CN201134069Y - Negative pressure suction type computer heat radiation casing - Google Patents
Negative pressure suction type computer heat radiation casing Download PDFInfo
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- CN201134069Y CN201134069Y CNU2007201389135U CN200720138913U CN201134069Y CN 201134069 Y CN201134069 Y CN 201134069Y CN U2007201389135 U CNU2007201389135 U CN U2007201389135U CN 200720138913 U CN200720138913 U CN 200720138913U CN 201134069 Y CN201134069 Y CN 201134069Y
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Abstract
本实用新型是一种负压吸入式电脑散热机壳,包括一电脑机壳、以及数个风扇,各风扇乃用以将电脑机壳内的空气排至外界,并使电脑机壳内形成一负压状态,且在电脑机壳内定义有一所欲散热的区域;其中,电脑机壳邻近所述所欲散热的区域一侧上设有数个进气孔,并由各进气孔至所欲散热的区域间以一导风流道连通;当各风扇运作时,电脑机壳即处在负压状态下,而能由各进气孔吸入空气,并由导风流道将空气引入所欲散热的区域,以帮助其进行散热。
The utility model is a negative pressure suction type computer heat dissipation case, comprising a computer case and a plurality of fans, each fan is used to discharge the air in the computer case to the outside, and form a negative pressure state in the computer case, and define a region to be radiated in the computer case; wherein, a plurality of air inlets are arranged on one side of the computer case adjacent to the region to be radiated, and an air guide channel is connected from each air inlet to the region to be radiated; when each fan is in operation, the computer case is in a negative pressure state, and air can be inhaled from each air inlet, and the air is introduced into the region to be radiated by the air guide channel to help the region to be radiated.
Description
技术领域 technical field
本实用新型涉及电脑机壳结构,特别是指一种能提供散热功能的电脑机壳。The utility model relates to a computer casing structure, in particular to a computer casing capable of providing heat dissipation.
背景技术 Background technique
随着科技的进步,电脑执行进度愈来愈快,但相对于主机内所产生的温度也越来越高,为了将电脑主机内所产生的温度有效散发在系统之外,以维持电脑内的各元件在容许温度之下运作,通常以具有较大面积的散热器附加在产生温度的各元件表面上,并凭借所述的散热器来增加其散热效果。With the advancement of technology, the progress of computer execution is getting faster and faster, but the temperature generated in the host computer is also getting higher and higher. In order to effectively dissipate the temperature generated in the host computer outside the system to maintain the temperature in the computer Each component operates below the allowable temperature, and a radiator with a larger area is usually attached to the surface of each component that generates temperature, and the heat dissipation effect is increased by means of the radiator.
此外,由于现有的散热器结构多应用在中央处理器(CPU)上,而现今电脑内部如VGA卡等等,其散热问题也日益受到重视。再加上现有电脑均需支援多媒体的运用、以及游戏软体的兴起等,各种扩充卡的使用也会产生热源,尤其若不针对如VGA卡上的图形处理晶片(chip)等加以散热,唯恐有过热而影响其运作之虞,且电脑外壳是近乎密闭的空间,也容易因热量无法向外界排出而产生类似于温室效应的结果。In addition, because the existing heat sink structure is mostly used on the central processing unit (CPU), and nowadays the heat dissipation problem of the VGA card inside the computer is also increasingly paid attention to. In addition, existing computers need to support the use of multimedia and the rise of game software, etc. The use of various expansion cards will also generate heat sources, especially if the graphics processing chip (chip) on the VGA card is not dissipated. I am afraid that overheating will affect its operation, and the computer casing is a nearly airtight space, and it is easy to produce a result similar to the greenhouse effect because the heat cannot be discharged to the outside.
