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WO2004038070A3 - Electrolyse a impulsion inverse de solutions de galvanoplastie de cuivre acides - Google Patents

Electrolyse a impulsion inverse de solutions de galvanoplastie de cuivre acides Download PDF

Info

Publication number
WO2004038070A3
WO2004038070A3 PCT/US2003/024498 US0324498W WO2004038070A3 WO 2004038070 A3 WO2004038070 A3 WO 2004038070A3 US 0324498 W US0324498 W US 0324498W WO 2004038070 A3 WO2004038070 A3 WO 2004038070A3
Authority
WO
WIPO (PCT)
Prior art keywords
reverse electrolysis
pulse reverse
copper electroplating
acidic copper
electroplating solutions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2003/024498
Other languages
English (en)
Other versions
WO2004038070A2 (fr
Inventor
Roderick D Herdman
Michael R Crary
Ernest Long
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Acumen Inc
Original Assignee
MacDermid Acumen Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Acumen Inc filed Critical MacDermid Acumen Inc
Priority to AU2003265370A priority Critical patent/AU2003265370A1/en
Publication of WO2004038070A2 publication Critical patent/WO2004038070A2/fr
Publication of WO2004038070A3 publication Critical patent/WO2004038070A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'inversion concerne une électrolyse à impulsion inverse de solutions de cuivre acides utilisée pour applique du cuivre sur des articles décoratifs, par exemple des roues d'automobile en alliage d'aluminium et des pièces en matière plastique destinées aux automobiles. Les avantages concernent notamment une meilleure répartition du cuivre électrodéposé sur l'article métallisé, des déchets métalliques moindres, des temps métallisation réduits et des capacités de production accrues.
PCT/US2003/024498 2002-10-21 2003-08-06 Electrolyse a impulsion inverse de solutions de galvanoplastie de cuivre acides Ceased WO2004038070A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003265370A AU2003265370A1 (en) 2002-10-21 2003-08-06 Pulse reverse electrolysis of acidic copper electroplating solutions

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/274,634 2002-10-21
US10/274,634 US20040074775A1 (en) 2002-10-21 2002-10-21 Pulse reverse electrolysis of acidic copper electroplating solutions

Publications (2)

Publication Number Publication Date
WO2004038070A2 WO2004038070A2 (fr) 2004-05-06
WO2004038070A3 true WO2004038070A3 (fr) 2004-07-01

Family

ID=32093089

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/024498 Ceased WO2004038070A2 (fr) 2002-10-21 2003-08-06 Electrolyse a impulsion inverse de solutions de galvanoplastie de cuivre acides

Country Status (4)

Country Link
US (1) US20040074775A1 (fr)
AU (1) AU2003265370A1 (fr)
TW (1) TWI261075B (fr)
WO (1) WO2004038070A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7105082B2 (en) * 2003-02-27 2006-09-12 Novellus Systems, Inc. Composition and method for electrodeposition of metal on a work piece
US20050284766A1 (en) * 2004-06-25 2005-12-29 Herdman Roderick D Pulse reverse electrolysis of acidic copper electroplating solutions
EP1712660A1 (fr) 2005-04-12 2006-10-18 Enthone Inc. Anode insoluble
US20080283404A1 (en) * 2007-05-14 2008-11-20 Nec Electronics Corporation Method of manufacturing semiconductor device to decrease defect number of plating film
US7905994B2 (en) * 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US20090188553A1 (en) * 2008-01-25 2009-07-30 Emat Technology, Llc Methods of fabricating solar-cell structures and resulting solar-cell structures
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
EP2568063A1 (fr) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Procédé d'électrodéposition de cuivre à faible contrainte interne
DE102012206800B3 (de) * 2012-04-25 2013-09-05 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Abscheiden eines Abscheidemetalls auf einem Werkstück
CN103334135A (zh) * 2013-06-19 2013-10-02 西北工业大学 一种超细晶铜线的制备方法
CN103668370A (zh) * 2013-12-19 2014-03-26 潮州市连思科技发展有限公司 一种光盘脉冲电镀方法
CN103911635B (zh) * 2014-03-21 2016-02-24 复旦大学 一种电镀铜溶液
CN106757193B (zh) * 2016-11-24 2018-07-13 中国地质大学（武汉） 一种树叶的无氰酸性光亮镀铜的方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
US20020036144A1 (en) * 2000-09-27 2002-03-28 Lee Sun-Jung Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming copper interconnect of semiconductor device using the same
US20030085133A1 (en) * 2001-07-26 2003-05-08 Electroplating Engineers Of Japan Limited (Japanese Corporation) Copper plating solution for embedding fine wiring, and copper plating method using the same
US6610192B1 (en) * 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2558090A (en) * 1947-12-11 1951-06-26 Westinghouse Electric Corp Periodic reverse current electroplating apparatus
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
US3956078A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US4673469A (en) * 1984-06-08 1987-06-16 Mcgean-Rohco, Inc. Method of plating plastics
KR20040045390A (ko) * 2001-10-16 2004-06-01 신꼬오덴기 고교 가부시키가이샤 소경홀의 구리 도금 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
US20020036144A1 (en) * 2000-09-27 2002-03-28 Lee Sun-Jung Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming copper interconnect of semiconductor device using the same
US6610192B1 (en) * 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
US20030085133A1 (en) * 2001-07-26 2003-05-08 Electroplating Engineers Of Japan Limited (Japanese Corporation) Copper plating solution for embedding fine wiring, and copper plating method using the same

Also Published As

Publication number Publication date
AU2003265370A1 (en) 2004-05-13
WO2004038070A2 (fr) 2004-05-06
TWI261075B (en) 2006-09-01
AU2003265370A8 (en) 2004-05-13
US20040074775A1 (en) 2004-04-22
TW200407467A (en) 2004-05-16

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