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WO2008126455A1 - 感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板 - Google Patents

感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板 Download PDF

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Publication number
WO2008126455A1
WO2008126455A1 PCT/JP2008/051805 JP2008051805W WO2008126455A1 WO 2008126455 A1 WO2008126455 A1 WO 2008126455A1 JP 2008051805 W JP2008051805 W JP 2008051805W WO 2008126455 A1 WO2008126455 A1 WO 2008126455A1
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WIPO (PCT)
Prior art keywords
photosensitive
photosensitive film
resin composition
printed board
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/051805
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English (en)
French (fr)
Inventor
Kimi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
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Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of WO2008126455A1 publication Critical patent/WO2008126455A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Health & Medical Sciences (AREA)
  • Structural Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Architecture (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

　耐めっき性、感度、現像性、及び密着性が良好な感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板を提供することを目的とする。 　本発明の観光性樹脂組成物は、バインダーと、重合性化合物と、光重合開始剤と、無機充填剤と、密着促進剤とを含有することを特徴とする。本発明の感光性フィルムは、支持体上に、前記感光性樹脂組成物からなる感光層が積層されてなることを特徴とする。本発明のパターン形成方法は、前記感光性フィルムにおける感光層に対し、露光を行うことを少なくとも含むことを特徴とする。本発明のプリント基板は、前記パターン形成方法により永久パターンが形成されることを特徴とする。
PCT/JP2008/051805 2007-03-30 2008-02-05 感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板 Ceased WO2008126455A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007095053A JP2010145425A (ja) 2007-03-30 2007-03-30 感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板
JP2007-095053 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008126455A1 true WO2008126455A1 (ja) 2008-10-23

Family

ID=39863613

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Application Number Title Priority Date Filing Date
PCT/JP2008/051805 Ceased WO2008126455A1 (ja) 2007-03-30 2008-02-05 感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板

Country Status (4)

Country Link
JP (1) JP2010145425A (ja)
KR (1) KR20100014433A (ja)
CN (1) CN101652716A (ja)
WO (1) WO2008126455A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040299A1 (ja) * 2009-09-30 2011-04-07 富士フイルム株式会社 感光性組成物、感光性ソルダーレジスト組成物及び感光性ソルダーレジストフィルム、並びに、永久パターン、その形成方法及びプリント基板
CN102399352A (zh) * 2010-09-15 2012-04-04 南开大学 一种含能热塑性弹性体及其合成方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2447773B1 (en) * 2010-11-02 2013-07-10 Fujifilm Corporation Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure
JP6348419B2 (ja) * 2012-09-18 2018-06-27 旭化成株式会社 感光性樹脂組成物
KR101361623B1 (ko) * 2012-10-15 2014-02-11 금호석유화학주식회사 광산발생제 및 이를 포함하는 레지스트 조성물
KR101434659B1 (ko) * 2012-10-15 2014-08-28 금호석유화학 주식회사 광산발생제 및 이를 포함하는 레지스트 조성물
JP6495214B2 (ja) * 2016-09-23 2019-04-03 株式会社タムラ製作所 感光性樹脂組成物
CN106768052B (zh) * 2016-12-27 2023-12-15 江苏大学 一种智能碳纤维复合材料传感元件及其制作方法
CN118900505A (zh) * 2024-08-14 2024-11-05 中山芯承半导体有限公司 一种pcb激光钻孔工艺

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0411261A (ja) * 1990-04-27 1992-01-16 Mitsubishi Kasei Corp 感光性組成物
JPH05249670A (ja) * 1992-03-05 1993-09-28 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2001235858A (ja) * 1999-12-15 2001-08-31 Ciba Specialty Chem Holding Inc 感光性樹脂組成物
JP2004272203A (ja) * 2002-09-23 2004-09-30 E I Du Pont De Nemours & Co 有利な適用および除去特性を有する、耐ハロー性、感光画像形成性のカバーレイ組成物およびそれに関する方法
JP2005122048A (ja) * 2003-10-20 2005-05-12 Mitsubishi Chemicals Corp 光硬化性組成物、並びにそれを用いた光硬化性画像形成材料、光硬化性画像形成材、及び画像形成方法
JP2006251385A (ja) * 2005-03-10 2006-09-21 Fuji Photo Film Co Ltd パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2006285179A (ja) * 2005-03-09 2006-10-19 Fuji Photo Film Co Ltd 感光性永久レジストフィルム及び永久パターン形成方法
JP2007003807A (ja) * 2005-06-23 2007-01-11 Sumitomo Bakelite Co Ltd 感光性樹脂組成物および該組成物を用いたソルダーレジスト
JP2007025176A (ja) * 2005-07-14 2007-02-01 Fujifilm Holdings Corp パターン形成材料、並びにパターン形成装置及び永久パターン形成方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0411261A (ja) * 1990-04-27 1992-01-16 Mitsubishi Kasei Corp 感光性組成物
JPH05249670A (ja) * 1992-03-05 1993-09-28 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2001235858A (ja) * 1999-12-15 2001-08-31 Ciba Specialty Chem Holding Inc 感光性樹脂組成物
JP2004272203A (ja) * 2002-09-23 2004-09-30 E I Du Pont De Nemours & Co 有利な適用および除去特性を有する、耐ハロー性、感光画像形成性のカバーレイ組成物およびそれに関する方法
JP2005122048A (ja) * 2003-10-20 2005-05-12 Mitsubishi Chemicals Corp 光硬化性組成物、並びにそれを用いた光硬化性画像形成材料、光硬化性画像形成材、及び画像形成方法
JP2006285179A (ja) * 2005-03-09 2006-10-19 Fuji Photo Film Co Ltd 感光性永久レジストフィルム及び永久パターン形成方法
JP2006251385A (ja) * 2005-03-10 2006-09-21 Fuji Photo Film Co Ltd パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007003807A (ja) * 2005-06-23 2007-01-11 Sumitomo Bakelite Co Ltd 感光性樹脂組成物および該組成物を用いたソルダーレジスト
JP2007025176A (ja) * 2005-07-14 2007-02-01 Fujifilm Holdings Corp パターン形成材料、並びにパターン形成装置及び永久パターン形成方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040299A1 (ja) * 2009-09-30 2011-04-07 富士フイルム株式会社 感光性組成物、感光性ソルダーレジスト組成物及び感光性ソルダーレジストフィルム、並びに、永久パターン、その形成方法及びプリント基板
JP2011095705A (ja) * 2009-09-30 2011-05-12 Fujifilm Corp 感光性組成物、感光性ソルダーレジスト組成物及び感光性ソルダーレジストフィルム、並びに、永久パターン、その形成方法及びプリント基板
CN102399352A (zh) * 2010-09-15 2012-04-04 南开大学 一种含能热塑性弹性体及其合成方法
CN102399352B (zh) * 2010-09-15 2013-05-22 南开大学 一种含能热塑性弹性体及其合成方法

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Publication number Publication date
KR20100014433A (ko) 2010-02-10
JP2010145425A (ja) 2010-07-01
CN101652716A (zh) 2010-02-17

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