CN201107724Y - Heat radiator for vertical computer - Google Patents
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- CN201107724Y CN201107724Y CNU200720174915XU CN200720174915U CN201107724Y CN 201107724 Y CN201107724 Y CN 201107724Y CN U200720174915X U CNU200720174915X U CN U200720174915XU CN 200720174915 U CN200720174915 U CN 200720174915U CN 201107724 Y CN201107724 Y CN 201107724Y
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims description 11
- 238000003491 array Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
本实用新型公开了一种直立式计算机的散热装置,该装置主要设有一壳体,该壳体中设有主机板、储存装置及固定架;而该主机板上设有电子零件及适配卡;而该储存装置设于主机板一侧;而该固定架上设有风扇,该风扇面对于主机板及储存装置,且该风扇的出风方向与适配卡排列平行,该壳体在远离站立处的相对面上设有对外连接端口,且该相对面上盖合有一罩体,如此一来,可因风扇是以单一方向直接面对发热的组件,而将外界的冷空气以正风压差方式直接由接近壳体底部的缝隙吸入,以减少灰尘由其它缝隙进入壳体内。
The utility model discloses a heat dissipation device for an upright computer. The device is mainly provided with a shell, in which a mainboard, a storage device and a fixing frame are arranged; the mainboard is provided with electronic parts and an adapter card; the storage device is arranged at one side of the mainboard; a fan is arranged on the fixing frame, the fan faces the mainboard and the storage device, and the air outlet direction of the fan is arranged parallel to the adapter card. The shell is provided with an external connection port on the opposite surface away from the standing position, and the opposite surface is covered with a cover body. In this way, because the fan directly faces the heat-generating components in a single direction, the cold air from the outside can be directly sucked in from the gap close to the bottom of the shell in a positive wind pressure difference mode, so as to reduce the dust from entering the shell through other gaps.
Description
技术领域technical field
本实用新型涉及一种直立式计算机的散热装置,其能通过风扇将外界的冷空气直接由接近壳体底部的缝隙吸入,以单一方向直接吹向发热的组件,减少灰尘由壳体内的其它缝隙进入壳体内。The utility model relates to a cooling device for an upright computer, which can directly inhale the cold air from the outside through the gap close to the bottom of the casing through a fan, and blow it directly to the heating components in a single direction, so as to reduce dust from other gaps in the casing. into the housing.
背景技术Background technique
计算机是已经相当普及的设备,然而一般使用者在使用计算机时通常都会遇到一个问题,也是一般计算机制造厂商所面临的问题,不但主机的处理器的速度愈来愈快,相对配合的显卡或其它配合的零件也愈来愈复杂,而资料储存装置(如硬盘)的容量需求也愈来愈大,由数十GBYTE(GIGA BYTE)至于数百GBYTE(GIGA BYTE),如此一来,当单颗的储存装置无法提供更高容量时,则必须将以串联或并联方向增加多颗储存装置以增加资料储存容量,而储存装置除本身会产生高温外,更易受高温的影响而造成计算机故障,因此计算机内的散热问题也成为一个迫切需要解决的问题。Computers are quite popular equipment. However, ordinary users usually encounter a problem when using computers. It is also a problem faced by general computer manufacturers. Other matching parts are becoming more and more complex, and the capacity requirements of data storage devices (such as hard disks) are also increasing, from tens of GBYTE (GIGA BYTE) to hundreds of GBYTE (GIGA BYTE). When a single storage device cannot provide a higher capacity, multiple storage devices must be connected in series or in parallel to increase the data storage capacity. In addition to the high temperature generated by the storage device itself, it is more likely to be affected by high temperature and cause computer failure. Therefore, the heat dissipation problem in the computer has also become an urgent problem to be solved.
