CN201004746Y - Fan-free heat dissipation system module - Google Patents

Abstract

The utility model relates to a system module free of fan heat dissipation, which comprises a shell unit and a circuit module. The shell unit comprises a front shell and a rear cover, wherein the front shell and the rear cover are mutually assembled together and matched to define an accommodating space; the rear cover body is provided with a first hollow part and a second hollow part which are respectively formed on the bottom side and the top side of the rear cover body; the two hollow-out parts are communicated with the containing space. The circuit module is accommodated in the accommodating space of the shell unit and comprises a circuit board, at least one heating element and a support, wherein the support is provided with a through hole. Therefore, hot air exchanging heat with the heating element can be discharged from the second hollow part, and meanwhile cold air enters the accommodating space from the first hollow part through the through hole and exchanges heat with the heating element, so that the heat dissipation effect is achieved.

Description

System modules without fan cooling

technical field

The utility model relates to a fan-free heat dissipation system module, in particular to a fan-free heat dissipation system module which utilizes the convection principle to achieve heat dissipation effect.

Background technique

The existing system module usually includes a casing and a circuit module inside the casing. Wherein, the circuit module is composed of a motherboard and a plurality of electronic components arranged on the motherboard, such as central processing unit, hard disk, memory, or IC.

Since the electronic components will generate heat when they work, ventilation holes and fans will be installed at the appropriate positions of the system modules corresponding to the electronic components to dissipate heat and avoid system crashes and abnormal operation caused by overheating of the electronic components.

However, the conventional system modules using fans for heat dissipation have the following deficiencies, resulting in poor applicability:

(1) The production cost of the fan is high.

(2) The space occupation rate of the fan is large, resulting in low space utilization inside the system module.

(3) When the fan is running, it is easy to generate noise.

(4) After the fan has been used for a period of time, it is prone to failure.

In view of the defects existing in the above-mentioned existing system modules, based on years of rich practical experience and professional knowledge engaged in the design and manufacture of such products, and with the application of academic theory, the designer actively researches and innovates, in order to create a new type of free The fan cooling system module can improve the general existing system module and make it more practical. Through continuous research, design, and after repeated trial samples and improvements, the utility model with practical value is finally created.

Contents of the invention

The main purpose of the utility model is to overcome the defects existing in the existing system modules and provide a new type of fan-free system modules for heat dissipation. Suitable for practical use.

Another object of the present invention is to provide a fan-free cooling system module with low production cost and good applicability.

Another object of the present invention is to provide a fan-free system module with high internal space utilization.

Another object of the present invention is to provide a fan-free heat dissipation system module that does not generate noise and has no risk of failure of the heat dissipation mechanism.

The purpose of this utility model and the solution to its technical problems are achieved by adopting the following technical solutions. According to the utility model, a fan-free cooling system module includes a housing unit and a circuit module. The housing unit includes a front housing that is assembled together and cooperates to define an accommodating space, and a rear cover made of metal with high thermal conductivity; wherein, the rear cover has a A first hollow part on the side, and a second hollow part formed on the top side thereof, the two hollow parts communicate with the accommodating space. The circuit module is accommodated in the accommodation space of the housing unit, and includes a circuit board, at least one heating element, at least one signal transmission member, and at least one bracket, which is assembled on the inside of the housing unit and runs through a The slot is provided for the signal transmission part to pass through, and the bracket is provided with at least one through hole, and the through hole communicates with the first hollow part and the second hollow part.

The purpose of this utility model and the solution to its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned fanless heat dissipation system module, the second hollow portion includes a plurality of through holes penetrating through the top side of the rear cover.

The aforementioned fan-free cooling system module, wherein the heating element is facing the rear cover; and the surfaces of the rear cover facing and away from the heating element are respectively defined as the inner surface and the back surface of the rear cover; The fan-free system module further includes a heat dissipation unit, and the heat dissipation unit includes: at least one insulating and heat-conducting member, which is detachably attached between the rear cover and the heating element, and is used to conduct the heat emitted by the heating element. the heat energy to the back cover; and at least one heat sink, which is integrally formed on the back of the back cover, and is generally fin-shaped.

