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WO2008126211A1 - 超音波接合装置及び超音波接合方法 - Google Patents

超音波接合装置及び超音波接合方法 Download PDF

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Publication number
WO2008126211A1
WO2008126211A1 PCT/JP2007/056560 JP2007056560W WO2008126211A1 WO 2008126211 A1 WO2008126211 A1 WO 2008126211A1 JP 2007056560 W JP2007056560 W JP 2007056560W WO 2008126211 A1 WO2008126211 A1 WO 2008126211A1
Authority
WO
WIPO (PCT)
Prior art keywords
ultrasonic bonding
wiping
fill
chip
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/056560
Other languages
English (en)
French (fr)
Inventor
Yasuyuki Masuda
Yukio Ozaki
Jun Matsueda
Kazuyuki Ikura
Taizan Kobayashi
Toshinori Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2009508762A priority Critical patent/JP5278311B2/ja
Priority to PCT/JP2007/056560 priority patent/WO2008126211A1/ja
Publication of WO2008126211A1 publication Critical patent/WO2008126211A1/ja
Priority to US12/564,423 priority patent/US7938160B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/00—
    • H10W72/073—
    • H10W72/07323—
    • H10W72/07338—
    • H10W72/20—
    • H10W72/354—
    • H10W74/15—
    • H10W90/724—

Landscapes

  • Wire Bonding (AREA)

Abstract

　基板（Ｂ）と電子部品（Ｃ）との間にアンダーフィル（ＵＦ）が充填された電子装置（１０）の製造に使用される超音波接合装置（１００）であって、チップ（Ｃ）を搭載可能なツール面（１０５）を有するヘッド（１０４）と、チップ（Ｃ）を基板（Ｂ）に超音波接合する超音波接合部（１１２、１２０、１２２）と、ヘッド（１０４）のツール面（１０５）に付着した未硬化のアンダーフィル（ＵＦ）をワイピング材（Ｗ）で拭き取るワイピングユニット（１４０）とを有することを特徴とする超音波接合装置を提供する。
PCT/JP2007/056560 2007-03-28 2007-03-28 超音波接合装置及び超音波接合方法 Ceased WO2008126211A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009508762A JP5278311B2 (ja) 2007-03-28 2007-03-28 超音波接合装置及び超音波接合方法
PCT/JP2007/056560 WO2008126211A1 (ja) 2007-03-28 2007-03-28 超音波接合装置及び超音波接合方法
US12/564,423 US7938160B2 (en) 2007-03-28 2009-09-22 Ultrasonic bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056560 WO2008126211A1 (ja) 2007-03-28 2007-03-28 超音波接合装置及び超音波接合方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/564,423 Continuation US7938160B2 (en) 2007-03-28 2009-09-22 Ultrasonic bonding apparatus

Publications (1)

Publication Number Publication Date
WO2008126211A1 true WO2008126211A1 (ja) 2008-10-23

Family

ID=39863394

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/056560 Ceased WO2008126211A1 (ja) 2007-03-28 2007-03-28 超音波接合装置及び超音波接合方法

Country Status (3)

Country Link
US (1) US7938160B2 (ja)
JP (1) JP5278311B2 (ja)
WO (1) WO2008126211A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5278311B2 (ja) * 2007-03-28 2013-09-04 富士通株式会社 超音波接合装置及び超音波接合方法
WO2008126213A1 (ja) * 2007-03-28 2008-10-23 Fujitsu Limited 超音波接合装置
WO2008126212A1 (ja) * 2007-03-28 2008-10-23 Fujitsu Limited 超音波接合装置
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
US9573221B2 (en) * 2014-06-25 2017-02-21 GM Global Technology Operations LLC Elimination of tool adhesion in an ultrasonic welding process
EP4681866A2 (en) * 2017-04-04 2026-01-21 Kulicke and Soffa Industries, Inc. Ultrasonic welding system and method of operating an ultrasonic welding system
JP6842669B2 (ja) * 2017-05-29 2021-03-17 トヨタ紡織株式会社 粒子含浸装置及び粒子含浸不織布の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002313837A (ja) * 2001-04-18 2002-10-25 Matsushita Electric Ind Co Ltd 半導体チップ装着装置及び方法
JP2003249793A (ja) * 2002-02-26 2003-09-05 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6034174B2 (ja) 1979-06-20 1985-08-07 松下電器産業株式会社 テ−プレコ−ダ
JPS60234282A (ja) 1984-05-07 1985-11-20 Hitachi Ltd 記録媒体の頭出し機構
JPH0638828Y2 (ja) 1988-09-07 1994-10-12 小谷電機株式会社 テープリール保持装置
JP2708222B2 (ja) 1989-03-31 1998-02-04 株式会社東芝 ボンディング装置
JP2987386B2 (ja) 1990-08-01 1999-12-06 九州日立マクセル株式会社 ヘッドクリーナ
JP2562897Y2 (ja) 1991-09-14 1998-02-16 株式会社リコー 塗工装置及び塗布液の消泡装置
JPH05345411A (ja) 1992-06-15 1993-12-27 Canon Inc インクジェット記録装置
JPH08195063A (ja) 1995-01-20 1996-07-30 Sony Corp 磁気テープ巻き取り装置
JPH08264584A (ja) 1995-03-22 1996-10-11 Nec Kansai Ltd ボンディングツールのクリーニング装置
JP2001030465A (ja) 1999-07-26 2001-02-06 Sankyo Seiki Mfg Co Ltd ホットスタンプ箔用カセット及びホットスタンプ装置
JP4521948B2 (ja) * 2000-08-08 2010-08-11 四国化工機株式会社 滅菌液除去装置
JP2004207294A (ja) 2002-12-24 2004-07-22 Seiko Epson Corp ボンディングツールのクリーニング方法及びクリーニング装置
JP4093910B2 (ja) 2003-05-15 2008-06-04 Ｊｕｋｉ株式会社 電子部品保持装置
JP4088217B2 (ja) 2003-08-22 2008-05-21 シャープタカヤ電子工業株式会社 インナーリードボンディング装置
JP4248441B2 (ja) 2004-04-06 2009-04-02 富士通株式会社 超音波フリップチップ実装方法
WO2008126212A1 (ja) * 2007-03-28 2008-10-23 Fujitsu Limited 超音波接合装置
JP5278311B2 (ja) * 2007-03-28 2013-09-04 富士通株式会社 超音波接合装置及び超音波接合方法
WO2008126213A1 (ja) * 2007-03-28 2008-10-23 Fujitsu Limited 超音波接合装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002313837A (ja) * 2001-04-18 2002-10-25 Matsushita Electric Ind Co Ltd 半導体チップ装着装置及び方法
JP2003249793A (ja) * 2002-02-26 2003-09-05 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US8833418B2 (en) 2009-08-24 2014-09-16 The Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive

Also Published As

Publication number Publication date
US20100038406A1 (en) 2010-02-18
JPWO2008126211A1 (ja) 2010-07-22
JP5278311B2 (ja) 2013-09-04
US7938160B2 (en) 2011-05-10

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