M328175 八、新型說明： 【新型所屬之技術領域】 本創作係一種電腦之散熱裝置，其係一種藉由風扇將外界之冷空氣直接由 接近殼體底部之縫隙吸入，以單一方向直接吹向發熱之組件，以減少灰塵由殼 體内之其他縫隙進入殼體内者。 【先前技術】 按，電腦是已經相當普及的設備，然而一般使用者在使用電腦時通常都會 遇到一個問題，也是一般電腦製造廠商所面臨的問題，不但主機之處理器之速 -度愈來愈快，相對配合之顯示卡或其他配合之零件也愈來愈複雜，而資料儲存 •設備(如硬碟)之容量需求也愈來愈大，由數十GBYTE (GIGA BYTE)至於數百GBYTE (GIGA BYTE)，如此一來，當單顆之儲存設備無法提供更高容量時，則必須將以 串聯或並聯方向增加多顆儲存設備以增加資料儲存容量，而儲存設備除本身會 產生咼溫外，更易受高溫之影響而造成電滕故障，因此電腦内之散熱問題也成 為一個迫切需要解決之問題。 請參照第1圖所示，其設有一直立式之殼體1〇〇，該殼體1〇〇後端設有一背 板110，該背板110上設有不同功能之連接琿120，而殼體1〇〇在靠近背板110 處設有一並排之電源供應器130及一風扇140,且該殼體1〇〇中之一側邊設有一 φ 主機板150,另，在殼體100前端設有儲存裝置160,該儲存裝置160包括硬碟、 光碟等等，因此，當風扇140啟動時，會將殼體1〇〇内熱源抽出（即負風壓差方 ，式），而使外界之冷空氣由殼體100之縫隙流入殼體100中，並流經殼體100内 之主機板150上之零件及儲存裝置160，如此一來，則會產生下列之缺點： 1·當外界之冷空氣由殼體1〇〇之縫隙進入時，並流經殼體100内之主機板 150上之發熱零件及儲存裝置160，會將細小塵埃附著於該等零件上，不但使該 等零件增加故障機會，降低該等零件之使用壽命，更會阻礙氣流之進行，造成 散熱不易之問題。 2·因殼體100係採直立式設計，使主機板150上之發熱零件與風扇140作 動所產生之氣流係呈垂直狀，會造成冷空氣無法直接進入部份發熱零件，而產 5 M328175 生發熱零件之熱滯留。 3·因習用電腦之對外連接槔12〇係設置在背板no上，而一般擺放方式， 皆係將背板110緊靠牆面或桌邊，因此在拆裝上非常不方便;但如將殼體擺放於 明顯位置時，則於外觀上會不美觀。 【新型内容】 創作目的： 本創作係為解決上述習用技術之缺點所做的進一步改良。 • 本創作之一目的’在提供一種電腦之散熱裝置，其係用來排除電腦主機内 部所產生之熱源之裝置，該裝置上設有一殼體，該殼體係呈直立式，且該殼體 φ中一側邊設有一主機板，該主機板上設有電子零件及介面卡，而在殼體前端則 設有一面板，鄰近該面板處則設有儲存裝置，另，該殼體中在面對主機板及儲 存裝置之位置上設有-固定架，該固定架上設有至少一風扇，該風扇之出風方 向係與介面卡排财向平行，如此—來，風扇啟動時，可以單—方向直接吹向 熱源產生處，不會受到阻礙，以增加散熱效果者。 本創作之另_目的，在提供—種制之散絲置，風扇啟鱗，可將外界 之冷空氣直接由接近殼體底部之縫隙吸入，使底部溫度較冷之冷空氣直接吹向 發熱之零件及儲存設備，如此可防止塵埃由殼體中其他缝隙進入，而延長零件 壽命，更可增加散熱效果。 相對面上设有對外連接埠，該等對外連接埠係凸露在殼體外 有-罩體’該罩體與殼體間並形成_通道，且該罩體在一端 -來，不但可方便使用者拆卸，且可藉由罩體之蓋合 鲁本創作之再-目的，在提供一種電滕之散熱裝置，其殼體在遠離站立處之 ，而在其上則蓋合M328175 VIII. New Description: [New Technology Field] This is a computer heat sink. It is a kind of fan that draws the cold air from the outside directly into the gap near the bottom of the housing and blows it directly in a single direction. The assembly is designed to reduce dust from entering other openings in the housing. [Prior Art] According to the computer, the computer is already quite popular equipment. However, the average user often encounters a problem when using the computer, which is also a problem faced by the general computer manufacturer. Not only the speed of the host processor is increasing. The faster, the more compatible display cards or other matching parts are becoming more and more complicated, and the capacity requirements of data storage and equipment (such as hard disk) are getting bigger and bigger, from tens of GBYTE (GIGA BYTE) to hundreds of GBYTE (GIGA BYTE), as a result, when a single storage device cannot provide higher capacity, it is necessary to add multiple storage devices in series or parallel direction to increase the data storage capacity, and the storage device itself generates a temperature difference. In addition, it is more susceptible to high temperature and cause electrical failure, so the heat dissipation problem in the computer has become an urgent problem to be solved. Please refer to FIG. 1 , which is provided with a vertical housing 1 , and a rear plate 110 is disposed at the rear end of the housing 1 , and the back plate 110 is provided with a connection port 120 with different functions. The housing 1 is provided with a side-by-side power supply 130 and a fan 140 near the back plate 110, and one side of the housing 1 is provided with a φ main board 150, and at the front end of the housing 100 A storage device 160 is provided. The storage device 160 includes a hard disk, a optical disk, and the like. Therefore, when the fan 140 is activated, the heat source in the casing 1 is extracted (ie, the negative air pressure is different), and the external The cold air