In the aforementioned fan-free cooling system module, the insulating and heat-conducting element is a flexible body.

In the aforementioned fan-free system module, wherein the inner surface of the rear cover is protruded with at least one limiting platform, the limiting platform is corresponding to the position of the heating element, and the insulating and heat-conducting member is interposed between the Limit between the platform and the heating element.

In the aforementioned fan-free cooling system module, the limiting platform is different from the rear cover, and the limiting platform is assembled on the inner surface of the rear cover and protrudes from the inner surface.

The aforementioned fan-free cooling system module, wherein the heating element is facing the rear cover; and the surfaces of the rear cover facing and away from the heating element are respectively defined as the inner surface and the back surface of the rear cover; The inner surface of the rear cover is provided with at least one limiting platform, which is different from the rear cover, protrudes from the inner surface, and corresponds to the position of the heating element; the system module further includes A heat dissipation unit, the heat dissipation unit includes: at least one insulating and heat-conducting member, interposed between the rear cover body and the restraint platform, for conducting the heat energy emitted by the heating element to the rear cover through the restraint platform body; and at least one heat sink, which is integrally formed on the back of the rear cover, and is generally fin-shaped.

In the aforementioned fanless cooling system module, the heating element can be a central processing unit, a hard disk, a memory, or an IC.

The aforementioned fan-free cooling system module, wherein the rear cover includes: a first cover, which is mutually assembled with the front case, and has a third hollowed-out part through; and a second cover A piece is detachably mounted on the third hollow part and closes the third hollow part; the first hollow part is formed on the bottom side of the first cover; the second hollow part is formed on the the top side of the first cover.

In the aforementioned fan-free cooling system module, the first cover further has at least one positioning groove recessed on one side of the third hollow, and the second cover has at least one stop The tenon is combined correspondingly with the positioning groove.

In the aforementioned fan-free cooling system module, a plurality of cooling holes are opened at appropriate positions around the rear cover.

In the above-mentioned system module without fan for heat dissipation, the system module includes a display module, and the system module and the display module are erected on a base.

Compared with the prior art, the utility model has obvious advantages and beneficial effects. It can be seen from the above that, in order to achieve the above purpose, the utility model provides a fan-free cooling system module, which includes a housing unit and a circuit module. The housing unit includes a front housing that is assembled together and cooperates to define an accommodating space, and a rear cover made of metal with high thermal conductivity; wherein, the rear cover has a A first hollow part on the side, and a second hollow part formed on the top side thereof, the two hollow parts communicate with the accommodating space. The circuit module is accommodated in the accommodation space of the housing unit, and includes a circuit board, at least one heating element, at least one signal transmission member, and at least one bracket, which is assembled on the inside of the housing unit and runs through a The slot is provided for the signal transmission part to pass through, and the bracket is provided with at least one through hole, and the through hole communicates with the first hollow part and the second hollow part.

With the above technical solution, the fan-free cooling system module of the present invention has at least the following advantages:

To sum up the above, since the system module of the present utility model does not require an additional assembly of a heat dissipation unit, it uses the convective mechanism design of the first hollow part through the through hole and the second hollow part, and the fin-shaped heat sink is integrally integrated. It is formed on the back of the rear cover, and is equipped with an insulating and heat-conducting element to conduct heat generated by the heating element to achieve a heat dissipation effect. The production cost is low and there is no risk of noise and failure. In addition, the space occupancy of the insulating and heat-conducting element is small, allowing the user to effectively use the accommodation space in the housing unit, and the space utilization is good. In addition, the fan-free cooling system module of the present invention can be designed to limit the platform, so that the insulating and heat-conducting parts are closely attached between the heating element and the rear cover, or the insulating and heat-conducting parts are closely attached to the heating element. The limit of component contact is between the platform and the rear cover, which enhances the heat dissipation effect and has good applicability.

