WO2009004902A1 - 異方性導電膜及びその製造方法、並びに接合体 - Google Patents
異方性導電膜及びその製造方法、並びに接合体 Download PDFInfo
- Publication number
- WO2009004902A1 WO2009004902A1 PCT/JP2008/060738 JP2008060738W WO2009004902A1 WO 2009004902 A1 WO2009004902 A1 WO 2009004902A1 JP 2008060738 W JP2008060738 W JP 2008060738W WO 2009004902 A1 WO2009004902 A1 WO 2009004902A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive particles
- conductive film
- anisotropic conductive
- bonded body
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Laminated Bodies (AREA)
Abstract
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| HK10102514.1A HK1135804B (en) | 2007-07-03 | 2008-06-12 | Anisotropic conductive film and method for producing the same, and bonded body |
| CN2008800037526A CN101601171B (zh) | 2007-07-03 | 2008-06-12 | 各向异性导电膜和其制造方法以及接合体 |
| US12/473,355 US7931956B2 (en) | 2007-07-03 | 2009-05-28 | Anisotropic conductive film, method for producing the same, and bonded structure |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007175428A JP4880533B2 (ja) | 2007-07-03 | 2007-07-03 | 異方性導電膜及びその製造方法、並びに接合体 |
| JP2007-175428 | 2007-07-03 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/473,355 Continuation US7931956B2 (en) | 2007-07-03 | 2009-05-28 | Anisotropic conductive film, method for producing the same, and bonded structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009004902A1 true WO2009004902A1 (ja) | 2009-01-08 |
Family
ID=40225956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/060738 Ceased WO2009004902A1 (ja) | 2007-07-03 | 2008-06-12 | 異方性導電膜及びその製造方法、並びに接合体 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7931956B2 (ja) |
| JP (1) | JP4880533B2 (ja) |
| KR (1) | KR101035864B1 (ja) |
| CN (1) | CN101601171B (ja) |
| TW (1) | TWI377240B (ja) |
| WO (1) | WO2009004902A1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015149132A (ja) * | 2014-02-04 | 2015-08-20 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
| JP2015149128A (ja) * | 2014-02-04 | 2015-08-20 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
| WO2022168972A1 (ja) * | 2021-02-08 | 2022-08-11 | デクセリアルズ株式会社 | 接続体の製造方法,接続体 |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090278891A1 (en) * | 1997-07-15 | 2009-11-12 | Silverbrook Research Pty Ltd | Printhead IC With Filter Structure At Inlet To Ink Chambers |
| US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
| CN101553084B (zh) * | 2008-04-01 | 2010-12-08 | 富葵精密组件(深圳)有限公司 | 线路基板及线路基板的制作方法 |
| CN102301561B (zh) | 2009-01-28 | 2015-03-11 | 住友重机械工业株式会社 | 混合式工作机械及蓄电控制装置 |
| JP4673933B2 (ja) * | 2009-08-26 | 2011-04-20 | 積水化学工業株式会社 | 異方性導電材料及び接続構造体 |
| JP5602743B2 (ja) * | 2009-08-26 | 2014-10-08 | 積水化学工業株式会社 | 異方性導電材料、接続構造体及び接続構造体の製造方法 |
| JP4673931B2 (ja) * | 2009-08-26 | 2011-04-20 | 積水化学工業株式会社 | 異方性導電材料及び接続構造体 |
| JP4673932B2 (ja) * | 2009-08-26 | 2011-04-20 | 積水化学工業株式会社 | 接続構造体の製造方法及び異方性導電材料 |
| KR101019756B1 (ko) * | 2009-12-24 | 2011-03-09 | 제일모직주식회사 | 비자외선형 다이접착필름 및 제조방법 |
| US20120327319A1 (en) * | 2010-03-10 | 2012-12-27 | Sharp Kabushiki Kaisha | Liquid crystal display device, and method for producing same |
| CN102290127A (zh) * | 2010-06-17 | 2011-12-21 | 鑫河电材股份有限公司 | 异方性导电膜及其制造方法 |
| JP5565277B2 (ja) * | 2010-11-09 | 2014-08-06 | デクセリアルズ株式会社 | 異方性導電フィルム |
| JP5756637B2 (ja) * | 2011-01-21 | 2015-07-29 | 積水化学工業株式会社 | 接続構造体の製造方法及び接続構造体 |
| JP5916423B2 (ja) * | 2011-02-17 | 2016-05-11 | 積水化学工業株式会社 | 異方性導電材料のbステージ化物、異方性導電材料のbステージ化物の製造方法、接続構造体及び接続構造体の製造方法 |
| JP5703061B2 (ja) * | 2011-02-23 | 2015-04-15 | 積水化学工業株式会社 | 接続構造体の製造方法 |
| JP5685473B2 (ja) * | 2011-04-06 | 2015-03-18 | デクセリアルズ株式会社 | 異方性導電フィルム、接合体の製造方法、及び接合体 |
| JP5705003B2 (ja) * | 2011-04-13 | 2015-04-22 | 積水化学工業株式会社 | 接続構造体の製造方法 |
| JP5698080B2 (ja) * | 2011-06-28 | 2015-04-08 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
| US9475963B2 (en) | 2011-09-15 | 2016-10-25 | Trillion Science, Inc. | Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes |
| US9568646B2 (en) * | 2011-11-04 | 2017-02-14 | Cam Holding Corporation | Methods for reducing diffuse reflection of nanostructure-based transparent conductive films and touch panels made of the same |
| JP2013105636A (ja) * | 2011-11-14 | 2013-05-30 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
| CN103988289A (zh) * | 2011-12-16 | 2014-08-13 | 旭化成电子材料株式会社 | 带各向异性导电薄膜的半导体芯片、带各向异性导电薄膜的半导体晶片、以及半导体装置 |
