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WO2008084651A1 - 硬化性組成物 - Google Patents

硬化性組成物 Download PDF

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Publication number
WO2008084651A1
WO2008084651A1 PCT/JP2007/074626 JP2007074626W WO2008084651A1 WO 2008084651 A1 WO2008084651 A1 WO 2008084651A1 JP 2007074626 W JP2007074626 W JP 2007074626W WO 2008084651 A1 WO2008084651 A1 WO 2008084651A1
Authority
WO
WIPO (PCT)
Prior art keywords
curable composition
plasticizer
dispersion
coupling agent
silane coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/074626
Other languages
English (en)
French (fr)
Inventor
Ayako Yano
Noriko Matsushita
Takeshi Sonoda
Shintaro Komitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Priority to JP2008553048A priority Critical patent/JP5284797B2/ja
Priority to EP07851032.8A priority patent/EP2123720B1/en
Priority to US12/522,872 priority patent/US8415444B2/en
Publication of WO2008084651A1 publication Critical patent/WO2008084651A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
    • C08G65/2606—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups
    • C08G65/2609—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups containing aliphatic hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2642—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds characterised by the catalyst used
    • C08G65/2645—Metals or compounds thereof, e.g. salts
    • C08G65/2663—Metal cyanide catalysts, i.e. DMC's
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/337—Polymers modified by chemical after-treatment with organic compounds containing other elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
    • C08L43/04—Homopolymers or copolymers of monomers containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
    • C09J143/04—Homopolymers or copolymers of monomers containing silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C08K5/31—Guanidine; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　本発明は硬化性組成物に関する発明であって、毒性が指摘されている有機錫系硬化触媒や、揮発性の化合物を含有せず、良好な硬化性、貯蔵安定性、硬化物の強度、伸びが良好である硬化性組成物を提供することを目的とするもので、分子中に加水分解性シリル基を有する有機重合体（Ａ）、アミジン化合物（Ｂ）、可塑剤（Ｃ）、アミノ基を有するシランカップリング剤（Ｄ）からなる硬化性組成物であり、アミジン化合物（Ｂ）を可塑剤（Ｃ）とアミノ基を有するシランカップリング剤（Ｄ）にあらかじめ混合して溶解および／または分散させたものを、反応性ケイ素基を有する化合物（Ａ）に添加してなることを特徴とする硬化性組成物が上記の目的を達成する解決手段として有効であることを見いだした。
PCT/JP2007/074626 2007-01-12 2007-12-21 硬化性組成物 Ceased WO2008084651A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008553048A JP5284797B2 (ja) 2007-01-12 2007-12-21 硬化性組成物
EP07851032.8A EP2123720B1 (en) 2007-01-12 2007-12-21 Curable composition
US12/522,872 US8415444B2 (en) 2007-01-12 2007-12-21 Curable composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-004607 2007-01-12
JP2007004607 2007-01-12

Publications (1)

Publication Number Publication Date
WO2008084651A1 true WO2008084651A1 (ja) 2008-07-17

Family

ID=39608548

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074626 Ceased WO2008084651A1 (ja) 2007-01-12 2007-12-21 硬化性組成物

Country Status (4)

Country Link
US (1) US8415444B2 (ja)
EP (1) EP2123720B1 (ja)
JP (1) JP5284797B2 (ja)
WO (1) WO2008084651A1 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110154772A1 (en) * 2009-12-31 2011-06-30 Bostik, Inc. Moisture Curable Adhesive Composition and Method for Installing Hardwood Floors
JP2012530174A (ja) * 2009-06-15 2012-11-29 ブルースター・シリコーンズ・フランス 錫を含まないシリコーン組成物を可撓性媒体上に被覆するための方法
JP2015038192A (ja) * 2013-07-16 2015-02-26 セメダイン株式会社 硬化性組成物
JP2015206048A (ja) * 2009-10-16 2015-11-19 株式会社カネカ 硬化性組成物
CN105969286A (zh) * 2016-06-06 2016-09-28 北京市建筑工程研究院有限责任公司 一种装配式建筑混凝土接缝耐候密封胶及其制备方法
JP2018512483A (ja) * 2015-04-16 2018-05-17 シーカ テクノロジー アクチェンゲゼルシャフト アミジン基含有触媒
JP2019006971A (ja) * 2017-06-23 2019-01-17 積水フーラー株式会社 硬化性組成物
JP2020083974A (ja) * 2018-11-21 2020-06-04 積水フーラー株式会社 硬化性組成物
JP2022132809A (ja) * 2021-03-01 2022-09-13 株式会社カネカ 硬化性樹脂組成物及びその硬化物
WO2024157860A1 (ja) * 2023-01-23 2024-08-02 株式会社カネカ 硬化性組成物の製造方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5420895B2 (ja) * 2006-02-16 2014-02-19 株式会社カネカ 硬化性組成物
BR112014016036B1 (pt) * 2011-12-28 2021-02-02 Bostik, Inc. composição seladora contendo polímeros de borracha não butílica de ligação não cruzada de aplicação a quente e unidade de janela de vidro isolante
US9404004B2 (en) 2011-12-28 2016-08-02 Bostik, Inc. High performance hotmelt window sealant
EP2935441B1 (en) * 2012-12-20 2017-02-01 Blue Cube IP LLC Low emission epoxy curing agents
EP2951234A2 (en) * 2013-02-01 2015-12-09 3M Innovative Properties Company Coating compositions and articles made therefrom
EP3010977A4 (en) 2013-06-20 2017-01-18 Momentive Performance Materials Inc. Moisture curable compound with thiourea
DE102013216787A1 (de) 2013-08-23 2015-02-26 Evonik Degussa Gmbh Guanidingruppen aufweisende semi-organische Siliciumgruppen enthaltende Verbindungen
US20150119480A1 (en) 2013-10-28 2015-04-30 Royal Adhesives & Sealants Canada Ltd. Use of Gas Adsorbed to Moledular Sieves to Expand One-Component Foams upon Exposure to Moisture
US20160326344A1 (en) * 2013-12-26 2016-11-10 Kaneka Corporation Curable composition and cured product thereof
US20150203624A1 (en) * 2014-01-21 2015-07-23 Vladimyr Wolan Second generation hybrid silane modified polymers of low viscosity for low toxicity rtv sealants and adhesives
US10100068B2 (en) * 2014-04-16 2018-10-16 Sika Technology Ag Amidine group—or guanidine group—containing silane
EP3362491B1 (de) * 2015-10-15 2020-07-29 Sika Technology AG Katalysatorsystem für härtbare zusammensetzungen auf basis von silangruppen-haltigen polymeren
US10544280B1 (en) * 2017-04-21 2020-01-28 Swimc Llc Joining compositions and methods
JP7721533B2 (ja) * 2019-12-19 2025-08-12 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 湿気硬化性ネットワークシリコーンポリマー及びその使用

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JP2015038192A (ja) * 2013-07-16 2015-02-26 セメダイン株式会社 硬化性組成物
JP2018512483A (ja) * 2015-04-16 2018-05-17 シーカ テクノロジー アクチェンゲゼルシャフト アミジン基含有触媒
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JP2022132809A (ja) * 2021-03-01 2022-09-13 株式会社カネカ 硬化性樹脂組成物及びその硬化物
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WO2024157860A1 (ja) * 2023-01-23 2024-08-02 株式会社カネカ 硬化性組成物の製造方法

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US20100004367A1 (en) 2010-01-07
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