To sum up, the utility model has the above-mentioned many advantages and practical value, it has great improvement no matter in product structure or function, has significant progress in technology, and has produced easy-to-use and practical effects, and Compared with the existing system modules, it has enhanced outstanding functions, is more suitable for practical use, and has wide application value in the industry. It is a novel, progressive and practical new design.

The above description is only an overview of the technical solutions of the present utility model. In order to better understand the technical means of the present utility model, it can be implemented according to the contents of the description, and in order to make the above-mentioned and other purposes, features and advantages of the present utility model better It is obvious and easy to understand. The preferred embodiments are specifically cited below, together with the accompanying drawings, and detailed descriptions are as follows.

Description of drawings

FIG. 1 shows a three-dimensional assembly diagram illustrating a preferred embodiment of the fan-free heat dissipation system module of the present invention, and shows the appearance of the system module erected on a base.

FIG. 2 is a perspective view illustrating the appearance of a preferred embodiment of the system module.

FIG. 3 is a three-dimensional exploded view illustrating a housing unit, a circuit module, and a heat dissipation unit of a preferred embodiment of the system module.

FIG. 4 is an exploded perspective view illustrating the three restraining platforms of the preferred embodiment of the system module.

FIG. 5 shows a part of a three-dimensional assembled view, illustrating the configuration relationship of a second cover and a first cover in a preferred embodiment of the system module after they are separated.

6 shows a schematic cross-sectional side view, illustrating the relative assembly relationship between one of the restraining platforms, a corresponding insulating and heat-conducting member, and a central processing unit of a preferred embodiment of the system module; and

FIG. 7 shows a schematic cross-sectional side view illustrating another embodiment of one of the restraining platforms of the preferred embodiment of the system module.

FIG. 8 is a schematic cross-sectional side view illustrating another embodiment of a restraining platform of the preferred embodiment of the system module.

1: Base body 2: System module

3: Housing unit 31: Accommodating space

32: Front shell 33: Rear cover

331: Inside 332: Back

333: the first cover 334: the second cover

335: The third hollow part 336: Positioning groove

337: Limiting tenon 338: Limiting to reach the platform

34: The first hollow part 35: The second hollow part

351: Perforation 4: Circuit module

41: Circuit board 42: Heating element

42a: central processing unit 42b: hard disk

42c: Memory 42d: IC

42e: IC 43: Signal transmission parts

44: bracket 441: slotting

442: Through hole 5: Cooling unit

51: Insulation and heat conduction parts 52: Heat dissipation parts

53: Cooling hole 6: Display module

Detailed ways

In order to further explain the technical means and effects of the utility model to achieve the intended purpose of the invention, the specific implementation and structure of the fan-free cooling system module proposed according to the utility model will be described below in conjunction with the accompanying drawings and preferred embodiments. , features and their effects are described in detail below.

Please refer to FIGS. 1-3 , which are a preferred embodiment of the fan-free cooling system module of the present invention. The system module 2 includes a housing unit 3 , a circuit module 4 , and a heat dissipation unit 5 .

The casing unit 3 includes a front casing 32 that is assembled together and cooperates to define an accommodating space 31, and a rear cover made of a metal with high thermal conductivity (such as aluminum, copper, or an alloy thereof) 33.

2-5, the circuit module 4 is accommodated in the accommodation space 31 of the housing unit 3, and includes a circuit board 41, at least one circuit board 41 is arranged on the circuit board 41 to form an electrical connection with the circuit board 41 and Facing the heating element 42 of the rear cover 33, at least one signal transmission member 43 inserted on the circuit board 41 and forming an electrical connection 41 with the circuit board, and a set of power supplies on the inner surface of the rear cover 33 of the housing unit 3 The signal transmission part 43 passes through the bracket 44 provided in the bundle. Here, the surface of the rear cover 33 facing the heating unit 42 is defined as the inner surface 331 of the rear cover 33 ; Also in the present embodiment, the number of heating elements 42 is five, which are respectively a central processing unit 42a, a hard disk 42b, a memory 42c, and ICs 42d and 42e.

