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TWI895871B - Pressing mechanism and processing apparatus - Google Patents

Pressing mechanism and processing apparatus

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Publication number
TWI895871B
TWI895871B TW112147680A TW112147680A TWI895871B TW I895871 B TWI895871 B TW I895871B TW 112147680 A TW112147680 A TW 112147680A TW 112147680 A TW112147680 A TW 112147680A TW I895871 B TWI895871 B TW I895871B
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TW
Taiwan
Prior art keywords
space
control unit
temperature control
temperature
crimping
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TW112147680A
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Chinese (zh)
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TW202525000A (en
Inventor
謝旼達
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鴻勁精密股份有限公司
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Priority to TW112147680A priority Critical patent/TWI895871B/en
Publication of TW202525000A publication Critical patent/TW202525000A/en
Application granted granted Critical
Publication of TWI895871B publication Critical patent/TWI895871B/en

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Press Drives And Press Lines (AREA)

Abstract

The pressing mechanism includes a supporter, a pressing jig, and a temperature control mechanism, which is arranged between the support and the pressing jig. The first heat-exchanged gas with the pressing jig in the first space is transported to the third space of the third temperature control unit by the transporter of the first temperature control uni. When the first heat-exchanged gas flows in the third spaced, it undergoes a second heat-exchanging with the first temperature control member of the second temperature control unit in the second space. The second heat-exchanged gas in the third space is cooled down and is discharged to the space beside the pressing jig. Thus, the temperature beside the pressing jig can be controlled to be not too high. Thereby, the cost of heat-dissipation can be reduced.

Description

壓接機構及作業設備Crimping mechanism and operating equipment

本發明提供一種節省處理高溫氣體能源成本及提高散熱使用效能之壓接機構。The present invention provides a crimping mechanism that saves energy costs for processing high-temperature gas and improves heat dissipation efficiency.

在現今,請參閱圖1、2,電子元件11製作完成後,業者以測試器12承置複數個電子元件11,並搬運至作業設備(例如電性測試作業設備或預燒測試作業設備)執行測試作業。測試器12包含電性連接之電路板121及複數個測試座122,測試座122以供承置及測試電子元件11,並配置外蓋123,外蓋123蓋合測試座122而限位電子元件11。然電子元件11之測試過程中,其自身會產生高溫 ,為避免過當之高溫影響測試品質,測試器12於外蓋123之頂面設置複數片的散熱鰭片124加以散熱。 Today, as shown in Figures 1 and 2, after electronic components 11 are manufactured, they are placed in a tester 12 and transported to processing equipment (such as electrical testing equipment or burn-in testing equipment) for testing. The tester 12 includes an electrically connected circuit board 121 and multiple test sockets 122 for holding and testing the electronic components 11. The test sockets 122 are equipped with a cover 123 that covers the test sockets 122 and holds the electronic components 11 in place. However, during the testing process, the electronic components 11 generate high temperatures. To prevent excessive temperatures from affecting test quality, the tester 12 is equipped with multiple heat sinks 124 on the top of the cover 123 to dissipate heat.

以預燒測試作業設備為例,其預燒爐體13的作業空間131設有複數層之承架132,以供承置具有複數個電子元件11之測試器12;預燒爐體13之一側設有入風流道133,以供氣體處理裝置(圖未示出)輸入具有預設熱度之氣體,並供氣體流入作業空間131,使電子元件11於模擬日後應用之高溫環境進行預燒測試作業;然複數層之各測試器12利用散熱鰭片124加以散熱,並使散熱出之高溫氣體流入作業空間131,作業空間131之大量高溫氣體再流入預燒爐體13另一側設置之出風流道134,出風流道134將大量高溫氣體輸送至氣體處理裝置,由氣體處理裝置將大量高溫氣體處理降溫至預設熱度,方可將具有預設熱度之氣體輸送回入風流道133。Taking the pre-burning test equipment as an example, the working space 131 of the pre-burning furnace body 13 is provided with a plurality of layers of racks 132 for holding a tester 12 with a plurality of electronic components 11; an air inlet duct 133 is provided on one side of the pre-burning furnace body 13 for a gas treatment device (not shown) to input gas with a preset temperature and allow the gas to flow into the working space 131, so that the electronic components 11 can be pre-burned in a high temperature environment that simulates future applications; and then Each of the testers 12 on several layers uses heat dissipation fins 124 to dissipate heat, and the high-temperature gas released by the heat dissipation flows into the working space 131. The large amount of high-temperature gas in the working space 131 then flows into the air outlet duct 134 set on the other side of the pre-furnace body 13. The air outlet duct 134 transports the large amount of high-temperature gas to the gas processing device, which processes the large amount of high-temperature gas and cools it to a preset temperature before transporting the gas with the preset temperature back to the air inlet duct 133.

