WO2006085419A1 - ポジ型レジスト組成物およびレジストパターン形成方法 - Google Patents
ポジ型レジスト組成物およびレジストパターン形成方法 Download PDFInfo
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- WO2006085419A1 WO2006085419A1 PCT/JP2005/022971 JP2005022971W WO2006085419A1 WO 2006085419 A1 WO2006085419 A1 WO 2006085419A1 JP 2005022971 W JP2005022971 W JP 2005022971W WO 2006085419 A1 WO2006085419 A1 WO 2006085419A1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/04—Polymerisation in solution
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
- C08F212/22—Oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
- C08F212/22—Oxygen
- C08F212/24—Phenols or alcohols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F216/12—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/22—Esters containing halogen
- C08F220/24—Esters containing halogen containing perhaloalkyl radicals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/281—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
- C09D125/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/108—Polyolefin or halogen containing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
Definitions
- hydroxyl groups are preferably bonded, and more preferably one.
- the cyclic alkyl group may be monocyclic or polycyclic, but is preferably a polycyclic group.
- the cyclic alkyl group preferably has 5 to 15 carbon atoms! / ,.
- the bonding position of the hydroxyl group is not particularly limited, but is preferably bonded to the 3rd position of the adamantyl group.
- R is a fluorine atom or a fluorinated lower alkyl group
- R 51 is a chain-like hydroxyalkyl group.
- the hydroxyalkyl group of R 51 is preferably a lower hydroxyalkyl group having 10 or less carbon atoms, more preferably a lower hydroxyalkyl group having 2 to 8 carbon atoms, and further preferably 2 to 4 carbon atoms.
- the structural unit (a4) includes a structural unit having at least a hydroxyl group-containing cyclic alkyl group.
- 5 to 45 moles 0 / 0 force S is more preferable
- 10 to 40 mol% is more preferable
- 15 to 40 mol% is particularly preferable.
- structural unit (a5) structural units represented by general formula (a5-l) shown below can be exemplified.
- the substitution position of R 7 may be any of o-position, m-position and p-position when r is 1 to 3, and any substitution position may be combined when r is 2 or 3. it can.
- one type may be used alone, or two or more types may be used in combination.
- the structural unit (a6) is not classified into the structural units (al) to (a5) described above, and is not particularly limited as long as it is other structural units.
- ArF excimer lasers for ArF excimer lasers, for KrF positive excimer lasers (preferably Can be used for resists such as ArF excimer laser), which have been known for their strength.
- the polymer compound (A1) is preferably a copolymer containing at least the structural units (al) and (a2).
- the structural units (al) and (a2) may be the strong copolymer, the structural units (al) and (a2), the structural units (a3) and (a4) And a copolymer having at least one of (a5).
- the proportion of the structural unit (al) is 10 to 85 mol 0 with respect to all the structural units constituting the ternary copolymer (A1-3). / it is preferably 0 instrument 15-70 mole 0/0, more preferably tool 20 to 60 mol% and more preferably tool 25-55 mol% is especially preferred.
- the proportion of the structural unit (a3) is preferably from preferred tool 5 to 45 mole 0/0 force S 5 to 50 mole 0/0, 10 to 40 mole 0/0 force S More preferably, 15 to 40 Mole% is particularly preferred.
- the acid dissociable, dissolution inhibiting group-containing group is selected from the acid dissociable, dissolution inhibiting groups, etc. (I), (II), and (III) force group forces. It is preferable that 2 or more types are included.
- Two or more of the ternary or quaternary copolymers may be mixed and used.
- mixed fats with different proportions of structural units (A1-3) mixed fats with different proportions of structural units (A1-4), (A1 3) and (A1-4 1) And mixed rosin.
- the polymer compound R s R ———— (A1) may be used alone or in combination of two or more.
- the component (B) is not particularly limited, and those that have been proposed as acid generators for chemical amplification resists can be used.
- acid generators include onium salt-based acid generators such as ododonium salts and sulfo-um salts, oxime sulfonate-based acid generators, bisalkyl or bisarylsulfonyldiazomethanes.
- diazomethane acid generators such as poly (bissulfol) diazomethanes, nitrobenzilsulfonate acid generators, iminosulfonate acid generators, and disulfone acid generators are known.
