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WO2006090529A1 - Dissolvant resine - Google Patents

Dissolvant resine Download PDF

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Publication number
WO2006090529A1
WO2006090529A1 PCT/JP2006/300118 JP2006300118W WO2006090529A1 WO 2006090529 A1 WO2006090529 A1 WO 2006090529A1 JP 2006300118 W JP2006300118 W JP 2006300118W WO 2006090529 A1 WO2006090529 A1 WO 2006090529A1
Authority
WO
WIPO (PCT)
Prior art keywords
mass
acetate
group
compound
methyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/300118
Other languages
English (en)
Japanese (ja)
Inventor
Takashi Tokuhashi
Syuji Iwakura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Priority to KR1020077011960A priority Critical patent/KR101251396B1/ko
Priority to CN2006800013132A priority patent/CN101068915B/zh
Publication of WO2006090529A1 publication Critical patent/WO2006090529A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • C09D9/005—Chemical paint or ink removers containing organic solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3707—Polyethers, e.g. polyalkyleneoxides

Definitions

  • the present invention relates to a remover containing a specific epoxy compound and used for removing or washing a solid surface strength resin or a resin composition.
  • Patent Document 1 reports a cleaning agent containing ⁇ -petit-mouth rataton
  • Patent Document 2 discloses a mixture of a ketone solvent and a soot or an ester solvent and an ether solvent.
  • a cleaning agent comprising a nitrogen-containing compound is reported in Patent Document 3.
  • Negative or positive resists are used for patterns such as printed circuit boards, electronic circuit wiring such as ICs, display element color filters, and CCD color filters.
  • Alcohol-based, ether-based, and ester-based solvents are used as organic-based removers (developers, stripping solutions) for removing the cured or uncured resist composition used in these.
  • the organic solvent-based cleaning agent or removing agent has a problem in that the residual liquid is volatilized and the resin residue adheres to the solid surface.
  • a cleaning agent or a removing agent using an alkaline compound such as a nitrogen-containing compound is a solid after the removal of the resin, because the decomposition product of the resin or the alkaline compound remains on the solid surface from which the resin has been removed. The use of the surface may have an adverse effect.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 8-117707
  • Patent Document 2 JP-A-8-165496
  • Patent Document 3 Japanese Patent Laid-Open No. 2001-518552
  • an object of the present invention is to provide a remover for removing or washing a rosin or rosin composition from a solid surface, and after removing the rosin or rosin composition having a large removal effect.
  • An object of the present invention is to provide a remover that does not affect the use of the body surface.
  • the present invention has been made on the basis of the above findings, and is a remover for removing or washing the rosin or the rosin composition from the solid surface, and 100 parts by mass of one or more kinds of organic solvents.
  • An epoxy compound represented by the following general formula (I) 1 to: provides a remover containing LOO parts by mass.
  • R represents a hydrocarbon group having 1 to 18 carbon atoms
  • R i ⁇ R 8 each independently represents a hydrogen atom
  • p represents 0 or 1
  • m and n each independently represents 0, 1 or 2;
  • the hydrocarbon group having 1 to 18 carbon atoms represented by R when p is 0, includes a benzene ring, a cycloalkane ring, a cycloalkene ring, etc. in the chain.
  • Alkyl group which may have a hydrocarbon ring, alkenyl which may have a hydrocarbon ring such as a benzene ring, a cycloalkane ring and a cycloalkene ring in a chain which may be linear or branched
  • a hydrocarbon group such as a benzene ring, a cycloalkane ring, a cycloalkene ring or the like, a alkynyl group, a cycloalkyl group, and an aryl group.
  • an alkyl group and an aryl group are preferable in that the epoxy compound is inexpensive and chemically stable.