| JP6252473B2 (ja) * | 2012-07-05 | 2017-12-27 | 株式会社スリーボンド | シート状接着剤およびこれを用いた有機elパネル |
| CN107722853B (zh) * | 2012-08-01 | 2021-12-17 | 迪睿合电子材料有限公司 | 各向异性导电膜的制造方法、各向异性导电膜及连接构造体 |
| WO2014021424A1 (ja) * | 2012-08-01 | 2014-02-06 | デクセリアルズ株式会社 | 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体 |
| CN104508064B (zh) * | 2012-08-03 | 2016-10-12 | 迪睿合电子材料有限公司 | 各向异性导电膜及其制造方法 |
| JP5972844B2 (ja) * | 2012-09-18 | 2016-08-17 | デクセリアルズ株式会社 | 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法 |
| CN103149718B (zh) * | 2013-04-02 | 2016-01-20 | 华映视讯(吴江)有限公司 | 一种异方性导电膜的固结方法 |
| JP6289831B2 (ja) * | 2013-07-29 | 2018-03-07 | デクセリアルズ株式会社 | 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法 |
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| JP2015079586A (ja) * | 2013-10-15 | 2015-04-23 | デクセリアルズ株式会社 | 異方性導電フィルム |
| JP6217422B2 (ja) * | 2014-02-04 | 2017-10-25 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
| JP6409281B2 (ja) * | 2014-02-04 | 2018-10-24 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
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| KR102677632B1 (ko) | 2014-11-17 | 2024-06-21 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 |
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| KR102700783B1 (ko) * | 2018-06-06 | 2024-08-29 | 데쿠세리아루즈 가부시키가이샤 | 접속체, 접속체의 제조 방법, 접속 방법 |
| CN113613892A (zh) * | 2019-03-13 | 2021-11-05 | 昭和电工材料株式会社 | 电路连接用黏合剂膜及其制造方法、电路连接结构体的制造方法以及黏合剂膜收纳套组 |
| JP2022039384A (ja) * | 2020-08-28 | 2022-03-10 | 昭和電工マテリアルズ株式会社 | 回路接続用接着剤フィルム及びその製造方法、並びに、回路接続構造体の製造方法 |
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| KR20230134656A (ko) * | 2022-03-14 | 2023-09-22 | 삼성디스플레이 주식회사 | 이방성 도전 필름 및 이를 포함하는 표시 장치 |
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| JP2002358825A (ja) * | 2001-05-31 | 2002-12-13 | Hitachi Chem Co Ltd | 異方導電性接着フィルム |
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| US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
| US7923488B2 (en) * | 2006-10-16 | 2011-04-12 | Trillion Science, Inc. | Epoxy compositions |
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2007
- 2007-07-03 JP JP2007175428A patent/JP4880533B2/ja active Active
-
2008
- 2008-06-12 KR KR1020097011832A patent/KR101035864B1/ko active Active
- 2008-06-12 WO PCT/JP2008/060738 patent/WO2009004902A1/ja not_active Ceased
- 2008-06-12 CN CN2008800037526A patent/CN101601171B/zh active Active
- 2008-06-17 TW TW97122605A patent/TWI377240B/zh active
-
2009
- 2009-05-28 US US12/473,355 patent/US7931956B2/en active Active
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| JPH11306861A (ja) * | 1998-04-09 | 1999-11-05 | Minnesota Mining & Mfg Co <3M> | 導電性接着剤組成物、それを有する異方導電性接着フィルム及びそのフィルムを用いた接続方法 |
| JP2000003621A (ja) * | 1998-06-12 | 2000-01-07 | Sekisui Chem Co Ltd | 異方性導電膜及び導電接続構造体 |
| JP2002358825A (ja) * | 2001-05-31 | 2002-12-13 | Hitachi Chem Co Ltd | 異方導電性接着フィルム |
| JP2003064324A (ja) * | 2001-06-11 | 2003-03-05 | Hitachi Chem Co Ltd | 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体 |
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| JP2015149132A (ja) * | 2014-02-04 | 2015-08-20 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
| JP2015149128A (ja) * | 2014-02-04 | 2015-08-20 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
| KR20160117456A (ko) * | 2014-02-04 | 2016-10-10 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 및 그의 제조 방법 |
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| US10902973B2 (en) | 2014-02-04 | 2021-01-26 | Dexerials Corporation | Anisotropic conductive film and production method of the same |
| KR102450709B1 (ko) * | 2014-02-04 | 2022-10-06 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 및 그의 제조 방법 |
| WO2022168972A1 (ja) * | 2021-02-08 | 2022-08-11 | デクセリアルズ株式会社 | 接続体の製造方法,接続体 |
| JP7583265B2 (ja) | 2021-02-08 | 2024-11-14 | デクセリアルズ株式会社 | 接続体の製造方法,接続体 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090239082A1 (en) | 2009-09-24 |
| JP4880533B2 (ja) | 2012-02-22 |
| KR20090092796A (ko) | 2009-09-01 |
| HK1135804A1 (en) | 2010-06-11 |
| CN101601171A (zh) | 2009-12-09 |
| US7931956B2 (en) | 2011-04-26 |
| CN101601171B (zh) | 2011-04-20 |
| TW200914572A (en) | 2009-04-01 |
| JP2009016133A (ja) | 2009-01-22 |
| TWI377240B (en) | 2012-11-21 |
| KR101035864B1 (ko) | 2011-05-20 |
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