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WO2009013887A1 - End section inspecting apparatus - Google Patents

End section inspecting apparatus Download PDF

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Publication number
WO2009013887A1
WO2009013887A1 PCT/JP2008/001941 JP2008001941W WO2009013887A1 WO 2009013887 A1 WO2009013887 A1 WO 2009013887A1 JP 2008001941 W JP2008001941 W JP 2008001941W WO 2009013887 A1 WO2009013887 A1 WO 2009013887A1
Authority
WO
WIPO (PCT)
Prior art keywords
end section
subject
inspecting apparatus
optical system
image forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/001941
Other languages
French (fr)
Japanese (ja)
Inventor
Naoshi Sakaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of WO2009013887A1 publication Critical patent/WO2009013887A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

Provided is an end section inspecting apparatus for inspecting the status of a region close to an end section of a disc-shaped subject to be inspected, by acquiring the image of the end section of the subject, while rotating the subject. The end section inspecting apparatus is provided with a first image forming optical system arranged above the subject to be inspected; a second image forming optical system arranged below the subject; and an imaging means for picking up the image of the end section of the subject by using at least the first image forming optical system or the second image forming optical system.
PCT/JP2008/001941 2007-07-25 2008-07-22 End section inspecting apparatus Ceased WO2009013887A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007193345 2007-07-25
JP2007-193345 2007-07-25

Publications (1)

Publication Number Publication Date
WO2009013887A1 true WO2009013887A1 (en) 2009-01-29

Family

ID=40281148

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001941 Ceased WO2009013887A1 (en) 2007-07-25 2008-07-22 End section inspecting apparatus

Country Status (2)

Country Link
TW (1) TW200917405A (en)
WO (1) WO2009013887A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111834243A (en) * 2019-04-16 2020-10-27 株式会社迪思科 Inspection equipment and processing equipment

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112129244B (en) * 2020-09-21 2022-05-06 北京石晶光电科技股份有限公司 Wafer chamfering detection method

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02141847U (en) * 1989-04-28 1990-11-29
JPH0369238U (en) * 1989-11-10 1991-07-09
JPH06258231A (en) * 1991-01-31 1994-09-16 Central Glass Co Ltd Defect detecting device for plate glass
JPH0972722A (en) * 1995-09-07 1997-03-18 Kao Corp Substrate visual inspection device
JP2000046537A (en) * 1998-07-24 2000-02-18 Kobe Steel Ltd Defect inspection equipment
JP2000136916A (en) * 1998-10-15 2000-05-16 Wacker Siltronic Corp Method and apparatus for detecting, monitoring and characterizing edge defects on semiconductor wafers
JP2002134575A (en) * 2000-10-26 2002-05-10 Sony Corp Substrate edge inspection method, electronic substrate manufacturing method, and substrate edge inspection apparatus
JP2003139523A (en) * 2001-11-02 2003-05-14 Nippon Electro Sensari Device Kk Surface defect detecting method and surface defect detecting device
WO2006059647A1 (en) * 2004-11-30 2006-06-08 Shibaura Mechatronics Corporation Surface inspection device and surface inspection method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02141847U (en) * 1989-04-28 1990-11-29
JPH0369238U (en) * 1989-11-10 1991-07-09
JPH06258231A (en) * 1991-01-31 1994-09-16 Central Glass Co Ltd Defect detecting device for plate glass
JPH0972722A (en) * 1995-09-07 1997-03-18 Kao Corp Substrate visual inspection device
JP2000046537A (en) * 1998-07-24 2000-02-18 Kobe Steel Ltd Defect inspection equipment
JP2000136916A (en) * 1998-10-15 2000-05-16 Wacker Siltronic Corp Method and apparatus for detecting, monitoring and characterizing edge defects on semiconductor wafers
JP2002134575A (en) * 2000-10-26 2002-05-10 Sony Corp Substrate edge inspection method, electronic substrate manufacturing method, and substrate edge inspection apparatus
JP2003139523A (en) * 2001-11-02 2003-05-14 Nippon Electro Sensari Device Kk Surface defect detecting method and surface defect detecting device
WO2006059647A1 (en) * 2004-11-30 2006-06-08 Shibaura Mechatronics Corporation Surface inspection device and surface inspection method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111834243A (en) * 2019-04-16 2020-10-27 株式会社迪思科 Inspection equipment and processing equipment

Also Published As

Publication number Publication date
TW200917405A (en) 2009-04-16

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