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WO2008078587A1 - 発光装置、表示装置、および固体発光素子基板 - Google Patents

発光装置、表示装置、および固体発光素子基板 Download PDF

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Publication number
WO2008078587A1
WO2008078587A1 PCT/JP2007/074202 JP2007074202W WO2008078587A1 WO 2008078587 A1 WO2008078587 A1 WO 2008078587A1 JP 2007074202 W JP2007074202 W JP 2007074202W WO 2008078587 A1 WO2008078587 A1 WO 2008078587A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
solid
heat transfer
element substrate
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/074202
Other languages
English (en)
French (fr)
Inventor
Shuji Gomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to EP07850690A priority Critical patent/EP2101360A1/en
Priority to JP2008551036A priority patent/JP5097127B2/ja
Priority to US12/521,074 priority patent/US20100097783A1/en
Publication of WO2008078587A1 publication Critical patent/WO2008078587A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

製造コストを抑えて効率良い放熱を可能とする発光装置等を提供する。バックライト装置は、バックライトフレームに、ＬＥＤを複数備えるＬＥＤ基板が装着ねじによって装着されて、構成されている。ＬＥＤ基板には、各ＬＥＤが装着される伝熱用ランド３１０から、スルーホール３４０および伝熱回路３２０を介して、装着ねじによってバックライトフレームに装着される部位の接触伝熱ランド３３０に至る伝熱系回路３００が形成されている。
PCT/JP2007/074202 2006-12-25 2007-12-17 発光装置、表示装置、および固体発光素子基板 Ceased WO2008078587A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP07850690A EP2101360A1 (en) 2006-12-25 2007-12-17 Light emitting device, display device and solid-state light emitting element substrate
JP2008551036A JP5097127B2 (ja) 2006-12-25 2007-12-17 発光装置、表示装置、および固体発光素子基板
US12/521,074 US20100097783A1 (en) 2006-12-25 2007-12-17 Light emitting device, display device and solid-state light emitting element substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006347246 2006-12-25
JP2006-347246 2006-12-25

Publications (1)

Publication Number Publication Date
WO2008078587A1 true WO2008078587A1 (ja) 2008-07-03

Family

ID=39562380

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074202 Ceased WO2008078587A1 (ja) 2006-12-25 2007-12-17 発光装置、表示装置、および固体発光素子基板

Country Status (7)

Country Link
US (1) US20100097783A1 (ja)
EP (1) EP2101360A1 (ja)
JP (1) JP5097127B2 (ja)
KR (1) KR20090093963A (ja)
CN (1) CN101563792A (ja)
TW (1) TW200832018A (ja)
WO (1) WO2008078587A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100201904A1 (en) * 2009-02-12 2010-08-12 Sang Jae Park Backlight unit
JP2010199057A (ja) * 2009-02-24 2010-09-09 Chi Mei Lighting Technology Corp Ｌｅｄランプ
KR20110002895A (ko) * 2009-06-29 2011-01-11 서울반도체 주식회사 발광장치
WO2011043094A1 (ja) * 2009-10-09 2011-04-14 シャープ株式会社 照明装置、及び表示装置
JP2011146402A (ja) * 2009-06-25 2011-07-28 Sharp Corp 光源装置、画像表示装置及びテレビ受像装置
US8636382B2 (en) 2009-06-25 2014-01-28 Sharp Kabushiki Kaisha Light source apparatus, image display apparatus and television receiving apparatus
US20140313733A1 (en) * 2009-05-22 2014-10-23 Sharp Kabushiki Kaisha Light source device and display device
US9341888B2 (en) 2009-05-22 2016-05-17 Sharp Kabushiki Kaisha Light reflection sheet, light source device, and display device
TWI832765B (zh) * 2023-05-18 2024-02-11 頎邦科技股份有限公司 薄膜電路板
WO2025183191A1 (ja) * 2024-02-28 2025-09-04 株式会社小糸製作所 照明装置
US12543262B2 (en) 2023-05-18 2026-02-03 Chipbond Technology Corporation Thin film circuit board

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5010311B2 (ja) * 2007-02-28 2012-08-29 Ｎｅｃディスプレイソリューションズ株式会社 投写型表示装置
EP2397753B1 (en) * 2010-06-15 2013-05-29 Kitagawa Holdings, LLC Led lamp and a heat sink thereof having a wound heat pipe
EP2450613B1 (en) 2010-11-08 2015-01-28 LG Innotek Co., Ltd. Lighting device
EP3417760A1 (en) * 2012-10-23 2018-12-26 Olympus Corporation Semiconductor apparatus, and manufacturing method of semiconductor apparatus
FR3001357B1 (fr) * 2013-01-22 2015-02-06 Sylumis Support de fixation mecanique et de raccordement electrique de diodes electroluminescentes
CN103115229B (zh) * 2013-02-27 2015-09-02 利亚德光电股份有限公司 Led显示单元及led显示系统
JP2015019068A (ja) * 2013-07-11 2015-01-29 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光部材及び照明装置
KR101600823B1 (ko) * 2015-06-15 2016-03-09 주식회사 구구라이팅 방열 구조가 개선된 엘이디 램프

