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WO2008078478A1 - 導電性バンプとその形成方法および半導体装置とその製造方法 - Google Patents

導電性バンプとその形成方法および半導体装置とその製造方法 Download PDF

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Publication number
WO2008078478A1
WO2008078478A1 PCT/JP2007/072423 JP2007072423W WO2008078478A1 WO 2008078478 A1 WO2008078478 A1 WO 2008078478A1 JP 2007072423 W JP2007072423 W JP 2007072423W WO 2008078478 A1 WO2008078478 A1 WO 2008078478A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive bump
manufacturing
semiconductor device
conductive
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/072423
Other languages
English (en)
French (fr)
Inventor
Yoshihiko Yagi
Daisuke Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to KR1020097009613A priority Critical patent/KR101155709B1/ko
Priority to JP2008550997A priority patent/JP5003689B2/ja
Priority to US12/514,649 priority patent/US7928566B2/en
Priority to CN2007800424492A priority patent/CN101578694B/zh
Publication of WO2008078478A1 publication Critical patent/WO2008078478A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W72/20—
    • H10W72/01223—
    • H10W72/01261—
    • H10W72/07251—
    • H10W72/074—
    • H10W72/224—
    • H10W72/225—
    • H10W72/251—
    • H10W72/252—
    • H10W72/253—
    • H10W72/354—
    • H10W72/90—
    • H10W72/923—
    • H10W72/9415—
    • H10W74/012—
    • H10W74/15—

Landscapes

  • Wire Bonding (AREA)

Abstract

電子部品の電極端子（１１）面に形成された導電性バンプ（１７）であって、導電性バンプ（１７）は、少なくとも導電性フィラーの密度が異なる複数の樹脂硬化物で構成される。それにより、実装時の導電性バンプ（１７）の潰れによる短絡や接続不良などの発生を防止できるものである。
PCT/JP2007/072423 2006-12-27 2007-11-20 導電性バンプとその形成方法および半導体装置とその製造方法 Ceased WO2008078478A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097009613A KR101155709B1 (ko) 2006-12-27 2007-11-20 도전성 범프와 그 형성 방법 및 반도체 장치와 그 제조 방법
JP2008550997A JP5003689B2 (ja) 2006-12-27 2007-11-20 導電性バンプ
US12/514,649 US7928566B2 (en) 2006-12-27 2007-11-20 Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device
CN2007800424492A CN101578694B (zh) 2006-12-27 2007-11-20 导电性凸块及其形成方法和半导体装置及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-351242 2006-12-27
JP2006351242 2006-12-27

Publications (1)

Publication Number Publication Date
WO2008078478A1 true WO2008078478A1 (ja) 2008-07-03

Family

ID=39562271

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/072423 Ceased WO2008078478A1 (ja) 2006-12-27 2007-11-20 導電性バンプとその形成方法および半導体装置とその製造方法

Country Status (6)

Country Link
US (1) US7928566B2 (ja)
JP (1) JP5003689B2 (ja)
KR (1) KR101155709B1 (ja)
CN (1) CN101578694B (ja)
TW (1) TWI469232B (ja)
WO (1) WO2008078478A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009038331A (ja) * 2007-07-11 2009-02-19 Sony Corp 配線への素子の電気的接続方法及び発光素子組立体の製造方法、並びに、発光素子組立体
US7838410B2 (en) 2007-07-11 2010-11-23 Sony Corporation Method of electrically connecting element to wiring, method of producing light-emitting element assembly, and light-emitting element assembly
WO2010034650A3 (de) * 2008-09-26 2011-01-20 Robert Bosch Gmbh Kontaktanordnung zur herstellung einer beabstandeten, elektrisch leitfähigen verbindung zwischen mikrostrukturierten bauteilen
WO2012081144A1 (ja) * 2010-12-15 2012-06-21 パナソニック株式会社 半導体装置及びその製造方法
WO2014129626A1 (ja) * 2013-02-22 2014-08-28 古河電気工業株式会社 接続構造体、及び半導体装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101677739B1 (ko) * 2010-09-29 2016-11-21 삼성전자주식회사 반도체 패키지 및 그의 제조방법
KR101479811B1 (ko) * 2011-12-02 2015-01-08 광 석 서 투명 전극 필름 제조용 기재 필름
CN113556882B (zh) * 2020-04-23 2022-08-16 鹏鼎控股(深圳)股份有限公司 透明电路板的制作方法以及透明电路板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02280334A (ja) * 1989-04-21 1990-11-16 Citizen Watch Co Ltd 半導体装置及びその製造方法
JPH06151438A (ja) * 1992-11-12 1994-05-31 Tanaka Kikinzoku Kogyo Kk 感光性導電ペーストによるバンプ形成方法
JPH11274209A (ja) * 1998-01-22 1999-10-08 Ricoh Microelectronics Co Ltd バンプ電極形成方法
JPH11274199A (ja) * 1998-03-19 1999-10-08 Ricoh Microelectronics Co Ltd バンプ電極形成方法及びその装置