目前现有的作法,主要是在电脑机壳上加装一风扇,所述的风扇乃特别针对VGA卡上的图形处理晶片进行散热。然而,此种作法不仅需增加风扇的使用量,且也容易因风扇使用数量过多而造成噪音;而若能利用其它风扇提供一自然对流的效果,似应可减少风扇的使用量,也能减少噪音产生。Existing way at present mainly is to install a fan additionally on the computer case, and described fan is to carry out heat dissipation especially for the graphic processing chip on the VGA card. However, this method not only needs to increase the use of fans, but also easily causes noise due to the excessive use of fans; and if other fans can be used to provide a natural convection effect, it seems that the use of fans can be reduced, and it can also Reduce noise generation.
有鉴于此,本实用新型设计人是改善并解决上述的缺失,乃特潜心研究并配合学理的运用,终于提出一种设计合理且有效改善上述缺失的本实用新型。In view of this, the designer of this utility model is to improve and solve the above-mentioned deficiencies. Naite devoted himself to research and combined with the application of theories, and finally proposed a utility model with a reasonable design and effectively improved the above-mentioned deficiencies.
发明内容 Contents of the invention
本实用新型的主要目的在于:提供一种负压吸入式电脑散热机壳,其是利用使机壳内呈负压状态,以令机壳能由一侧的进气孔提供自动流入的气流,凭借此等气流提供机壳内一特定区域进行散热,尤其可针对如VGA卡上的处理晶片。The main purpose of this utility model is to provide a negative pressure suction type computer cooling case, which uses the negative pressure inside the case so that the case can provide the airflow that flows in automatically from the air inlet on one side. By virtue of these airflows, a specific area within the enclosure is provided for cooling, especially for processing chips such as on a VGA card.
为实现上述目的,本实用新型采用的技术方案是:For realizing above-mentioned object, the technical scheme that the utility model adopts is:
一种负压吸入式电脑散热机壳,其特征在于:包括:一电脑机壳,其内呈中空,并在其内定义有一所欲散热的区域;与数个风扇,分别设在所述的电脑机壳上,用以将所述的电脑机壳内的空气排至外界,并使所述的电脑机壳内形成一负压状态;其中,所述的电脑机壳邻近所述所欲散热的区域一侧上是设有数个进气孔,并由所述的进气孔至所述的所欲散热的区域间以一导风流道连通。A negative pressure suction type computer cooling case is characterized in that it includes: a computer case, which is hollow inside, and defines a desired heat dissipation area in it; On the computer casing, it is used to exhaust the air in the computer casing to the outside, and to form a negative pressure state in the computer casing; wherein, the computer casing is adjacent to the desired heat dissipation One side of the area is provided with several air intake holes, and an air guiding channel is connected from the air intake holes to the area to be dissipated.
与现有技术相比较,采用上述技术方案的本实用新型具有的优点在于:如此,当各风扇运作时,电脑机壳即处在负压状态下,而能由各进气孔吸入空气,并由导风流道将空气引入所欲散热的区域,以帮助其进行散热。Compared with the prior art, the utility model adopting the above-mentioned technical solution has the advantages that in this way, when the fans are in operation, the computer case is in a negative pressure state, and the air can be sucked in by the air inlets, and Air is drawn into the area to be dissipated by the air guide channel to help it dissipate heat.
附图说明 Description of drawings
图1是本实用新型机壳内部的分解示意图;Fig. 1 is the exploded schematic view inside the casing of the utility model;
图2是本实用新型机壳内部的组合示意图;Fig. 2 is the combination schematic diagram inside the casing of the utility model;
图3是本实用新型机壳内部的纵向剖视图;Fig. 3 is a longitudinal sectional view inside the casing of the utility model;
图4是本实用新型机壳内部的横向剖视图;Fig. 4 is a transverse cross-sectional view inside the casing of the utility model;
图5是本实用新型机壳内部另一视角的分解示意图;Fig. 5 is an exploded schematic diagram of another angle of view inside the casing of the utility model;
图6是本实用新型机壳内部另一视角的组合示意图;Fig. 6 is a combination schematic diagram of another perspective inside the casing of the utility model;
图7是图6的A部份放大详图。FIG. 7 is an enlarged detailed view of part A of FIG. 6 .