请参照图1所示,其设有一直立式的壳体100,该壳体100后端设有一背板110,该背板110上设有不同功能的连接端口120,而壳体100在靠近背板110处设有一并排的电源供应器130及一风扇140,且该壳体100中的一侧边设有一主机板150,另,在壳体100前端设有储存装置160,该储存装置160包括硬盘、光盘等等,因此,当风扇140激活时,会将壳体100内热源抽出(即负风压差方式),而使外界的冷空气由壳体100的缝隙流入壳体100中,并流经壳体100内的主机板150上的零件及储存装置160,如此一来,则会产生下列的缺点:Please refer to Fig. 1, it is provided with a vertical housing 100, the rear end of the housing 100 is provided with a back plate 110, the back plate 110 is provided with connection ports 120 with different functions, and the housing 100 is close to A side-by-side power supply 130 and a fan 140 are arranged at the backplane 110, and a motherboard 150 is arranged on one side of the casing 100, and a storage device 160 is arranged at the front end of the casing 100, and the storage device 160 Including hard disks, CDs, etc. Therefore, when the fan 140 is activated, the heat source in the casing 100 will be drawn out (that is, the negative wind pressure difference mode), and the cold air from the outside will flow into the casing 100 through the gap of the casing 100, And flow through the parts on the motherboard 150 in the housing 100 and the storage device 160, in this way, the following disadvantages will occur:
1.当外界的冷空气由壳体100的缝隙进入时,并流经壳体100内的主机板150上的发热零件及储存装置160,会将细小尘埃附着于该等零件上,不但使该等零件增加故障机会,降低该等零件的使用寿命,更会阻碍气流的进行,造成散热不易的问题。1. When the outside cold air enters through the gap of the housing 100, and flows through the heat-generating parts and the storage device 160 on the motherboard 150 inside the housing 100, fine dust will be attached to these parts, which not only makes the Other parts increase the chance of failure, reduce the service life of these parts, and hinder the progress of air flow, resulting in the problem of difficult heat dissipation.
2.因壳体100采用直立式设计,使主机板150上的发热零件与风扇140动作所产生的气流呈垂直状,会造成冷空气无法直接进入部份发热零件,而产生发热零件的热滞留。2. Since the housing 100 adopts a vertical design, the heat-generating parts on the motherboard 150 and the airflow generated by the action of the fan 140 are perpendicular to each other, which will prevent cold air from directly entering some of the heat-generating parts, resulting in heat retention of the heat-generating parts .
3.因公知计算机的对外连接端口120设置在背板110上,而一般摆放方式,皆是将背板110紧靠墙面或桌边,因此在拆装上非常不方便;但如将壳体摆放于明显位置时,则于外观上会不美观。3. Because the external connection port 120 of the known computer is set on the backboard 110, and the general placement method is to put the backboard 110 close to the wall or the edge of the table, so it is very inconvenient to disassemble; When the body is placed in an obvious position, it will be unsightly in appearance.
本实用新型是为解决上述公知技术的缺点所做的进一步改良。The utility model is a further improvement to solve the above-mentioned shortcoming of the known technology.
发明内容Contents of the invention
本实用新型要解决的技术问题上提供一种直立式计算机的散热装置,其用来排除计算机主机内部所产生的热源的装置,该装置上设有一壳体,该壳体呈直立式,且该壳体中一侧边设有一主机板,该主机板上设有电子零件及适配卡,而在壳体前端则设有一面板,邻近该面板处则设有储存装置,另,该壳体中在面对主机板及储存装置的位置上设有一固定架,该固定架上设有至少一风扇,该风扇的出风方向与适配卡排列方向平行,如此一来,风扇激活时,可以单一方向直接吹向热源产生处,不会受到阻碍,以增加散热效果。The technical problem to be solved by the utility model is to provide a cooling device for a vertical computer, which is used to eliminate the heat source generated inside the computer mainframe. The device is provided with a housing, which is vertical, and the One side of the housing is provided with a main board, the main board is provided with electronic components and adapter cards, and a panel is provided at the front end of the housing, and a storage device is provided adjacent to the panel. In addition, in the housing A fixed frame is provided at a position facing the main board and the storage device, and at least one fan is arranged on the fixed frame, and the air outlet direction of the fan is parallel to the direction in which the adapter cards are arranged. In this way, when the fan is activated, it can be single The direction blows directly to the place where the heat source is generated without being hindered, so as to increase the heat dissipation effect.
本实用新型要解决的另一技术问题是提供一种计算机的散热装置,风扇激活时,可将外界的冷空气直接由接近壳体底部的缝隙吸入,使底部温度较冷的冷空气直接吹向发热的零件及储存装置,如此可防止尘埃由壳体中其它缝隙进入,而延长零件寿命,更可增加散热效果。Another technical problem to be solved by the utility model is to provide a cooling device for a computer. When the fan is activated, the cold air from the outside can be sucked in directly from the gap close to the bottom of the casing, so that the cold air with a lower temperature at the bottom can be blown directly to the Heat-generating parts and storage devices can prevent dust from entering through other gaps in the casing, prolong the life of parts, and increase the heat dissipation effect.