The bracket 44 has through slots 441 penetrating in the vertical direction, the number and shape of which correspond to the signal transmission element 43 , and are used to bundle the signal transmission element 43 . The signal transmission part 43 of this embodiment can be a universal serial bus (Universal Serial Bus, USB), an AV terminal, or a PS2 port and the like. The bracket 44 also has a plurality of through holes 442 penetrating in the vertical direction, and the through holes communicate with the first hollow part 34 and the second hollow hole 35 described below.

In addition, in this embodiment, in order to facilitate replacement of the hard disk 42b and the memory 42c, the hard disk 42b and the memory 42c are all designed to be detachably inserted on the circuit board 41; correspondingly, the rear cover 33 may include a first cover 333 and a second cover 334 . Wherein, the first cover 333 is assembled with the front case 32, and has a through third hollow portion 335 corresponding to the positions of the hard disk 42b and the memory 42c; and the second cover 334 is detachable. The third hollow portion 335 is installed on the first cover 333 to close the third hollow portion 335 . In practice, the first cover 333 also has at least one positioning groove 336 recessed on one side of the third hollow portion 335 , while the second cover 334 has at least one positioning card correspondingly combined with the positioning groove 336 The tenons 337 are used to connect the covers 333 , 334 together to form the rear cover 33 . In this way, if the user wants to install and remove the hard disk 42b or the memory 42c, he only needs to separate the stopper tenon 337 of the second cover 334 from the positioning groove 336 of the first cover 333 to conveniently install and remove the hard disk. 42b or memory 42c.

The fan-free cooling system module of the utility model mainly uses the convection principle and the heat conduction principle to achieve the cooling effect. Wherein, the principle of convection is to form a first hollow part 34 through the bottom side of the first cover part 333 of the rear cover body 33, and penetrate through the top side of the first cover part 333 (that is, the upper side of the first hollow part 34). A second hollow portion 35 is formed. In this embodiment, the second hollow portion 35 is composed of a plurality of through holes 351 arranged at intervals on the top side of the first cover 333 . Accordingly, when the heating element 42 operates to generate heat, it will exchange heat with the adjacent air, and the hot air will rise and be discharged from the second hollow portion 35 above, while the cold air will be discharged from the first hollow portion below. 34 replenishes into the accommodating space 31 through the through hole 442 of the bracket 44 , and exchanges heat with the heating element 42 again. If it is a convective circulation, it will be able to achieve the cooling effect.

The principle of heat conduction is to use a heat dissipation unit 5 to achieve heat dissipation. The heat dissipation unit 5 includes six insulating and heat-conducting members 51 for conducting the heat energy generated by the heating element 42 to the rear cover 33, and two heat dissipation members for dissipating the heat absorbed from the rear cover 33 into the air 52.

Four of these insulating and heat-conducting members 51 are respectively attached between the central processing unit 42a, memory 42c, IC 42d and 42e and the rear cover 33, and the other two insulating and heat-conducting members 51 are correspondingly spaced apart. It is pasted between the hard disk 42b and the rear cover 33 . In this embodiment, the insulating and heat-conducting member 51 is made of a flexible body (such as silica gel) with insulating and heat-conducting properties, and is pasted between the rear cover 33 and the heating element 42 by means of double-sided adhesive. between. Also, in this embodiment, in order to save material costs, the insulating and heat-conducting elements 51 are cut to an appropriate area, and then correspondingly attached to each heating element 42; The number of implementations is changed according to the difference, and is not limited to what is disclosed in this embodiment.

The heat sink 52 is roughly fin-shaped, and is integrally formed on the back side (the side away from the circuit module 4 ) of the first cover 333 and the second cover 334 of the rear cover 33 respectively.