flows into the casing 100 through the gap of the casing 100, and flows through the parts and the storage device 160 on the main board 150 in the casing 100. Thus, the following disadvantages are caused: 1. When the outside world When the cold air enters through the gap of the casing 1 and flows through the heat generating component and the storage device 160 on the main board 150 in the casing 100, fine dust is attached to the parts, which not only increases the parts. The opportunity of failure, reducing the service life of these parts, will also hinder the flow of air, making heat dissipation difficult Problem. 2. Since the housing 100 adopts an upright design, the airflow generated by the heating parts on the main board 150 and the fan 140 is vertical, which causes cold air to directly enter some of the heat-generating parts, and produces 5 M328175 Heat retention of hot parts. 3. The external connection of the computer is set on the back panel no, and the general placement method is to close the back panel 110 against the wall or the table side, so it is very inconvenient to disassemble; When the housing is placed in an obvious position, it will be unsightly in appearance. [New Content] Purpose of Creation: This creation is a further improvement to solve the shortcomings of the above-mentioned conventional techniques. • One of the purposes of this creation is to provide a computer heat sink that is used to remove a heat source generated inside a computer mainframe, the device being provided with a housing that is upright and that is φ A main board is disposed on one side of the main board, and an electronic component and an interface card are disposed on the main board, and a panel is disposed at a front end of the housing, and a storage device is disposed adjacent to the panel, and the housing is facing The main board and the storage device are provided with a fixing frame, and the fixing frame is provided with at least one fan, and the fan outlet direction is parallel to the interface card discharging direction, so that when the fan is started, the fan can be single- The direction is directly blown to the heat source, and will not be hindered to increase the heat dissipation effect. The other purpose of this creation is to provide a set of loose filaments and a fan to open the scales. The cold air from the outside can be directly sucked into the gap near the bottom of the casing, so that the cold air with a cold bottom is directly blown to the heat. Parts and storage devices prevent dust from entering through other gaps in the housing, extending the life of the part and increasing heat dissipation. The outer surface of the outer surface is provided with an outer joint, and the outer joint is exposed outside the casing, and the cover body and the casing form a channel, and the cover body is at one end, which is convenient for use. Disassembled, and by the cover of the cover and the purpose of the creation of the Ruben, in the provision of a heat sink, the housing is away from the standing, and the cover is closed
【實施方式】[Embodiment]