附图标记说明:1-电脑机壳;10-发热区;11-进气孔;12-导风罩;120-导风流道;121-枢轴;122-弹片;123-扣部;124-扳动弧口;13-枢接部;130-竖板;131-枢槽;14-扣孔;2-风扇;3-VGA卡。Explanation of reference signs: 1-computer casing; 10-heating area; 11-air intake hole; 12-wind guide cover; 120-air guide flow channel; 121-pivot; 13-pivot joint; 130-vertical plate; 131-pivot slot; 14-button hole; 2-fan; 3-VGA card.
具体实施方式 Detailed ways
为了使审查委员能更进一步了解本实用新型的特征与技术内容,请参阅以下有关本实用新型的详细说明与附图,然而所附图式仅提供参考与说明用,并非用来对本实用新型加以限制。In order to enable the review committee to further understand the features and technical content of the utility model, please refer to the following detailed description and drawings of the utility model, but the attached drawings are only for reference and illustration, and are not used to explain the utility model limit.
请参阅图1与图2,分别是本实用新型机壳内部的分解示意图与组合示意图。本实用新型是提供一种负压吸入式电脑散热机壳,其是利用数个风扇2分别装配在一电脑机壳1上,且采由内向外吸气的方式,将电脑机壳1内部的空气向外排出,以令所述的电脑机壳1内部形成负压状态,而能让外界空气通过所述的电脑机壳1上的进气孔11进入其内部,并被导引至所欲散热处,如VGA卡3上的处理晶片等,以帮助散热。Please refer to FIG. 1 and FIG. 2 , which are respectively an exploded schematic diagram and a combined schematic diagram of the inside of the casing of the utility model. The utility model provides a negative pressure suction type computer cooling case, which utilizes
所述的电脑机壳1内呈中空,用以供电脑内部的各零组件装配在其内部,如主机板、硬碟与电源供应器等,由于此部份概与现有的结构相同,故不再赘述。而在所述的电脑机壳1上、下或前、后各侧处上,则视所述的电脑机壳1内部空间的设计大小,将数个风扇2分别配置在上述各位置处上;当电脑机壳1内部空间设计越大时,所需的风扇2数量就越多、或单一风扇2所能提供的风压量就越大,反的则越少或越小。通过各风扇2的运作,而能将电脑机壳1内部的空气吸出并排至外界,如此即可令所述的电脑机壳1内部形成负压状态(即如图3所示)。Described
所述的电脑机壳1内部至少具有一发热区10,并选定其中一发热区10作为所欲散热的区域,而在电脑机壳1邻近所述的发热区10一侧处上则设有数个进气孔11,并以一导风流道120连通在所述的进气孔11上,且令所述的导风流道120由电脑机壳1一侧延伸通往至所述的发热区10;在本实用新型所举的实施例中,所述发热区10是电脑主机板安装VGA卡11的区域位置,特别是可针对VGA卡上的处理晶片提供散热,而所述的进气孔11则设在电脑机壳1后侧处,通过一导风罩12连接在电脑机壳1后侧内,且所述的导风罩12的断面是呈一“ㄈ”字型(或者称“U”型),以在导风罩12内形成所述导风流道120,故当所述的导风罩12水平横置在电脑机壳1内时,恰好可令导风流道120朝向所述的发热区10处。The inside of the
再者,如图5与图6所示,所述的导风罩12在近进气孔11一端处上是设有枢轴121,而在另一端处则设有一弹片122;另在电脑主机1对应所述的枢轴121处则设有一枢接部13,而在对应所述的弹片122处则设有扣孔14(如图1所示)。其中,电脑机壳1的枢接部13是包含二间隔相对的竖板130所构成,二竖板130的间距恰与导风罩12宽度相当,并在所述的二竖板130上分别设有可供枢轴121滑入配合的枢槽131(即如图7所示),以供导风罩12能枢接在所述的枢接部13上;而导风罩12的弹片122则设有能卡扣在扣孔14内的突起扣部123,且在所述的弹片122上也可进一步凹入而形成一扳动弧口124,便于人手拇指贴靠在所述的弹片122上以便施力。且当扳动所述的弹片122时,即可将导风罩12向电脑机壳1一侧外掀起,供电脑内部零组件安装与维修。Furthermore, as shown in Figures 5 and 6, the
据此,请一并参阅图3与图4所示,由于所述的电脑机壳1内部,是通过各风扇2而将其内部的空气抽出,使所述的电脑机壳1内部可形成负压状态。因此,外界的空气则能主动由电脑机壳1的进气孔11进入其内部,再通过导风罩2的导风流道120而被引入至发热处10处,以便提供所述的发热区10较低温的气流作为散热所需,并可如此持续为所述的发热区10灌入低温气流,能避免热量囤积而造成温室效应的产生。Accordingly, please refer to Fig. 3 and Fig. 4 together, since the inside of the
是以,凭借上述的构造组成,即可得到本实用新型负压吸入式电脑散热机壳。Therefore, by virtue of the above-mentioned structural composition, the negative pressure suction type computer cooling case of the present utility model can be obtained.