With the heat dissipation unit 5 cooperating with the mechanism design of the rear cover 33 and the circuit module 4, when the heating element 42 operates to generate heat, the heat will be conducted to the rear cover 33 and the heat dissipation member 52 through the insulating heat conducting member 51, and then escape. Scatter in the air to achieve the effect of heat dissipation.

In addition, a plurality of heat dissipation holes 53 can be opened at appropriate positions around the rear cover 33, so that the heat energy generated by the heating element 42 can also be dissipated into the air through the heat dissipation holes 53 to improve the heat dissipation effect.

With reference to FIG. 6 , in order to strengthen the fit between the insulating heat-conducting member 51 and the rear cover 33 and the heating element 42, the inner surface 331 of the rear cover 33 is protruded with at least one limiting platform 338, and the limiting platform 338 is Corresponding to the position of the heating unit 42 , the insulating and heat-conducting element 51 is more closely attached between the limiting platform 338 and the heating element 42 . In this embodiment, the quantity of the limiting platforms 338 is three, and they are respectively protruded at positions corresponding to the central processing unit 42a, IC 42d and 42e; however, the number of limiting platforms 338 can be increased or decreased according to design requirements .

Also refer to shown in Figure 7, the limiting platform 338 and the rear cover 33 can be different bodies, therefore, the limiting platform 338 is additionally assembled on the inner surface of the rear cover 33, and the limiting platform protrudes from the rear cover 33. The inner surface of the rear cover body 33 . The size and thickness of the limiting platform 338 may depend on the heat of the heating element 42 . According to this structure, the limiting platform 338 can be specially selected from a material with better thermal conductivity, so that the heat energy of the heating element 42 can be transmitted to the rear cover 33 more quickly, and the heat dissipation efficiency can be improved.

Please also refer to FIG. 8 , in the case where the limiting platform 338 and the rear cover 33 are different bodies and then assembled, the insulating and heat-conducting element 51 can also be pasted between the limiting platform 338 and the rear cover 33 Between them, the limiting platform 338 with high thermal conductivity directly contacts the heating element 42 , absorbs the heat energy, and conducts it to the rear cover 33 through the insulating heat conducting element 51 .

Please also refer to FIG. 1 , the system module 2 further includes a display module 6 , and the system module 2 and the display module 6 are erected on the base 1 for easy viewing of the display module 6 .

To sum up the above, since the system module of the present utility model does not require an additional assembly of a heat dissipation unit, it uses the convective mechanism design of the first hollow part through the through hole and the second hollow part, and the fin-shaped heat sink is integrally integrated. It is formed on the back of the rear cover, and is equipped with an insulating and heat-conducting element to conduct heat generated by the heating element to achieve a heat dissipation effect. The production cost is low and there is no risk of noise and failure. In addition, the space occupancy of the insulating and heat-conducting element is small, allowing the user to effectively use the accommodation space in the housing unit, and the space utilization is good. In addition, the fan-free cooling system module of the present invention can be designed to limit the platform, so that the insulating and heat-conducting parts are closely attached between the heating element and the rear cover, or the insulating and heat-conducting parts are closely attached to the heating element. The limit of component contact is between the platform and the rear cover, which enhances the heat dissipation effect and has good applicability. So can really reach the creation purpose of the present utility model.

The above are only preferred embodiments of the present utility model, and do not limit the utility model in any form. Although the utility model has been disclosed as above with preferred embodiments, it is not intended to limit the utility model. Any Those skilled in the art can use the technical content disclosed above to make some changes or modify them into equivalent embodiments without departing from the technical solution of the present utility model. Content, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the utility model still belong to the scope of the technical solution of the utility model.