- the aryl group of R lw to R 3 is not particularly limited, for example, an aryl group having 6 to 20 carbon atoms, in which part or all of the hydrogen atoms are alkyl groups, alkoxy groups. It may not be substituted with a group, a halogen atom, etc.
- the aryl group is preferably an aryl group having 6 to 7 carbon atoms because it can be synthesized at low cost. For example, a phenol group and a naphthyl group can be mentioned.
- alkyl group on which the hydrogen atom of the aryl group may be substituted examples include a methyl group, an ethyl group, a propyl group, an n-butyl group, and a tert-butyl group, which are preferably alkyl groups having 1 to 5 carbon atoms. Most preferred to be.
- the “ ⁇ ” alkyl group is not particularly limited, and examples thereof include a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms. From the viewpoint of excellent resolution, the number of carbon atoms is preferably 1 to 5. Specifically, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an n-pentyl group, a cyclopentyl group, a hexyl group, a cyclohexyl group, a nonyl group, A decanyl group and the like can be mentioned, and a methyl group can be mentioned as a preferable one because it is excellent in resolution and can be synthesized at low cost.
- the straight chain alkyl group is most preferably 1 to 4 carbon atoms, more preferably 1 to 8 carbon atoms, more preferably 1 to 8 carbon atoms, and most preferably 1 to 4 carbon atoms.
- the cyclic alkyl group is a cyclic group as shown by the above R 1 ′′, preferably a carbon number of 4 to 15 carbon atoms, more preferably a carbon number of 4 to 10 carbon atoms. Most preferably, the number is from 6 to 10.
- R 4 ′′ is most preferably a linear or cyclic alkyl group or a fluorinated alkyl group.
- Examples of the aryl group of R 5 “to R 6 " include the same as the aryl group of,, ⁇ "
- the acid salt-based acid generator include trifluoromethane sulfonate or nonafluorobutane sulfonate of diphenylodium, trifluoromethanesulfonate or nona of bis (4-tert-butylphenol) ododonium.
- X is a linear or branched alkylene group in which at least one hydrogen atom is substituted with a fluorine atom, and the alkylene group has 2 to 6 carbon atoms, preferably 3 to 3 carbon atoms. 5 and most preferably 3 carbon atoms.
- Y ′′ and Z ′′ are each independently a linear or branched alkyl group in which at least one hydrogen atom is substituted with a fluorine atom, and the alkyl group has 1 to 10 carbon atoms, preferably It is C1-C7, More preferably, it is C1-C3.
- the carbon number of the alkylene group of X "or the carbon number of the alkyl group of ⁇ " and ⁇ " is preferably as small as possible because it has good solubility in the resist solvent within the above carbon number range. ⁇ .
- the greater the number of hydrogen atoms substituted by fluorine atoms, the stronger the acid strength, and the higher energy light with a wavelength of 200 nm or less This is preferable because it improves the transparency to electron beams.
- the fluorination rate of the alkylene group or alkyl group that is, the hydrogen atom of the alkylene group in the state or the hydrogen atom of the alkyl group is completely substituted with a fluorine atom.
- the ratio of hydrogen atoms substituted with fluorine atoms is preferably 70 to 100%, more preferably 90 to 100%, and most preferably perfluorocarbons in which all hydrogen atoms are substituted with fluorine atoms.
- an ohmic salt having a relatively weak acid strength and having a camphorsulfonic acid ion in the key-on part may be used. it can.
- the cation moiety is the same as that represented by the general formula (b-1) or (b-2). Specific examples include compounds represented by the following chemical formulas.
- the organic group for R 22 is preferably a linear, branched or cyclic alkyl group, aryl group or cyan group.
- Examples of the alkyl group and aryl group for R 22 include the same alkyl groups and aryl groups as those described above for R 21 .
- R 22 is particularly preferably a cyano group, an alkyl group having 1 to 8 carbon atoms having no substituent, or a fluorinated alkyl group having 1 to 8 carbon atoms.
- an alkyl group or halogen having no substituent of R 31 is preferably 1 to 8 carbon atoms, more preferably 1 to 8 carbon atoms, and most preferably 1 to 6 carbon atoms.