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
JPH0747233B2 (ja) 1987-09-14 1995-05-24 古河電気工業株式会社 半田析出用組成物および半田析出方法
JP3537871B2 (ja) 1993-07-05 2004-06-14 昭和電工株式会社 はんだコートおよびその形成方法
US5977615A (en) * 1996-12-24 1999-11-02 Matsushita Electronics Corporation Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device
US6297559B1 (en) * 1997-07-10 2001-10-02 International Business Machines Corporation Structure, materials, and applications of ball grid array interconnections
US6225205B1 (en) * 1998-01-22 2001-05-01 Ricoh Microelectronics Company, Ltd. Method of forming bump electrodes
JP3996276B2 (ja) 1998-09-22 2007-10-24 ハリマ化成株式会社 ソルダペースト及びその製造方法並びにはんだプリコート方法
JP3822040B2 (ja) * 2000-08-31 2006-09-13 株式会社ルネサステクノロジ 電子装置及びその製造方法
TWI230425B (en) * 2004-02-06 2005-04-01 South Epitaxy Corp Bumping process for light emitting diode
JP4385794B2 (ja) * 2004-02-26 2009-12-16 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接続方法
JP4761164B2 (ja) * 2006-03-31 2011-08-31 ブラザー工業株式会社 接続構造、および部品搭載基板
KR101087344B1 (ko) * 2007-03-23 2011-11-25 파나소닉 주식회사 도전성 범프와 그 제조 방법 및 전자 부품 실장 구조체
US20100052163A1 (en) * 2007-04-27 2010-03-04 Nec Corporation Semiconductor device, method of manufacturing same and method of repairing same
JP5366674B2 (ja) * 2008-06-27 2013-12-11 パナソニック株式会社 実装構造体および実装方法
JP5542470B2 (ja) * 2009-02-20 2014-07-09 パナソニック株式会社 はんだバンプ、半導体チップ、半導体チップの製造方法、導電接続構造体、および導電接続構造体の製造方法
JP2010263014A (ja) * 2009-04-30 2010-11-18 Panasonic Corp 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02280334A (ja) * 1989-04-21 1990-11-16 Citizen Watch Co Ltd 半導体装置及びその製造方法
JPH06151438A (ja) * 1992-11-12 1994-05-31 Tanaka Kikinzoku Kogyo Kk 感光性導電ペーストによるバンプ形成方法
JPH11274209A (ja) * 1998-01-22 1999-10-08 Ricoh Microelectronics Co Ltd バンプ電極形成方法
JPH11274199A (ja) * 1998-03-19 1999-10-08 Ricoh Microelectronics Co Ltd バンプ電極形成方法及びその装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009038331A (ja) * 2007-07-11 2009-02-19 Sony Corp 配線への素子の電気的接続方法及び発光素子組立体の製造方法、並びに、発光素子組立体
US7838410B2 (en) 2007-07-11 2010-11-23 Sony Corporation Method of electrically connecting element to wiring, method of producing light-emitting element assembly, and light-emitting element assembly
WO2010034650A3 (de) * 2008-09-26 2011-01-20 Robert Bosch Gmbh Kontaktanordnung zur herstellung einer beabstandeten, elektrisch leitfähigen verbindung zwischen mikrostrukturierten bauteilen
CN102164847B (zh) * 2008-09-26 2015-09-23 罗伯特·博世有限公司 用于在微结构化部件之间制造间隔的导电连接的接触装置
WO2012081144A1 (ja) * 2010-12-15 2012-06-21 パナソニック株式会社 半導体装置及びその製造方法
WO2014129626A1 (ja) * 2013-02-22 2014-08-28 古河電気工業株式会社 接続構造体、及び半導体装置

Also Published As

Publication number Publication date
CN101578694A (zh) 2009-11-11
CN101578694B (zh) 2011-07-13
US20100029044A1 (en) 2010-02-04
KR101155709B1 (ko) 2012-06-12
TW200834771A (en) 2008-08-16
KR20090067202A (ko) 2009-06-24
JP5003689B2 (ja) 2012-08-15
US7928566B2 (en) 2011-04-19
JPWO2008078478A1 (ja) 2010-04-15
TWI469232B (zh) 2015-01-11

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