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WO2008078483A1 - 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 - Google Patents

感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 Download PDF

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Publication number
WO2008078483A1
WO2008078483A1 PCT/JP2007/072622 JP2007072622W WO2008078483A1 WO 2008078483 A1 WO2008078483 A1 WO 2008078483A1 JP 2007072622 W JP2007072622 W JP 2007072622W WO 2008078483 A1 WO2008078483 A1 WO 2008078483A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
wiring board
printed wiring
resist pattern
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/072622
Other languages
English (en)
French (fr)
Inventor
Masahiro Miyasaka
Yukiko Muramatsu
Hanako Nankawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN2007800481739A priority Critical patent/CN101568883B/zh
Priority to JP2008550999A priority patent/JP5029617B2/ja
Priority to KR1020097012516A priority patent/KR101141909B1/ko
Priority to KR1020117020669A priority patent/KR101168828B1/ko
Publication of WO2008078483A1 publication Critical patent/WO2008078483A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Ceramic Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

　本発明の感光性樹脂組成物は、（Ａ）下記一般式（Ｉ）～（ＩＶ）で表される２価の基を有するバインダーポリマー、（Ｂ）光重合性化合物、及び（Ｃ）光重合開始剤を含有する。 ［式（Ｉ）～（ＩＶ）中、Ｒ１，Ｒ３，Ｒ５及びＲ６はそれぞれ独立に水素原子又はメチル基を示し、Ｒ２及びＲ４はそれぞれ独立に炭素数１～３のアルキル基、炭素数１～３のアルコキシ基、ＯＨ基又はハロゲン原子を示し、Ｒ７は炭素数１～６のアルキル基を示す。］
PCT/JP2007/072622 2006-12-27 2007-11-22 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 Ceased WO2008078483A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2007800481739A CN101568883B (zh) 2006-12-27 2007-11-22 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及印刷电路板的制造方法
JP2008550999A JP5029617B2 (ja) 2006-12-27 2007-11-22 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
KR1020097012516A KR101141909B1 (ko) 2006-12-27 2007-11-22 감광성수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조방법
KR1020117020669A KR101168828B1 (ko) 2006-12-27 2007-11-22 감광성수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006352734 2006-12-27
JP2006-352734 2006-12-27

Publications (1)

Publication Number Publication Date
WO2008078483A1 true WO2008078483A1 (ja) 2008-07-03

Family

ID=39562276

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/072622 Ceased WO2008078483A1 (ja) 2006-12-27 2007-11-22 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Country Status (5)

Country Link
JP (4) JP5029617B2 (ja)
KR (2) KR101141909B1 (ja)
CN (3) CN101568883B (ja)
TW (2) TWI412887B (ja)
WO (1) WO2008078483A1 (ja)

Cited By (8)

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WO2010098183A1 (ja) * 2009-02-26 2010-09-02 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2012137768A (ja) * 2006-12-27 2012-07-19 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2012252320A (ja) * 2011-05-10 2012-12-20 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法
JP2013092676A (ja) * 2011-10-26 2013-05-16 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JPWO2012067107A1 (ja) * 2010-11-17 2014-05-12 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2015018029A (ja) * 2013-07-09 2015-01-29 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
US10104781B2 (en) 2013-12-27 2018-10-16 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
US10564543B2 (en) 2014-09-18 2020-02-18 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board

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CN102854750B (zh) * 2010-07-30 2014-08-27 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀剂图形制法、引线框制法及线路板制法
CN103076719B (zh) * 2011-10-26 2019-08-09 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法
CN103076717A (zh) * 2011-10-26 2013-05-01 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法
TWI521016B (zh) 2012-07-18 2016-02-11 財團法人工業技術研究院 蝕刻含聚亞醯胺之膜層的方法
JP6361191B2 (ja) * 2014-03-14 2018-07-25 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びタッチパネルの製造方法
CN114296315B (zh) * 2015-09-11 2025-09-05 旭化成株式会社 感光性树脂组合物
CN106909026B (zh) * 2017-03-31 2019-11-22 苏州福斯特光伏材料有限公司 一种可直接描绘曝光成像的抗蚀剂组合物及抗蚀剂层压体
CN109856912A (zh) * 2019-03-11 2019-06-07 浙江福斯特新材料研究院有限公司 一种高附着力感光性树脂组合物
CN111752096B (zh) * 2019-03-29 2022-10-14 常州正洁智造科技有限公司 用于彩色滤光片的感光性树脂组合物及彩色滤光片
WO2021192058A1 (ja) * 2020-03-24 2021-09-30 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性エレメント、及び配線基板の製造方法
WO2022044963A1 (ja) * 2020-08-24 2022-03-03 富士フイルム株式会社 転写フィルム、積層体の製造方法、回路配線の製造方法、電子デバイスの製造方法
JP2023059827A (ja) 2021-10-15 2023-04-27 三菱製紙株式会社 感光性樹脂組成物及びめっき方法

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Cited By (15)

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Publication number Priority date Publication date Assignee Title
JP2012137768A (ja) * 2006-12-27 2012-07-19 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
TWI479261B (zh) * 2009-02-26 2015-04-01 Hitachi Chemical Co Ltd A photosensitive resin composition and a photosensitive member using the same, a method of forming a photoresist pattern, and a method of manufacturing the printed circuit board
CN102317864A (zh) * 2009-02-26 2012-01-11 日立化成工业株式会社 感光性树脂组合物、以及使用了该组合物的感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法
WO2010098183A1 (ja) * 2009-02-26 2010-09-02 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN104808444A (zh) * 2009-02-26 2015-07-29 日立化成工业株式会社 感光性树脂组合物、以及感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法
JP5327310B2 (ja) * 2009-02-26 2013-10-30 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
KR101339530B1 (ko) 2009-02-26 2013-12-10 히타치가세이가부시끼가이샤 감광성 수지 조성물, 및 이것을 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
CN103543608A (zh) * 2009-02-26 2014-01-29 日立化成工业株式会社 感光性树脂组合物、以及使用了该组合物的感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法
JPWO2012067107A1 (ja) * 2010-11-17 2014-05-12 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2012252320A (ja) * 2011-05-10 2012-12-20 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法
JP2016118793A (ja) * 2011-05-10 2016-06-30 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法
JP2013092676A (ja) * 2011-10-26 2013-05-16 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2015018029A (ja) * 2013-07-09 2015-01-29 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
US10104781B2 (en) 2013-12-27 2018-10-16 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
US10564543B2 (en) 2014-09-18 2020-02-18 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board

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Publication number Publication date
JP2012137768A (ja) 2012-07-19
CN102385253B (zh) 2014-08-27
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