- R 31 is more preferably a fluorinated alkyl group, preferably a halogenated alkyl group.
- the fluorinated alkyl group for R 31 is preferably fluorinated with 50% or more of the hydrogen atom of the alkyl group, more preferably 70% or more, and even more preferably 90% or more. I like it! /
- the aryl group of R 32 is an aromatic hydrocarbon such as a phenyl group, a biphenyl group, a fluorenyl group, a naphthyl group, an anthracyl group, a phenanthryl group, and the like.
- a fluorenyl group is preferable.
- the aryl group of R 32 may have a substituent such as an alkyl group having 1 to 10 carbon atoms, a halogenated alkyl group, or an alkoxy group.
- the alkyl group or halogenated alkyl group in the substituent preferably has 1 to 4 carbon atoms, more preferably 1 to 4 carbon atoms.
- the halogenated alkyl group is preferably a fluorinated alkyl group.
- the alkyl group having no substituent of R 33 or the halogenated alkyl group preferably has 1 to 10 carbon atoms, more preferably 1 to 8 carbon atoms, and more preferably 1 to 6 carbon atoms. Most preferred.
- R 33 is preferably a fluorinated alkyl group, preferably a halogenated alkyl group, and more preferably a partially fluorinated alkyl group.
- the fluorinated alkyl group in R 33 preferably has 50% or more of the hydrogen atoms of the alkyl group fluorinated, more preferably 70% or more, and even more preferably 90% or more. This is preferable because the strength of the acid is increased. Most preferably, it is a fully fluorinated alkyl group in which a hydrogen atom is 100% fluorine-substituted.
- oxime sulfonate-based acid generators include ⁇ - (P-toluenesulfo-luoximino) -benzyl cyanide, a- (p-chlorobenzenebenzene-sulfoximino) -benzil cyanide, a- ( 4-Nitrobenzenesulfo-ruximino) -Benzyl cyanide, a- (4-Nitro-2-trifluoromethylbenzenesulfo-ruximino) -Benzyl cyanide, a- (Benzenesulfo-ruximino) -4-Black mouth Benzyl cyanide, a-(Benzenesulfo-ruximino)-2, 4-dichlorobenzil cyanide, a-(Benzenesulfo-ruxinomino)-2, 6 -dichlorobenzil cyanide, a-(Benzenesulf
- CH 3 -C N-OS02- (CH 2 ) 3CH3
- bisalkyl or bisarylsulfol diazomethanes include bis (isopropylsulfol) diazomethane, bis (p toluenesulfol) diazomethane, bis (1 , 1-dimethylethylsulfol) diazomethane, bis (cyclohexylsulfol) diazomethane, bis (2,4 dimethylphenylsulfol) diazomethane, and the like.
- component (B) an oxime sulfonate-based acid generator and an ohmic salt-based acid generator containing Z or fluorinated alkyl sulfonate ions as the ion are used. I like it! /
- one type of these acid generators may be used alone, or two or more types may be used in combination.
- the content of the component (B) in the negative resist composition of the present invention is 0.530 parts by mass, preferably 115 parts by mass with respect to 100 parts by mass of the component (A). By making it in the above range, pattern formation is sufficiently performed. Further, it is preferable because a uniform solution can be obtained and storage stability is improved.
- the positive resist composition of the present invention is further optional in order to improve the resist pattern shape, post exposure stability of the latent image formed oy the pattern-wise exposure of the resist layer, and the like.
- Nitrogen-containing organic compounds except for the component (B)) (D) (hereinafter referred to as the component (D)) can be blended as these components. Since a wide variety of component (D) has already been proposed, any known component may be used.
- Component (D) is usually used in the range of 0.01 to 5.0 parts by mass per 100 parts by mass of component (A).
- organic carboxylic acid for example, malonic acid, citrate, malic acid, succinic acid, benzoic acid, salicylic acid and the like are suitable.
- Phosphorus oxalic acid or its derivatives include phosphoric acid, phosphoric acid di-n-butyl ester, phosphoric acid diphenol ester and other derivatives such as phosphoric acid, phosphonic acid, dimethyl phosphonate, phosphonic acid Phosphonic acids such as n-butyl ester, phenol phosphonic acid, phosphonic acid diphenyl ester, phosphonic acid dibenzyl ester, and derivatives thereof, phosphinic acid, phenol phosphine Examples thereof include phosphinic acids such as acids and derivatives such as esters thereof, among which phosphonic acid is particularly preferred.