因此,凭借本实用新型负压吸入式电脑散热机壳,不仅可利用各风扇2帮助电脑机壳1内部作气流交换,同时,也可凭借各风扇2抽风的效,令所述的电脑机壳1内部形成负压状态后,而能提供一自动入气的散热流道,如此进一步提供所述的电脑机壳1内部特定区域或位置的散热,尤其可针对VGA卡上的处理晶片提供散热,无须为此而配置专属对应的风扇,因而兼具降低噪音以获静音的效。Therefore, by virtue of the negative pressure suction type computer cooling case of the present utility model, not only the
以上说明对本实用新型而言只是说明性的,而非限制性的,本领域普通技术人员理解,在不脱离权利要求所限定的精神和范围的情况下,可作出许多修改、变化或等效,但都将落入本实用新型的权利要求可限定的范围之内。The above description is only illustrative, rather than restrictive, of the present utility model. Those of ordinary skill in the art understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined in the claims. But all will fall within the limitable scope of the claims of the present utility model.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CNU2007201389135U CN201134069Y (en) | 2007-08-16 | 2007-08-16 | Negative pressure suction type computer heat radiation casing |
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| Application Number | Priority Date | Filing Date | Title |
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| CNU2007201389135U CN201134069Y (en) | 2007-08-16 | 2007-08-16 | Negative pressure suction type computer heat radiation casing |
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| CN201134069Y true CN201134069Y (en) | 2008-10-15 |
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| CNU2007201389135U Expired - Fee Related CN201134069Y (en) | 2007-08-16 | 2007-08-16 | Negative pressure suction type computer heat radiation casing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208841A (en) * | 2015-11-11 | 2015-12-30 | 林炳彩 | Circuit board device assembly with shock absorption function |
| CN105246304A (en) * | 2015-11-11 | 2016-01-13 | 方小刚 | Solar-powered and illuminated circuit board device assembly provided with cooler |
-
2007
- 2007-08-16 CN CNU2007201389135U patent/CN201134069Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208841A (en) * | 2015-11-11 | 2015-12-30 | 林炳彩 | Circuit board device assembly with shock absorption function |
| CN105246304A (en) * | 2015-11-11 | 2016-01-13 | 方小刚 | Solar-powered and illuminated circuit board device assembly provided with cooler |
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Effective date of registration: 20090227 Address after: Cheong east city of Huizhou province Guangdong Zhongkai hi tech Industrial Development Zone 4 road 18, zip code: 516006 Patentee after: Cooler Master Co., Ltd. Address before: Postcode of Taiwan, Taipei, china: Patentee before: Xunkai International Co., Ltd. |
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| ASS | Succession or assignment of patent right |
Owner name: XUNQIANG ELECTRONIC ( HUIZHOU ) CO., LTD. Free format text: FORMER OWNER: XUNKAI INTERNATIONAL CO., LTD. Effective date: 20090227 |
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Granted publication date: 20081015 Termination date: 20130816 |