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002040955A (ja) * 2000-07-25 2002-02-08 Sanyo Electric Co Ltd 表示装置
JP2002094122A (ja) * 2000-07-13 2002-03-29 Matsushita Electric Works Ltd 光源装置及びその製造方法
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール
JP2006059607A (ja) * 2004-08-18 2006-03-02 Sony Corp 放熱装置及び表示装置
JP2006080117A (ja) * 2004-09-07 2006-03-23 Hitachi Aic Inc チップ部品型発光装置及びそのための配線基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002084750A1 (en) * 2001-04-12 2002-10-24 Matsushita Electric Works, Ltd. Light source device using led, and method of producing same
KR20070000835A (ko) * 2005-06-28 2007-01-03 엘지.필립스 엘시디 주식회사 백라이트 유닛
US7431475B2 (en) * 2005-07-22 2008-10-07 Sony Corporation Radiator for light emitting unit, and backlight device
JP2007036073A (ja) * 2005-07-29 2007-02-08 Hitachi Displays Ltd 照明装置およびこの照明装置を用いた表示装置
US7513639B2 (en) * 2006-09-29 2009-04-07 Pyroswift Holding Co., Limited LED illumination apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002094122A (ja) * 2000-07-13 2002-03-29 Matsushita Electric Works Ltd 光源装置及びその製造方法
JP2002040955A (ja) * 2000-07-25 2002-02-08 Sanyo Electric Co Ltd 表示装置
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール
JP2006059607A (ja) * 2004-08-18 2006-03-02 Sony Corp 放熱装置及び表示装置
JP2006080117A (ja) * 2004-09-07 2006-03-23 Hitachi Aic Inc チップ部品型発光装置及びそのための配線基板

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101806976A (zh) * 2009-02-12 2010-08-18 Lg伊诺特有限公司 在模块衬底上含发光二极管的背光单元和含该单元的设备
EP2219067A1 (en) 2009-02-12 2010-08-18 LG Innotek Co., Ltd. A backlight unit comprising a light emitting diode on a module substrate, a device comprising said unit
US20100201904A1 (en) * 2009-02-12 2010-08-12 Sang Jae Park Backlight unit
US8421948B2 (en) 2009-02-12 2013-04-16 Lg Innotek Co., Ltd. Backlight unit
JP2010199057A (ja) * 2009-02-24 2010-09-09 Chi Mei Lighting Technology Corp Ｌｅｄランプ
US20140313733A1 (en) * 2009-05-22 2014-10-23 Sharp Kabushiki Kaisha Light source device and display device
US9341888B2 (en) 2009-05-22 2016-05-17 Sharp Kabushiki Kaisha Light reflection sheet, light source device, and display device
JP2011146402A (ja) * 2009-06-25 2011-07-28 Sharp Corp 光源装置、画像表示装置及びテレビ受像装置
US8636382B2 (en) 2009-06-25 2014-01-28 Sharp Kabushiki Kaisha Light source apparatus, image display apparatus and television receiving apparatus
KR20110002895A (ko) * 2009-06-29 2011-01-11 서울반도체 주식회사 발광장치
KR101650920B1 (ko) 2009-06-29 2016-08-24 서울반도체 주식회사 발광장치
WO2011043094A1 (ja) * 2009-10-09 2011-04-14 シャープ株式会社 照明装置、及び表示装置
TWI832765B (zh) * 2023-05-18 2024-02-11 頎邦科技股份有限公司 薄膜電路板
JP2024166052A (ja) * 2023-05-18 2024-11-28 ▲き▼邦科技股▲分▼有限公司 薄膜回路基板
US12543262B2 (en) 2023-05-18 2026-02-03 Chipbond Technology Corporation Thin film circuit board
WO2025183191A1 (ja) * 2024-02-28 2025-09-04 株式会社小糸製作所 照明装置

Also Published As

Publication number Publication date
KR20090093963A (ko) 2009-09-02
JP5097127B2 (ja) 2012-12-12
CN101563792A (zh) 2009-10-21
JPWO2008078587A1 (ja) 2010-04-22
TW200832018A (en) 2008-08-01
US20100097783A1 (en) 2010-04-22
EP2101360A1 (en) 2009-09-16

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