- Component (E) is used in a proportion of 0.01 to 5.0 parts by mass per 100 parts by mass of component (A).
- the positive resist composition of the present invention if desired, there are further miscible additives, for example, an additional resin for improving the performance of the resist film, and a surfactant for improving the coating property. Further, a dissolution inhibitor, a plasticizer, a stabilizer, a colorant, an antihalation agent, a dye, and the like can be appropriately added and contained.
- the positive resist composition of the present invention can be produced by dissolving the material in an organic solvent.
- each component to be used can be dissolved into a uniform solution.
- any one or two of the known solvents for chemically amplified resists can be used. These can be appropriately selected and used.
- latones such as ⁇ -butyrolatatane; ketones such as acetone, methyl ethyl ketone, cyclohexanone, methyl isoamyl ketone, 2-heptanone; ethylene glycol, ethylene glycol monoacetate, diethylene glycol, diethylene glycol
- Polyhydric alcohols such as monoacetate, propylene glycol, propylene glycol monoacetate, dipropylene glycol, or monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether or monophenyl ether of dipropylene glycol monoacetate and derivatives thereof; Cyclic ethers such as dioxane; methyl lactate, ethyl lactate (EL), methyl acetate, ethyl acetate, butyl acetate, methyl pyruvate, pyrbi Acid Echiru, methyl methoxypropionate, and the like esters such as ethoxy
- organic solvents can be used alone or as a mixed solvent of two or more.
- a mixed solvent obtained by mixing propylene glycol monomethyl ether acetate (PGMEA) and a polar solvent is preferable.
- the mixing ratio may be appropriately determined in consideration of the compatibility between PGMEA and the polar solvent, preferably 1: 9 to 9: 1, more preferably 2: 8 to 8: 2. Preferably within range! /. More specifically, when EL is blended as a polar solvent, the mass ratio of PGMEA: EL is preferably 1: 9-9: 1, more preferably 2: 8-8: 2! / ,.
- TMAH tetramethyl ammonium hydroxide
- An organic or inorganic antireflection film can be provided between the substrate and the coating layer of the resist composition.
- the wavelength of the electron beam or other deep ultraviolet rays used for the exposure is not particularly limited, and ArF excimer laser, KrF excimer laser, F laser, EUV (extreme ultraviolet), VUV (
- the positive resist composition of the present invention has high stability under vacuum, it can be suitably used for forming a resist pattern including an exposure step under vacuum, such as KrF excimer laser, electron beam or EUV ( It is preferable for extreme ultraviolet rays, especially for electron beams. is there.
- a high-resolution pattern with reduced LER can be formed.
- the following reasons are conceivable as the reason for the strong effect. That is, in the structural unit (a2), a fluorine atom or a fluorinated lower alkyl group is bonded to the ⁇ -position, whereby the acid dissociable, dissolution inhibiting group is easily dissociated. Since the acid dissociable, dissolution inhibiting group is easily released, the alkali solubility of the exposed part, which has a high rate of dissociation (deprotection rate) of the acid dissociable, dissolution inhibiting group present in the exposed part during exposure, is greatly increased.
- alkali solubility dissolution contrast
- it is a structural unit from which acrylate power is also derived
- it is more suitable for exposure light sources such as KrF excimer laser than when it contains only hydroxystyrene-based structural units such as structural unit (al) and structural unit (a3).
- Transparency is enhanced, exposure light is transmitted sufficiently to the vicinity of the upper force substrate interface of the resist film, and acid generation from the component (B) is efficiently decomposed. As a result, it is estimated that LERR is reduced and resolution is improved.
- a four-necked flask equipped with a nitrogen blowing tube, a reflux condenser, a dropping funnel and a thermometer was fitted with 141 g of isopio pinoleanolenoconole, 7 g of 4-acetoxystyrene and 3-hydroxy-1-adamantyl-one a-trifluoro. After adding 3 g of romethyl acrylate and purging with nitrogen, the temperature was raised to 82 ° C. with stirring.