惟,數十個或上百個之測試座122的散熱鰭片124所流散出於作業空間131之大量高溫氣體,導致測試座122周遭的環境溫度超過原本預設之環境溫度,溫度過高的大量高溫氣體再經由出風通道134輸送至氣體處理裝置,以致預燒測試作業設備必需配置較大功率之氣體處理裝置方可將龐大流量且溫度過高之氣體處理降溫至預設溫度,致使相當耗費能源及成本。However, the large amount of high-temperature gas released from the heat sink fins 124 of dozens or hundreds of test sockets 122 into the workspace 131 causes the ambient temperature around the test sockets 122 to exceed the originally preset ambient temperature. The large amount of high-temperature gas with excessive temperature is then transported to the gas processing device through the air outlet duct 134. As a result, the pre-burn test operation equipment must be equipped with a larger-power gas processing device to cool down the large flow and high temperature gas to the preset temperature, resulting in considerable energy consumption and cost.

又,較大功率之氣體處理裝置相對具有較大體積,以致相當佔用預燒測試作業設備之周遭空間,不利空間配置。Furthermore, the larger the power of the gas treatment equipment, the larger the volume. This occupies a considerable amount of space around the pre-burn test equipment, which is not conducive to space allocation.

本發明之目的一,提供一種壓接機構,包含至少一架置器、至少一壓接治具及至少一溫控結構;架置器以供裝配至少一溫控結構,溫控結構包含第一溫控單元、第二溫控單元及第三溫控單元,第一溫控單元以供裝配壓接治具,並設置具有輸送器之第一空間,輸送器能夠輸出第一空間內且與壓接治具作第一次熱交換之氣體,第二溫控單元設有第二空間,以供配置第一溫控件 ,第三溫控單元設置於第一溫控單元與第二溫控單元之間,並設有第三空間,以供輸送器輸入第一次熱交換之氣體,第一次熱交換之氣體於第三空間流動過程中,能夠與第二空間之第一溫控件作第二次熱交換,第三空間再排出第二次熱交換且降溫之氣體至壓接治具之周遭環境或壓接機構之外部環境;藉以避免壓接治具周遭之環境溫度過高,尤其在數十個或上百個溫控結構同時運作狀態下,毋需配置較大功率之氣體處理裝置,進而有效節省能源成本。 A first object of the present invention is to provide a crimping mechanism comprising at least one mounting device, at least one crimping jig, and at least one temperature control structure. The mounting device is configured to receive the at least one temperature control structure, which comprises a first temperature control unit, a second temperature control unit, and a third temperature control unit. The first temperature control unit is configured to receive the crimping jig and has a first space containing a conveyor capable of discharging gas within the first space for primary heat exchange with the crimping jig. The second temperature control unit is configured to have a second space for accommodating the first temperature control unit. The third temperature control unit is located between the first and second temperature control units and provides a third space for the conveyor to input the gas for the first heat exchange. As the gas flows through the third space, it undergoes a second heat exchange with the first temperature control unit in the second space. The third space then discharges the gas, which has undergone the second heat exchange and has been cooled, into the surrounding environment of the press-fitting fixture or the external environment of the press-fitting mechanism. This prevents the ambient temperature around the press-fitting fixture from rising too high. This eliminates the need for high-power gas processing equipment, especially when dozens or hundreds of temperature control mechanisms are operating simultaneously, effectively saving energy costs.

本發明之目的二,提供一種壓接機構,其溫控結構排出之第二次熱交換且降溫的氣體,可有效避免壓接治具周遭的環境溫度過高,毋需配置大功率且體積大之氣體處理裝置,進而有效縮減體積以利作業設備之周遭空間配置。A second objective of the present invention is to provide a crimping mechanism in which the secondary heat exchange and cooling gas discharged from the temperature control structure can effectively prevent the ambient temperature around the crimping fixture from being too high, eliminating the need for a high-power and large gas processing device, thereby effectively reducing the volume and facilitating the space surrounding the operating equipment.

本發明之目的三,提供一種作業設備,包含機架、至少一本發明壓接機構及中央控制裝置;機架設置至少一承架,以供承置至少一測試器;至少一本發明壓接機構裝配於機架,以供壓接及溫控該測試器;中央控制裝置以供控制及整合壓接機構作動而執行自動化作業。A third object of the present invention is to provide an operating apparatus comprising a rack, at least one crimping mechanism of the present invention, and a central control device; the rack being provided with at least one support frame for supporting at least one tester; at least one crimping mechanism of the present invention being mounted on the rack for crimping and temperature-controlling the tester; and the central control device for controlling and integrating the movement of the crimping mechanism to perform automated operations.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:To help you better understand this invention, we will provide you with a better understanding of this invention by providing a preferred embodiment with accompanying drawings.

請參閱圖3、4,本發明壓接機構應用於作業設備,作業設備可為電子元件之電性測試作業設備或預燒測試作業設備。作業設備包含機架、至少一本發明壓接機構及中央控制裝置(圖未示出);機架設置至少一承架,以供承置至少一測試器;至少一本發明壓接機構裝配於機架,包含至少一架置器、至少一溫控結構及至少一壓接治具,以供壓接及溫控測試器;中央控制裝置以供控制及整合壓接機構作動而執行自動化作業。Referring to Figures 3 and 4, the present invention's crimping mechanism is applied to an operating device, which can be electrical testing equipment or burn-in testing equipment for electronic components. The operating device includes a rack, at least one present invention crimping mechanism, and a central control device (not shown). The rack is equipped with at least one support frame for holding at least one tester. The at least one present invention crimping mechanism is mounted on the rack and includes at least one mounting device, at least one temperature control structure, and at least one crimping fixture for crimping and temperature-controlling the tester. The central control device controls and integrates the crimping mechanism's movements to perform automated operations.

依作業需求,作業設備可配置一個或複數個本發明壓接機構;於本實施例,作業設備為電子元件預燒測試作業設備,機架21以複數個架體圍構成一作業空間211,並於呈Z方向配置之二側架212間設有至少一承架213,承架213可為一字型架、L型架、機台板或承板等,以供承置至少一測試器(圖未示出 );於本實施例,二側架212之內面分別設置複數層且兩兩相對配置之承架213,各層相對之二承架213呈X方向配置。 Depending on the work requirements, the operating equipment can be equipped with one or more of the present crimping mechanisms. In this embodiment, the operating equipment is electronic component burn-in test equipment. A rack 21 is constructed of multiple frames to form a workspace 211. At least one support frame 213 is positioned between two side frames 212 arranged in the Z direction. The support frame 213 can be a straight-line frame, an L-shaped frame, a machine plate, or a support plate, etc., for supporting at least one tester (not shown). In this embodiment, multiple layers of support frames 213 are positioned on the inner surfaces of the two side frames 212, each arranged in pairs. The two opposing support frames 213 on each layer are arranged in the X direction.

依作業需求,機架21能夠設置至少一第二驅動器(圖未示出),第二驅動器以供驅動承架213沿壓接軸向(例如Z方向)位移;亦即承架213承置測試器,第二驅動器可驅動承架213及測試器朝向壓接治具作Z方向位移。Depending on the operating requirements, the frame 21 can be equipped with at least one second actuator (not shown) to drive the support frame 213 to move along the compression axis (e.g., the Z direction); that is, the support frame 213 supports the tester, and the second actuator can drive the support frame 213 and the tester to move in the Z direction toward the compression fixture.

依作業需求,預燒測試作業設備若需於作業空間211流入所需預設溫度之熱氣時,可於機架21之兩側配置相通作業空間211之入風流道(圖未示出)及出風流道(圖未示出),亦無不可,不受限於本實施例。According to the working requirements, if the pre-burning test working equipment needs to flow hot air of the required preset temperature into the working space 211, an air inlet duct (not shown) and an air outlet duct (not shown) communicating with the working space 211 can be configured on both sides of the rack 21. This is also possible and is not limited to this embodiment.

本發明壓接機構裝配於機架21,包含至少一架置器、至少一壓接治具及至少一溫控結構。The crimping mechanism of the present invention is assembled on the frame 21 and includes at least one mounting device, at least one crimping fixture, and at least one temperature control structure.

至少一架置器為固定式或可活動式配置;例如架置器為搬運車架之固定式車架或預燒測試作業設備之固定式機架21。例如架置器為電性測試作業設備之可活動式移載臂或預燒測試作業設備之可活動式機架。承上述,架置器可為獨立架體、移載臂或機架21之側架212;於本實施例,架置器為預燒測試作業設備之固定式機架21的側架212,側架212呈Z方向配置。At least one mount is configured to be fixed or movable. For example, the mount can be a fixed frame of a transport vehicle or a fixed frame 21 of the burn-in test equipment. For example, the mount can be a movable transfer arm of electrical test equipment or a movable frame of the burn-in test equipment. As mentioned above, the mount can be a standalone frame, a transfer arm, or a side frame 212 of the frame 21. In this embodiment, the mount is a side frame 212 of the fixed frame 21 of the burn-in test equipment, and the side frame 212 is configured in the Z direction.

至少一壓接治具22,以供壓接電子元件。依作業需求,壓接治具22可執行壓接電子元件之作業,或者設有至少一抽氣部(圖未示出),以供執行移載及壓接電子元件之作業;於本實施例,壓接治具22可執行壓接電子元件之作業。At least one crimping jig 22 is provided for crimping electronic components. Depending on the operation requirements, the crimping jig 22 can perform the crimping operation, or it can be equipped with at least one exhaust unit (not shown) for performing the transfer and crimping operations of the electronic components. In this embodiment, the crimping jig 22 can perform the crimping operation of the electronic components.

依作業需求,壓接機構更包含至少一第二溫控件,第二溫控件裝配於壓接治具22,以供溫控調整電子元件之預設測試溫度;例如電子元件未逹到預設測試溫度,可啟動第二溫控件,以升溫或降溫調整電子元件之測試溫度 ;例如電子元件已逹到預設測試溫度,可關閉第二溫控件。更進一步,第二溫控件可裝配於溫控結構與壓接治具22之間,或裝配於壓接治具22之內部、底部等適當位置,亦無不可。承上述,第二溫控件可為加熱件、致冷晶片或具流體之溫控座;於本實施例,第二溫控件為加熱件23,並配置於壓接治具22之內部。 Depending on operational requirements, the crimping mechanism further includes at least one second temperature control unit, mounted on the crimping jig 22, to control and adjust the electronic component's preset test temperature. For example, if the electronic component has not reached the preset test temperature, the second temperature control unit can be activated to raise or lower the test temperature. If the electronic component has reached the preset test temperature, the second temperature control unit can be deactivated. Furthermore, the second temperature control unit can be mounted between the temperature control structure and the crimping jig 22, or mounted within or at a suitable location within the crimping jig 22. As mentioned above, the second temperature control unit can be a heater, a cooling chip, or a temperature control seat containing fluid. In this embodiment, the second temperature control unit is a heater 23, which is disposed within the crimping jig 22.

至少一溫控結構裝配於架置器,包含至少一第一溫控單元、至少一第二溫控單元及至少一第三溫控單元;第一溫控單元以供裝配壓接治具22,並設置具有至少一輸送器之第一空間,輸送器能夠輸出第一空間內且與壓接治具22作第一次熱交換之氣體;第二溫控單元設有第二空間,以供配置第一溫控件;第三溫控單元設置於第一溫控單元與第二溫控單元之間,並設有第三空間以供輸送器輸入第一次熱交換之氣體,第一次熱交換之氣體能夠與第二空間之第一溫控件作第二次熱交換,第三空間排出第二次熱交換且降溫之氣體。At least one temperature control structure is assembled on the mount, including at least one first temperature control unit, at least one second temperature control unit, and at least one third temperature control unit; the first temperature control unit is used to assemble the compression jig 22 and is provided with a first space having at least one conveyor, which can output the gas in the first space and undergo a first heat exchange with the compression jig 22; the second temperature control unit is provided with a second space for configuring the first temperature control unit; the third temperature control unit is arranged between the first temperature control unit and the second temperature control unit and is provided with a third space for the conveyor to input the gas for the first heat exchange, the gas for the first heat exchange can undergo a second heat exchange with the first temperature control unit in the second space, and the third space discharges the gas that has undergone the second heat exchange and has been cooled.

依作業需求,輸送器可為風扇或抽吸泵等,以供將氣體輸入或輸出於第一空間或第三空間,不受限於本實施例。According to the operation requirements, the conveyor can be a fan or a suction pump, etc., for inputting or outputting the gas into or out of the first space or the third space, and is not limited to this embodiment.

依作業需求,第一溫控件可為液體、氣體或致冷晶片等,不受限於本實施例。Depending on the operation requirements, the first temperature control element can be liquid, gas or a cooling chip, etc., and is not limited to this embodiment.

依作業需求,壓接機構更包含至少一第一驅動器,第一驅動器裝配於架置器,以供驅動溫控結構沿壓接軸向(例如Z軸向)位移。更進一步,第一驅動器可為線性馬達、壓缸或包含馬達及至少一傳動組,傳動組可為皮帶輪組或螺桿螺座組;於本實施例,壓接機構於機架21之二側架212內面配置複數層之複數個第一驅動器,各層二相對配置之第一驅動器為壓缸24,並呈Z方向配置。Depending on operational requirements, the press-fit mechanism further includes at least one first actuator, mounted on a mount to drive the temperature-control structure along the press-fit axis (e.g., the Z-axis). Furthermore, the first actuator can be a linear motor, a cylinder, or a combination of a motor and at least one transmission assembly, such as a pulley assembly or a screw-screw assembly. In this embodiment, the press-fit mechanism comprises multiple layers of first actuators arranged on the inner surfaces of the two side frames 212 of the frame 21. The two opposing first actuators on each layer are cylinders 24, arranged in the Z-direction.

依作業需求,第一溫控單元之第一空間或/及第三溫控單元之第三空間設有至少一鰭片,以供散熱。According to the operation requirements, the first space of the first temperature control unit and/or the third space of the third temperature control unit are provided with at least one fin for heat dissipation.

於本實施例,壓接機構配置複數層溫控結構,各層之溫控結構包含複數個第一溫控單元、一第二溫控單元及複數個第三溫控單元,複數個第一溫控單元裝配於複數個第三溫控單元的下方,第二溫控單元及第三溫控單元裝配於壓缸24,使得壓缸24能夠帶動複數個第一溫控單元、一第二溫控單元及複數個第三溫控單元於機架21之作業空間211沿壓接軸向同步位移。In this embodiment, the pressing mechanism is configured with multiple layers of temperature control structures, and each layer of the temperature control structure includes multiple first temperature control units, a second temperature control unit, and multiple third temperature control units. The multiple first temperature control units are assembled below the multiple third temperature control units, and the second temperature control units and the third temperature control units are assembled on the pressure cylinder 24, so that the pressure cylinder 24 can drive the multiple first temperature control units, the second temperature control unit, and the multiple third temperature control units to synchronously displace along the pressing axis in the working space 211 of the frame 21.

第一溫控單元設置複數個第一板件251以圍構成第一空間252,並以位於底部之第一板件251供裝配壓接治具22,第一空間252可供外部氣體流入 。更進一步,至少一第一板件251的內面朝向第一空間252設有複數個為第一鰭片253之鰭片。第一溫控單元於第一空間252之內部設置至少一為風扇254之輸送器,風扇254能夠輸出第一空間252內且與壓接治具22作第一次熱交換的氣體。 The first temperature control unit is equipped with a plurality of first plates 251 to enclose a first space 252. The first plate 251 at the bottom is used to assemble the press-fitting jig 22. The first space 252 allows for the flow of external air. Furthermore, the inner surface of at least one first plate 251, facing the first space 252, is provided with a plurality of first fins 253. The first temperature control unit is equipped with at least one conveyor, a fan 254, within the first space 252. The fan 254 is capable of discharging air from the first space 252 for the initial heat exchange with the press-fitting jig 22.

第二溫控單元位於第一溫控單元之上方,並設置複數個第二板件261以圍構成至少一第二空間262;第一溫控件為液體,第二空間262設有入口263及出口264,入口263以供輸入具有預設溫度之液體,液體可為冷卻水或冷媒等;於本實施例,液體為冷卻水,第二空間262一側之入口263以供輸入具有預設低溫之冷卻水,冷卻水沿第二空間262之液體流動路徑而朝向另一側之出口264流動,出口264以供輸出已熱交換之冷卻水。又第二溫控單元之複數個第二板件261的兩側裝配連接壓缸24,而可由壓缸24驅動複數個第二板件261沿壓接軸向位移。The second temperature control unit is located above the first temperature control unit and is provided with a plurality of second plates 261 to enclose at least one second space 262. The first temperature control unit is a liquid. The second space 262 is provided with an inlet 263 and an outlet 264. The inlet 263 is for inputting a liquid with a preset temperature. The liquid can be cooling water or a refrigerant. In this embodiment, the liquid is cooling water. The inlet 263 on one side of the second space 262 is for inputting cooling water with a preset low temperature. The cooling water flows along the liquid flow path of the second space 262 toward the outlet 264 on the other side. The outlet 264 is for outputting the cooling water that has undergone heat exchange. The two sides of the plurality of second plates 261 of the second temperature control unit are assembled and connected to the cylinder 24, and the cylinder 24 can drive the plurality of second plates 261 to move along the axial direction of the press connection.

第三溫控單元位於第一溫控單元與第二溫控單元之間,並設置複數個第三板件271A、271B…以圍構至少一第三空間272。然第三溫控單元可配置獨立之第三板件作為頂板,或以第二溫控單元位於底部之第二板件261作為頂板,亦無不可。於本實施例,第三溫控單元以第二溫控單元位於底部之第二板件261作為頂板,並配置另一獨立之第三板件271A作為底板,第二板件261與第三板件271A呈上下相對且X方向配置,並於二者間以複數個第三板件271B分隔複數個第三空間272。更進一步,第二板件261與第三板件271A朝向第三空間272的一面設有複數個為第二鰭片273之鰭片。第三溫控單元之第三板件271A的兩側裝配連接壓缸24,而可由壓缸24驅動沿壓接軸向位移。The third temperature-control unit is located between the first and second temperature-control units, and is provided with a plurality of third plates 271A, 271B, etc. to enclose at least one third space 272. However, the third temperature-control unit can be configured with an independent third plate as the top plate, or with the second plate 261 of the second temperature-control unit located at the bottom as the top plate. In this embodiment, the third temperature-control unit uses the second plate 261 of the second temperature-control unit located at the bottom as the top plate, and is configured with another independent third plate 271A as the bottom plate. The second plate 261 and the third plate 271A are arranged vertically opposite each other and in the X direction, and a plurality of third plates 271B are used between them to separate the plurality of third spaces 272. Furthermore, the second plate 261 and the third plate 271A are provided with a plurality of second fins 273 on the side facing the third space 272. The third plate 271A of the third temperature control unit is assembled and connected to the cylinder 24 on both sides and can be driven by the cylinder 24 to move along the axial direction of the press connection.

第三溫控單元之第三板件271A可作為第一溫控單元之頂板,第三板件271A設有相通第一空間252及第三空間272之至少一第一通口274,第一通口274以供第一溫控單元之風扇254將第一空間252之第一次熱交換的氣體輸出至第三空間272。另於第三板件271A或/及第三板件271B設有相通第三空間272及壓接治具22周遭環境(或/及機架21外部環境)的至少一第二通口275,第二通口275以供排出第三空間272之第二次熱交換的氣體;於本實施例,第三溫控單元於第三板件271A設有相通第三空間272及壓接治具22外部周遭環境(即機架21的作業空間211)的複數個第二通口275,以供排出第三空間272之第二次熱交換且降溫的氣體。承上述,第三溫控單元之第三板件271A外部的底面可供裝配複數個第一溫控單元,使得複數個第一溫控單元可隨第三溫控單元同步位移。The third plate 271A of the third temperature control unit can serve as the top plate of the first temperature control unit. The third plate 271A is provided with at least one first opening 274 connecting the first space 252 and the third space 272. The first opening 274 is used for the fan 254 of the first temperature control unit to output the gas of the first heat exchange in the first space 252 to the third space 272. Furthermore, at least one second opening 275 is provided on the third plate 271A and/or the third plate 271B, connecting the third space 272 and the surrounding environment of the press-fitting jig 22 (or/and the external environment of the rack 21). The second opening 275 is used to exhaust the gas generated by the second heat exchange in the third space 272. In this embodiment, the third temperature-control unit is provided with multiple second openings 275 on the third plate 271A, connecting the third space 272 and the external environment of the press-fitting jig 22 (i.e., the working space 211 of the rack 21), to exhaust the gas generated by the second heat exchange and cooling in the third space 272. As described above, the bottom surface of the third plate 271A of the third temperature-control unit can be mounted with multiple first temperature-control units, allowing the multiple first temperature-control units to move synchronously with the third temperature-control unit.

承上述,第二溫控單元可設置單一第二空間262,單一第二空間262的面積含蓋複數個第三空間272之上方,或者第二溫控單元依第三空間272之數量而配置相對數量之第二空間262,亦無不可。於本實施例,第二溫控單元設有單一第二空間262,單一第二空間262的面積含蓋複數個第三空間272之上方,亦即第二空間262的液體流動路徑含蓋複數個第三空間272之上方,使冷卻水能夠流經複數個第三空間272之上方。As described above, the second temperature-control unit can be provided with a single second space 262, the area of which covers the tops of multiple third spaces 272. Alternatively, the second temperature-control unit can be provided with a corresponding number of second spaces 262 based on the number of third spaces 272. In this embodiment, the second temperature-control unit is provided with a single second space 262, the area of which covers the tops of multiple third spaces 272. In other words, the liquid flow path of the second space 262 covers the tops of multiple third spaces 272, allowing cooling water to flow through the tops of the multiple third spaces 272.

請參閱圖5至圖7,一測試器包含電性連接之電路板31及複數個測試座32,測試座32配置有外蓋33,並能夠承置及測試電子元件34。於本實施例 ,預燒測試作業設備之機架21的每一層承架213供承置一具有複數個測試座32及電子元件34之電路板31,每一層之複數個測試座32及複數個電子元件34位於機架21之作業空間211,且測試座32位於相對之壓接治具22的下方。 Referring to Figures 5 through 7, a tester includes an electrically connected circuit board 31 and multiple test sockets 32. The test sockets 32 are equipped with covers 33 and are capable of holding and testing electronic components 34. In this embodiment, each shelf 213 of the rack 21 of the burn-in test equipment is configured to hold a circuit board 31 with multiple test sockets 32 and electronic components 34. Each layer of multiple test sockets 32 and multiple electronic components 34 is located in the working space 211 of the rack 21, with the test sockets 32 positioned below the corresponding press-fit fixture 22.

壓接機構之每一層壓缸24帶動第一溫控單元、第二溫控單元、第三溫控單元及壓接治具22等同步沿壓接軸向(如Z方向)向下位移,令壓接治具22壓接於測試座32之外蓋33,並以加熱件23溫控測試座32內之電子元件34而執行測試作業。Each level of the press-fit mechanism's press cylinders 24 drive the first, second, and third temperature-control units, along with the press-fit fixture 22, to synchronously move downward along the press-fit axis (e.g., the Z direction). This allows the press-fit fixture 22 to press-fit against the outer cover 33 of the test socket 32. The heater 23 then controls the temperature of the electronic components 34 within the test socket 32 to perform the test operation.

