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US20160120077A1 - Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil - Google Patents

Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil Download PDF

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Publication number
US20160120077A1
US20160120077A1 US14/894,508 US201414894508A US2016120077A1 US 20160120077 A1 US20160120077 A1 US 20160120077A1 US 201414894508 A US201414894508 A US 201414894508A US 2016120077 A1 US2016120077 A1 US 2016120077A1
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United States
Prior art keywords
thin film
metal thin
electromagnetic wave
copper foil
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/894,508
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English (en)
Inventor
Masahiro Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Assigned to TATSUTA ELECTRIC WIRE & CABLE CO., LTD. reassignment TATSUTA ELECTRIC WIRE & CABLE CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WATANABE, MASAHIRO
Publication of US20160120077A1 publication Critical patent/US20160120077A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape

Definitions

  • the present invention relates to an electromagnetic wave shield film, a shield printed wiring board using the shield film, and a rolled copper foil which is usable for an electromagnetic wave shield film.
  • An electromagnetic wave from the outside is typically shielded, for example, by pasting an electromagnetic wave shield film (printed wiring board shield film) onto a printed wiring board such as a flexible printed wiring board (FPC).
  • an electromagnetic wave shield film printed wiring board shield film
  • FPC flexible printed wiring board
  • an electromagnetic wave shield film recited in PTL 1 is configured in such a way that an adhesive layer, a metal thin film, and an insulating layer are laminated in order.
  • this electromagnetic wave shield film is superposed onto a flexible printed wiring board and thermal pressing is performed, the electromagnetic wave shield film is joined with the printed wiring board by the adhesive layer and the shield printed wiring board is manufactured. After above joining, components are mounted on the printed wiring board by solder reflow.
  • a print pattern on the base film is covered with an insulating film.
  • the shield printed wiring board recited in PTL 1 When the shield printed wiring board recited in PTL 1 is heated in a thermal pressing process or a solder reflow process, gas is generated from the adhesive layer of the electromagnetic wave shield film, the insulating film of the printed wiring board, or the like. Furthermore, when the base film of the printed wiring board is made of highly hygroscopic resin such as polyimide, water vapor may be generated from the base film due to the heating. Such volatile components generated from the adhesive layer, the insulating film, and the base film cannot pass the metal thin film, and hence the volatile components are accumulated between the metal thin film and the adhesive layer.
  • the shield printed wiring board is typically annealed before the solder reflow process to volatilize the volatile components in advance.
  • the annealing requires hours to process, the production time is elongated.
  • the present invention was done to solve the problem above, and an object of the present invention is to provide an electromagnetic wave shield film which prevents a metal thin film and an adhesive layer from being peeled off from each other and to provide a shield printed wiring board using the electromagnetic wave shield film.
  • an electromagnetic wave shield film includes at least a metal thin film and an adhesive layer which are laminated in order, wherein, water vapor permeability according to JISK7129 is 0.5 g/m 2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a differential pressure of latm.
  • the water vapor permeability according to JISK7129 is 0.5 g/m 2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a differential pressure of 1 atm, even if volatile components are generated from the adhesive, the resin film of the printed wiring board, or the like when the electromagnetic wave shield film of the present invention which is adhered to the printed wiring board by the adhesive is heated, the volatile components are allowed to escape to the outside, and hence delamination due to the accumulation of the volatile components between the metal thin film and the adhesive layer is prevented.
  • the electromagnetic wave shield film of the first aspect is configured such that the metal thin film is formed by impregnating, into a solvent, a metal sheet formed of a hard-to-melt component with low solubility in the solvent and an easily-melted component more soluble in the solvent than the hard-to-melt component, the easily-melted component is particles of a granular material dispersed in the metal sheet, and as the granular material is dissolved in the solvent, openings are formed in the metal thin film.
  • the granular material made of the easily-melted component dissolves and disappear as it is more easily dissolved in the solvent than the hard-to-melt component. Therefore, the openings may be formed in the metal thin film.
  • the metal thin film with multiple openings all over is obtained.
  • the electromagnetic wave shield film of the third aspect of the invention is configured such that, in the second aspect, the hard-to-melt component is metal mainly made of copper, whereas the easily-melted component is copper oxide.
  • the electromagnetic wave shield film of the present invention is efficiently produced by using an etching solution which has been commonly used as a solvent.
  • the commonly-used etching solution include a sodium persulfate aqueous solution, a mixed solution of hydrogen peroxide and sulfuric acid, an iron chloride aqueous solution, and a copper chloride aqueous solution.
  • the electromagnetic wave shield film of the fourth aspect of the invention is configured such that, in the second aspect, the hard-to-melt component is metal mainly made of copper, whereas the easily-melted component is copper oxide (I).
  • the electromagnetic wave shield film of the present invention is further efficiently produced by using an etching solution which has been commonly used as a solvent.
  • the electromagnetic wave shield film of the fifth aspect of the invention is configured such that, in any one of the second to fourth aspects, each of the openings ranges from 0.1 to 100 ⁇ m in diameter.
  • each opening is 0.1 ⁇ m or longer in diameter, even if volatile components are generated from the adhesive, the resin film of the printed wiring board, or the like when the electromagnetic wave shield film of the present invention adhered to the printed wiring board by the adhesive is heated, the volatile components are allowed to escape to the outside through the openings of the metal thin film, and hence the accumulation of the volatile components from the adhesive or the like between the metal thin film and the adhesive layer is prevented.
  • each opening is 100 ⁇ m or shorter in diameter, good electromagnetic wave shielding characteristics are exhibited to low frequency electromagnetic waves, and the metal thin film is less likely to be broken and is easily handled.
  • each opening is preferably 50 ⁇ m or shorter in diameter, and more preferably 10 ⁇ m or shorter in diameter.
  • the electromagnetic wave shield film of the sixth aspect of the invention is configured such that, in any one of the second to fifth aspects, the number of the openings per 1 cm 2 in the metal thin film is 10 to 1000/cm 2 .
  • the number of the openings is 10/cm 2 or more, even if volatile components are generated from the adhesive, the resin film of the printed wiring board, or the like when the electromagnetic wave shield film of the present invention adhered to the printed wiring board by the adhesive is heated, the volatile components are allowed to escape to the outside through the openings of the metal thin film, and hence the accumulation of the volatile components from the adhesive or the like between the metal thin film and the adhesive layer is further certainly prevented.
  • the number of the openings is 1000/cm 2 or less, the metal thin film is less likely to be broken and is easily handled.
  • the electromagnetic wave shield film of the seventh aspect of the invention is configured such that, in any one of the second to sixth aspects, the metal thin film is in a range of 0.5 to 12 ⁇ m in thickness.
  • the thickness of the metal thin film is 0.5 ⁇ m or thicker, the metal thin film is less likely to be broken and is easily handled, and good electromagnetic wave shielding characteristics are achieved.
  • the electromagnetic wave shield film shows good flexibility.
  • the electromagnetic wave shield film of the eighth aspect of the invention is configured such that, in any one of the first to seventh aspects, the metal thin film is a rolled copper foil.
  • the rolled copper foil when used as the metal thin film of the electromagnetic wave shield film, good electromagnetic wave shielding characteristics are achieved. Furthermore, because the rolled copper foil is an inexpensive material, a metal thin film suitable for the electromagnetic wave shield film is obtained.
  • the rolled copper foil is formed of tough-pitch copper made of copper oxide (I) and pure copper which is 99.9% or higher in purity, in which the copper oxide is equivalent to the easily-melted component and the pure copper is equivalent to the hard-to-melt component. This is because a metal thin film having plural openings is easily obtained by using a commonly-used etching solution.
  • the rolled copper foil other than the tough-pitch copper is a copper foil including copper oxide such as an HA foil (made by JX Nippon Mining & Metals Corp.).
  • a copper foil with desired thickness is obtained by etching the rolled copper foil, the thickness of the metal thin film is highly precisely adjusted and the metal thin film suitably used for the electromagnetic wave shield film.
  • a rolled copper foil of the ninth aspect of the present invention is a rolled copper foil in which openings are formed by wet etching, wherein, each of the openings is in a range of 0.1 to 100 ⁇ m in diameter, the number of the openings per 1 cm 2 in the rolled copper foil is in a range of 10 to 1000/cm 2 , and the rolled copper foil is in a range of 0.5 to 12 ⁇ m in thickness.
  • a metal thin film suitable for an electromagnetic wave shield film is obtained by conventional wet etching and by using an inexpensive and widely-available rolled copper foil.
  • the number of the openings is 10 to 1000/cm 2 per 1 cm 2 in the rolled copper foil, and the thickness of the rolled copper foil is in a range of 0.5 to 12 ⁇ m, when the electromagnetic wave shield film of the present invention adhered to the printed wiring board by the adhesive is heated, even if volatile components are generated from the adhesive, the resin film of the printed wiring board or the like, the volatile components are allowed to escape to the outside via the openings of the metal thin film, and hence delamination due to the volatile components accumulating between the metal thin film and the adhesive layer is prevented, and an electromagnetic wave shield film showing good shielding characteristics is provided.
  • the wet etching in the present invention may be a known method. Examples of the known wet etching include elution of metal by electrolysis
  • a shield printed wiring board of the tenth aspect of the invention is configured to include the electromagnetic wave shield film of any one of the first to eighth aspects.
  • FIG. 1 is a cross section of an electromagnetic wave shield film of First Embodiment.
  • FIG. 2 is a cross section of a shield printed wiring board including the electromagnetic wave shield film of FIG. 1 .
  • FIG. 3A is an end view for explaining a process of manufacturing a metal thin film of the electromagnetic wave shield film of FIG. 1 .
  • FIG. 3B is an end view for explaining a process of manufacturing a metal thin film of the electromagnetic wave shield film of FIG. 1 .
  • FIG. 4A is an end view for explaining a process of manufacturing a metal thin film of Second Embodiment and Third Embodiment.
  • FIG. 4B is an end view for explaining a process of manufacturing a metal thin film of Second Embodiment and Third Embodiment.
  • FIG. 4C is an end view for explaining a process of manufacturing a metal thin film of Second Embodiment and Third Embodiment.
  • FIG. 5A is an end view for explaining a process of manufacturing a metal thin film of Fourth Embodiment.
  • FIG. 5B is an end view for explaining a process of manufacturing a metal thin film of Fourth Embodiment.
  • FIG. 5C is an end view for explaining a process of manufacturing a metal thin film of Fourth Embodiment.
  • FIG. 5D is an end view for explaining a process of manufacturing a metal thin film of Fourth Embodiment.
  • FIG. 6A is an end view for explaining a process of manufacturing a metal thin film of Fifth Embodiment.
  • FIG. 6B is an end view for explaining a process of manufacturing a metal thin film of Fifth Embodiment.
  • FIG. 7A shows photos before and after the etching of a rolled copper foil of Example 1.
  • FIG. 7B shows photos before and after the etching of a rolled copper foil of Example 2.
  • an electromagnetic wave shield film 1 of the present embodiment (hereinafter, a shield film 1 ) is formed by laminating a transfer film 2 , an insulating layer 3 , a metal thin film 4 , and an adhesive layer 5 in order.
  • the shield film 1 is used by being pasted onto, for example, a flexible printed wiring board (FPC) 6 shown in FIG. 2 or a printed wiring board such as a COF (Chip On Flex), an RF (flex print board), a multilayer flexible substrate, and a rigid substrate.
  • FPC flexible printed wiring board
  • the shield film 1 and the flexible printed wiring board 6 constitute a shield printed wiring board 10 .
  • the transfer film 2 is provided for purposes such as the protection of the insulating layer 3 or the like when the shield film 1 is mounted on the flexible printed wiring board 6 and thermal pressing is performed, and for purposes such as the improvement in handling of the shield film 1 by improving the rigidity to the shield film 1 .
  • the transfer film 2 is, for example, made of polyethylene terephthalate (PET), polypropylene, cross-linked polyethylene, polybenzimidazole, aramid, polyimide, polyimidoamide, polyetherimide, polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), or like.
  • PET polyethylene terephthalate
  • PPS polyphenylene sulfide
  • PEN polyethylene naphthalate
  • the transfer film 2 may not be provided.
  • the insulating layer 3 is provided to insulate the metal thin film 4 so as to prevent short-circuiting of the metal thin film 4 with surrounding circuits.
  • the insulating layer 3 is formed of a cover film or a coating layer made of insulating resin.
  • the insulating layer 3 may include a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, filler, a flame retardant, a viscosity control agent, an antiblocking agent, or the like.
  • the insulating layer 3 may be formed by two or more types of layers which are different from one another in composition.
  • the insulating resin of which the cover film is made is engineering plastics.
  • the engineering plastics include polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimidoamide, polyetherimide, polyphenylene sulfide (PPS), and polyethylene naphthalate (PEN).
  • the cover film is joined with the metal thin film 4 by using, for example, an adhesive.
  • the insulating resin of which the coating layer is formed examples include thermoplastic resin, thermosetting resin, ultraviolet-curing resin and electron-beam-curing resin.
  • the thermoplastic resin include styrene-based resin, vinyl acetate-based resin, polyester-based resin, polyethylene-based resin, polypropylene-based resin, imide-based resin, and acryl-based resin.
  • the thermosetting resin include phenol resin, acrylic resin, epoxy resin, melamine resin, silicon resin, and acryl-modified silicon resin.
  • the ultraviolet-curing resin include epoxy acrylate resin, polyester acrylate resin, and methacrylate modifications thereof.
  • the coating layer is, for example, formed to be closely in contact with the metal thin film as the resin is applied to the surface of the metal thin film and dried.
  • the metal thin film 4 has a shielding effect of shielding an electromagnetic wave from the outside and noise such as unnecessary radiation of an electric signal from the printed wiring board 6 .
  • the metal thin film 4 is made of copper or copper alloy.
  • An example of the copper alloy is an alloy which is mainly made of copper and includes any one of silver, nickel, tin, gold, platinum, palladium, aluminum, chromium, titanium, and zinc, or at least two of them. Because the metal thin film 4 is formed of copper or alloy which is mainly made of copper, good electromagnetic wave shielding characteristics and good economic efficiency are achieved.
  • the thickness of the metal thin film 4 is in a range of 0.5 to 12 ⁇ m, and is preferably in a range of 2 to 3 ⁇ m.
  • each pin hole 4 a is about 0.1 to 100 ⁇ m in diameter.
  • the diameter of the pin hole 4 a is preferably 50 ⁇ m or shorter and more preferably 10 ⁇ m or shorter.
  • the density of the pin holes 4 a is in a range of 10 to 1000 holes/cm 2 .
  • the metal thin film 4 of the present embodiment is formed by impregnating, into an etching solution, a rolled copper foil 11 which is formed by copper or copper alloy rolled by rollers or the like.
  • the rolled copper foil 11 includes granular copper oxide 12 .
  • the copper oxide 12 is 0.1 to 100 ⁇ m in grain diameter and is dispersed over the entire rolled copper foil 11 .
  • the thickness of the rolled copper foil 11 before the etching is in a range of 1.0 to 100 ⁇ m, and is preferably in a range of about 10 to 40 ⁇ m when the thickness after the etching is in a range of 2 to 3 ⁇ m.
  • the rolled copper foil 11 is preferably a rolled copper foil formed by rolling tough-pitch copper or an HA foil (product name) which is formed by rolling alloy of copper and silver and is made by JX Nippon Mining & Metals Corp.
  • the rolled copper foil made of the tough-pitch copper is particularly preferable on account of a large content of the copper oxide.
  • the tough-pitch copper is copper which includes copper oxide (I) and pure copper occupies at least 99.9% of the tough-pitch copper.
  • the HA foil also includes the copper oxide (I).
  • the etching solution include an etching-solution sodium persulfate aqueous solution, a mixture liquid of hydrogen peroxide and sulfuric acid, an iron chloride aqueous solution, and a copper chloride aqueous solution.
  • the copper oxide 12 is highly soluble in the above-described etching solution as compared to a part of the rolled copper foil 11 excluding the copper oxide 12 (i.e., pure copper or copper alloy).
  • the rolled copper foil 11 is impregnated into the etching solution, as shown in FIG. 3B , the rolled copper foil 11 is getting thinned as the copper oxide 12 is dissolved and disappear so that the pin holes 4 a substantially identical in size with the gram diameter of the copper oxide 12 may be formed in the rolled copper foil 11 .
  • the copper oxide 12 is dispersed over the entire rolled copper foil 11 , the plural pin holes 4 a are formed in the entire rolled copper foil 11 .
  • the pin holes are formed in the metal thin film 4 in such a way that the copper oxide 12 is preferentially dissolved by the etching solution so that the pin holes 4 a are formed in the entire rolled copper foil 11 .
  • the adhesive layer 5 is provided to make the shield film 1 adhere to the printed wiring board 6 .
  • the adhesive resin from which the adhesive layer 5 is formed is thermoplastic resin, thermosetting resin, ultraviolet-curing resin, or electron-beam-curing resin.
  • the adhesive layer 5 is, for example, formed to be closely in contact with the metal thin film 4 in such a way that resin is applied to the surface of the metal thin film 4 and cured.
  • thermoplastic resin of which the adhesive layer 5 is formed examples include polystyrene-based resin, vinyl acetate-based resin, polyester-based resin, polyethylene-based resin, polypropylene-based resin, polyamide-based resin, rubber-based resin, and acryl-based resin.
  • thermosetting resin of which the adhesive layer 5 is formed examples include phenol-based resin, epoxy-based resin, urethane-based resin, melamine-based resin, and alkyd-based resin.
  • the resin from which the adhesive layer 5 is formed may be entirely a single type of the resin above or may be a mixture of plural types of the resins above.
  • Examples of a layer-forming component of the ultraviolet-curing resin from which the adhesive layer 5 is formed include cationic polymers and radical polymers.
  • Examples of the cationic polymers include epoxy-based polymer, vinyl ether-based polymer, and oxetane-based polymer.
  • Examples of the radical polymers include polyester acrylate-based polymer, polyether acrylate-based polymer, acrylic oligomer acrylate-based polymer, urethane acrylate-based polymer, and epoxy acrylate-based polymer.
  • An example of special radical polymerization with thiyl radicals is a combination formed by polyene with aryl group and polythiol with thiol group.
  • cationic polymer which is a combination of solvent-soluble polyester resin, epoxy resin, cationic polymerization catalyst, and modified epoxy resin is preferably used, but the disclosure is not limited to this.
  • the epoxy resin used in the cationic polymer may be a diglycidyl-type such as bisphenol A, F, and AF with an epoxy equivalent of 10000 or lower.
  • Representative examples of the modified epoxy resin are glycidylated polyester resin and glycidylated butadiene.
  • the ultraviolet-curing resin is preferably successively-polymerized polymer. Furthermore, this successively-polymerized polymer is preferably ultraviolet-curing cationic polymer.
  • the successively-polymerized polymer is cured even if ultraviolet light is irradiated for a short time, as the reaction successively progresses once the reaction starts.
  • the adhesive layer 5 may be cured under the radiation of ultraviolet right for a short time. After the curing, the adhesive layer 5 excels in heat resistance. To accelerate the reaction speed, the cationic polymer may coexist with radical polymer.
  • Another layer-forming component of the ultraviolet-curing resin is rubber, polyfunctional acrylate, or the like.
  • the rubber include styrene-butadiene-based block, random copolymer, acrylic rubber, polyisoprene, polybutadiene, butadiene-acrylnitrile rubber, polychloroprene, ethylene-vinyl acetate copolymer.
  • An example of the polyfunctional acrylate is trimethylolpropane acrylate.
  • the layer-forming component of the electron-beam-curing resin from which the adhesive layer 5 is formed is mainly made of, for example, unsaturated polyester type, epoxy acrylate type, urethane acrylate type, polyester acrylate type, polyether acrylate type, and acryl type.
  • a material which does not include an initiator in the composition of the ultraviolet-curing resin may be used.
  • An example of such a material is a compound composition made up of epoxy acrylate, polyester acrylate, GPTA (Glyceryl Propoxy Triacrylate), and TRPGDA (Tripropylene Glycol Diacrylate).
  • the ultraviolet-curing resin includes a polymerization initiator for initiating the polymerization.
  • a radical-polymer-type polymerization initiator include hydrogen abstraction types (e.g., benzophenone and thioxanthones), types with which radicals are formed by cleavage (e.g., benzoin ethers and acetophenones), and electron transfer types (e.g., a combination of aromatic ketone and tertiary amine).
  • a cationic-polymer-type polymerization initiator include onium salts such as aromatic diazonium, aromatic halonium, and aromatic sulfonium.
  • An example of an addition-polymer-type polymerization initiator is benzophenone.
  • powder plated with silver, aluminum or gold, glass beads, or resin balls may be mixed into ultraviolet-curing resin or electron-beam-curing resin.
  • ultraviolet light having entered a part of the ultraviolet-curing resin or the electron-beam-curing resin is irregularly reflected to spread across the ultraviolet-curing resin or the electron-beam-curing resin, with the result that the curing is further promoted.
  • the adhesive layer 5 may further include a tackifier.
  • the tackifier include fatty acid hydrocarbon resin, C5/C9 mixed resin, rosin, rosin derivative, terpene resin, aromatic hydrocarbon resin, and thermal reactive resin.
  • the adhesive layer 5 is preferably a conductive adhesive layer in which conductive fillers are included in the adhesive resin described above.
  • the conductive fillers are entirely or partially formed of a metal material.
  • the conductive fillers may be made of conductive fibers, carbon, silver, copper, nickel, solder, aluminum, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, or gold-coated nickel powder.
  • Such metal powders may be formed by atomization, carbonylation, or the like.
  • the conductive fillers particles formed by metal-plated resin balls, glass beads or the like, or particles formed by coating metal powder with resin may be used.
  • the conductive fillers may be a mixture of two or more types of the above-described metal powders and particles.
  • the conductive fillers are preferably silver-coated copper powder or silver-coated nickel powder. This is because conductive particles with stable conductivity may be obtained from inexpensive materials.
  • the conductive fillers are made of metal which is formed of at least two components, forms alloy when melted, and is low-melting-point metal in which the remelting temperature of the alloy is higher than the initial melting point.
  • the conductive fillers are melted and joined at a temperature which is sufficiently low to prevent components or the like of the printed wiring board 6 from being damaged, when the shield film 1 is joined with the printed wiring board 6 by thermal pressing.
  • the conductive fillers are cooled and solidified after the melting, the conductive fillers become alloy and the remelting point of the conductive fillers becomes higher than the initial melting point. For this reason, the conductive fillers which have been heated and solidified are less likely to be melted again, even if the shield film 1 is exposed to a high-temperature environment.
  • the ratio of the conductive fillers to the adhesive resin is preferably 10 to 400 parts by weight relative to 100 parts by weight of the adhesive resin in case of silver-coated copper fillers, and is more preferably 20 to 150 parts by weight relative to 100 parts by weight of the adhesive resin.
  • the ratio of the conductive fillers exceeds 400 parts by weight, the adhesiveness to a later-described ground circuit 8 b is deteriorated and the flexibility of the shield printed wiring board 10 becomes deteriorated.
  • the conductivity is significantly deteriorated when the ratio of the conductive fillers is lower than 10 parts by weight.
  • the ratio of the conductive fillers to the adhesive resin is preferably 40 to 400 parts by weight relative to 100 parts by weight of the adhesive resin, and is more preferably 100 to 350 parts by weight relative to 100 parts by weight of the adhesive resin.
  • the ratio of the conductive fillers exceeds 400 parts by weight, the adhesiveness to the later-described ground circuit 8 b is deteriorated and the flexibility of the shield FPC or the like become deteriorated.
  • the conductivity is significantly deteriorated when the ratio of the conductive fillers is lower than 40 parts by weight.
  • the shape of the metal filler may be any one of spherical, needle-shaped, fiber-shaped, flake-shaped, or resin-shaped.
  • the conductive adhesive layer may be an anisotropic conductive adhesive layer.
  • the anisotropic conductive adhesive layer is an adhesive layer which has different conductivities in thickness directions and in surface directions. With this, better transmission characteristics are achieved than those of an isotropic conductive adhesive layer which an electrically conductive state is achieved in all directions in three dimensions constituted by thickness direction, width direction, and longitudinal direction.
  • the anisotropic conductive adhesive layer 5 is formed in such a way that a flame retardant and the above-described conductive fillers are added to an adhesive.
  • the minimum thickness of the anisotropic conductive adhesive layer 5 is preferably 2 ⁇ m, and more preferably 3 ⁇ m.
  • the maximum thickness of the anisotropic conductive adhesive layer 5 is preferably 15 ⁇ m, and more preferably 9 ⁇ m.
  • the adhesive included in the anisotropic conductive adhesive layer 5 is formed of thermoplastic resin such as polystyrene-based resin, vinyl acetate-based resin, polyester-based resin, polyethylene-based resin, polypropylene-based resin, polyamide-based resin, rubber-based resin, and acryl-based resin, or thermosetting resin such as phenol-based resin, epoxy-based resin, urethane-based resin, melamine-based resin, and alkyd-based resin.
  • the adhesive may be entirely a single type of the resin above or may be a mixture of plural types of the resins above.
  • the amount of the added conductive fillers is in a range of 3 weight % to 39 weight % relative to the total amount of the anisotropic conductive adhesive layer 5 .
  • the average particle diameter of the conductive fillers preferably falls within the range of 2 ⁇ m to 20 ⁇ m, but an optimum value may be chosen in accordance with the thickness of the anisotropic conductive adhesive layer 5 .
  • the water vapor permeability of the shield film 1 according to JISK7129 is 0.5 g/m 2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a differential pressure of latm.
  • the shield film 1 is, for example, manufactured in such a way that, after the metal thin film 4 is formed by etching the rolled copper foil 11 as described above, the insulating layer 3 is formed on one surface of the metal thin film 4 and then the transfer film 2 is formed further thereon. Furthermore, the adhesive layer 5 is formed on the other surface of the metal thin film 4 .
  • the flexible printed wiring board 6 to which the shield film 1 is pasted will be described. As shown in FIG. 2 , the flexible printed wiring board 6 is formed by laminating a base film 7 , a printed circuit 8 , and an insulating film 9 in order.
  • the printed circuit 8 is formed of a signal circuit 8 a and a ground circuit 8 b .
  • the ground circuit 8 b is covered by the insulating film 9 except at least a part of the ground circuit 8 b .
  • the adhesive layer 5 of the shield film 1 is formed of conductive adhesive
  • the ground circuit 8 b and the metal thin film 4 are electrically connected with each other via the adhesive layer 5 , with the result that the electromagnetic wave shielding characteristics are improved.
  • the base film 7 and the insulating film 9 are both made of engineering plastics.
  • the engineering plastics include resins such as polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimidoamide, polyetherimide, and polyphenylene sulfide (PPS).
  • the base film 7 and the printed circuit 8 may be joined with each other by adhesive, or may be joined with each other without an adhesive, i.e., in the same manner as a non-adhesive type copper clad laminate.
  • the insulating film 9 may be formed by laminating flexible insulating films 9 by adhesive, or may be formed by performing a series of processes, i.e., application, drying, exposure, development, and thermal treatment of photosensitive insulating resin.
  • the shield printed wiring board 10 may be manufactured in such a way that, when the adhesive layer 5 of the shield film 1 is formed of thermoplastic resin or thermosetting resin, the shield film 1 is mounted on the flexible printed wiring board 6 and thermal pressing is conducted, so that the shield film 1 is joined with the flexible printed wiring board 6 .
  • the shield film 1 is mounted on the flexible printed wiring board 6 and ultraviolet light or an electron beam is irradiated from the transfer film 2 side. Because the pin holes 4 a are formed in the metal thin film 4 , the ultraviolet light or the electron beam passes through the metal thin film 4 and reach the ultraviolet-curing resin or the electron-beam-curing resin. With this, the ultraviolet-curing resin or the electron-beam-curing resin is cured and the shield film 1 is joined with the flexible printed wiring board 6 .
  • the pin holes 4 a are formed in the metal thin film 4 , and the water vapor permeability of the shield film 1 according to JISK7129 is 0.5 g/m 2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a differential pressure of 1 atm, the volatile components described above pass through the metal thin film 4 and are discharged to the outside, and hence delamination due to the volatile components accumulating between the metal thin film 4 and the adhesive layer 5 is prevented.
  • the diameter of each pin hole 4 a formed by etching may be in a range of 0.1 to 100 ⁇ m.
  • the diameter of each pin hole 4 a is configured to be 0.1 ⁇ m or longer, the volatile components generated from the adhesive layer 5 or the like are allowed to escape to the outside through the pin holes 4 a of the metal thin film 4 .
  • the diameter of each pin hole 4 a is configured to be 100 ⁇ m or shorter, the metal thin film 4 is less likely to be broken and is easily handled, and the electromagnetic wave shield film 1 exhibits good electromagnetic wave shielding characteristics with respect to low frequency electromagnetic waves.
  • diameter of each pin hole is preferably 50 ⁇ m or shorter, and more preferably 10 ⁇ m or shorter.
  • the electromagnetic wave shield film 1 exhibits good electromagnetic wave shielding characteristics. Furthermore, as the thickness of the rolled copper foil 11 before etching is configured to be 100 ⁇ m or thinner, the time required to melt the copper oxide 12 to form the pin holes 4 a is shortened when the rolled copper foil 11 is impregnated into the etching solution. In view of the reduction of the time required for melting the copper oxide 12 to form the pin holes 4 a , the thickness of the rolled copper foil 11 before etching is preferably 50 ⁇ m or thinner, and more preferably 10 ⁇ m or thinner.
  • the number of the pin holes 4 a in the metal thin film 4 per 1 cm 2 is configured to be 10/cm 2 or more, delamination due to the volatile components which are generated from the adhesive or the like and accumulate between the metal thin film 4 and the adhesive layer 5 of the electromagnetic wave shield film 1 is further certainly prevented.
  • the number of the pin holes 4 a in the metal thin film 4 per 1 cm 2 is configured to be 1000/cm 2 or less, the metal thin film 4 after the etching is less likely to be broken, and the handling of the metal thin film 4 is improved.
  • the thickness of the metal thin film 4 after the etching is configured to be 0.5 ⁇ m or thicker, the metal thin film 4 is less likely to be broken and easily handled, and the electromagnetic wave shield film 1 exhibits good electromagnetic wave shielding characteristics. Furthermore, because the thickness of the metal thin film 4 after the etching is configured to be 12 ⁇ m or thinner, the flexibility of the electromagnetic wave shield film 1 is good.
  • the copper oxide 12 in the rolled copper foil 11 before the etching is equivalent to a granular material in an easily-melted component of a metal sheet of the present invention
  • the pure copper or copper alloy in the rolled copper foil 11 is equivalent to a hard-to-melt component of the metal sheet of the present invention.
  • the materials of the metal sheet forming the metal thin film of the present invention are not limited to them.
  • the metal thin film having pin holes and made of copper or copper alloy may be manufactured by etching a metal sheet where a granular material formed of a component is dispersed through a predetermined solvent.
  • the component is more soluble in the predetermined solvent than the metal thin film.
  • the thickness of the metal thin film (metal sheet) before the etching, the granular diameter of the granular material, the thickness of the metal thin film after the etching, and preferred ranges of the diameter of each pin hole and the density are identical with those in the embodiment above.
  • the metal sheet before the etching is preferably twice as thick as the granular material at the maximum, and more preferably 1.5 times as thick as the granular material at the maximum.
  • the metal thin film having pin holes and formed of aluminum, silver, or gold or formed of alloy mainly made of one of these metals may be manufactured by etching a metal sheet where a granular material formed of a component is dispersed through a predetermined solvent.
  • the component is more soluble in the predetermined solvent than the metal thin film.
  • a non-limiting example of the component of the granular material is a component which is easily soluble in an etching solution used in typical etching.
  • the thickness of the metal thin film (metal sheet) before the etching, the granular diameter of the granular material, the thickness of the metal thin film after the etching, and preferred ranges of the diameter of each pin hole and the density of the pin holes are identical with those in the embodiment above.
  • the metal sheet before the etching is preferably twice as thick as the granular material at the maximum, and more preferably 1.5 times as thick as the granular material at the maximum.
  • the flexible printed wiring board 6 of the present embodiment is a single-sided FPC which has a printed circuit 8 on only one surface of the base film 7
  • the flexible printed wiring board 6 may be a double-sided FPC in which printed circuits 8 are provided on both surfaces of the base film 7 or a multilayer FPC in which the FPCs are laminated to form plural layers.
  • the shield film 1 is provided on only one surface of the flexible printed wiring board 6
  • the shield films 1 may be provided on both surfaces of the flexible printed wiring board 6 to shield these surfaces.
  • a shield film of the present embodiment is identical with the shield film 1 of the First Embodiment except that a metal thin film 104 is different from the metal thin film 4 of the shield film 1 of First Embodiment.
  • the water vapor permeability of the shield film of the present embodiment according to JISK7129 is identical with that in First Embodiment, i.e., 0.5 g/m 2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a differential pressure of 1 atm.
  • the metal thin film 104 is formed of copper and has plural pin holes 104 a as shown in FIG. 4C .
  • the thickness (maximum thickness) of the metal thin film 104 , the diameter of each pin hole 104 a , and the density of the pin holes 104 a are identical with those in the metal thin film 4 of First Embodiment. It is noted that, because FIG. 4 is used also in Third Embodiment below, the reference numerals 204 , 204 a , and 221 in FIG. 4 are provided for Third Embodiment.
  • the metal thin film 104 of the present embodiment is manufactured in such a way that, to begin with, as shown in FIG. 4A , a carrier copper foil 120 having a roughened surface and including a release layer (not illustrated) thereon is prepared.
  • the surface roughness Ra of the surface of the carrier copper foil 120 is, for example, 1.0 ⁇ m or higher and 10 ⁇ m or lower. (This Ra is defined in JIS B 0601-1994).
  • the release layer is formed on the surface of the carrier copper foil by a known method, e.g., a carrier copper foil is impregnated into a chromium trioxide aqueous solution so that the surface of the carrier copper foil is chromated.
  • this carrier copper foil 120 is impregnated into a sulfuric acid/sulfuric acid copper bath liquid so that, as shown in FIG. 4B , an electro-deposited copper foil 121 is formed on the release layer of the carrier copper foil 120 on account of electrolytic plating. Because the surface of the carrier copper foil 120 is minutely uneven, the thickness of the electro-deposited copper foil 121 is uneven, too. When the electro-deposited copper foil 121 becomes as thick as the metal thin film 4 to be manufactured, the electrolysis is terminated, and as shown in FIG. 4C , the electro-deposited copper foil 121 is peeled off from the release layer on the carrier copper foil 120 .
  • the thickness of the copper foil 121 formed by the electrolytic plating is significantly uneven.
  • the electro-deposited copper foil 121 is broken at thin parts (concave parts) at the time of the peeling, with the result that pin holes 104 a are formed.
  • the pin holes 104 a are formed in the metal thin film 104 , volatile components generated from the adhesive layer 5 or the like when the shield flexible printed wiring board is heated are able to pass through the metal thin film 104 in the same manner as in First Embodiment, and hence delamination due to the volatile components accumulating between the metal thin film 104 and the adhesive layer 5 is prevented.
  • metal thin film 104 is made of copper
  • a metal thin film may be formed of metal other than copper (e.g., alloy mainly made of copper, or aluminum, silver, gold, or alloy mainly made of them), by the same manufacturing method as the metal thin film 104 of the present embodiment.
  • a shield film of the present embodiment is different from the shield film of Second Embodiment in the method of manufacturing a metal thin film 204 .
  • the material and thickness of the metal thin film 204 are identical with those in the shield film of Second Embodiment.
  • the water vapor permeability of the shield film of the present embodiment according to JISK7129 is identical with that in First Embodiment, i.e., 0.5 g/m 2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a differential pressure of latm.
  • the metal thin film 204 of the present embodiment is manufactured in such a way that, to begin with, as shown in FIG. 4A , a carrier copper foil 120 having a roughened surface and including a release layer (not illustrated) thereon is prepared in the same manner as in Second Embodiment.
