1990-11-29
JPH0369238U (ja) * 1989-11-10 1991-07-09
JPH06258231A (ja) * 1991-01-31 1994-09-16 Central Glass Co Ltd 板ガラスの欠点検出装置
JPH0972722A (ja) * 1995-09-07 1997-03-18 Kao Corp 基板外観検査装置
JP2000046537A (ja) * 1998-07-24 2000-02-18 Kobe Steel Ltd 欠陥検査装置
JP2000136916A (ja) * 1998-10-15 2000-05-16 Wacker Siltronic Corp 半導体ウエ―ハ上のエッジ欠陥を検出、モニタ及び特徴付ける方法及び装置
JP2002134575A (ja) * 2000-10-26 2002-05-10 Sony Corp 基板周縁検査方法、電子基板の製造方法および基板周縁検査装置
JP2003139523A (ja) * 2001-11-02 2003-05-14 Nippon Electro Sensari Device Kk 表面欠陥検出方法および表面欠陥検出装置
WO2006059647A1 (ja) * 2004-11-30 2006-06-08 Shibaura Mechatronics Corporation 表面検査装置及び表面検査方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111834243A (zh) * 2019-04-16 2020-10-27 株式会社迪思科 检查装置和加工装置

Also Published As

Publication number Publication date
TW200917405A (en) 2009-04-16

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