  • hydrocarbon group having 1 to 18 carbon atoms represented by R when p is 1, a benzene ring, a cycloalkane ring, a cycloalkene in a chain that may be linear or branched.
  • An alkanedyl group which may have a hydrocarbon ring such as a ring, or a hydrocarbon ring such as a benzene ring, a cycloalkane ring or a cycloalkene ring in a chain which may be linear or branched Alkenes that may be Diyl group, hydrocarbon chain such as benzene ring, cycloalkane ring, cycloalkene ring, etc.
  • an alkanedyl group and an arylene group are preferable in that the epoxy compound is inexpensive and chemically stable.
  • R is preferred when p is 0! /,
  • the above alkyl group is methyl, ethyl, propyl, isopropyl, butyl, sec-butyl, tert-butyl, isobutyl, amyl, isoamyl, Tertiary amyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 1-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, isoheptyl, tertiary heptyl, n-octyl, iso-octyl , Tert-octyl, 2-ethylhexyl, nonyl, isononyl, decyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecyl, am
  • the aryl group which is a preferred group for R when p is 0, includes phenyl, naphthyl, 2-methylphenyl, 3-methylphenyl, 4-methylphenyl, 3-isopropyl.
  • the above alkanediyl group which is a preferred group as R when p is 1, can also introduce a diol compound force.
  • the dioly compound include ethylene glycol, 1,2 propanediol, 1,3 propanediol, 2-methyl-1,3 propanediol, 2 butyl-2-ethyl-1,3 propanediol, 1,4 butanediol, Neopentyl glycol, 3-methyl-2,4 pentanediol, 2,4 pentanediol, 1,5 pentanediol, 3-methyl-1,5 pentanediol, 2-methi Lu 2, 4-pentanediol, 2, 4-jetyl 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, 3,5-heptanediol, 1,8-otatandiol, 2 — Aliphatic diol compounds such as
  • the arylene group which is a preferred group as R when p is 1, can also introduce dihydroxy aromatic compound power.
  • dihydroxy aromatic compound examples include resorcin, catechol, hydroquinone, 3-methyl resorcin, 3-ethyl resorcin, 3-propyl resorcin, 3-butyl resorcin, 3-tert-butyl resorcin, 3-phenyl resorcin, 3-cumyl resorcin, 3-methyl hydroquinone, 3-ethyl hydroquinone, 3-propyl hydroquinone, 3-butyl hydroquinone, 3-tert-butyl hydroquinone, 3-phenyl hydroquinone, 3-tamyl hydroquinone, 4, 4 ' Dihydroxyaryl compounds such as dihydroxydiphenyl; bis (1, 1-bis (4-hydroxyphenyl) cyclopentane, 1,1-bis (4-hydroxyphenyl
  • Hydroxyaryl) cycloalkanes bis (4-hydroxyphenol) methane, 1 , 1-bis (4-hydroxyphenol) ethane, 1,2-bis (4-hydroxyphenoxy) ethane, 1,3-bis (4-hydroxyphenol) propane, 2, 2-bis (4 —Hydroxyphenyl) propane, 2,2-bis (4-hydroxy-3,5-dimethylphenol) propan, 1,1-bis (4-hydroxyphenyl) butane, 1,1-bis ( Bis (hydroxyaryl) such as 4-hydroxyphenyl) butane, 2,2-bis (4-hydroxyphenyl) butane, 2,4-bis (4-hydroxyphenol 2-methyl) butane Examples include alkanes.
  • m and n are each independently 0, 1 or 2.
  • the content of the epoxy compound represented by the general formula (I) in the removing agent of the present invention is 1 to L00 parts by mass with respect to 100 parts by mass of the organic solvent. Less than 1 part by mass is sufficient The use effect cannot be obtained, and even if the amount exceeds 100 parts by mass, the use effect is not further improved.
  • the content of the epoxy compound represented by the general formula (I) is preferably 10 to 85 parts by mass, more preferably 20 to 75 parts by mass.
  • the organic solvent used in the removing agent of the present invention is not particularly limited, and a known general organic solvent can be used.
  • the organic solvent include alcohol solvents, polyol solvents, ketone solvents, ester solvents, ether solvents, polyether solvents, aliphatic hydrocarbon solvents, aromatic hydrocarbon solvents, chlorine.
  • examples thereof include hydrocarbon solvents having a cyano group, pyrrolidone solvents, and the like, and these can be used alone or in combination of two or more.
  • the epoxy compound represented by the general formula (I) can be stably dissolved, is inexpensive, and has a large removal effect on the resin or resin composition. It is preferable to use a ketone solvent and a Z or C 2-18 ester solvent.
  • the ketone solvent in an organic solvent at 50 to: LO 0% by mass, particularly 50 to 90% by mass.