於電子元件34測試過程中,電子元件34經壓接治具22將高溫傳導至第一鰭片253,第一溫控單元以風扇254抽吸第一空間252內且與第一鰭片253 、壓接治具22作第一次熱交換且高溫的氣體,並經由第一通口274輸送至第三溫控單元之第三空間272,使壓接治具22散熱,並使電子元件34保持預設測試溫度而於測試座32內執行測試作業;由於第三溫控單元之第三空間272僅供相對應第一溫控單元之第一空間252內的第一次熱交換氣體流入,在流量少之第一次熱交換氣體的狀態下,利用第二溫控單元之第二空間262一側的入口263輸入冷卻水 ,冷卻水沿第二空間262之液體流動路徑朝向另一側之出口264流動,使位於第二空間262下方之第三空間272內的第一次熱交換且高溫的氣體於流動過程中,不僅可與第二鰭片273作熱交換且產生紊流而散熱,更能夠與第二空間262內的冷卻水作第二次熱交換而降溫,第二空間262已熱交換之冷卻水則由出口264流出;第三空間272內之第二次熱交換且降溫的氣體再由第二通口275排出至壓接治具22周遭環境空間(亦即排出至機架21之作業空間211)或作業設備外部均可。 During the testing process of the electronic component 34, the electronic component 34 transfers high temperature to the first fin 253 through the press-fit fixture 22. The first temperature control unit uses the fan 254 to draw air into the first space 252 and into the first fin 253. The high-temperature gas undergoes the first heat exchange with the press-fit jig 22 and is transported through the first port 274 to the third space 272 of the third temperature-controlled unit. This dissipates heat from the press-fit jig 22 and maintains the electronic component 34 at the preset test temperature while the test operation is performed within the test socket 32. Since the third space 272 of the third temperature-controlled unit only allows the first heat exchange gas from the corresponding first space 252 of the first temperature-controlled unit to flow in, cooling water is introduced through the inlet 263 on the side of the second space 262 of the second temperature-controlled unit while the first heat exchange gas is flowing at a low flow rate. The cooling water flows along the liquid flow path of the second space 262 toward the outlet 264 on the other side. During the flow process, the high-temperature gas in the third space 272 below the second space 262 undergoes the primary heat exchange and not only exchanges heat with the second fins 273, generating turbulence and dissipating heat, but also undergoes a secondary heat exchange with the cooling water in the second space 262, cooling the gas. The cooling water in the second space 262 that has undergone the secondary heat exchange flows out of the outlet 264. The gas in the third space 272, which has undergone the secondary heat exchange and has been cooled, is then discharged through the second port 275 to the ambient space surrounding the press-fitting jig 22 (i.e., to the working space 211 of the rack 21) or to the outside of the working equipment.

因此,壓接機構利用溫控結構而避免壓接治具22周遭之環境溫度過高,不僅毋需配置大功率且體積大之氣體處理裝置(圖未示出),而有效節省能源成本及利於空間配置,更加迅速確保測試座32及電子元件34於預設測試溫度執行測試作業,進而提高測試品質。Therefore, the crimping mechanism utilizes a temperature control structure to prevent the ambient temperature around the crimping fixture 22 from being too high. This not only eliminates the need for a high-power and bulky gas handling device (not shown), but also effectively saves energy costs and facilitates space allocation. It also more quickly ensures that the test socket 32 and electronic component 34 perform testing operations at the preset test temperature, thereby improving test quality.

[習知] 電子元件11 測試器12 電路板121 測試座122 外蓋123 散熱鰭片124 預燒爐體13 作業空間131 承架132 入風流道133 出風流道134 [本發明] 機架21 作業空間211 側架212 承架213 壓接治具22 加熱件23 壓缸24 第一板件251 第一空間252 第一鰭片253 風扇254 第二板件261 第二空間262 入口263 出口264 第三板件271A、271B 第三空間272 第二鰭片273 第一通口274 第二通口275 電路板31 測試座32 外蓋33 電子元件34 [Knowledge] Electronic component 11 Tester 12 Circuit board 121 Test stand 122 Cover 123 Heat sink fin 124 Preheater body 13 Workspace 131 Support frame 132 Air inlet duct 133 Air outlet duct 134 [Present Invention] Frame 21 Workspace 211 Side frame 212 Support frame 213 Pressing fixture 22 Heating element 23 Cylinder 24 First plate 251 First space 252 First fin 253 Fan 254 Second plate 261 Second space 262 Inlet 263 Outlet 264 Third plates 271A, 271B Third space 272 Second fin 273 First opening 274 Second opening 275 Circuit board 31 Test socket 32 Outer cover 33 Electronic component 34

圖1:習知預燒作業設備之局部使用示意圖。 圖2:習知圖1之局部放大示意圖。 圖3:本發明作業設備之局部示意圖。 圖4:本發明壓接機構之示意圖。 圖5至圖7:本發明壓接機構之使用示意圖。 Figure 1: Schematic diagram of a partial view of the known pre-burning equipment. Figure 2: Enlarged schematic diagram of a partial view of Figure 1. Figure 3: Schematic diagram of a partial view of the equipment of the present invention. Figure 4: Schematic diagram of the crimping mechanism of the present invention. Figures 5 to 7: Schematic diagrams of the crimping mechanism of the present invention in use.

機架21 作業空間211 壓接治具22 加熱件23 壓缸24 第一空間252 第一鰭片253 風扇254 第二空間262 出口264 第三空間272 第二鰭片273 第一通口274 第二通口275 測試座32 外蓋33 電子元件34 Frame 21 Workspace 211 Pressing fixture 22 Heating element 23 Cylinder 24 First space 252 First fin 253 Fan 254 Second space 262 Outlet 264 Third space 272 Second fin 273 First port 274 Second port 275 Test socket 32 Cover 33 Electronic component 34

Claims (10)

一種壓接機構,包含: 至少一架置器; 至少一壓接治具:以供壓接電子元件; 至少一溫控結構:裝配於該架置器,包含第一溫控單元、第二溫控單元及第三溫控單元,該第一溫控單元以供裝配該壓接治具,並設置具有至少一輸送器之第一空間,該輸送器能夠輸出該第一空間內且與該壓接治具作第一次熱交換之氣體,該第二溫控單元設有第二空間,以供配置第一溫控件,該第三溫控單元設置於該第一溫控單元與該第二溫控單元之間,並設有第三空間以供該輸送器輸入第一次熱交換之該氣體,第一次熱交換之該氣體能夠與該第二空間之該第一溫控件作第二次熱交換,該第三空間排出第二次熱交換之該氣體。 A crimping mechanism comprises: At least one mounting device; At least one crimping fixture for crimping electronic components; At least one temperature control structure is mounted on the mounting device and includes a first temperature control unit, a second temperature control unit, and a third temperature control unit. The first temperature control unit is used to mount the compression jig and has a first space with at least one conveyor. The conveyor can output the gas in the first space that undergoes a primary heat exchange with the compression jig. The second temperature control unit has a second space for accommodating the first temperature control unit. The third temperature control unit is located between the first and second temperature control units and has a third space for the conveyor to input the gas for the primary heat exchange. The gas in the primary heat exchange can undergo a secondary heat exchange with the first temperature control unit in the second space. The third space discharges the gas after the secondary heat exchange. 如請求項1所述之壓接機構,更包含至少一第一驅動器,該第一驅 動器裝配於該架置器,以供驅動該溫控結構沿壓接軸向位移。 The press-fit mechanism of claim 1 further comprises at least one first actuator mounted on the mount to drive the temperature control structure to move along the press-fit axis. 如請求項1所述之壓接機構,其該第一溫控單元之該第一空間與該 第三溫控單元之該第三空間設有相通之至少一第一通口,該第一通口以供該第一空間之第一次熱交換的該氣體輸入該第三空間,該第三溫控單元設有至少一第二通口,該第二通口以供排出該第三空間之第二次熱交換的該氣體。 In the compression-welding mechanism of claim 1, the first space of the first temperature-control unit and the third space of the third temperature-control unit are provided with at least one first opening communicating with each other. The first opening allows the gas from the first heat exchange in the first space to be introduced into the third space. The third temperature-control unit is provided with at least one second opening for the gas from the second heat exchange in the third space to be discharged. 如請求項1所述之壓接機構,其該第一溫控單元之該第一空間或/及 該第三溫控單元之該第三空間設有至少一鰭片。 In the crimping mechanism of claim 1, the first space of the first temperature control unit and/or the third space of the third temperature control unit are provided with at least one fin. 如請求項1所述之壓接機構,其該第一溫控單元設置複數個第一板 件以圍構成至少一該第一空間。 In the crimping mechanism of claim 1, the first temperature control unit includes a plurality of first plates to enclose at least one first space. 如請求項1所述之壓接機構,其該第二溫控單元設置複數個第二板 件以圍構成該第二空間。 In the crimping mechanism described in claim 1, the second temperature control unit is provided with a plurality of second plates to enclose the second space. 如請求項1所述之壓接機構,其該第三溫控單元設置複數個第三板 件以圍構成該第三空間。 In the crimping mechanism described in claim 1, the third temperature control unit is provided with a plurality of third plates to enclose the third space. 如請求項1所述之壓接機構,更包含至少一第二溫控件,該第二溫 控件裝配於該壓接治具。 The crimping mechanism of claim 1 further comprises at least one second temperature control unit, the second temperature control unit being mounted on the crimping jig. 一種作業設備,包含: 機架:設置至少一承架,以供承置至少一測試器; 至少一如請求項1至8中任一項所述之壓接機構:裝配於該機架,以供壓接 及溫控該測試器; 中央控制裝置:以供控制及整合該壓接機構作動而執行自動化作業。 A processing apparatus comprising: a rack equipped with at least one support frame for supporting at least one tester; at least one crimping mechanism as described in any one of claims 1 to 8, mounted on the rack for crimping and temperature-controlling the tester; and a central control unit for controlling and integrating the operation of the crimping mechanism to perform automated operations. 如請求項9所述之作業設備,其該機架設置至少一第二驅動器,以 供驅動該承架沿壓接軸向位移。 In the operating equipment of claim 9, the frame is provided with at least one second actuator for driving the support frame to move along the press-fit axial direction.
TW112147680A 2023-12-07 2023-12-07 Pressing mechanism and processing apparatus TWI895871B (en)

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