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WO2009075160A1 - 電気部品の実装方法及び実装装置 - Google Patents

電気部品の実装方法及び実装装置 Download PDF

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Publication number
WO2009075160A1
WO2009075160A1 PCT/JP2008/070691 JP2008070691W WO2009075160A1 WO 2009075160 A1 WO2009075160 A1 WO 2009075160A1 JP 2008070691 W JP2008070691 W JP 2008070691W WO 2009075160 A1 WO2009075160 A1 WO 2009075160A1
Authority
WO
WIPO (PCT)
Prior art keywords
electric component
chip
wiring board
less
mounting apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/070691
Other languages
English (en)
French (fr)
Inventor
Kazunori Hamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to CN2008801195813A priority Critical patent/CN101889336B/zh
Priority to EP08858733A priority patent/EP2224473A1/en
Priority to US12/747,129 priority patent/US8486212B2/en
Priority to HK10111414.3A priority patent/HK1144734B/xx
Priority to KR1020127010090A priority patent/KR101398307B1/ko
Publication of WO2009075160A1 publication Critical patent/WO2009075160A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H10P72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/073—
    • H10W72/07338—
    • H10W72/252—
    • H10W72/325—
    • H10W72/351—
    • H10W72/354—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

　厚みが２００μｍ以下の薄い電気部品を配線基板上に実装する際に、導電性粒子を含み且つ最低溶融粘度が低い導電性接着剤を用いて熱圧着した場合に生じる電気部品の反り量を大幅に低減させることができる電気部品の実装装置を提供する。 　実装装置においては、基台１１の上に載置された配線基板１００の上に、最低溶融粘度が１．０×１０３Ｐａ・ｓ以下の異方性導電接着フィルム３００を載置するとともに当該異方性導電接着フィルム３００の上に厚みが２００μｍ以下のＩＣチップ２００を載置する。そして、実装装置においては、ゴム硬度が６０以下のエラストマーからなる圧着部１４を有する熱圧着ヘッド１２によってＩＣチップ２００を加圧し、当該ＩＣチップ２００を配線基板１００の上に熱圧着する。
PCT/JP2008/070691 2007-12-10 2008-11-13 電気部品の実装方法及び実装装置 Ceased WO2009075160A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008801195813A CN101889336B (zh) 2007-12-10 2008-11-13 电气元件的安装方法和安装装置
EP08858733A EP2224473A1 (en) 2007-12-10 2008-11-13 Method and apparatus for mounting electric component
US12/747,129 US8486212B2 (en) 2007-12-10 2008-11-13 Method and apparatus for mounting electric component
HK10111414.3A HK1144734B (en) 2007-12-10 2008-11-13 Method and apparatus for mounting electric component
KR1020127010090A KR101398307B1 (ko) 2007-12-10 2008-11-13 전기 부품의 실장 방법 및 실장 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-318751 2007-12-10
JP2007318751A JP2009141269A (ja) 2007-12-10 2007-12-10 電気部品の実装方法及び実装装置

Publications (1)

Publication Number Publication Date
WO2009075160A1 true WO2009075160A1 (ja) 2009-06-18

Family

ID=40755403

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070691 Ceased WO2009075160A1 (ja) 2007-12-10 2008-11-13 電気部品の実装方法及び実装装置

Country Status (7)

Country Link
US (1) US8486212B2 (ja)
EP (1) EP2224473A1 (ja)
JP (1) JP2009141269A (ja)
KR (2) KR20100102648A (ja)
CN (1) CN101889336B (ja)
TW (1) TWI390647B (ja)
WO (1) WO2009075160A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3868749A1 (en) 2016-03-23 2021-08-25 Syngenta Participations Ag Herbicidal compounds