  • the ester solvent is preferably 10 to in an organic solvent: LOO% by mass, particularly 10 to 50%. It is preferable to use mass%.
  • a C3-C18 ketone solvent which is an organic solvent, such as acetone, ethyl methyl ketone, methyl propyl ketone, methyl isopropyl ketone, butyl methyl ketone, Isobutyl methyl ketone, sec-butyl methyl ketone, tributyl methyl ketone, jetyl ketone, 2-heptanone, 3-heptanone, dibutyl ketone, diisoptyl ketone, di-tert-butyl ketone, cyclopentanone, cyclohexanone, 4-methylhexanone and the like can be mentioned. These may be used alone or in combination of two or more.
  • a preferable organic solvent used in the removing agent of the present invention having 2 to 18 carbon atoms, methyl formate, ethyl formate, methyl acetate, ethyl acetate, isopropyl acetate, acetic acid acetate, Butyl, isobutyl acetate, 2 butyl acetate, 3 butyl acetate, amyl acetate, isoamyl acetate, 3 amyl acetate, phenyl acetate, methyl propionate, ethyl propionate, isopropyl propionate, butyl propionate, isobutyl propionate, propionate 2 butyl acid, 3 butyl propionate, amyl propionate, propion Isoamyl acid, tertiary amyl propionate, propionate phenol, methyl lactate, ethyl lactate, methyl methoxypropionate, methyl
  • additives may be used as necessary for the removing agent of the present invention.
  • the additive include alkaline compounds such as inorganic alkali compounds, organic amines, ammonia and quaternary ammonium salts; acidic compounds such as organic acids; viscosity modifiers; leveling agents; Agents; anti-gelling agents; dispersion stabilizers; antistatic agents; surfactants such as ionic surfactants and nonionic surfactants; water and the like.
  • the amount of these additives to be used is appropriately selected according to the type of additive to be used, etc., but the total amount of all additives is usually 20 parts per 100 parts by mass of the organic solvent. It selects from the range used as the mass part or less.
  • Apps of the remover of the present invention include cleaning of a resin composition for sealants used for ICs, printed wiring boards, etc., and a resin composition adhering to plastic processing equipment such as molds and processing machines. Cleaning of products, cleaning of mixing or manufacturing apparatus for mixing or manufacturing a resin or a resin composition, a developing solution of photoresist, a stripping solution of photoresist, cleaning of a photoresist apparatus, and the like.
  • a 30 mm ⁇ 50 mm ⁇ lmm SUS304 plate was dip coated with the black resin composition produced by the following production method to prepare a test piece.
  • the test piece was immersed in a remover sample (see Tables 1 to 3) for 60 seconds. At this time, while the test piece was immersed, the remover sample was stirred with a magnetic stirrer. After pulling up the test piece, the surface condition was observed. Also, stick to the surface of the specimen! / Transfer the black fat composition to cellophane tape, measure the OD value of the cellophane tape before and after transfer with a Macbeth densitometer (Macbeth RD-933 type), and calculate the increase (A OD) did. The results are shown in Tables 1-3.
  • tetrahydroanhydranoic anhydride 6. Calored Og at 120 ° C. for 4 hours. 3 hours at 100 ° C [3 ⁇ 4, stirred at 80 ° C for 4 hours, 60 ° C for 6 hours, and 40 ° C for 11 hours, and then added 29 g of propylene glycol-1-monomethyl ether-2-acetate To 12g of this composition, Trimethylolpropane tri Atari rate 8 g, benzophenone 1. 8 g, carbon black (Mitsubishii ⁇ “MA100” manufactured by Gakusha Co., Ltd. (3.2 g) and ethyl acetate mouthsolve (75 g) were added and stirred well to obtain a black moon cake composition.
  • the organic solvent contains a specific epoxy compound.
  • the removing agent of the present invention When the removing agent of the present invention is used, the solid surface is uniformly washed, and there are few resin compositions remaining on the solid surface (Examples 1 to 8).
  • the solid surface is not evenly washed and becomes patchy, and there are many rosin compositions remaining on the solid surface (Comparative Example 1). .

