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WO2008123087A1 - 異方性導電ペースト - Google Patents

異方性導電ペースト Download PDF

Info

Publication number
WO2008123087A1
WO2008123087A1 PCT/JP2008/055042 JP2008055042W WO2008123087A1 WO 2008123087 A1 WO2008123087 A1 WO 2008123087A1 JP 2008055042 W JP2008055042 W JP 2008055042W WO 2008123087 A1 WO2008123087 A1 WO 2008123087A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive paste
anisotropic conductive
inorganic filler
solder particles
insulating inorganic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055042
Other languages
English (en)
French (fr)
Inventor
Tadahiko Sakai
Hideki Eifuku
Yukinari Abe
Satomi Kawamoto
Kaori Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Namics Corp
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp, Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Namics Corp
Priority to JP2009509040A priority Critical patent/JP5491856B2/ja
Publication of WO2008123087A1 publication Critical patent/WO2008123087A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H10W72/07331—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　高温高湿下でも信頼性の高い電気接続を可能とする異方性導電ペースト、及び該異方性導電ペーストを用いた接続を含む半導体装置を提供する。エポキシ樹脂、イミダゾール化合物、ハンダ粒子及び絶縁性無機フィラーを含み、ハンダ粒子の平均粒子寸法よりも、絶縁性無機フィラーの平均粒子寸法が小さい、異方性導電ペーストである。
PCT/JP2008/055042 2007-03-19 2008-03-19 異方性導電ペースト Ceased WO2008123087A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009509040A JP5491856B2 (ja) 2007-03-19 2008-03-19 異方性導電ペースト

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-071346 2007-03-19
JP2007071346 2007-03-19

Publications (1)

Publication Number Publication Date
WO2008123087A1 true WO2008123087A1 (ja) 2008-10-16

Family

ID=39830588

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055042 Ceased WO2008123087A1 (ja) 2007-03-19 2008-03-19 異方性導電ペースト

Country Status (4)

Country Link
JP (1) JP5491856B2 (ja)
KR (1) KR20090129478A (ja)
TW (1) TWI476266B (ja)
WO (1) WO2008123087A1 (ja)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219507A (ja) * 2009-02-20 2010-09-30 Panasonic Corp はんだバンプ、半導体チップ、半導体チップの製造方法、導電接続構造体、および導電接続構造体の製造方法
JP2012072211A (ja) * 2010-09-27 2012-04-12 Panasonic Corp 熱硬化性樹脂組成物及び半導体部品実装基板
CN103666297A (zh) * 2012-09-21 2014-03-26 第一毛织株式会社 各向异性导电膜和包括它的半导体装置
JP2014209624A (ja) * 2014-04-18 2014-11-06 パナソニック株式会社 回路基板と半導体部品との接合部構造
WO2015056754A1 (ja) * 2013-10-17 2015-04-23 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体
WO2015133343A1 (ja) * 2014-03-07 2015-09-11 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
WO2015178482A1 (ja) * 2014-05-23 2015-11-26 デクセリアルズ株式会社 接着剤及び接続構造体
JP2015221876A (ja) * 2014-05-23 2015-12-10 デクセリアルズ株式会社 接着剤及び接続構造体
JP2015221875A (ja) * 2014-05-23 2015-12-10 デクセリアルズ株式会社 接着剤及び接続構造体
JP2016054296A (ja) * 2014-09-01 2016-04-14 積水化学工業株式会社 接続構造体の製造方法
CN106062119A (zh) * 2014-03-19 2016-10-26 迪睿合株式会社 各向异性导电粘接剂
WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
CN108251030A (zh) * 2016-12-28 2018-07-06 株式会社田村制作所 各向异性导电糊及电子基板的制造方法
JP2020152789A (ja) * 2019-03-19 2020-09-24 パナソニックＩｐマネジメント株式会社 樹脂組成物およびこれを含む異方性導電フィルム、並びに電子装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI499775B (zh) * 2013-01-28 2015-09-11 Tanaka Precious Metal Ind 氣體感測電極形成用之金屬膏