本实用新型要解决的再一技术问题是提供一种直立式计算机的散热装置,其壳体在远离站立处的相对面上设有对外连接端口,该等对外连接端口凸露在壳体外,而在其上则盖合有一罩体,该罩体与壳体间形成一信道,且该罩体在一端上设有开口,如此一来,不但可方便使用者拆卸,且可通过罩体的盖合,保护对外连接端口,更可使流出壳体的气流在信道导引下,由开口流至外界,确保对流畅通。Another technical problem to be solved by the utility model is to provide a cooling device for an upright computer, the housing of which is provided with external connection ports on the opposite surface away from the stand, and these external connection ports protrude outside the housing, and A cover is covered on it, a channel is formed between the cover and the housing, and an opening is provided on one end of the cover, so that it is not only convenient for the user to disassemble, but also can pass through the cover of the cover. Closed to protect the external connection port, the airflow out of the shell can be guided by the channel and flow from the opening to the outside to ensure smooth convection.
为此,本实用新型提出了一种直立式计算机的散热装置,该装置包括:For this reason, the utility model proposes a kind of cooling device of vertical computer, and this device comprises:
一壳体,该壳体的正面及背面分别设有一面板及背板,并于该壳体中的面板及背板间的一侧边设有一主机板,该主机板上设有多个平行排列的适配卡,于主机板的一侧靠近面板处设有框体,该框体上设有储存装置;A housing, the front and back of the housing are respectively provided with a panel and a back plate, and a main board is provided on one side between the panel and the back board in the housing, and the main board is provided with a plurality of parallel arrays The adapter card is provided with a frame on one side of the motherboard close to the panel, and the frame is provided with a storage device;
一固定架,其设置在该壳体中,并面对于主机板及储存装置;a fixing frame, which is arranged in the casing and faces the motherboard and the storage device;
至少一个风扇,其设置于该固定架上,该风扇的出风方向与适配卡排列方向平行。At least one fan is arranged on the fixing frame, and the air outlet direction of the fan is parallel to the arrangement direction of the adapter cards.
其中一个优选实施例中,所述风扇为两个。In one of the preferred embodiments, there are two fans.
其中一个优选实施例中,所述壳体在远离站立处的相对面上设有对外连接端口,所述对外连接端口凸露在壳体外,且在其上盖合有一罩体,该罩体与壳体间形成一信道,该罩体在一端上设有开口。In one of the preferred embodiments, the housing is provided with an external connection port on the opposite surface away from the standing place, the external connection port protrudes outside the housing, and a cover is covered on it, and the cover is connected with the A channel is formed between the shells, and the cover is provided with an opening at one end.
其中一个优选实施例中,所述壳体内进一步包含有一电源供应器,该电源供应器设于该固定架下方邻近壳体站立处。In one of the preferred embodiments, the casing further includes a power supply, and the power supply is arranged under the fixing bracket and adjacent to the standing position of the casing.
其中一个优选实施例中,所述壳体内进一步包含有一电源供应器,该电源供应器设于该固定架上方远离壳体站立处。In one of the preferred embodiments, the casing further includes a power supply, and the power supply is arranged above the fixing bracket at a position away from the casing.
因此,本实用新型的优点是:通过上述构件的组成,透过风扇转动,使外界的冷空气可由壳体底部缝隙,进入壳体中,使该冷空气以单一方向直接吹向发热处,以增加散热效果。Therefore, the utility model has the advantages that: through the composition of the above-mentioned components, through the rotation of the fan, the cold air from the outside can enter the housing from the gap at the bottom of the housing, so that the cold air can be directly blown to the heating place in a single direction, so as to Increase cooling effect.
附图说明Description of drawings
图1是公知装置示意图。Figure 1 is a schematic diagram of a known device.
图2是本实用新型的立体分解示意图。Fig. 2 is a three-dimensional exploded schematic diagram of the utility model.
图3是本实用新型的组合断面示意图。Fig. 3 is a combined cross-sectional view of the utility model.
图4是本实用新型的断面动作示意图。Fig. 4 is a cross-sectional action schematic diagram of the utility model.
图5是本实用新型另一实施例的断面示意图。Fig. 5 is a schematic cross-sectional view of another embodiment of the present invention.