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Materials Engineering (AREA)
  • Detergent Compositions (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Paints Or Removers (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

La présente invention concerne un dissolvant destiné à éliminer ou nettoyer de la résine ou une composition de résine présente sur une surface solide. Le dissolvant contient de 1 à 100 parties en masse d’un composé époxy représenté par la formule générale (I) ci-dessous pour 100 parties en masse d’un ou plusieurs solvants organiques. (I) (Dans la formule, R représente un groupe hydrocarboné ayant de 1 à 18 atomes de carbone, R1 à R8 représentent indépendamment un atome d’hydrogène ou un groupe méthyle ; p vaut 0 ou 1 ; et m et n valent indépendamment 0, 1 ou 2.)
PCT/JP2006/300118 2005-02-24 2006-01-10 Dissolvant resine Ceased WO2006090529A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020077011960A KR101251396B1 (ko) 2005-02-24 2006-01-10 수지용 제거제
CN2006800013132A CN101068915B (zh) 2005-02-24 2006-01-10 树脂用除去剂

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005048299A JP4707409B2 (ja) 2005-02-24 2005-02-24 樹脂用除去剤
JP2005-048299 2005-02-24

Publications (1)

Publication Number Publication Date
WO2006090529A1 true WO2006090529A1 (fr) 2006-08-31

Family

ID=36927177

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/300118 Ceased WO2006090529A1 (fr) 2005-02-24 2006-01-10 Dissolvant resine

Country Status (5)

Country Link
JP (1) JP4707409B2 (fr)
KR (1) KR101251396B1 (fr)
CN (1) CN101068915B (fr)
TW (1) TWI384066B (fr)
WO (1) WO2006090529A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5540917B2 (ja) * 2010-06-15 2014-07-02 横浜ゴム株式会社 塗装剥離剤
CN103157621A (zh) * 2011-12-13 2013-06-19 贵州黎阳航空动力有限公司 清除密封剂的化学方法及用该方法配制的溶液
JP6260441B2 (ja) * 2014-04-30 2018-01-17 旭硝子株式会社 樹脂層の除去方法
KR102097253B1 (ko) * 2019-12-12 2020-04-03 하민아 혼합 용제 조성물 및 이를 포함하는 도료 세정제

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07216398A (ja) * 1994-01-31 1995-08-15 Asahi Chem Ind Co Ltd 洗浄剤
JPH09194891A (ja) * 1995-11-13 1997-07-29 Japan Energy Corp 低腐食性洗浄用組成物
JPH1036890A (ja) * 1996-07-22 1998-02-10 Asahi Chem Ind Co Ltd インキ洗浄剤
JPH1135993A (ja) * 1997-07-23 1999-02-09 Sanyo Chem Ind Ltd スクリーン印刷版用洗浄剤組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG43439A1 (en) * 1995-11-13 1997-10-17 Japan Energy Corp Low corrosive cleaner composition
US6828295B2 (en) * 2001-09-10 2004-12-07 Proacter & Gamble Company Non-silicone polymers for lipophilic fluid systems

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07216398A (ja) * 1994-01-31 1995-08-15 Asahi Chem Ind Co Ltd 洗浄剤
JPH09194891A (ja) * 1995-11-13 1997-07-29 Japan Energy Corp 低腐食性洗浄用組成物
JPH1036890A (ja) * 1996-07-22 1998-02-10 Asahi Chem Ind Co Ltd インキ洗浄剤
JPH1135993A (ja) * 1997-07-23 1999-02-09 Sanyo Chem Ind Ltd スクリーン印刷版用洗浄剤組成物

Also Published As

Publication number Publication date
TWI384066B (zh) 2013-02-01
JP2006232957A (ja) 2006-09-07
CN101068915A (zh) 2007-11-07
TW200641120A (en) 2006-12-01
KR20070106498A (ko) 2007-11-01
CN101068915B (zh) 2012-12-26
KR101251396B1 (ko) 2013-04-05
JP4707409B2 (ja) 2011-06-22

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