TWI261075B - Pulse reverse electrolysis of acidic copper electroplating solutions - Google Patents
Pulse reverse electrolysis of acidic copper electroplating solutions Download PDFInfo
- Publication number
- TWI261075B TWI261075B TW092122858A TW92122858A TWI261075B TW I261075 B TWI261075 B TW I261075B TW 092122858 A TW092122858 A TW 092122858A TW 92122858 A TW92122858 A TW 92122858A TW I261075 B TWI261075 B TW I261075B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper
- electroplating bath
- pulse
- concentration
- plating
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 69
- 239000010949 copper Substances 0.000 title claims abstract description 69
- 238000005868 electrolysis reaction Methods 0.000 title claims abstract description 11
- 238000009713 electroplating Methods 0.000 title claims description 30
- 230000002378 acidificating effect Effects 0.000 title description 2
- 238000007747 plating Methods 0.000 claims abstract description 47
- 239000002253 acid Substances 0.000 claims abstract description 17
- 229920003023 plastic Polymers 0.000 claims abstract description 7
- 239000004033 plastic Substances 0.000 claims abstract description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 31
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 18
- 230000008021 deposition Effects 0.000 claims description 15
- 239000002202 Polyethylene glycol Substances 0.000 claims description 12
- 229920001223 polyethylene glycol Polymers 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 9
- -1 alkali metal salt Chemical class 0.000 claims description 8
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 7
- 229920000570 polyether Polymers 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 claims description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 4
- 229910001431 copper ion Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 150000003464 sulfur compounds Chemical class 0.000 claims 6
- 229910052783 alkali metal Inorganic materials 0.000 claims 3
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000009826 distribution Methods 0.000 abstract description 8
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000010814 metallic waste Substances 0.000 abstract 1
- 239000000654 additive Substances 0.000 description 18
- 238000000151 deposition Methods 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 14
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical class [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 description 13
- 230000000996 additive effect Effects 0.000 description 10
- 101000692259 Homo sapiens Phosphoprotein associated with glycosphingolipid-enriched microdomains 1 Proteins 0.000 description 8
- 102100026066 Phosphoprotein associated with glycosphingolipid-enriched microdomains 1 Human genes 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000003929 acidic solution Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229940126062 Compound A Drugs 0.000 description 4
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 4
- WIYCQLLGDNXIBA-UHFFFAOYSA-L disodium;3-(3-sulfonatopropyldisulfanyl)propane-1-sulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)CCCSSCCCS([O-])(=O)=O WIYCQLLGDNXIBA-UHFFFAOYSA-L 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000005749 Copper compound Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 101000987219 Sus scrofa Pregnancy-associated glycoprotein 1 Proteins 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 150000001880 copper compounds Chemical class 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- REJSMTWFWDLMQN-UHFFFAOYSA-N 3-(3-sulfopropylsulfanyl)propane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCSCCCS(O)(=O)=O REJSMTWFWDLMQN-UHFFFAOYSA-N 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 241001124308 Cumacea Species 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 101100443631 Schizosaccharomyces pombe (strain 972 / ATCC 24843) dni2 gene Proteins 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000003416 augmentation Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- LEKPFOXEZRZPGW-UHFFFAOYSA-N copper;dicyanide Chemical compound [Cu+2].N#[C-].N#[C-] LEKPFOXEZRZPGW-UHFFFAOYSA-N 0.000 description 1