該面板上11處設有框體12，該框體12内安裝有數個儲存裝置2〇，於本實施例 M328175 為光碟機或硬碟機等，而該殼體10背面則設有一背板13，且於該殼體1〇中之 面板11與背板13間之一側邊設有一主機板(M〇ther ，該主機板3〇上 设有微處理器(CPU)等等電子零件，且該主機板30上設有數個與面板^平行排 列之介面卡31(例如顯示卡等）。 再者’棘照第2、3圖所*，該殼體10在站立處靠近背板13處設有一電 源供應器40，而在面對主機板3〇及儲存裝置2〇上設有一固定架5〇，該固定架 50係固定在殼體1〇中，其固定方式可崎接或鎖合或插置料方式，而該固定 架50上設有至少一風扇6〇，於本實施例為兩個並排，該風扇6〇之出風方向係 與介面卡31排列方向平行。 ' _ 此外’ a月參照第2、3圖所示，其殼體1〇在遠離站立處之相對面(於本實施 例為殼體頂端)上設有料連接埠7G，該騎外連接埠70係凸露在殼體外， 而在其上則蓋合有-罩體8〇，該罩體8〇與殼體1〇 形成一通道，且該罩體 80在-端上⑤有開口 8卜如此—來，可因鮮對外連接槔r^設置在使用者觸 手可及之處，而能方便使用者拆卸，再者，藉由罩體8〇之蓋合，更可保護 連接埠70。 、f參照第4圖所*，當風扇60啟動時，因風扇60將外界之冷空氣直接由 接近殼艘10底部之縫隙吸入，使底部溫度較冷之冷空氣以單一方向直接吹向發 ^之零件、介面卡31及儲存裝置卿卩採正向風壓差方式），如此可防止塵埃由 .殼體10中其他縫隙進入，而延長零件壽命，又，進入殼體1〇之冷空氣在流經 熱零件介面卡31及儲存裝置20後，會由殼體1〇中其他缝隙及開口 81流 至外界，確保對流暢通，更可增加散熱效果。 ^月參:照第5圖所不’該裝置上設有一殼體1〇，於本實施例為直立式桌上型 電腦，該殼體」〇正面設有一面板u，且殼體1〇在靠近面板u處設有框體12， 12上安裝有儲存裝置2〇，於本實施例為硬碟或光碟機，而該殼體切背 =則叹有#板13’且該殼體时之面板n與背板13間之_側邊則設有主機 30 ’該主機板3〇中設有微處理器(⑽等等電子零件，且該主賊3〇上設有 與面板11 |行排列之介面卡31(例如顯示卡等）；該殼艟在遠離站立處 7 M328175 設有-電源供應器4〇 ’該電源供應器40係靠近背板13，而在面對主機板3〇及 儲存裝置20上設有-固定架5〇，該固定架5〇係固定在殼體1〇中其固定 可用焊接韻合或插置科方式’種@定架5G上設有至少—風㈣於本實 施例為兩個並排，該風扇60之出風方向係與介面卡31之排列方向平行又 殼體1〇在遠雜立處之相對面(於本實施例絲體頂端）上設有對外連 該等對外連接㈣係凸露在殼體料，而在其上職合有—罩㈣， 80與殼體10間並形成-通道’且該罩體8〇在一端上設有開口 81。The frame 12 is provided with a frame 12, and a plurality of storage devices 2 are mounted in the frame 12. In the embodiment, M328175 is a CD player or a hard disk drive, and the back of the case 10 is provided with a back plate 13. And a main board (M〇ther is disposed on one side between the panel 11 and the backboard 13 in the casing 1 , and the motherboard 3 is provided with an electronic component such as a microprocessor (CPU), and The motherboard 30 is provided with a plurality of interface cards 31 (such as display cards, etc.) arranged in parallel with the panel. Further, the housing 10 is disposed near the back panel 13 at the standing position. There is a power supply 40, and a fixing frame 5 is disposed on the main board 3〇 and the storage device 2, and the fixing frame 50 is fixed in the casing 1 ,, and the fixing manner thereof can be satisfactorily or locked or The mounting bracket 50 is provided with at least one fan 6 〇. In this embodiment, two side by side, the fan 6 出 wind direction is parallel to the direction of the interface card 31. ' _ In addition ' a Referring to Figures 2 and 3, the housing 1 is provided with a material port 7G on the opposite side (in the present embodiment, the top end of the casing) from the standing position. The outer mount 埠 70 is exposed outside the casing, and the cover 8 盖 is covered thereon, the cover 8 〇 forms a passage with the casing 1 ,, and the cover 80 is at the end 5 There is an opening 8 such that the fresh external connection 槔r^ can be placed at the touch of the user, and can be easily disassembled by the user. Moreover, the cover can be protected by the cover 8埠70., f refer to Fig. 4, when the fan 60 is started, the fan 60 directly draws cold air from the outside to the bottom of the shell 10, so that the cold cold air at the bottom is directly blown in a single direction. The positive wind pressure difference method is adopted for the parts, the interface card 31 and the storage device, so as to prevent the dust from entering by other gaps in the casing 10, and prolonging the life of the parts, and entering the casing 1 After flowing through the hot part interface card 31 and the storage device 20, the cold air will flow to the outside through other gaps and openings 81 in the casing 1 to ensure smooth flow and increase heat dissipation. ^月参: According to Figure 5, the device is provided with a casing 1 . In this embodiment, it is an upright desktop computer. The casing is provided with a panel u on the front side, and the casing 1 is placed on the front side. A frame 12 is disposed near the panel u, and a storage device 2 is mounted on the 12, which is a hard disk or a CD player in the embodiment, and the casing is cut back = the plate 13 is sighed and the casing is The side of the panel n and the back panel 13 is provided with a host 30. The motherboard 3 is provided with a microprocessor ((10) and other electronic components, and the main thief is arranged on the 3 与 and the panel 11 | Interface card 31 (such as a display card, etc.); the case is provided at a distance from the standing position 7 M328175 - a power supply 4 〇 'The power supply 40 is close to the back plate 13 and faces the motherboard 3 〇 and stores The device 20 is provided with a fixing frame 5〇, and the fixing frame 5 is fixed in the casing 1〇, and the fixing frame 5 can be fixed by welding rhyme or inserting. The seeding type 5G is provided with at least the wind (four) in the present The embodiment is two side by side, the wind direction of the fan 60 is parallel to the arrangement direction of the interface card 31, and the opposite side of the housing 1 is at the far side (at the top of the wire body of the embodiment) The external connection (4) is exposed to the outer casing, and the upper cover is provided with a cover (four), 80 and the casing 10 and a channel is formed, and the cover 8 is disposed at one end. There is an opening 81.
風扇60啟動時，因風扇60將外界之冷空氣直接由接近殼體1〇底部 =使底部溫度較冷之冷空氣直接吹向發熱组件及儲存裝置2〇(即採正向風壓 差方式）’如此可防止塵埃由殼體财其他_進人，桃長零件壽命又， 進入殼體10之冷空氣在流經發熱零件、介面卡31及二儲存裝置2〇後會 體10中其他縫隙及開Π 81流至外界，確保對流暢通，更可增加散敎效果。 2上述難實補之贿’本_之辑可提高賴之散熱效率 技術7失做良。藉由上面所述，摘作之結構、特徵及實施例皆已 充，顯示出本創作案在目的及功效上均深富實施之進步性When the fan 60 is started, the fan 60 directly blows the cold air from the outside to the bottom of the casing 1 to directly blow the cold air with a cold bottom temperature to the heat generating component and the storage device 2 (that is, adopting the forward wind pressure difference mode) 'This prevents the dust from being filled by the shell _ others, the long life of the peach parts, and the cold air entering the casing 10 flows through the heat generating parts, the interface card 31 and the second storage device 2, and then the other gaps in the body 10 and The opening 81 flows to the outside world to ensure smooth flow and increase the effect of dilation. 2 The above-mentioned difficult to make up the bribes' _ The series can improve the cooling efficiency of the technology. Through the above, the structure, features and examples of the abstracts have been fully shown, showing that the purpose of this creation is rich in progress in terms of purpose and efficacy.
紐’蝴細場未㈣㈣她爾所述本 作案元全符合創作專利之要件。 J 並祈惠准，是所至禱 於本創作專利涵蓋之範圍内，謹請貴審查委員明鑑， 【圖式簡單說明】 第1圖係習知裝置示意圖 第2圖係本創作之立體分解示意圖。 第3圖係本創作之組合斷面示意圖。 第4圖係本創作之斷面動作示意圖。 第5圖係本創作另一實施例之斷面示意圖。 【主要元件符號說明】 8 殼體 10 面板 11 框體 12 背板 13 儲存裝置 20 主機板 30 介面卡 31 電源供應器 40 固定架 50 風扇 60 對外連接埠 70 罩體 80 開口 81 M328175New York’s small field is not (4) (4) Herr’s case is in line with the requirements of the creation of patents. J and pray for the right, is the scope of the pen to the scope of this patent, please ask your review committee Ming Jian, [Simple diagram of the diagram] Figure 1 is a schematic diagram of the conventional device Figure 2 is a three-dimensional decomposition diagram of the creation . Figure 3 is a schematic cross-sectional view of the creation. Figure 4 is a schematic diagram of the cross-section action of this creation. Figure 5 is a schematic cross-sectional view showing another embodiment of the present creation. [Main component symbol description] 8 Housing 10 Panel 11 Frame 12 Back panel 13 Storage device 20 Motherboard 30 Interface card 31 Power supply 40 Mounting bracket 50 Fan 60 External connection 埠 70 Cover 80 Opening 81 M328175