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08195414A (ja) * 1995-01-12 1996-07-30 Toshiba Corp 半導体装置
WO1998003047A1 (fr) * 1996-07-15 1998-01-22 Hitachi Chemical Company, Ltd. Adhesif du type film destine a la connexion d'un circuit et d'une plaquette de circuits
JPH1021746A (ja) * 1996-07-02 1998-01-23 Toshiba Chem Corp 異方性導電膜
WO1999001519A1 (fr) * 1997-07-04 1999-01-14 Nippon Zeon Co., Ltd. Adhesif pour composants semi-conducteurs
JP2001184949A (ja) * 1999-12-24 2001-07-06 Asahi Kasei Corp 異方導電性材料
WO2005035617A1 (ja) * 2003-10-10 2005-04-21 Asahi Kasei Chemicals Corporation 潜在性硬化剤および組成物
JP2006137954A (ja) * 2005-11-16 2006-06-01 Hitachi Chem Co Ltd 回路接続用接着剤
JP2006257280A (ja) * 2005-03-17 2006-09-28 Fuji Electric Holdings Co Ltd 電子部品実装用熱硬化性樹脂組成物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08195414A (ja) * 1995-01-12 1996-07-30 Toshiba Corp 半導体装置
JPH1021746A (ja) * 1996-07-02 1998-01-23 Toshiba Chem Corp 異方性導電膜
WO1998003047A1 (fr) * 1996-07-15 1998-01-22 Hitachi Chemical Company, Ltd. Adhesif du type film destine a la connexion d'un circuit et d'une plaquette de circuits
WO1999001519A1 (fr) * 1997-07-04 1999-01-14 Nippon Zeon Co., Ltd. Adhesif pour composants semi-conducteurs
JP2001184949A (ja) * 1999-12-24 2001-07-06 Asahi Kasei Corp 異方導電性材料
WO2005035617A1 (ja) * 2003-10-10 2005-04-21 Asahi Kasei Chemicals Corporation 潜在性硬化剤および組成物
JP2006257280A (ja) * 2005-03-17 2006-09-28 Fuji Electric Holdings Co Ltd 電子部品実装用熱硬化性樹脂組成物
JP2006137954A (ja) * 2005-11-16 2006-06-01 Hitachi Chem Co Ltd 回路接続用接着剤

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219507A (ja) * 2009-02-20 2010-09-30 Panasonic Corp はんだバンプ、半導体チップ、半導体チップの製造方法、導電接続構造体、および導電接続構造体の製造方法
JP2012072211A (ja) * 2010-09-27 2012-04-12 Panasonic Corp 熱硬化性樹脂組成物及び半導体部品実装基板
CN103666297A (zh) * 2012-09-21 2014-03-26 第一毛织株式会社 各向异性导电膜和包括它的半导体装置
WO2015056754A1 (ja) * 2013-10-17 2015-04-23 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体
CN105684096B (zh) * 2014-03-07 2018-04-17 积水化学工业株式会社 导电糊剂、连接结构体及连接结构体的制造方法
JP5851071B1 (ja) * 2014-03-07 2016-02-03 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
WO2015133343A1 (ja) * 2014-03-07 2015-09-11 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
CN105684096A (zh) * 2014-03-07 2016-06-15 积水化学工业株式会社 导电糊剂、连接结构体及连接结构体的制造方法
JP2016048691A (ja) * 2014-03-07 2016-04-07 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
CN106062119B (zh) * 2014-03-19 2018-12-07 迪睿合株式会社 各向异性导电粘接剂
CN106062119A (zh) * 2014-03-19 2016-10-26 迪睿合株式会社 各向异性导电粘接剂
KR20160135700A (ko) * 2014-03-19 2016-11-28 데쿠세리아루즈 가부시키가이샤 이방성 도전 접착제
KR102339440B1 (ko) 2014-03-19 2021-12-14 데쿠세리아루즈 가부시키가이샤 이방성 도전 접착제
EP3121237A4 (en) * 2014-03-19 2017-10-18 Dexerials Corporation Anisotropic conductive adhesive
JP2014209624A (ja) * 2014-04-18 2014-11-06 パナソニック株式会社 回路基板と半導体部品との接合部構造
WO2015178482A1 (ja) * 2014-05-23 2015-11-26 デクセリアルズ株式会社 接着剤及び接続構造体
JP2015221876A (ja) * 2014-05-23 2015-12-10 デクセリアルズ株式会社 接着剤及び接続構造体
JP2015221875A (ja) * 2014-05-23 2015-12-10 デクセリアルズ株式会社 接着剤及び接続構造体
US10435601B2 (en) 2014-05-23 2019-10-08 Dexerials Corporation Adhesive agent and connection structure
JP2016054296A (ja) * 2014-09-01 2016-04-14 積水化学工業株式会社 接続構造体の製造方法
JPWO2017033934A1 (ja) * 2015-08-24 2017-10-12 積水化学工業株式会社 導電材料及び接続構造体
WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
CN108251030A (zh) * 2016-12-28 2018-07-06 株式会社田村制作所 各向异性导电糊及电子基板的制造方法
JP2020152789A (ja) * 2019-03-19 2020-09-24 パナソニックＩｐマネジメント株式会社 樹脂組成物およびこれを含む異方性導電フィルム、並びに電子装置
JP7249549B2 (ja) 2019-03-19 2023-03-31 パナソニックＩｐマネジメント株式会社 樹脂組成物およびこれを含む異方性導電フィルム、並びに電子装置

Also Published As

Publication number Publication date
TW200902673A (en) 2009-01-16
TWI476266B (zh) 2015-03-11
JP5491856B2 (ja) 2014-05-14
KR20090129478A (ko) 2009-12-16
JPWO2008123087A1 (ja) 2010-07-15

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