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USD689031S1 - LED chip - Google Patents

LED chip Download PDF

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Publication number
USD689031S1
USD689031S1 US29/436,228 US201229436228F USD689031S US D689031 S1 USD689031 S1 US D689031S1 US 201229436228 F US201229436228 F US 201229436228F US D689031 S USD689031 S US D689031S
Authority
US
United States
Prior art keywords
led chip
view
ornamental design
led
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/436,228
Inventor
Matthew Donofrio
James Ibbetson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/436,228 priority Critical patent/USD689031S1/en
Application granted granted Critical
Publication of USD689031S1 publication Critical patent/USD689031S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DONOFRIO, MATTHEW, IBBETSON, JAMES
Assigned to CREE LED, INC. reassignment CREE LED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART MODULAR TECHNOLOGIES, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, CREELED, INC., SMART EMBEDDED COMPUTING, INC. reassignment SMART MODULAR TECHNOLOGIES, INC. RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to CREELED, INC. reassignment CREELED, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: CREE, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top perspective view of the LED chip showing our design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a bottom view thereof;
FIG. 6 is a back view thereof;
FIG. 7 is a side view thereof; and,
FIG. 8 is an opposing side view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for LED chip, as shown and described.
US29/436,228 2011-07-08 2012-11-02 LED chip Active USD689031S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/436,228 USD689031S1 (en) 2011-07-08 2012-11-02 LED chip

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/396,911 USD673126S1 (en) 2011-07-08 2011-07-08 LED chip
US29/436,228 USD689031S1 (en) 2011-07-08 2012-11-02 LED chip

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/396,911 Division USD673126S1 (en) 2011-07-08 2011-07-08 LED chip

Publications (1)

Publication Number Publication Date
USD689031S1 true USD689031S1 (en) 2013-09-03

Family

ID=47360037

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/396,911 Active USD673126S1 (en) 2011-07-08 2011-07-08 LED chip
US29/436,228 Active USD689031S1 (en) 2011-07-08 2012-11-02 LED chip

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/396,911 Active USD673126S1 (en) 2011-07-08 2011-07-08 LED chip

Country Status (1)

Country Link
US (2) USD673126S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD768584S1 (en) * 2014-11-13 2016-10-11 Mitsubishi Electric Corporation Light source module
USD780704S1 (en) * 2014-08-27 2017-03-07 Mitsubishi Electric Corporation Light source module
USD808576S1 (en) * 2015-09-02 2018-01-23 As Seen On PC, Inc. Bracket for gutter mounted lighting devices
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD673126S1 (en) * 2011-07-08 2012-12-25 Cree, Inc. LED chip
USD691973S1 (en) 2011-07-08 2013-10-22 Cree, Inc. Lamp packages
USD703348S1 (en) 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD996377S1 (en) 2022-02-17 2023-08-22 Creeled, Inc. Light-emitting diode package
USD996378S1 (en) 2022-03-09 2023-08-22 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080157114A1 (en) * 2004-11-15 2008-07-03 Philips Lumileds Lighting Company, Llc Multiple Lenses Molded Over LED Die
US20090039381A1 (en) 2007-08-10 2009-02-12 Alti-Electronics Co., Ltd. Light emitting diode package and method of manufacturing the same
US20090108281A1 (en) 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD598871S1 (en) 2006-11-06 2009-08-25 Koninklijke Philips Electronics N.V. Et Al. LED package
US7772604B2 (en) 2006-01-05 2010-08-10 Illumitex Separate optical device for directing light from an LED
US7855395B2 (en) 2004-09-10 2010-12-21 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins on a light emitting diode die
USD631020S1 (en) 2010-04-29 2011-01-18 Edison Opto Corporation LED package
US7906788B2 (en) 2004-12-22 2011-03-15 Panasonic Corporation Semiconductor light emitting device, illumination module, illumination apparatus, method for manufacturing semiconductor light emitting device, and method for manufacturing semiconductor light emitting element
US20110062482A1 (en) 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
USD637565S1 (en) 2010-11-02 2011-05-10 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD640643S1 (en) 2010-04-07 2011-06-28 Everlight Electronics Co., Ltd. Light emitting diode
USD642143S1 (en) 2010-07-07 2011-07-26 Panasonic Corporation Light emitting diode
US20110248289A1 (en) 2010-04-09 2011-10-13 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
US20110260192A1 (en) 2008-10-01 2011-10-27 Chang Hoon Kwak Light-emitting diode package using a liquid crystal polymer
US20110278827A1 (en) 2007-11-14 2011-11-17 Faurecia Innenraum Systeme Gmbh Rebound strap for an airbag cover and method for producing a trim part
US20110291154A1 (en) 2009-02-10 2011-12-01 Nichia Corporation Semiconductor light emitting device
USD650343S1 (en) 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD651989S1 (en) 2010-04-09 2012-01-10 Everlight Electronics Co., Ltd. Light emitting diode
US8119534B2 (en) 2003-08-19 2012-02-21 Nichia Corporation Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth
US8210715B2 (en) * 2009-12-09 2012-07-03 Tyco Electronics Corporation Socket assembly with a thermal management structure
USD673126S1 (en) * 2011-07-08 2012-12-25 Cree, Inc. LED chip

