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WO2008133037A1 - 導電性粒子体及びこれを用いた異方性導電接続材料、並びに導電性粒子体の製造方法 - Google Patents

導電性粒子体及びこれを用いた異方性導電接続材料、並びに導電性粒子体の製造方法 Download PDF

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Publication number
WO2008133037A1
WO2008133037A1 PCT/JP2008/057150 JP2008057150W WO2008133037A1 WO 2008133037 A1 WO2008133037 A1 WO 2008133037A1 JP 2008057150 W JP2008057150 W JP 2008057150W WO 2008133037 A1 WO2008133037 A1 WO 2008133037A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conductive
conductive particle
particle
connection material
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057150
Other languages
English (en)
French (fr)
Inventor
Yasushi Akutsu
Hidetsugu Namiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to US12/515,118 priority Critical patent/US8309224B2/en
Priority to HK10106550.7A priority patent/HK1140575B/xx
Priority to KR1020097017355A priority patent/KR101402508B1/ko
Priority to CN2008800124134A priority patent/CN101681692B/zh
Publication of WO2008133037A1 publication Critical patent/WO2008133037A1/ja
Anticipated expiration legal-status Critical
Priority to US12/982,184 priority patent/US8846142B2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)

Abstract

　本発明は、基板、電子部品間等の導電接続を行う異方性導電接続材料に用いられる導電性粒子体であり、少なくとも表面が導電性を有する基材粒子（２）と、上記基材粒子の表面を被覆するように絶縁性樹脂の微粒子（３ａ）の融着に基づく連続した絶縁性樹脂膜（３）とを有し、少なくとも上記微粒子間に空隙を有している。
PCT/JP2008/057150 2007-04-16 2008-04-11 導電性粒子体及びこれを用いた異方性導電接続材料、並びに導電性粒子体の製造方法 Ceased WO2008133037A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/515,118 US8309224B2 (en) 2007-04-16 2008-04-11 Conductive particle, anisotropic conductive interconnection material that uses the conductive particle, and method for producing the conductive particle
HK10106550.7A HK1140575B (en) 2007-04-16 2008-04-11 Electrically conductive particle, anisotropic conductive connection material, and method for production of electrically conductive particle
KR1020097017355A KR101402508B1 (ko) 2007-04-16 2008-04-11 도전성 입자체 및 이것을 이용한 이방성 도전 접속 재료, 및 도전성 입자체의 제조 방법
CN2008800124134A CN101681692B (zh) 2007-04-16 2008-04-11 导电性粒子体及使用该粒子体的各向异性导电连接材料、以及导电性粒子体的制造方法
US12/982,184 US8846142B2 (en) 2007-04-16 2010-12-30 Conductive particle, anisotropic conductive interconnection material that uses the conductive particle, and method for producing the conductive particle

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007107475A JP5074082B2 (ja) 2007-04-16 2007-04-16 導電性粒子体及びこれを用いた異方性導電接続材料、並びに導電性粒子体の製造方法
JP2007-107475 2007-04-16

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/515,118 A-371-Of-International US8309224B2 (en) 2007-04-16 2008-04-11 Conductive particle, anisotropic conductive interconnection material that uses the conductive particle, and method for producing the conductive particle
US12/982,184 Division US8846142B2 (en) 2007-04-16 2010-12-30 Conductive particle, anisotropic conductive interconnection material that uses the conductive particle, and method for producing the conductive particle

Publications (1)

Publication Number Publication Date
WO2008133037A1 true WO2008133037A1 (ja) 2008-11-06

Family

ID=39925496

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057150 Ceased WO2008133037A1 (ja) 2007-04-16 2008-04-11 導電性粒子体及びこれを用いた異方性導電接続材料、並びに導電性粒子体の製造方法

Country Status (6)

Country Link
US (2) US8309224B2 (ja)
JP (1) JP5074082B2 (ja)
KR (1) KR101402508B1 (ja)
CN (1) CN101681692B (ja)
TW (1) TWI486976B (ja)
WO (1) WO2008133037A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011086598A (ja) * 2009-09-15 2011-04-28 Nippon Shokubai Co Ltd 絶縁性微粒子被覆導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4957838B2 (ja) 2009-08-06 2012-06-20 日立化成工業株式会社 導電性微粒子及び異方性導電材料
JP5402804B2 (ja) * 2010-04-12 2014-01-29 デクセリアルズ株式会社 発光装置の製造方法
JP5650611B2 (ja) 2011-08-23 2015-01-07 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続方法、及び接合体
KR101403865B1 (ko) * 2011-12-16 2014-06-10 제일모직주식회사 이방성 도전 필름용 조성물, 이방성 도전 필름 및 반도체 장치
JP6289831B2 (ja) * 2013-07-29 2018-03-07 デクセリアルズ株式会社 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
CN104576966B (zh) * 2014-12-31 2017-02-01 北京维信诺科技有限公司 一种柔性显示装置及其制备方法
KR101763556B1 (ko) * 2015-03-06 2017-08-16 (주)뉴옵틱스 전도성 플레이트
US20190100663A1 (en) * 2017-10-03 2019-04-04 Shin-Etsu Chemical Co., Ltd. Anisotropic conductive film and method for manufacturing anisotropic conductive film
JP7671142B2 (ja) * 2019-02-28 2025-05-01 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
KR20210041661A (ko) * 2019-10-07 2021-04-16 삼성디스플레이 주식회사 표시모듈 제조장치 및 표시모듈 제조방법
KR20220090647A (ko) 2020-12-22 2022-06-30 삼성디스플레이 주식회사 이방성 도전 필름을 포함하는 표시 장치 및 표시 장치의 제조 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003025955A1 (en) * 2001-09-14 2003-03-27 Sekisui Chemical Co., Ltd. Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
JP2005044773A (ja) * 2003-07-07 2005-02-17 Sekisui Chem Co Ltd 被覆導電性粒子、異方性導電材料及び導電接続構造体

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Publication number Priority date Publication date Assignee Title
KR19980081191A (ko) * 1997-04-08 1998-11-25 모리시다요이치 도전성 페이스트 및 그 제조방법과 그것을 이용한 프린트 배선기판
KR100589799B1 (ko) * 2003-05-06 2006-06-14 한화석유화학 주식회사 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품
CN100437838C (zh) * 2003-07-07 2008-11-26 积水化学工业株式会社 包覆导电性粒子、各向异性导电材料以及导电连接结构体
JP4724369B2 (ja) * 2003-09-29 2011-07-13 ソニーケミカル＆インフォメーションデバイス株式会社 導電粒子の製造方法
KR100597391B1 (ko) * 2004-05-12 2006-07-06 제일모직주식회사 절연 전도성 미립자 및 이를 함유하는 이방 전도성 접착필름
KR100722493B1 (ko) * 2005-09-02 2007-05-28 제일모직주식회사 절연 전도성 미립자 및 이를 이용한 이방 전도성 접착필름

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003025955A1 (en) * 2001-09-14 2003-03-27 Sekisui Chemical Co., Ltd. Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
JP2005044773A (ja) * 2003-07-07 2005-02-17 Sekisui Chem Co Ltd 被覆導電性粒子、異方性導電材料及び導電接続構造体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011086598A (ja) * 2009-09-15 2011-04-28 Nippon Shokubai Co Ltd 絶縁性微粒子被覆導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体

Also Published As

Publication number Publication date
TWI486976B (zh) 2015-06-01
US20110095235A1 (en) 2011-04-28
US8846142B2 (en) 2014-09-30
KR101402508B1 (ko) 2014-06-03
KR20090129991A (ko) 2009-12-17
CN101681692B (zh) 2012-11-14
JP2008269816A (ja) 2008-11-06
TW200849286A (en) 2008-12-16
JP5074082B2 (ja) 2012-11-14
US8309224B2 (en) 2012-11-13
US20100051878A1 (en) 2010-03-04
HK1140575A1 (en) 2010-10-15
CN101681692A (zh) 2010-03-24

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