  • a copper foil 221 is formed on the release layer of the carrier copper foil 120 by vacuum deposition, ion plating, sputtering, CVD, MO (Metal Organic), or the like, which are additive methods.
  • vacuum deposition ion plating, sputtering, CVD, MO (Metal Organic), or the like, which are additive methods.
  • the carrier copper foil 120 with the release layer is set in a vacuum deposition device (not illustrated), and the vapor-deposited copper foil 221 is formed on the release layer of the carrier copper foil 120 by vacuum deposition as shown in FIG. 4B .
  • the vacuum deposition is terminated when the vapor-deposited copper foil 221 becomes substantially as thick as the metal thin film 4 to be formed, and the vapor-deposited copper foil 221 is peeled off from the release layer of the carrier copper foil 120 as shown in FIG. 4C .
  • the thickness of the copper foil 221 formed by the vacuum deposition is significantly uneven.
  • the vapor-deposited copper foil 221 is broken at thin parts (concave parts) at the time of the peeling, with the result that pin holes 204 a are formed.
  • the diameter of each pin hole 204 a generated by the peeling and the density of these pin holes 204 a are identical with those of the pin holes 104 a of Second Embodiment.
  • the kinetic energy of a vacuum deposition material heading toward a base on which the deposition is performed is typically lower than in other additive methods, it is difficult to obtain a fine film.
  • pin holes (not illustrated; see pin holes 404 a in FIG. 6 ) are formed differently from the pin holes 104 a formed by the peeling. Because the vacuum deposition is a method with which such pin holes are particularly easily formed among the additive methods above, the metal thin film 204 is preferably formed by the vacuum deposition.
  • the pin holes 204 a are formed in the metal thin film 204 , volatile components generated from the adhesive layer 5 or the like when the shield flexible printed wiring board is heated are able to pass through the metal thin film 204 in the same manner as in First Embodiment, and hence delamination due to the volatile components accumulating between the metal thin film 204 and the adhesive layer 5 is prevented.
  • a metal thin film may be formed of metal which is not copper (e.g., alloy mainly made of copper, aluminum, silver, gold, or alloy mainly made of them), by the same manufacturing method as the metal thin film 104 of the present embodiment.
  • a shield film of the present embodiment is different from the shield film of First Embodiment in the method of manufacturing a metal thin film 304 .
  • the configurations (material, thickness, diameter of each pin hole 304 a , and density of pin holes 304 a ) of the metal thin film 304 are identical with those of the shield film of Second Embodiment.
  • the metal thin film 304 of the present embodiment is manufactured in such a way that, to begin with, as shown in FIG. 5A and FIG. 5B , by using a carrier copper foil 320 having a roughened surface and including release layer (not illustrated) thereon in the same manner as in Second Embodiment, an electro-deposited copper foil 321 is formed by electrolytic plating. The electrolysis is terminated when the thickness of the electro-deposited copper foil 321 reaches predetermined thickness which is thicker than the thickness of the metal thin film 304 to be formed, and as shown in FIG. 5C , the electro-deposited copper foil 321 is peeled off from the release layer on the carrier copper foil 320 .
  • the electro-deposited copper foil 321 is thicker than the electro-deposited copper foil 121 of Second Embodiment, thin parts (concave parts) of the electro-deposited copper foil 321 are rarely broken by the peeling. The thin parts may be broken.
  • the electro-deposited copper foil 321 is impregnated into an etching solution which is a sodium persulfate aqueous solution, a mixed solution of hydrogen peroxide and sulfuric acid, or the like. Because the overall thickness of the electro-deposited copper foil 321 is reduced by the impregnation, the thin parts at the time of the peeling are melted and penetrated, with the result that pin holes 304 a are formed.
  • an etching solution which is a sodium persulfate aqueous solution, a mixed solution of hydrogen peroxide and sulfuric acid, or the like.
  • the pin holes 304 a are formed in the metal thin film 304 , volatile components generated from the adhesive layer 5 or the like when the shield flexible printed wiring board is heated are able to pass through the metal thin film 304 in the same manner as in First and Second Embodiments, and hence delamination due to the volatile components accumulating between the metal thin film 304 and the adhesive layer 5 is prevented.
  • metal thin film 304 is made of copper
  • a metal thin film may be formed of metal which is not copper (e.g., alloy mainly made of copper, aluminum, silver, gold, or alloy mainly made of them), by the same manufacturing method as the metal thin film 304 of the present embodiment.
  • a metal thin film 404 of a shield film of the present embodiment is made of silver.
  • the thickness of the metal thin film 404 is preferably in a range of 0.1 to 12 ⁇ m, for example.
  • plural pin holes 404 a are formed in the metal thin film 404 .
  • the water vapor permeability of the shield film of the present embodiment according to JISK7129 is identical with the that in First Embodiment, i.e., 0.5 g/m 2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a differential pressure of 1 atm.
  • the metal thin film 404 of the present embodiment is manufactured in such a way that, to begin with, as shown in FIG. 6A , an insulating layer 3 is prepared to mount the metal thin film 404 thereon.
  • the insulating layer 3 may be, for example, a cover film made of insulating resin, in consideration of the handling when the insulating layer 3 is set in a later-described vacuum deposition device.
  • a silver foil 404 is formed on the surface of the insulating layer 3 as shown in FIG. 6B by vacuum deposition, ion plating, sputtering, CVD, MO (Metal Organic), or the like, which are additive methods.
  • vacuum deposition ion plating, sputtering, CVD, MO (Metal Organic), or the like, which are additive methods.
  • pin holes 404 a are formed in the silver foil 404 due to the reason described in Third Embodiment. Because the pin holes 404 a are particularly easily formed by the vacuum deposition, the vacuum deposition is preferable among the additive methods above.
  • the insulating layer 3 is set in a vacuum deposition device (not illustrated), and the vapor-deposited silver foil 404 is formed on the surface of the insulating layer 3 by the vacuum deposition.
  • the vacuum deposition is terminated when the thickness of the electro-deposited silver foil 404 reaches predetermined thickness.
  • the pin holes 404 a are formed in the metal thin film 404 , volatile components generated from the adhesive layer 5 or the like when the shield flexible printed wiring board is heated are able to pass through the metal thin film 404 in the same manner as in First and Second Embodiments, and hence delamination due to the volatile components accumulating between the metal thin film 404 and the adhesive layer 5 is prevented.
  • metal thin film 404 is made of silver
  • a metal thin film may be formed of metal which is not silver (e.g., alloy mainly made of silver, aluminum, copper, gold, or alloy mainly made of them), by the same manufacturing method as the metal thin film 404 of the present embodiment.
  • FIG. 7A shows photos before and after the etching of the rolled copper foil in Example 1. As shown in FIG. 7A , in the rolled copper foil after the etching, pin holes each being about 5 ⁇ m in diameter were formed.
  • FIG. 7B shows photos before and after the etching of the rolled copper foil in Example 2. As shown in FIG. 7B , in the rolled copper foil after the etching, pin holes each being about 5 ⁇ m in diameter were formed.
  • a 1 ⁇ m thick electro-deposited copper foil was formed by a method similar to the method of forming the metal thin film of Second Embodiment, and a shield film with similar configuration to that in FIG. 1 was manufactured by using this electro-deposited copper foil.
  • the surface roughness (Ra) of the surface of a carrier copper foil was 4.0 ⁇ m, and a release layer was formed on the surface of the carrier copper foil by impregnating the carrier copper foil into the chromium trioxide aqueous solution so that the surface was chromated.