Claims (12)

1, a kind of system's module of exempting from the fan heat radiation is characterized in that this system's module comprises:

One housing unit, it comprises mutual winding together and match and define a procapsid of an accommodation space, and one by the made rear cover body of high-termal conductivity metal; Wherein, this rear cover body has first hollow-out parts that is formed at its bottom side, and second hollow-out parts that is formed at its top side, and these two hollow-out parts communicate with this accommodation space; And

One circuit module, be located in this accommodation space, and comprise a circuit board, at least one heater element its be arranged on this circuit board and form with this circuit board is electrically connected, at least one signal Transmission Part its be inserted on this circuit board and and be electrically connected with this circuit board formation, and at least one support its be mounted on the inboard of this housing unit and run through and have the groove of wearing and wear appearance for this signal Transmission Part, and this support is provided with at least one through hole that runs through, and this through hole communicates with this first hollow-out parts and this second hollow-out parts.

2, system's module of exempting from the fan heat radiation according to claim 1 is characterized in that described second hollow-out parts comprises most the perforation that run through this rear cover body top side.

3, system's module of exempting from the fan heat radiation according to claim 1 is characterized in that described heater element is in the face of this rear cover body; And this rear cover body is in the face of reaching the inner face and the back side that is defined as this rear cover body away from the face of this heater element respectively; This system's module more comprises a heat-sink unit, and this heat-sink unit comprises:

At least one insulating heat-conductive spare is attached between this rear cover body and this heater element separably, in order to conduct heat energy that this heater element sends to this rear cover body; And

At least one heat sink, it is integrally formed in the back side of this rear cover body, and shape is the fin shape.

4, system's module of exempting from the fan heat radiation according to claim 3 is characterized in that described insulating heat-conductive spare is to be flexible body.

5, system's module of exempting from the fan heat radiation according to claim 3, the inner face that it is characterized in that described rear cover body convexes with at least one limit to platform, it is position corresponding to this heater element that this limit is supported platform, and this insulating heat-conductive spare be between this limit between platform and this heater element.

6, system's module of exempting from fan heat radiation according to claim 5 is characterized in that described limit supports platform and this rear cover body and be consubstantiality not, and this limit is the inner face that is mounted on this rear cover body to platform, and protrudes from this inner face.

7, system's module of exempting from the fan heat radiation according to claim 1 is characterized in that described heater element is in the face of this rear cover body; And this rear cover body is in the face of reaching the inner face and the back side that is defined as this rear cover body away from the face of this heater element respectively; The inner face group of this rear cover body is provided with at least one limit and supports platform, and this limit is supported platform and this rear cover body and is consubstantiality not, and protrudes from this inner face, and corresponding to the position of this heater element; This system's module more comprises a heat-sink unit, and this heat-sink unit comprises:

At least one insulating heat-conductive spare supports between the platform between this rear cover body and this limit, conducts to this rear cover body after the heat energy that this heater element sent is supported platform via this limit; And

At least one heat sink, it is integrally formed in the back side of this rear cover body, and shape is the fin shape.

8, system's module of exempting from the fan heat radiation according to claim 1 is characterized in that described heater element can be a central processing unit, a hard disc, a memory body, or an IC.

9, system's module of exempting from the fan heat radiation according to claim 1 is characterized in that described rear cover body comprises:

One first cover piece, itself and this procapsid is organized mutually and is established, and has the 3rd hollow-out parts that runs through; And

One second cover piece is installed in the 3rd hollow-out parts removably, and seals the 3rd hollow-out parts;

And this first hollow-out parts is the bottom side that is formed at this first cover piece; This second hollow-out parts is the top side that is formed at this first cover piece.

10, system's module of exempting from the fan heat radiation according to claim 9, it is arranged with a sidepiece in the 3rd hollow-out parts to it is characterized in that having more at least one location notch by described first cover piece, this second cover piece then have at least one spacing trip its with the corresponding combination of this location notch.

11, system's module of exempting from the fan heat radiation according to claim 1 is characterized in that the appropriate location of the periphery of described rear cover body offers plural louvre.

12,, it is characterized in that described system module includes one and shows module, and this system's module and this demonstration module are to be set up on the pedestal according to the described system's modules of exempting from the fan heat radiation of claim 1,3 or 7.

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