JP2014035659A - Heat dissipation structure for electronic apparatus and electronic apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat dissipation structure for an electronic apparatus that does not expose an opening when a housing is seen from front and has a housing preferable in terms of design.SOLUTION: A heat dissipation structure for an electronic apparatus comprises: a housing; an electronic component, which is mounted in an internal space of the housing and generates heat; and a fan configured to force air in the internal space out. The housing includes: a rear and a bottom defining the internal space; an intake port and exhaust port communicating with the internal space; and leg parts projecting from the bottom opposite a placing surface on which the electronic apparatus is placed, and abutting on the placing surface. The leg parts define a ventilation space together with the placing surface, the ventilation space having an opening on the rear side of the housing. One of the intake port and exhaust port is provided in the bottom of the housing so as to communicate with the ventilation space. The other of the intake port and exhaust port is provided in the rear of the housing.

Description

  The present invention relates to a heat dissipation structure used for heat dissipation of an electronic apparatus such as an audiovisual apparatus or an electronic computer, and in particular, heat dissipation of an electronic apparatus having an opening communicating with an intake port or an exhaust port provided on a bottom surface of a housing. Concerning structure.

  In a semiconductor element used in an audiovisual apparatus or an electronic apparatus constituting an electronic computer such as a personal computer, heat is generated due to power loss in the semiconductor element. Further, not only the semiconductor elements arranged in the casing of the electronic device but also a recording medium control device such as an HDD (Hard Disk Drive) or a circuit component such as a power source generates heat. Therefore, in order to prevent destruction due to heat generation, the housing is generally provided with an intake port and an exhaust port, and in some cases, a fan that exhausts the heated air in the internal space of the housing may be provided. is there.

  Conventionally, for example, a housing in which a first heat generating member and a second heat generating member are arranged inside and an inlet for sucking outside air is formed, and the first heat generating member and the second heat generating member A case member having a fan for radiating heat, a heat generation member storage portion in which the first heat generation member is stored, and a fan storage portion in communication with the heat generation member storage portion and in which the fan is stored, The case member includes a first opening for sucking air into the heat generating member storage portion, and a first opening for sucking air inside the housing into the fan storage portion without passing through the heat generating member storage portion. 2 openings and an exhaust port for releasing air from the fan housing part are formed, and a part of the fan arranged in the fan housing part releases air in the heat generating member housing part from the exhaust port. Function of the fan A part of which functions to discharge air from the second opening from the exhaust port, and the second heat generating member is disposed in an air flow path connecting the suction port and the second opening, There are electronic devices. (Patent Document 1).

  Further, conventionally, a main body provided with an exhaust hole and an exhaust fan at a position not facing the intake hole on the rear panel while being provided with an intake hole near the front panel on the bottom surface, and a heat sink A plurality of components including at least one first heat generating component having and at least one second heat generating component not having a heat sink, the motherboard being accommodated in the main body while avoiding the intake holes; The first heat generating component is arranged in a line extending in a direction extending from the position near the exhaust fan of the motherboard toward the front panel, and the second heat generating component is The motherboard is disposed at a position close to the intake hole, and the motherboard has an end face facing the exhaust hole and a face facing the motherboard open. A duct member having a semi-cylindrical shape extending from the air hole toward the front panel is attached to cover the exhaust fan and the first heat generating component, and faces the second heat generating component of the duct member. An opening for allowing air flowing into the main body through the intake hole to be sucked into the duct member is provided on the side surface so as to cut a lower end thereof. There is a heat dissipation structure (Patent Document 2).

Japanese Patent No. 4457414 (FIGS. 1 to 13) Japanese Patent No. 4466640 (FIGS. 1 to 10)

  However, in the electronic devices as described above, many design restrictions are required for the housing that realizes the heat dissipation structure. For example, if an air intake hole is provided at a position close to the front panel on the bottom surface, a bottom leg is attached to the bottom surface of the housing, and the air is It will be possible to flow from the front side. However, in this case, there is a problem that the space below the front panel has to be increased, which restricts the design. Even if an intake or exhaust port is provided on the bottom of the housing for heat dissipation reasons, if there is a heat dissipation structure that does not see a space that communicates with the housing when viewed from the front, It may be preferable. Further, there is a problem that dust is collected in the suction holes on the bottom surface of the casing due to the sucked air and looks dirty.

  The present invention has been made to solve the above-described problems of the prior art, and an object thereof is related to a heat dissipation structure used for heat dissipation of an electronic device, and more particularly, an air inlet or an exhaust provided on a bottom surface of a housing. An object of the present invention is to provide a heat dissipation structure for an electronic device having an opening communicating with a mouth, in which the opening is not visible when the housing is viewed from the front, and a housing that is preferable in design can be realized.

  The heat dissipation structure for an electronic device according to the present invention is a heat dissipation structure for an electronic device including a housing, an electronic component that generates heat that is attached to the internal space of the housing, and a fan that exhausts air in the internal space to the outside. And a mounting surface that protrudes from a bottom surface and a bottom surface that define the internal space, an intake port and an exhaust port that communicate with the internal space, and a bottom surface that faces the mounting surface on which the electronic device is mounted. And a leg portion that defines a ventilation space having an opening on the back side of the housing together with the mounting surface, and either the intake port or the exhaust port communicates with the ventilation space. As described above, the other of the intake port and the exhaust port is provided on the back surface of the housing.

  Preferably, in the heat dissipation structure for an electronic device according to the present invention, the leg portion of the housing includes a front wall surface, a right wall surface, and a left wall surface, and is on the rear side of the housing and viewed from the front or side. An opening is defined at a position where it cannot be seen.

  In the heat dissipation structure for an electronic device according to the present invention, the air inlet is provided on the bottom surface of the housing, and the air outlet and the fan are provided on the back surface of the housing.

  Moreover, the electronic device of this invention contains the thermal radiation structure of the electronic device in any one of the said description.

  The operation of the present invention will be described below.

  The heat dissipation structure for an electronic device according to the present invention includes a housing, an electronic component that generates heat that is attached to the internal space of the housing, and a fan that discharges air in the internal space to the outside. The housing is provided so as to protrude from the back and bottom surfaces that define the internal space, the air intake and exhaust ports that communicate with the internal space, and the bottom surface that faces the mounting surface on which the electronic device is mounted. And a leg portion in contact therewith. When the fan operates, the fan rotates the blades to generate air that discharges and cools the air in the internal space of the housing heated by the high-temperature electronic components.

  The legs of the housing define a ventilation space having an opening on the back side of the housing together with the placement surface. If the legs of the case include the front wall, the right wall, and the left wall, the opening should be defined at the rear side of the case and not visible when the case is viewed from the front or side. Can do. Either the intake port or the exhaust port of the housing is provided on the bottom surface of the housing so as to communicate with the ventilation space, and either the intake port or the exhaust port is provided on the back surface of the housing. Preferably, the intake port is provided on the bottom surface of the housing, and the exhaust port and the fan are provided on the back surface of the housing.

  Therefore, in an electronic device having an opening communicating with an intake port or an exhaust port provided on the bottom surface of the housing, the opening of the heat dissipation structure can be made invisible when the housing is viewed from the front. This is because the opening is provided on the back side of the leg portion provided on the bottom surface of the housing, so that the opening is almost invisible regardless of whether the housing is viewed from the front or the side. Therefore, even if the housing of an electronic device shortens the distance between the lower end of the front panel and the mounting surface, which is preferable in terms of design, when the fan operates, maintain sufficient heat dissipation performance. Can do. Even if the space under the front panel is not enlarged, dust does not collect due to the sucked air and it does not appear to be dirty.

  The heat dissipating structure of the present invention and the electronic apparatus using the heat dissipating structure are designed so that the opening cannot be seen when the housing is viewed from the front, even if the housing has an opening communicating with the air intake or exhaust provided on the bottom surface of the housing. A favorable housing can be realized.

It is a perspective view explaining the audiovisual apparatus by preferable embodiment of this invention. Example 1 It is the perspective view which looked at the audiovisual apparatus by preferable embodiment of this invention from the lower side. Example 1 It is sectional drawing explaining the heat dissipation structure of the audiovisual apparatus by preferable embodiment of this invention. Example 1

  Hereinafter, although the thermal radiation structure by the preferable embodiment of this invention and an electronic device using the same are demonstrated, this invention is not limited to these embodiment.

  FIG. 1 is a perspective view of an audiovisual apparatus 1 including a heat dissipation structure according to a preferred embodiment of the present invention as viewed obliquely from the front. FIG. 2 is a perspective view of the audiovisual apparatus 1 as viewed from below, and FIG. 3 is a cross-sectional view of a side perspective view taken along line A-A ′ in FIG. 1. In addition, below, illustration and description are abbreviate | omitted about the one part detailed structure unnecessary for description of operation | movement of the thermal radiation structure in the audiovisual apparatus 1. FIG.

  The audiovisual apparatus 1 according to the present embodiment is a music player that includes a display 5 and left and right speakers 6 in a housing 3. The housing 3 has a leg 4 at the center of the bottom thereof, and the audiovisual apparatus 1 is placed on the plane 2 via the leg 4 and used. The casing 3 molded into a rounded shape as a whole is composed of a plurality of members molded from resin. The housing 3 includes a front surface 31 to which the display 5 and the left and right speakers 6 are attached, a side surface 32 that is a side surface portion, a bottom surface 33 that is a bottom surface portion facing the placement surface, a back surface 34 that is a back surface portion, and leg portions. 4 is included.

  The housing 3 defines an internal space 30 that houses a plurality of circuits 9 including electronic components connected to the display 5 and the left and right speakers 6 and the like. The heat dissipating structure in the audiovisual apparatus 1 radiates heat by discharging the air heated in the internal space 30 of the housing 3 to the outside of the housing 3 as indicated by a dotted arrow in FIG. In the present embodiment, the leg 4 on the bottom surface 33 of the housing 3 is provided with the air inlet 7 that communicates with the internal space 30, and the exhaust port 8 and the fan 10 that communicate with the internal space 30 are provided on the back surface 34 of the housing 3. Provided.

  The leg portion 4 is a portion provided so as to partially protrude outward from the bottom surface 33 and the back surface 34 facing the plane 2, and is continuous with the front wall surface portion 41 that contacts the plane 2 and the front wall surface portion 41. The right wall surface portion 42 and the left wall surface portion 43 formed as described above, and the back surface portion 44 connected to the back surface 34 of the housing 3 are included. The back surface portion 44 is provided with a terminal portion 45 to which a plurality of terminals are attached at the back. The front wall surface portion 41, the right wall surface portion 42 and the left wall surface portion 43 slightly protrude from the bottom surface 33. Therefore, although the bottom surface 33 of the housing 3 is slightly separated from the plane 2, it appears as if it is in close contact with the plane 2 when the user views the audiovisual apparatus 1 from the front. The front wall surface portion 41, the right wall surface portion 42, and the left wall surface portion 43 are preferably configured to be flat so as to be in close contact with the flat surface 2.

  The front wall surface portion 41, the right wall surface portion 42, and the left wall surface portion 43 of the leg portion 4 are connected to the plane 2 in a substantially U-shape and have a ventilation space 21 having an opening 20 on the back side of the housing 3. Defined with plane 2 The air inlet 7 of the leg portion 4 is formed in the bottom surface 33 and the leg portion 4 as a plurality of through holes that allow the ventilation space 21 defined by the leg portion 4 to communicate with the internal space 30 of the housing 3. The opening 20 is defined as a rectangular opening on the back side of the housing 3 by the right wall surface portion 42 and the left wall surface portion 43, the plane 2 and the terminal portion 45. The opening 20 is in a position that cannot be seen when the housing 3 is viewed from the front or the side. Therefore, the air inlet 7 and the opening 20 in the heat dissipation structure of the audiovisual apparatus 1 are almost invisible regardless of whether the housing 3 is viewed from the front or the side.

  Further, the exhaust port 8 is formed as a plurality of through holes in the back surface 34 of the housing 3 and the back surface portion 44 of the leg portion 4 connected thereto. The fan 10 is a fan device attached to the internal space 30 of the housing 3 so as to cover the exhaust port 8. The fan 10 has rotating blades in a substantially rectangular parallelepiped frame, and can generate DC cooling air by rotating the rotating blades with a motor. The fan 10 of this embodiment generates an air flow illustrated by a dotted arrow. The fan 10 is supplied with power from a power supply device (not shown) of the audiovisual apparatus 1, and is rotated and stopped by being turned on / off and controlled by a microcomputer (not shown) as a control device.

  When the fan 10 operates, the heat dissipation structure of the audiovisual apparatus 1 forcibly sucks air from the air inlet 7 and discharges the air in the internal space 30 of the housing 3 through the air outlet 8. . On the other hand, even when the fan 10 operates, the air in the internal space 30 of the housing 3 heated by the high-temperature electronic components is exhausted by the air flowing from the intake port 7 of the bottom surface 33 by natural convection. Is discharged from the outside. Therefore, the heat dissipation structure of the audiovisual apparatus 1 can cool the electronic components that generate heat inside the housing 3.

  In the heat dissipation structure of the audiovisual apparatus 1, an opening 20 through which external air flows into the internal space 30 of the housing 3 is provided on the back side of the leg portion 4 that cannot be seen when the housing 3 is viewed from the front. This is because the leg 4 is provided on the bottom 33 of the housing 3 so as to define the ventilation space 21 communicating with the air inlet 7. Accordingly, the fan 10 operates even when the housing 3 of the audiovisual apparatus 1 is designed to shorten the distance between the lower end of the front surface 31 that is preferable in design and the plane 2 that is the mounting surface. Therefore, the heat dissipation performance can be sufficiently maintained. Further, since the space below the front surface 31 of the housing 3 does not need to be increased, not only the design advantage but also dust is collected by the sucked air, and the front surface 3 side of the housing 3 becomes dirty. There is an advantage that it is not visible.

  In the heat dissipation structure of the audiovisual apparatus 1, the shape of the other leg portion 4 may be adopted instead of the shape of the leg portion 4 in the above embodiment. For example, the leg portion 4 may have a substantially arcuate structure that abuts against the plane 2, and may be provided with an opening 20 on the back side and defining the ventilation space 21 together with the plane 2.

  Further, the present invention is not limited to the above embodiment. The heat dissipation structure of the audiovisual apparatus 1 is not limited to the heat dissipation structure of the audiovisual apparatus 1 as illustrated. In the above heat dissipation structure, the fan 10 is attached to the exhaust port 8. However, the fan 10 may be attached to the intake port 7, and is located anywhere in the internal space 30 of the housing 3. Thus, it is only necessary to attach the heated air in the internal space 30 to a position where it can be properly discharged to the outside.

  The heat dissipation structure of the present invention can be applied not only to audiovisual equipment but also to an electronic computer such as a personal computer.

DESCRIPTION OF SYMBOLS 1 Audio visual equipment 2 Plane, mounting surface 3 Case 4 Leg part 5 Display 6 Speaker 7 Intake port 8 Exhaust port 9 Circuit 10 Fan

Claims (4)

A heat dissipation structure for an electronic device comprising a housing, a heat generating electronic component attached to the internal space of the housing, and a fan for discharging the air in the internal space to the outside,
The housing is provided to protrude from the back and bottom surfaces defining the internal space, the air inlet and exhaust ports communicating with the internal space, and the bottom surface facing the mounting surface on which the electronic device is mounted. A leg portion that abuts the mounting surface;
The leg portion defines a ventilation space having an opening on the back side of the housing together with the mounting surface,
Either the intake port or the exhaust port is provided on the bottom surface of the casing so as to communicate with the ventilation space, and either the intake port or the exhaust port is connected to the casing of the casing. Provided on the back,
Heat dissipation structure for electronic equipment. The leg of the housing includes a front wall surface, a right wall surface, and a left wall surface, and the opening is defined at a position on the back side of the housing that is not visible when the housing is viewed from the front or side. To be
The heat dissipation structure for an electronic device according to claim 1. The intake port is provided on the bottom surface of the housing, and the exhaust port and the fan are provided on the back surface of the housing.
The heat dissipation structure for an electronic device according to claim 1 or 2. The electronic device containing the heat dissipation structure of the electronic device in any one of Claim 1 to 3.

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