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100845856B1 (en) * 2006-12-21 2008-07-14 엘지전자 주식회사 Light emitting device package and its manufacturing method
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8119534B2 (en) 2003-08-19 2012-02-21 Nichia Corporation Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth
US7855395B2 (en) 2004-09-10 2010-12-21 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins on a light emitting diode die
US20080157114A1 (en) * 2004-11-15 2008-07-03 Philips Lumileds Lighting Company, Llc Multiple Lenses Molded Over LED Die
US7906788B2 (en) 2004-12-22 2011-03-15 Panasonic Corporation Semiconductor light emitting device, illumination module, illumination apparatus, method for manufacturing semiconductor light emitting device, and method for manufacturing semiconductor light emitting element
US7772604B2 (en) 2006-01-05 2010-08-10 Illumitex Separate optical device for directing light from an LED
USD598871S1 (en) 2006-11-06 2009-08-25 Koninklijke Philips Electronics N.V. Et Al. LED package
US20090039381A1 (en) 2007-08-10 2009-02-12 Alti-Electronics Co., Ltd. Light emitting diode package and method of manufacturing the same
US20090108281A1 (en) 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
US20110278827A1 (en) 2007-11-14 2011-11-17 Faurecia Innenraum Systeme Gmbh Rebound strap for an airbag cover and method for producing a trim part
US20110260192A1 (en) 2008-10-01 2011-10-27 Chang Hoon Kwak Light-emitting diode package using a liquid crystal polymer
US20110291154A1 (en) 2009-02-10 2011-12-01 Nichia Corporation Semiconductor light emitting device
US8210715B2 (en) * 2009-12-09 2012-07-03 Tyco Electronics Corporation Socket assembly with a thermal management structure
US20110062482A1 (en) 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
USD640643S1 (en) 2010-04-07 2011-06-28 Everlight Electronics Co., Ltd. Light emitting diode
US20110248289A1 (en) 2010-04-09 2011-10-13 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
USD651989S1 (en) 2010-04-09 2012-01-10 Everlight Electronics Co., Ltd. Light emitting diode
USD631020S1 (en) 2010-04-29 2011-01-18 Edison Opto Corporation LED package
USD642143S1 (en) 2010-07-07 2011-07-26 Panasonic Corporation Light emitting diode
USD637565S1 (en) 2010-11-02 2011-05-10 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD650343S1 (en) 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD673126S1 (en) * 2011-07-08 2012-12-25 Cree, Inc. LED chip

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD780704S1 (en) * 2014-08-27 2017-03-07 Mitsubishi Electric Corporation Light source module
USD768584S1 (en) * 2014-11-13 2016-10-11 Mitsubishi Electric Corporation Light source module
USD808576S1 (en) * 2015-09-02 2018-01-23 As Seen On PC, Inc. Bracket for gutter mounted lighting devices
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip

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