- the ethyl acetate solution was washed with a large amount of water, the ethyl acetate was distilled off by atmospheric distillation, and the precipitated white solid was dissolved in 1030 g of tetrahydrofuran to obtain 1237 g of a precursor polymer tetrahydrofuran solution.
- reaction solution was dropped into a large amount of water to obtain a precipitate.
- the precipitate was filtered, washed and dried to obtain 55 g of a white solid random copolymer (resin l).
- a 4-necked flask equipped with a nitrogen blowing tube, a reflux condenser, a dropping funnel and a thermometer was added to 67 g of isopianorenoreconole, 4 g of cetoxystyrene, 2 g of 4- (1-ethoxyethoxy) styrene and t— After adding 2 g of butyl-a-trifluoromethyl acrylate, the atmosphere was replaced with nitrogen, the temperature was raised to 82 ° C. with stirring.
- reaction solution was dropped into a large amount of water to obtain a precipitate.
- the precipitate was filtered, washed and dried to obtain a white solid random copolymer (Resin 3).
- the exposure margin was calculated by measuring the dimensional change with respect to 1 / z CZcm 2 at ⁇ 5% from the optimum exposure dose in the 1: 1 lOOnmLZS pattern. (LER)
- 3 ⁇ is the triple value of the standard deviation ( ⁇ ), which is obtained by measuring the width of the resist pattern of the sample using 32 side SEM (manufactured by Hitachi, Ltd., trade name “S-9220”) and calculating the resulting force. 3 ⁇ ). This 3 ⁇ means that the smaller the value, the smaller the resist pattern with uniform width.
- PAG1 Triphenylenosulphonum nonafnoreobutane sulfonate.
- PAG2 Bis-O (n-butylsulfol) a-dimethyldarioxime.
- PAG3 a- (methyloxyimino) p-methoxyphenylacetonitrile.
- AMINE 1 Tri-n-octylamine.
- AMINE2 Tribenzylamine.
- Comparative Resin 1 Polymer represented by the following formula (a-3) (mass average molecular weight 10,000, dispersity 1.2
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Abstract
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE112005003399.6T DE112005003399B4 (de) | 2005-02-10 | 2005-12-14 | Positivresist-Zusammensetzung und Verfahren zur Erzeugung eines Resistmusters |
| US11/813,765 US7687221B2 (en) | 2005-02-10 | 2005-12-14 | Positive resist composition and resist pattern forming method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005-034103 | 2005-02-10 | ||
| JP2005034103 | 2005-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006085419A1 true WO2006085419A1 (ja) | 2006-08-17 |
Family
ID=36792997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/022971 Ceased WO2006085419A1 (ja) | 2005-02-10 | 2005-12-14 | ポジ型レジスト組成物およびレジストパターン形成方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7687221B2 (ja) |
| KR (1) | KR100902535B1 (ja) |
| DE (1) | DE112005003399B4 (ja) |
| TW (1) | TWI319120B (ja) |
| WO (1) | WO2006085419A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010091927A1 (en) * | 2009-02-11 | 2010-08-19 | International Business Machines Corporation | Photoresist compositions and methods of use |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5401086B2 (ja) | 2008-10-07 | 2014-01-29 | 東京応化工業株式会社 | 液浸露光用レジスト組成物、レジストパターン形成方法および含フッ素樹脂 |
| JP5750272B2 (ja) | 2010-02-18 | 2015-07-15 | 東京応化工業株式会社 | レジストパターン形成方法 |
| US11327398B2 (en) | 2019-04-30 | 2022-05-10 | Samsung Electronics Co., Ltd. | Photoresist compositions and methods for fabricating semiconductor devices using the same |
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|---|---|---|---|---|
| JP2000227658A (ja) * | 1999-02-05 | 2000-08-15 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
| JP2001201853A (ja) * | 2000-01-17 | 2001-07-27 | Toray Ind Inc | ポジ型感放射線性組成物およびこれを用いたレジストパターンの製造方法 |
| JP2002220420A (ja) * | 2000-11-21 | 2002-08-09 | Shin Etsu Chem Co Ltd | 高分子化合物、レジスト材料及びパターン形成方法 |
| JP2003002925A (ja) * | 2001-06-25 | 2003-01-08 | Shin Etsu Chem Co Ltd | 高分子化合物、レジスト材料及びパターン形成方法 |
| JP2003277443A (ja) * | 2001-11-07 | 2003-10-02 | Samsung Electronics Co Ltd | フルオロ化されたエチレングリコール基を有する感光性ポリマー及びこれを含む化学増幅型レジスト組成物 |
| JP2003302754A (ja) * | 2002-04-12 | 2003-10-24 | Fuji Photo Film Co Ltd | レジスト組成物 |
| JP2004045448A (ja) * | 2002-07-04 | 2004-02-12 | Shin Etsu Chem Co Ltd | レジスト材料及びパターン形成方法 |
| JP2004333548A (ja) * | 2003-04-30 | 2004-11-25 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジスト組成物およびレジストパターン形成方法 |
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|---|---|---|---|---|
| US6479211B1 (en) * | 1999-05-26 | 2002-11-12 | Fuji Photo Film Co., Ltd. | Positive photoresist composition for far ultraviolet exposure |
| JP2002006501A (ja) | 1999-11-09 | 2002-01-09 | Sumitomo Chem Co Ltd | 化学増幅型レジスト組成物 |
| JP4255633B2 (ja) * | 2000-11-21 | 2009-04-15 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
| JP2002341538A (ja) | 2001-05-11 | 2002-11-27 | Fuji Photo Film Co Ltd | 電子線またはx線用ポジ型レジスト組成物 |
| JP4115309B2 (ja) | 2003-03-24 | 2008-07-09 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
| JP4327003B2 (ja) * | 2003-07-01 | 2009-09-09 | 東京応化工業株式会社 | ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法 |
| JP2005049695A (ja) | 2003-07-30 | 2005-02-24 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
-
2005
- 2005-12-14 WO PCT/JP2005/022971 patent/WO2006085419A1/ja not_active Ceased
- 2005-12-14 US US11/813,765 patent/US7687221B2/en active Active
- 2005-12-14 KR KR1020077017340A patent/KR100902535B1/ko not_active Expired - Fee Related
- 2005-12-14 DE DE112005003399.6T patent/DE112005003399B4/de not_active Expired - Fee Related
- 2005-12-23 TW TW094146249A patent/TWI319120B/zh not_active IP Right Cessation
Patent Citations (8)
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| JP2000227658A (ja) * | 1999-02-05 | 2000-08-15 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
| JP2001201853A (ja) * | 2000-01-17 | 2001-07-27 | Toray Ind Inc | ポジ型感放射線性組成物およびこれを用いたレジストパターンの製造方法 |
| JP2002220420A (ja) * | 2000-11-21 | 2002-08-09 | Shin Etsu Chem Co Ltd | 高分子化合物、レジスト材料及びパターン形成方法 |
| JP2003002925A (ja) * | 2001-06-25 | 2003-01-08 | Shin Etsu Chem Co Ltd | 高分子化合物、レジスト材料及びパターン形成方法 |
| JP2003277443A (ja) * | 2001-11-07 | 2003-10-02 | Samsung Electronics Co Ltd | フルオロ化されたエチレングリコール基を有する感光性ポリマー及びこれを含む化学増幅型レジスト組成物 |
| JP2003302754A (ja) * | 2002-04-12 | 2003-10-24 | Fuji Photo Film Co Ltd | レジスト組成物 |
| JP2004045448A (ja) * | 2002-07-04 | 2004-02-12 | Shin Etsu Chem Co Ltd | レジスト材料及びパターン形成方法 |
| JP2004333548A (ja) * | 2003-04-30 | 2004-11-25 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジスト組成物およびレジストパターン形成方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2010091927A1 (en) * | 2009-02-11 | 2010-08-19 | International Business Machines Corporation | Photoresist compositions and methods of use |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100902535B1 (ko) | 2009-06-15 |
| US7687221B2 (en) | 2010-03-30 |
| TW200628986A (en) | 2006-08-16 |
| DE112005003399T5 (de) | 2007-12-27 |
| DE112005003399B4 (de) | 2017-04-13 |
| US20090047600A1 (en) | 2009-02-19 |
| TWI319120B (en) | 2010-01-01 |
| KR20070100771A (ko) | 2007-10-11 |
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