主要组件的附图标记说明:Explanation of the reference signs of the main components:
壳体 10Shell 10
面板 11
框体 12
背板 13
储存装置 20
主机板 30Motherboard 30
适配卡 31
电源供应器 40
固定架 50Fixed
风扇 60
对外连接端口 70
罩体 80
开口 81opening 81
具体实施方式Detailed ways
本实用新型涉及一种直立式计算机的散热装置,请参照图2、3所示,该装置上设有一壳体10,于本实施例为直立式桌上型计算机,该壳体10正面设有一面板11,邻近该面板11处设有框体12,该框体12内安装有多个储存装置20,于本实施例为光驱或硬盘机等,而该壳体10背面则设有一背板13,且于该壳体10中的面板11与背板13间的一侧边设有一主机板(Mother board)30,该主机板30上设有微处理器(CPU)等等电子零件,且该主机板30上设有多个与面板11平行排列的适配卡31(例如显卡等)。The utility model relates to a cooling device for an upright computer. Please refer to FIGS. The
再者,请参照图2、3所示,该壳体10在站立处靠近背板13处设有一电源供应器40,而在面对主机板30及储存装置20上设有一固定架50,该固定架50固定在壳体10中,其固定方式可用焊接或锁合或插置等等方式,而该固定架50上设有至少一风扇60,于本实施例为两个并排,该风扇60的出风方向与适配卡31排列方向平行。Furthermore, please refer to FIGS. 2 and 3 , the
此外,请参照图2、3所示,其壳体10在远离站立处的相对面(于本实施例为壳体顶端)上设有对外连接端口70,该等对外连接端口70凸露在壳体10外,而在其上则盖合有一罩体80,该罩体80与壳体10间形成一信道,且该罩体80在一端上设有开口81,如此一来,可因该等对外连接端口70设置在使用者触手可及之处,而能方便使用者拆卸,再者,通过罩体80的盖合,更可保护对外连接端口70。In addition, please refer to Figures 2 and 3, the
请参照图4所示,当风扇60激活时,因风扇60将外界的冷空气直接由接近壳体10底部的缝隙吸入,使底部温度较冷的冷空气以单一方向直接吹向发热的零件、适配卡31及储存装置20(即采正向风压差方式),如此可防止尘埃由壳体10中其它缝隙进入,而延长零件寿命,又,进入壳体10的冷空气在流经发热零件、适配卡31及储存装置20后,会由壳体10中其它缝隙及开口81流至外界,确保对流畅通,更可增加散热效果。Please refer to Fig. 4, when the
请参照图5所示,该装置上设有一壳体10,于本实施例为直立式桌上型计算机,该壳体10正面设有一面板11,且壳体10在靠近面板11处设有框体12,该框体12上安装有储存装置20,于本实施例为硬盘或光驱,而该壳体10背面则设有一背板13,且该壳体10中的面板11与背板13间的一侧边则设有主机板30,该主机板30中设有微处理器(CPU)等等电子零件,且该主机板30上设有多个与面板11平行排列的适配卡31(例如显卡等);该壳体10在远离站立处设有一电源供应器40,该电源供应器40靠近背板13,而在面对主机板30及储存装置20上设有一固定架50,该固定架50固定在壳体10中,其固定方式可用焊接或锁合或插置等等方式,而该固定架50上设有至少一风扇60,于本实施例为两个并排,该风扇60的出风方向与适配卡31的排列方向平行,又,壳体10在远离站立处的相对面(于本实施例为壳体顶端)上设有对外连接端口70,该等对外连接端口70凸露在壳体10外,而在其上则盖合有一罩体80,该罩体80与壳体10间形成一信道,且该罩体80在一端上设有开口81。Please refer to Fig. 5, the device is provided with a
风扇60激活时,因风扇60将外界的冷空气直接由接近壳体10底部的缝隙吸入,使底部温度较冷的冷空气直接吹向发热组件及储存装置20(即采正向风压差方式),如此可防止尘埃由壳体10中其它缝隙进入,而延长零件寿命,又,进入壳体10的冷空气在流经发热零件、适配卡31及二储存装置20后,会由壳体10中其它缝隙及开口81流至外界,确保对流畅通,更可增加散热效果。When the
唯以上所述者,仅为本实用新型的较佳实施例而已,当不能用来限定本实用新型所实施的范围。即大凡依本实用新型权利要求书所作的均等变化与修饰,皆应仍属于本实用新型专利涵盖的范围内。Only those described above are only preferred embodiments of the present utility model, and should not be used to limit the implementation scope of the present utility model. That is, all equivalent changes and modifications made according to the claims of the utility model should still fall within the scope covered by the utility model patent.
Claims (5)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200720174915XU CN201107724Y (en) | 2007-09-05 | 2007-09-05 | Heat radiator for vertical computer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200720174915XU CN201107724Y (en) | 2007-09-05 | 2007-09-05 | Heat radiator for vertical computer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102253699A (en) * | 2010-05-19 | 2011-11-23 | 技嘉科技股份有限公司 | System host computer |
| CN110087150A (en) * | 2019-04-22 | 2019-08-02 | 杭州迪普科技股份有限公司 | A kind of communication equipment |
-
2007
- 2007-09-05 CN CNU200720174915XU patent/CN201107724Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102253699A (en) * | 2010-05-19 | 2011-11-23 | 技嘉科技股份有限公司 | System host computer |
| CN110087150A (en) * | 2019-04-22 | 2019-08-02 | 杭州迪普科技股份有限公司 | A kind of communication equipment |
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