  • a 2 ⁇ m thick electro-deposited copper foil was formed by the method of forming the metal thin film of Second Embodiment, and a shield film with similar configuration to that in FIG. 1 was manufactured by using this electro-deposited copper foil.
  • the surface roughness of the surface of the carrier copper foil was identical with the surface roughness in Example 3.
  • a 0.1 ⁇ m thick vapor-deposited silver foil was formed on a cover film made of insulating resin, and a shield film with similar configuration to that in FIG. 1 was manufactured by using this laminated body of the insulating film and silver foil.
  • a 5 ⁇ m thick electro-deposited copper foil was formed by the method of forming the metal thin film of Second Embodiment, and a shield film with similar configuration to that in FIG. 1 was manufactured by using this electro-deposited copper foil.
  • the surface roughness of the surface of the carrier copper foil was identical with the surface roughness in Example 3.
  • a shield film 5 ⁇ m thick to that in FIG. 1 was manufactured by using a rolled copper foil which was 6 ⁇ m in thickness and was made of tough-pitch copper.
  • the water vapor permeabilities of the shield films of Examples 1 to 5 and Comparative Examples 1 and 2 were measured by a differential-pressure method (conforming to JISK7129), respectively. Measurement conditions were 80 degrees centigrade in temperature, 95% RH in moisture, and 1 atm in differential pressure.
  • Each of the shield films of Examples 1 to 5 and Comparative Examples 1 and 2 was joined with a printed wiring board by thermal pressing. Subsequently, after the printed wiring board was left for seven days in a clean room which was 23 degrees centigrade in temperature and 63% RH in moisture, whether delamination occurred was evaluated while the printed wiring board was exposed to a temperature condition in reflowing.
  • the temperature condition in reflowing was set at a temperature profile of 265 degrees centigrade at the maximum, and in consideration of lead-free solder. Furthermore, whether delamination occurred was evaluated in such a way that the printed wiring board with which the shield film was joined was caused to pass an infrared reflow furnace five times, and the existence of swelling was visually checked.
  • the evaluation result was GOOD when no swelling occurred in the shield film at all, was SATISFACTORY when only a part of the shield film swelled, or was BAD when the entire surface of the shield film significantly swelled.
  • the results are shown in Table 1.
  • Example 1 As clearly shown in Table 1, while the water vapor permeabilities were zero in Comparative Examples 1 and 2, the water vapor permeabilities were 0.5 g/m 2 per 24 hours or higher in Examples 1 to 5.
  • the water vapor permeability in Example 1 was higher than that in Example 2. This was presumably because the density (number of molecules/cm 2 ) of copper oxide in the rolled copper foil before the etching in Example 1 was higher than the density in Example 2.
  • Example 3 was significantly higher than that in Example 4.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Magnetic Heads (AREA)
US14/894,508 2013-05-29 2014-04-30 Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil Abandoned US20160120077A1 (en)

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US16/929,736 Active 2034-07-28 US11497152B2 (en) 2013-05-29 2020-07-15 Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil
US16/929,764 Abandoned US20200352064A1 (en) 2013-05-29 2020-07-15 Electromagnetic Wave Shield Film, Printed Wiring Board Using Same, and Rolled Copper Foil
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US16/929,764 Abandoned US20200352064A1 (en) 2013-05-29 2020-07-15 Electromagnetic Wave Shield Film, Printed Wiring Board Using Same, and Rolled Copper Foil
US16/929,753 Active 2034-10-10 US11317548B2 (en) 2013-05-29 2020-07-15 Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil

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US20190261503A1 (en) * 2017-02-13 2019-08-22 Tatsuta Electric Wire & Cable Co., Ltd. Ground Member, Shielded Printed Circuit Board, and Method for Manufacturing Shielded Printed Circuit Board
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US20240172405A1 (en) * 2021-03-29 2024-05-23 Tatsuta Electric Wire & Cable Co., Ltd. Electromagnetic wave shielding film and shielded printed wiring board

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JP7022573B2 (ja) * 2017-12-01 2022-02-18 信越ポリマー株式会社 電磁波シールドフィルム付きプリント配線板及びその製造方法
CN110769666A (zh) * 2018-07-27 2020-02-07 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
JP7256618B2 (ja) * 2018-08-29 2023-04-12 タツタ電線株式会社 転写フィルム付電磁波シールドフィルム、転写フィルム付電磁波シールドフィルムの製造方法及びシールドプリント配線板の製造方法
JP2020136437A (ja) * 2019-02-18 2020-08-31 信越ポリマー株式会社 電磁波シールドフィルム、及び回路基板
JP7543139B2 (ja) * 2019-03-29 2024-09-02 東レ株式会社 金属化フィルムおよびその製造方法
JP2021052063A (ja) * 2019-09-24 2021-04-01 信越ポリマー株式会社 電磁波シールド付きカバーレイフィルム及びその製造方法、並びに電磁波シールド付きフレキシブルプリント配線板及びその製造方法
CN110798966A (zh) * 2019-11-19 2020-02-14 江苏上达电子有限公司 一种用于线路板的新的电磁屏蔽的实现方法
JP6690773B1 (ja) * 2019-12-18 2020-04-28 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板
TWI812913B (zh) * 2020-03-02 2023-08-21 日商拓自達電線股份有限公司 金屬箔及電磁波屏蔽膜
TWI858176B (zh) * 2020-03-02 2024-10-11 日商拓自達電線股份有限公司 接地連接引出膜
KR20250016077A (ko) * 2022-05-27 2025-02-03 도레이 케이피 필름 가부시키가이샤 이형 필름 부착 금속박 및 그 제조 방법, 및 전자파 실드 필름의 제조 방법
WO2024080241A1 (ja) * 2022-10-12 2024-04-18 タツタ電線株式会社 電磁波シールドフィルム及びシールドプリント配線板
CN115613014A (zh) * 2022-10-17 2023-01-17 河北省纺织科学研究所 一种在芳纶织物上化学镀银的方法
US12461523B2 (en) 2022-11-08 2025-11-04 International Business Machines Corporation Orchestrating vehicles and remote operating clients

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010239141A (ja) * 2010-05-31 2010-10-21 Tatsuta Electric Wire & Cable Co Ltd プリント配線板用シールドフィルム及びその製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0818228A (ja) * 1994-06-27 1996-01-19 Yamamoto Seisakusho:Kk 多層プリント配線板の製造方法
