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WO2009075159A1 - 電気部品の実装方法及び実装装置 - Google Patents

電気部品の実装方法及び実装装置 Download PDF

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Publication number
WO2009075159A1
WO2009075159A1 PCT/JP2008/070690 JP2008070690W WO2009075159A1 WO 2009075159 A1 WO2009075159 A1 WO 2009075159A1 JP 2008070690 W JP2008070690 W JP 2008070690W WO 2009075159 A1 WO2009075159 A1 WO 2009075159A1
Authority
WO
WIPO (PCT)
Prior art keywords
electric component
chip
wiring board
less
mounting apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/070690
Other languages
English (en)
French (fr)
Inventor
Kazunori Hamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to EP08859346A priority Critical patent/EP2234148A1/en
Priority to KR1020107015235A priority patent/KR101141990B1/ko
Priority to HK10111415.2A priority patent/HK1144853B/xx
Priority to CN2008801195705A priority patent/CN101889335B/zh
Priority to US12/747,130 priority patent/US8419888B2/en
Publication of WO2009075159A1 publication Critical patent/WO2009075159A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P72/00—
    • H10W72/00—
    • H10W72/0198—
    • H10W72/01225—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/252—
    • H10W72/354—
    • H10W74/15—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

　厚みが２００μｍ以下の薄い電気部品を配線基板上に実装する際に、導電性粒子を含まず且つ最低溶融粘度が低い非導電性接着剤を用いて熱圧着した場合に生じる電気部品の反り量を大幅に低減させることができる電気部品の実装装置を提供する。 　実装装置においては、基台１１の上に載置された配線基板１００の上に、最低溶融粘度が１．０×１０３Ｐａ・ｓ以下の非導電性接着フィルム３００を載置するとともに当該非導電性接着フィルム３００の上に厚みが２００μｍ以下のＩＣチップ２００を載置する。そして、実装装置においては、ゴム硬度が６０以下のエラストマーからなる圧着部１４を有する熱圧着ヘッド１２によってＩＣチップ２００を加圧し、当該ＩＣチップ２００を配線基板１００の上に熱圧着する。
PCT/JP2008/070690 2007-12-10 2008-11-13 電気部品の実装方法及び実装装置 Ceased WO2009075159A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP08859346A EP2234148A1 (en) 2007-12-10 2008-11-13 Method and apparatus for mounting electric component
KR1020107015235A KR101141990B1 (ko) 2007-12-10 2008-11-13 전기 부품의 실장 방법 및 실장 장치
HK10111415.2A HK1144853B (en) 2007-12-10 2008-11-13 Method and apparatus for mounting electric component
CN2008801195705A CN101889335B (zh) 2007-12-10 2008-11-13 电气元件的安装方法和安装装置
US12/747,130 US8419888B2 (en) 2007-12-10 2008-11-13 Method and apparatus for mounting electric component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-318724 2007-12-10
JP2007318724A JP2009141267A (ja) 2007-12-10 2007-12-10 電気部品の実装方法及び実装装置

Publications (1)

Publication Number Publication Date
WO2009075159A1 true WO2009075159A1 (ja) 2009-06-18

Family

ID=40755402

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070690 Ceased WO2009075159A1 (ja) 2007-12-10 2008-11-13 電気部品の実装方法及び実装装置

Country Status (7)

Country Link
US (1) US8419888B2 (ja)
EP (1) EP2234148A1 (ja)
JP (1) JP2009141267A (ja)
KR (1) KR101141990B1 (ja)
CN (1) CN101889335B (ja)
TW (1) TWI390646B (ja)
WO (1) WO2009075159A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5965185B2 (ja) * 2012-03-30 2016-08-03 デクセリアルズ株式会社 回路接続材料、及びこれを用いた半導体装置の製造方法
CN104678604A (zh) * 2013-11-27 2015-06-03 浙江金徕镀膜有限公司 一种压接装置
TWI666738B (zh) * 2017-01-31 2019-07-21 Shinkawa Ltd. 半導體晶片的安裝裝置及安裝方法
JP7301468B2 (ja) * 2019-04-17 2023-07-03 株式会社ディスコ 被加工物の加工方法、熱圧着方法
US11587809B2 (en) * 2020-09-30 2023-02-21 Advanced Semiconductor Engineering, Inc. Wafer supporting mechanism and method for wafer dicing
CN113115584B (zh) * 2021-04-16 2024-02-09 南通勒诚智能科技有限公司 一种基于pcb板的直线电机结构
CN113363219B (zh) * 2021-05-11 2024-02-06 苏州通富超威半导体有限公司 一种bga产品、热压设备及热压工艺
CN118688488B (zh) * 2024-08-23 2024-11-08 宁波中车时代传感技术有限公司 一种电流传感芯片的制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296746A (ja) * 2003-03-26 2004-10-21 Nikkiso Co Ltd 加圧装置および回路素子の実装方法
JP2005032952A (ja) 2003-07-11 2005-02-03 Sony Chem Corp 電気部品の実装方法及び実装装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296746A (ja) * 2003-03-26 2004-10-21 Nikkiso Co Ltd 加圧装置および回路素子の実装方法
JP2005032952A (ja) 2003-07-11 2005-02-03 Sony Chem Corp 電気部品の実装方法及び実装装置

Also Published As

Publication number Publication date
US20110017397A1 (en) 2011-01-27
US8419888B2 (en) 2013-04-16
HK1144853A1 (en) 2011-03-11
CN101889335B (zh) 2013-09-04
KR20100102647A (ko) 2010-09-24
TW200937548A (en) 2009-09-01
EP2234148A1 (en) 2010-09-29
TWI390646B (zh) 2013-03-21
JP2009141267A (ja) 2009-06-25
CN101889335A (zh) 2010-11-17
KR101141990B1 (ko) 2012-05-17

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