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010070806A1 (ja) * 2008-12-16 2010-06-24 パナソニック株式会社 半導体装置とフリップチップ実装方法およびフリップチップ実装装置
JP5540916B2 (ja) * 2010-06-15 2014-07-02 デクセリアルズ株式会社 接続構造体の製造方法
US8381965B2 (en) * 2010-07-22 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compress bonding
US8651359B2 (en) * 2010-08-23 2014-02-18 International Business Machines Corporation Flip chip bonder head for forming a uniform fillet
US8104666B1 (en) 2010-09-01 2012-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compressive bonding with separate die-attach and reflow processes
US8177862B2 (en) 2010-10-08 2012-05-15 Taiwan Semiconductor Manufacturing Co., Ltd Thermal compressive bond head
JP5732239B2 (ja) * 2010-11-30 2015-06-10 デクセリアルズ株式会社 熱圧着ヘッド、熱圧着装置、実装方法
DE102011109938A1 (de) 2011-03-29 2012-10-04 Oliver Wiesener Klebstoffhärten bei gleichzeitiger Fixierung von Bauteilen auf einem Träger
JP5965185B2 (ja) * 2012-03-30 2016-08-03 デクセリアルズ株式会社 回路接続材料、及びこれを用いた半導体装置の製造方法
JP6212011B2 (ja) * 2014-09-17 2017-10-11 東芝メモリ株式会社 半導体製造装置
KR20200135586A (ko) * 2019-05-22 2020-12-03 삼성디스플레이 주식회사 연성 회로 필름 본딩 장치 및 이를 이용한 연성 회로 필름 부착 방법
KR102732411B1 (ko) * 2019-06-14 2024-11-20 삼성디스플레이 주식회사 표시 장치의 제조 장치, 및 표시 장치의 제조 방법
CN113690149A (zh) * 2020-05-16 2021-11-23 佛山市国星光电股份有限公司 一种芯片键合结构、方法及设备
US20240186280A1 (en) * 2022-12-01 2024-06-06 Intel Corporation Thermocompression bonding tool for panel-level thermo-compression bonding

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086635A (ja) * 2001-09-12 2003-03-20 Nikkiso Co Ltd 回路素子の実装方法
JP2005032952A (ja) 2003-07-11 2005-02-03 Sony Chem Corp 電気部品の実装方法及び実装装置

Family Cites Families (8)

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US3699640A (en) * 1970-12-01 1972-10-24 Western Electric Co Compliant bonding
US4511425A (en) * 1983-06-13 1985-04-16 Dennison Manufacturing Company Heated pad decorator
JP3298810B2 (ja) * 1997-07-09 2002-07-08 株式会社新川 ダイボンディング装置
WO2003025997A1 (fr) * 2001-09-12 2003-03-27 Nikkiso Co.,Ltd. Procede et presse de montage de circuits
JP3886401B2 (ja) * 2002-03-25 2007-02-28 ソニーケミカル＆インフォメーションデバイス株式会社 接続構造体の製造方法
US6605491B1 (en) * 2002-05-21 2003-08-12 Industrial Technology Research Institute Method for bonding IC chips to substrates with non-conductive adhesive
EP1845556A4 (en) * 2005-02-02 2010-02-10 Sony Chem & Inf Device Corp ATTACHING DEVICE FOR ELECTRICAL COMPONENTS
JP4996859B2 (ja) * 2006-02-10 2012-08-08 ソニーケミカル＆インフォメーションデバイス株式会社 圧着装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086635A (ja) * 2001-09-12 2003-03-20 Nikkiso Co Ltd 回路素子の実装方法
JP2005032952A (ja) 2003-07-11 2005-02-03 Sony Chem Corp 電気部品の実装方法及び実装装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3868749A1 (en) 2016-03-23 2021-08-25 Syngenta Participations Ag Herbicidal compounds

Also Published As

Publication number Publication date
TWI390647B (zh) 2013-03-21
KR20100102648A (ko) 2010-09-24
JP2009141269A (ja) 2009-06-25
KR20120060888A (ko) 2012-06-12
US8486212B2 (en) 2013-07-16
KR101398307B1 (ko) 2014-05-27
US20100288416A1 (en) 2010-11-18
EP2224473A1 (en) 2010-09-01
HK1144734A1 (zh) 2011-03-04
CN101889336A (zh) 2010-11-17
CN101889336B (zh) 2013-05-01
TW200939374A (en) 2009-09-16

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