JPH08175891A (ja) * 1994-12-27 1996-07-09 Matsushita Electric Works Ltd セラミック基板の粗面化法
TW456164B (en) * 1999-08-06 2001-09-21 Paragon Technologies Co Ltd Method for forming EMI shielding film on flexible wire and flexible printed circuit board and product manufactured by the same
US20020050783A1 (en) * 2000-06-01 2002-05-02 Tadahiko Kubota Electromagnetic-wave-shielding film, production method thereof and image display device using the same
JP4201548B2 (ja) 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP2004122456A (ja) * 2002-09-30 2004-04-22 Panac Co Ltd 耐クラック性に優れた金属層転写フィルム及び金属層の転写方法
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
JP2005260058A (ja) * 2004-03-12 2005-09-22 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、キャリア付き極薄銅箔の製造方法および配線板
EP1795336B1 (en) * 2004-09-10 2012-02-29 Mitsui Mining & Smelting Co., Ltd. Electrolytic copper foil with carrier foil furnished with primer resin layer and process for producing the same
JPWO2007097249A1 (ja) * 2006-02-20 2009-07-09 ダイセル化学工業株式会社 多孔性フィルム及び多孔性フィルムを用いた積層体
US20080200333A1 (en) * 2006-06-29 2008-08-21 Gotou Akiko Protective film temporarily lamination to electromagnetic wave shielding sheet, method for producing the same, and electromagnetic wave shielding sheet
JP2008041553A (ja) * 2006-08-09 2008-02-21 Sony Corp 蒸着用マスク及び蒸着用マスクの製造方法
JP2008270659A (ja) * 2007-04-24 2008-11-06 Toppan Printing Co Ltd プラズマディスプレィ前面板用黒色化シールドメッシュの製造方法
EP2009977A3 (en) * 2007-05-09 2011-04-27 FUJIFILM Corporation Electromagnetic shielding film and optical filter
JP2009099624A (ja) * 2007-10-12 2009-05-07 Fujitsu Ltd 配線基板およびその製造方法
KR100992569B1 (ko) * 2008-04-29 2010-11-05 두성산업 주식회사 전자파 차폐용 초박막 도전 테이프 및 그 제조 방법
JP5548396B2 (ja) * 2009-06-12 2014-07-16 三菱マテリアル株式会社 薄膜トランジスタ用配線層構造及びその製造方法
WO2011027558A1 (ja) 2009-09-02 2011-03-10 パナソニック株式会社 プリント配線板、ビルドアップ多層基板とその製造方法
JP5726048B2 (ja) * 2011-11-14 2015-05-27 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
TWM428656U (en) * 2011-12-26 2012-05-01 Flexium Interconnect Inc Anti- electromagnetic wave has the effect of flexible printed circuit board
JP5650186B2 (ja) * 2012-12-12 2015-01-07 タツタ電線株式会社 プリント配線板用シールドフィルム及びその製造方法
KR20160013048A (ko) * 2013-05-29 2016-02-03 다츠다 덴센 가부시키가이샤 전자파 실드 필름, 이것을 사용한 프린트 배선판, 및 압연 동박
CN103763893B (zh) * 2014-01-14 2016-04-13 广州方邦电子股份有限公司 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010239141A (ja) * 2010-05-31 2010-10-21 Tatsuta Electric Wire & Cable Co Ltd プリント配線板用シールドフィルム及びその製造方法

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10652996B2 (en) * 2015-12-21 2020-05-12 3M Innovative Properties Company Formable shielding film
US20170318713A1 (en) * 2016-04-29 2017-11-02 Samsung Electronics Co., Ltd Shielding member and electronic device including the same
TWI760431B (zh) * 2017-02-08 2022-04-11 日商拓自達電線股份有限公司 電磁波屏蔽膜、屏蔽印刷配線板及電子機器
TWI761445B (zh) * 2017-02-08 2022-04-21 日商拓自達電線股份有限公司 電磁波屏蔽膜、屏蔽印刷配線板及電子機器
TWI761446B (zh) * 2017-02-08 2022-04-21 日商拓自達電線股份有限公司 電磁波屏蔽膜、屏蔽印刷配線板及電子機器
TWI761447B (zh) * 2017-02-08 2022-04-21 日商拓自達電線股份有限公司 電磁波屏蔽膜、屏蔽印刷配線板及電子機器
US20190261503A1 (en) * 2017-02-13 2019-08-22 Tatsuta Electric Wire & Cable Co., Ltd. Ground Member, Shielded Printed Circuit Board, and Method for Manufacturing Shielded Printed Circuit Board
US10638598B2 (en) * 2017-02-13 2020-04-28 Tatsuta Electric Wire & Cable Co., Ltd. Ground member, shielded printed circuit board, and method for manufacturing shielded printed circuit board
US10512200B1 (en) * 2017-03-03 2019-12-17 Nitto Denko Corporation Electromagnetic wave absorber and molded article with electromagnetic wave absorber
US11387566B2 (en) 2017-06-13 2022-07-12 Nitto Denko Corporation Electromagnetic wave absorber and molded article with electromagnetic wave absorber
US11529796B2 (en) * 2018-04-20 2022-12-20 Voestalpine Stahl Gmbh Coated sheet metal band and production method
US20210146657A1 (en) * 2018-04-20 2021-05-20 Voestalpine Stahl Gmbh Coated sheet metal band and production method
US11782322B2 (en) 2018-12-17 2023-10-10 E Ink Corporation Anisotropically conductive moisture barrier films and electro-optic assemblies containing the same
EP3899640A4 (en) * 2018-12-17 2022-09-07 E Ink Corporation ANISOTROPIC CONDUCTIVE MOISTURE BARRIER COATINGS AND ELECTROOPTIC ARRANGEMENTS THEREOF
US11520211B2 (en) 2018-12-17 2022-12-06 E Ink Corporation Anisotropically conductive moisture barrier films and electro-optic assemblies containing the same
US11647618B2 (en) * 2019-05-29 2023-05-09 Tatsuta Electric Wire & Cable Co., Ltd. Electromagnetic wave shielding film and shielding printed wiring board
US20220151119A1 (en) * 2019-05-29 2022-05-12 Tatsuta Electric Wire & Cable Co., Ltd. Electromagnetic Wave Shielding Film and Shielding Printed Wiring Board
CN112020200A (zh) * 2019-05-30 2020-12-01 东洋油墨Sc控股株式会社 电磁波屏蔽片及印刷配线板
KR20210130685A (ko) * 2019-05-30 2021-11-01 토요잉크Sc홀딩스주식회사 전자파 차폐 시트 및 프린트 배선판
US10820457B1 (en) 2019-05-30 2020-10-27 Toyo Ink Sc Holdings Co., Ltd. Electromagnetic wave shielding sheet and printed wiring board
US11533833B2 (en) 2019-05-30 2022-12-20 Toyo Ink Sc Holdings Co., Ltd. Electromagnetic wave shielding sheet and printed wiring board
KR20200137937A (ko) * 2019-05-30 2020-12-09 토요잉크Sc홀딩스주식회사 전자파 차폐 시트 및 프린트 배선판
KR102341213B1 (ko) * 2019-05-30 2021-12-20 토요잉크Sc홀딩스주식회사 전자파 차폐 시트 및 프린트 배선판
KR102598841B1 (ko) * 2019-05-30 2023-11-07 토요잉크Sc홀딩스주식회사 전자파 차폐 시트 및 프린트 배선판
US20240172405A1 (en) * 2021-03-29 2024-05-23 Tatsuta Electric Wire & Cable Co., Ltd. Electromagnetic wave shielding film and shielded printed wiring board
US12232306B2 (en) * 2021-03-29 2025-02-18 Tatsuta Electric Wire & Cable Co., Ltd. Electromagnetic wave shielding film and shielded printed wiring board
JP2022154716A (ja) * 2021-03-30 2022-10-13 Jsr株式会社 電磁波シールド積層体、電磁波シールド積層体の製造方法、シールドプリント配線板、シールドプリント配線板の製造方法、半導体パッケージ、及び電子機器
JP7569254B2 (ja) 2021-03-30 2024-10-17 Jsr株式会社 電磁波シールド積層体、電磁波シールド積層体の製造方法、シールドプリント配線板、シールドプリント配線板の製造方法、半導体パッケージ、及び電子機器

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