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WO2008126212A1 - 超音波接合装置 - Google Patents

超音波接合装置 Download PDF

Info

Publication number
WO2008126212A1
WO2008126212A1 PCT/JP2007/056562 JP2007056562W WO2008126212A1 WO 2008126212 A1 WO2008126212 A1 WO 2008126212A1 JP 2007056562 W JP2007056562 W JP 2007056562W WO 2008126212 A1 WO2008126212 A1 WO 2008126212A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiping
ultrasonic bonding
bonding apparatus
electronic component
tool surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/056562
Other languages
English (en)
French (fr)
Inventor
Yasuyuki Masuda
Yukio Ozaki
Jun Matsueda
Kazuyuki Ikura
Taizan Kobayashi
Toshinori Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to PCT/JP2007/056562 priority Critical patent/WO2008126212A1/ja
Priority to JP2009508763A priority patent/JP5024369B2/ja
Publication of WO2008126212A1 publication Critical patent/WO2008126212A1/ja
Priority to US12/564,431 priority patent/US7905268B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H10W74/012—
    • H10W74/15—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H10W72/0711—
    • H10W72/07173—
    • H10W72/07178—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/856—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

　電子部品（Ｃ）と基板（Ｂ）との間にアンダーフィル（ＵＦ）が充填された電子装置（１０）の製造に使用される超音波接合装置（１００）であって、電子部品を搭載可能なツール面（１０５）を有するヘッド（１０４）と、ヘッドのツール面に付着した未硬化のアンダーフィルをワイピング材（Ｗ）で拭き取るワイピングユニット（１４０）と、電子部品を基板に超音波接合すると共にワイピング台（１４９）上のワイピング材にヘッドを加圧可能な超音波接合部（１１２、１２０、１２２）と、ワイピングユニットによるワイピング時にワイピング台（１４９）上のワイピング材とツール面との間に加わる加圧力を検出する検出部（１１４）と、検出結果に基づいて超音波接合部による加圧力を制御する制御部（１１０）とを有する超音波接合装置を提供する。
PCT/JP2007/056562 2007-03-28 2007-03-28 超音波接合装置 Ceased WO2008126212A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2007/056562 WO2008126212A1 (ja) 2007-03-28 2007-03-28 超音波接合装置
JP2009508763A JP5024369B2 (ja) 2007-03-28 2007-03-28 超音波接合装置
US12/564,431 US7905268B2 (en) 2007-03-28 2009-09-22 Ultrasonic bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056562 WO2008126212A1 (ja) 2007-03-28 2007-03-28 超音波接合装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/564,431 Continuation US7905268B2 (en) 2007-03-28 2009-09-22 Ultrasonic bonding apparatus

Publications (1)

Publication Number Publication Date
WO2008126212A1 true WO2008126212A1 (ja) 2008-10-23

Family

ID=39863395

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/056562 Ceased WO2008126212A1 (ja) 2007-03-28 2007-03-28 超音波接合装置

Country Status (3)

Country Link
US (1) US7905268B2 (ja)
JP (1) JP5024369B2 (ja)
WO (1) WO2008126212A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
CN114750417A (zh) * 2022-03-25 2022-07-15 必能信超声(上海)有限公司 一种超声波塑料焊接机架

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5278311B2 (ja) * 2007-03-28 2013-09-04 富士通株式会社 超音波接合装置及び超音波接合方法
WO2008126213A1 (ja) * 2007-03-28 2008-10-23 Fujitsu Limited 超音波接合装置
WO2008126212A1 (ja) * 2007-03-28 2008-10-23 Fujitsu Limited 超音波接合装置
JP5491081B2 (ja) * 2009-06-22 2014-05-14 株式会社アルテクス 超音波振動金属接合用共振器
JP5876000B2 (ja) * 2012-06-11 2016-03-02 株式会社新川 ボンディング装置およびボンディング方法
US9573221B2 (en) * 2014-06-25 2017-02-21 GM Global Technology Operations LLC Elimination of tool adhesion in an ultrasonic welding process

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002313837A (ja) * 2001-04-18 2002-10-25 Matsushita Electric Ind Co Ltd 半導体チップ装着装置及び方法
JP2003249793A (ja) * 2002-02-26 2003-09-05 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4521948B2 (ja) * 2000-08-08 2010-08-11 四国化工機株式会社 滅菌液除去装置
JP5278311B2 (ja) * 2007-03-28 2013-09-04 富士通株式会社 超音波接合装置及び超音波接合方法
WO2008126213A1 (ja) * 2007-03-28 2008-10-23 Fujitsu Limited 超音波接合装置
WO2008126212A1 (ja) * 2007-03-28 2008-10-23 Fujitsu Limited 超音波接合装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002313837A (ja) * 2001-04-18 2002-10-25 Matsushita Electric Ind Co Ltd 半導体チップ装着装置及び方法
JP2003249793A (ja) * 2002-02-26 2003-09-05 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US8833418B2 (en) 2009-08-24 2014-09-16 The Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
CN114750417A (zh) * 2022-03-25 2022-07-15 必能信超声(上海)有限公司 一种超声波塑料焊接机架

Also Published As

Publication number Publication date
JPWO2008126212A1 (ja) 2010-07-22
US20100006621A1 (en) 2010-01-14
JP5024369B2 (ja) 2012-09-12
US7905268B2 (en) 2011-03-15

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