- CGPVLUCOFNAVGV-UHFFFAOYSA-N copper;pentahydrate Chemical compound O.O.O.O.O.[Cu] CGPVLUCOFNAVGV-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005363 electrowinning Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000004686 pentahydrates Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 229940098465 tincture Drugs 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004876 x-ray fluorescence Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/274,634 US20040074775A1 (en) | 2002-10-21 | 2002-10-21 | Pulse reverse electrolysis of acidic copper electroplating solutions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200407467A TW200407467A (en) | 2004-05-16 |
| TWI261075B true TWI261075B (en) | 2006-09-01 |
Family
ID=32093089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092122858A TWI261075B (en) | 2002-10-21 | 2003-08-20 | Pulse reverse electrolysis of acidic copper electroplating solutions |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20040074775A1 (fr) |
| AU (1) | AU2003265370A1 (fr) |
| TW (1) | TWI261075B (fr) |
| WO (1) | WO2004038070A2 (fr) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7105082B2 (en) * | 2003-02-27 | 2006-09-12 | Novellus Systems, Inc. | Composition and method for electrodeposition of metal on a work piece |
| US20050284766A1 (en) * | 2004-06-25 | 2005-12-29 | Herdman Roderick D | Pulse reverse electrolysis of acidic copper electroplating solutions |
| EP1712660A1 (fr) | 2005-04-12 | 2006-10-18 | Enthone Inc. | Anode insoluble |
| US20080283404A1 (en) * | 2007-05-14 | 2008-11-20 | Nec Electronics Corporation | Method of manufacturing semiconductor device to decrease defect number of plating film |
| US7905994B2 (en) * | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
| US20090188553A1 (en) * | 2008-01-25 | 2009-07-30 | Emat Technology, Llc | Methods of fabricating solar-cell structures and resulting solar-cell structures |
| US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
| EP2568063A1 (fr) * | 2011-09-09 | 2013-03-13 | Rohm and Haas Electronic Materials LLC | Procédé d'électrodéposition de cuivre à faible contrainte interne |
| DE102012206800B3 (de) * | 2012-04-25 | 2013-09-05 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Abscheiden eines Abscheidemetalls auf einem Werkstück |
| CN103334135A (zh) * | 2013-06-19 | 2013-10-02 | 西北工业大学 | 一种超细晶铜线的制备方法 |
| CN103668370A (zh) * | 2013-12-19 | 2014-03-26 | 潮州市连思科技发展有限公司 | 一种光盘脉冲电镀方法 |
| CN103911635B (zh) * | 2014-03-21 | 2016-02-24 | 复旦大学 | 一种电镀铜溶液 |
| CN106757193B (zh) * | 2016-11-24 | 2018-07-13 | 中国地质大学（武汉） | 一种树叶的无氰酸性光亮镀铜的方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2558090A (en) * | 1947-12-11 | 1951-06-26 | Westinghouse Electric Corp | Periodic reverse current electroplating apparatus |
| US2700019A (en) * | 1951-07-05 | 1955-01-18 | Westinghouse Electric Corp | Acid copper plating |
| US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
| US3682788A (en) * | 1970-07-28 | 1972-08-08 | M & T Chemicals Inc | Copper electroplating |
| US3956078A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4673469A (en) * | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
| US5972192A (en) * | 1997-07-23 | 1999-10-26 | Advanced Micro Devices, Inc. | Pulse electroplating copper or copper alloys |
| KR100366631B1 (ko) * | 2000-09-27 | 2003-01-09 | 삼성전자 주식회사 | 폴리비닐피롤리돈을 포함하는 구리도금 전해액 및 이를이용한 반도체 소자의 구리배선용 전기도금방법 |
| US6610192B1 (en) * | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
| JP2003105584A (ja) * | 2001-07-26 | 2003-04-09 | Electroplating Eng Of Japan Co | 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法 |
| KR20040045390A (ko) * | 2001-10-16 | 2004-06-01 | 신꼬오덴기 고교 가부시키가이샤 | 소경홀의 구리 도금 방법 |
-
2002
- 2002-10-21 US US10/274,634 patent/US20040074775A1/en not_active Abandoned
-
2003
- 2003-08-06 WO PCT/US2003/024498 patent/WO2004038070A2/fr not_active Ceased
- 2003-08-06 AU AU2003265370A patent/AU2003265370A1/en not_active Abandoned
- 2003-08-20 TW TW092122858A patent/TWI261075B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003265370A1 (en) | 2004-05-13 |
| WO2004038070A2 (fr) | 2004-05-06 |
| AU2003265370A8 (en) | 2004-05-13 |
| US20040074775A1 (en) | 2004-04-22 |
| WO2004038070A3 (fr) | 2004-07-01 |
| TW200407467A (en) | 2004-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |