TWI901181B - Test socket, cooling system and test system - Google Patents

Abstract

The present invention is a test socket for carrying a coolant. The test socket includes a base, a plurality of elastic metal parts provided in the base, and a conductive elastic piece provided above the base. The conductive elastic piece isolates the coolant from the elastic metal parts, thereby the problem that the coolant affects the test results of the test socket is avoided. A cooling system is disclosed in the present invention, which combines the aforementioned test socket with a cooling device and is used to cool a device under test during the test process of the test socket. The present invention also discloses a test system that adjusts the pressure of input gas and the coolant to prevent the coolant from affecting the operation of the chip on the device under test.

Description

Test socket, cooling system and test system

The present invention relates to semiconductor testing technology, and more particularly to a test socket, cooling system, and testing system.

Semiconductor package testing typically involves placing a DUT (DUT), such as a semiconductor package or chip, into a test socket equipped with multiple probes. After each probe is electrically connected to the DUT, the test signal is transmitted through the probes to the DUT, achieving the test objective. However, the DUT generates a significant amount of waste heat during the testing process, necessitating cooling.

In the past, when cooling an object under test, the cooling head of a temperature control device was placed in contact with the surface of the object under test. This caused the high-temperature waste heat generated by the object to be transferred to the cooling head. The liquid within the sealed flow channel within the cooling head then transferred the heat to the radiator. The radiator, equipped with a fan, dissipated the heat carried by the liquid in the radiator into the air, thereby dissipating the heat of the object under test.

With the rapid development of artificial intelligence (AI) and high-performance computing (HPC), integrated circuits (ICs) are trending towards higher power, which in turn leads to higher chip temperatures. However, conventional cooling heads only contact a portion of the surface of the object under test, resulting in ineffective heat dissipation. This makes them insufficient for high-performance and high-power chips.

In view of the above issues, how to provide a test device or system with a good cooling mechanism, especially one that can provide better heat dissipation than conventional temperature control equipment, will become a goal that researchers in this field are eager to pursue.

To address the aforementioned problems of the prior art, the present invention discloses a test base for carrying a coolant. The test base comprises: a base having first and second opposing surfaces and a plurality of through-holes connecting the first and second surfaces; a plurality of elastic metal members disposed in each of the through-holes; and a conductive elastic sheet positioned above the base for carrying the coolant and isolating the coolant from the elastic metal members.

In one embodiment, the test socket of the present invention further includes a frame coupled to the conductive elastic sheet and disposed on the first surface, wherein the frame has at least one first flow channel for the coolant to flow into or a second flow channel for the coolant to flow out of the test socket.

In one embodiment, the frame is mounted on the base via a plurality of guide pins, such that the frame and the conductive elastic sheet are adapted to move relative to the base between the ends of each guide pin.

In another embodiment, the frame and the conductive elastic sheet are fixed to the first surface of the base, so that the conductive elastic sheet seals each of the through holes.

The present invention further discloses a cooling system for cooling an object under test. The cooling system comprises: a cooling device adapted to provide a cooling liquid; and a test socket connected to the cooling device. The test socket comprises: a base; a plurality of elastic metal parts disposed in the base; and a conductive elastic sheet positioned above the base and adapted to form a flow channel between the test object and the test object when the test object is supported, for passage of the cooling liquid.

In another embodiment, the base includes a first surface and a second surface facing each other, and a plurality of through holes connecting the first surface and the second surface and for respectively accommodating the elastic metal parts, and the flow channel is not connected to each of the through holes.

In another embodiment, the test socket further includes a frame disposed on the base and coupled to the periphery of the conductive elastic sheet. The frame secures the conductive elastic sheet to the base. The frame and the conductive elastic sheet are adapted to move relative to the base so that the conductive elastic sheet contacts and electrically connects to the elastic metal parts during testing.

In another embodiment, the frame includes a first flow-guiding channel or a second flow-guiding channel connected to the flow channel.

In another embodiment, the cooling system of the present invention further includes a controller connected to the cooling device and configured to control the cooling device to provide the coolant. The controller controls the coolant to flow from the cooling device through the first flow channel into the flow channel, and to be directed from the flow channel back to the cooling device through the second flow channel.

The present invention further discloses a testing system for testing an object under test. The testing system comprises: a test socket comprising a base, a plurality of elastic metal parts disposed in the base, and a conductive elastic sheet disposed on the base, wherein the conductive elastic sheet is adapted to form a flow channel between the object under test and the test object when the conductive elastic sheet supports the test object; and a temperature control head comprising a flow guide member having a first flow guide channel. The temperature control head is disposed corresponding to the test socket and adapted to be coupled to the test socket to connect the first flow guide channel to the flow channel.

In one embodiment, the base includes a first surface and a second surface facing each other, and a plurality of through holes connecting the first surface and the second surface and for respectively accommodating the elastic metal parts, and the flow channel is not connected to each of the through holes.

In another embodiment, the test socket further includes a frame positioned around the conductive elastic sheet and having a second flow-guiding channel. The frame secures the conductive elastic sheet to the base, and the frame and conductive elastic sheet are adapted to move relative to the base. When the temperature control head is coupled to the test socket for testing, the conductive elastic sheet is electrically connected to the elastic metal parts, and the first flow-guiding channel, the flow channel, and the second flow-guiding channel are interconnected.

In one embodiment, the horizontal position of the second diversion channel is lower than the horizontal position of the first diversion channel.

In another embodiment, the object under test comprises a substrate, a chip disposed on the substrate, and a support member disposed on the substrate and surrounding the chip. The flow guide member comprises corresponding upper and lower surfaces, a receiving space connecting the upper and lower surfaces and corresponding to the chip, and a third flow guide channel connecting the receiving space and the outside.

In another embodiment, the temperature control head further includes a pressing member having a cover disposed on the upper surface of the flow guide member and covering the accommodating space, and a pressing portion extending from the cover into the accommodating space to contact the chip. When the pressing member presses against the chip, a chamber communicating with the third flow guide channel is formed between the cover, the outer sidewall of the pressing portion, the inner sidewall of the accommodating space, and the substrate.

In another embodiment, the temperature control head further includes a sealing member disposed between the flow guide member and the support member.

In another embodiment, the testing system of the present invention further includes a first fluid located in the third flow channel and a second fluid located in the first flow channel, the flow channel, and the second flow channel, wherein the fluid pressure of the first fluid is greater than the fluid pressure of the second fluid.

In another embodiment, the testing system of the present invention further includes a controller and a cooling device connected to the controller and configured to provide the second fluid. The controller is configured to control the second fluid to flow from the cooling device through the first flow channel into the flow channel, and to be directed from the flow channel back to the cooling device through the second flow channel.

In another embodiment, the first fluid is a gas, and the second fluid is a non-conductive cooling liquid.

In another embodiment, the testing system of the present invention further includes a blowing device connected to the third flow channel to provide the first fluid.

As can be seen from the above, the test seat of the present invention isolates the cooling liquid from the elastic metal part by the conductive elastic sheet, thereby preventing the cooling liquid from affecting the test results of the test seat; furthermore, the cooling system of the present invention forms a flow channel for the cooling liquid to flow between the conductive elastic sheet and the test object, thereby providing the test object with a cooling effect; in addition, the test system of the present invention is provided by the conductive elastic sheet in the test seat. A flow channel is formed between the thermal pad and the object under test. When the temperature-controlled head is coupled to the test socket, the first flow channel of the temperature-controlled head connects to the flow channel, providing cooling during the testing of the object under test. Furthermore, by maintaining a pressure balance between the chamber and the flow channel, or by ensuring that the air pressure within the chamber is greater than the liquid pressure in the flow channel, the coolant is prevented from entering the chamber and affecting the operation of the chip or the temperature control effect of the temperature-controlled head.

1: Test socket

10: Cooling system

100:Test system

11: Base

111: First Surface

112: Second Surface

113: Through hole

12: Elastic metal parts

13: Conductive elastic sheet

14: Framework

141: First diversion channel

142: Second diversion channel

15: Guide pin

16: Runner

17: Capping

21: Cooling device

22: Controller

23: Blowing device

3: Temperature control head

31: Drainage piece

311: First diversion channel

312: Third diversion channel

313: Storage Space

314: Chamber

315: Upper surface

316: Lower surface

32: Press-fit fittings

321: Cover

322: Pressing part

33: Seal

4: First fluid

5: Second fluid

6: Coolant

7: Gap

8: Object under test

81:Substrate

82: Chip

83: Support parts

84: Adhesive

A-A: hatching line

B-B: hatching line

D: distance

Figure 1 is an exploded view of the test socket of the present invention.

Figure 2 is a three-dimensional structural diagram of the test socket of the present invention.

Figure 3 is a cross-sectional view taken along the A-A section line in Figure 2.

Figures 4A and 4B are schematic structural diagrams of the frame of another embodiment of the test socket of the present invention.

Figure 5 is a schematic diagram of the cooling system of the present invention.

Figure 6 is a schematic diagram of the test system of the present invention.

Figure 7 is a top view of the object under test.

Figure 8 is a cross-sectional view taken along the B-B section line in Figure 7.

The following describes the technical content of the present invention using a specific embodiment. Those skilled in the art can easily understand the advantages and effects of the present invention from the content disclosed in this specification. However, the present invention can also be implemented or applied through other different specific embodiments.

Figure 1 is an exploded view of the test socket of the present invention, Figure 2 is a three-dimensional structural diagram of the test socket of the present invention, and Figure 3 is a cross-sectional view taken along the A-A section line in Figure 2 . As shown in the figure, the test socket 1 of the present invention comprises a base 11, a plurality of elastic metal parts 12, and a conductive elastic sheet 13. The test socket 1 of the present invention can hold an object under test and a coolant 6, and provides cooling for the object under test by guiding the flow of the coolant 6. A detailed description of the test socket 1 of the present invention is provided below.

The base 11 includes a first surface 111 and a second surface 112 facing each other, and a plurality of through holes 113 connecting the first surface 111 and the second surface 112. Accordingly, the test base 1 is disposed on a test substrate with the second surface 112 of the base 11.

Each of the elastic metal members 12 is disposed in each of the through holes 113. In a specific embodiment, each of the elastic metal members 12 can be a probe or other elastic conductive metal structure to electrically contact the test substrate and receive a test signal from the test substrate.

The conductive elastic sheet 13 is located above the base 11 and is fixed to the base 11, for example, by screws or adhesive. The conductive elastic sheet 13 is used to carry the coolant 6 and isolate the coolant 6 from the elastic metal parts 12. In this embodiment, the coolant 6 is a non-conductive liquid.

In one embodiment, the conductive elastic sheet 13 may include a plurality of conductive elastic regions corresponding to the respective elastic metal members 12 and a plurality of conductive particles located in each of the conductive elastic regions. This allows electrical conduction between the object under test and the elastic metal members 12 when pressed against them during testing.

As described above, the test socket 1 of the present invention isolates the coolant 6 from the through-holes 113 by means of the conductive elastic sheet 13. This provides cooling for the object under test while carrying and guiding the flow of the coolant 6. Furthermore, since the coolant 6 does not flow into the through-holes 113, the elastic metal parts 12 are prevented from being immersed in the coolant 6 and thus affecting electrical properties and test results.

As shown in FIG3 , the test socket 1 of the present invention includes a frame 14. The frame 14 is combined with the conductive elastic sheet 13 and is disposed above the first surface 111 of the base 11. When the conductive elastic sheet 13 carries the coolant 6, the coolant 6 is located in the space defined by the conductive elastic sheet 13 and the frame 14. Specifically, the frame 14 is located around the conductive elastic sheet 13 to be combined with the conductive elastic sheet 13. The frame 14 has at least one first flow channel 141 for the coolant 6 to flow into and/or at least one second flow channel 142 for the coolant 6 to flow out of the test socket 1. As shown in the figure, the frame 14 is provided with both a first flow channel 141 and a second flow channel 142 as an example. In other embodiments, the frame 14 may have both a first flow channel 141 and a second flow channel 142. The first flow channel can be incorporated into other components (other examples will be discussed later). Accordingly, as indicated by the arrows in the figure, the test socket 1 of the present invention utilizes the first flow channel 141 as a water inlet, introducing the coolant 6 into the test socket 1 through the first flow channel 141 for flow. The coolant 6 can then be discharged through the second flow channel 142. This continuous flow process cools the object under test. It is worth noting that in this embodiment, the coolant 6 flows between the lower surface of the object under test and the upper surface of the conductive elastic sheet 13 (as shown in Figure 4B below), thereby cooling the heat generated by the increased contact resistance between the electrical contacts of the object under test (e.g., solder balls) and the conductive elastic sheet 13.

Figures 4A and 4B are schematic diagrams of the frame structure of another embodiment of the test socket of the present invention. As shown in Figure 4A , the frame 14 is mounted on the base 11 via a plurality of guide pins 15 , allowing the frame 14 and the conductive elastic sheet 13 to move freely between the ends of each guide pin 15 . This allows the conductive elastic sheet 13 to move relative to the base 11 , thereby allowing the external pipelines (not shown) connected to the first and second flow-guiding channels 141 and 142 to move with it. Furthermore, before testing, each elastic metal member 12 is slightly in contact with or separated from the conductive elastic sheet 13 by a distance D. During testing, as shown in FIG. 4B , the object under test 8 is pressed against the conductive elastic sheet 13 and moved toward the base 11 to contact and electrically connect each elastic metal member 12 . Each elastic metal member 12 is immersed in the conductive elastic sheet 13 , thereby increasing the contact area between the two and reducing the contact resistance. In one embodiment, the frame 14 may have a plurality of through-holes corresponding to the guide pins 15 . Furthermore, an elastic member may be disposed between the lower surface and the first surface 111 of the base 11 . When a force is applied, the frame 14 moves toward the base 11 and presses against the elastic member. When the force is released, the frame 14 returns to a position spaced a distance D from the base 11 by the elastic force of the elastic member.

In the aforementioned embodiment, the frame 14 and the conductive elastic sheet 13 are secured via guide pins 15, maintaining a distance D between the conductive elastic sheet 13 and the elastic metal member 12. In another embodiment, the frame 14 and the conductive elastic sheet 13 can be directly secured to the first surface 111 of the base 11. Specifically, the frame 14 and the conductive elastic sheet 13 are directly placed on the first surface 111. This allows the conductive elastic sheet 13 to seal the through-holes within the base.

Figure 5 is a schematic diagram of the cooling system of the present invention. As shown in the figure, the cooling system 10 of the present invention is used to cool a test object 8 and includes a test socket 1 and a cooling device 21 connected to the test socket 1, as described below.

The cooling device 21 is adapted to provide a cooling liquid 6 to the test seat 1 to cool and reduce the temperature of the object under test 8 during the test process.

The test base 1 includes a base 11, a plurality of elastic metal parts 12 disposed within the base 11, and a conductive elastic sheet 13 located above the base 11. The test base 1 can be used to support the object under test 8 for testing. When supporting the object under test 8, the conductive elastic sheet 13 is adapted to form a flow channel 16 between the conductive elastic sheet 13 and the object under test 8 for the coolant 6 to flow through.

In summary, the cooling system 10 of the present invention continuously delivers the cooling liquid 6 to the test seat 1 via the cooling device 21, causing the cooling liquid 6 to flow through the flow channel 16 between the conductive elastic sheet 13 and the object under test 8, while simultaneously returning the cooling liquid 6 from the test seat 1. This reciprocating cycle continues, thereby cooling the object under test 8.

In one embodiment, the base 11 includes opposing first and second surfaces 111, 112, and a plurality of through-holes 113 connecting the first and second surfaces 111, 112 for receiving the respective elastic metal members 12. The flow channel 16 is not connected to the through-holes 113 to prevent the coolant 6 from flowing into the through-holes 113 and adversely affecting the elastic metal members 12.

Furthermore, the test seat 1 further includes a frame 14 having a first flow channel 141 connected to the flow channel 16, wherein the frame 14 is arranged on the base 11 and is combined with the periphery of the conductive elastic sheet 13. The conductive elastic sheet 13 is firmly fixed to the base 11 by the frame 14. Furthermore, the first flow channel 141 can serve as a water inlet and is connected to the flow channel 16 to receive the coolant 6 transported from the cooling device 21 and guide it to the test The frame 14 may further include a second flow channel 142 connected to the flow channel 16, with the second flow channel 142 serving as a water outlet. Specifically, the frame 14 includes a first flow channel 141 and a second flow channel 142 connected to the flow channel 16. When the first flow channel 141, the flow channel 16, and the second flow channel 142 are connected, the coolant 6 flows through them sequentially (as indicated by the arrows in the figure).

In one embodiment, the cooling system 10 of the present invention further includes a cover 17 for covering and sealing the periphery of the frame 14, so that a closed space is formed between the cover 17, the frame 14, and the conductive elastic sheet 13.

In another embodiment, the frame 14 and the conductive elastic sheet 13 are adapted to move relative to the base 11. That is, when not under test, the frame 14 and the conductive elastic sheet 13 can be spaced a distance from the first surface 111 of the base 11. During testing, the frame 14 and the conductive elastic sheet 13 are forced to move toward the base 11, thereby electrically connecting the elastic metal members 12 and communicating between the first flow channel 141 and the flow channel 16.

In another embodiment, the cooling system 10 of the present invention may further include a controller 22 connected to the cooling device 21 and configured to control the cooling device 21 in providing the cooling liquid 6. The controller 22 controls the cooling liquid 6 to flow from the cooling device 21 through the first flow channel 141 into the flow channel 16 and to be directed from the flow channel 16 back to the cooling device 21 through the second flow channel 142. Thus, the present invention can continuously provide low-temperature cooling liquid 6 to the test socket 1 and remove the cooling liquid 6 that has been heated by cooling the test object 8 from the test socket 1, thereby effectively dissipating heat from the test object 8.

Figure 6 is a schematic diagram of the test system of the present invention. As shown, the test system 100 of this embodiment is used to perform package testing on the DUT 8 and includes a test socket 1 and a temperature control head 3. Furthermore, a cooling device 21 and a controller 22 may be added as required. The test socket 1, the cooling device 21, and the controller 22 are substantially the same as the cooling system described above and are not described in detail here. Further details regarding the test system 100 of the present invention are provided below.

The temperature control head 3 is positioned relative to the test socket 1 and is adapted to engage with the test socket 1. Specifically, the temperature control head 3 is positioned vertically opposite the test socket 1, allowing it to be driven toward the test socket 1, thereby pressing against the object under test 8 supported on the test socket 1. By engaging with the test socket 1, the object under test 8 can be tested and, during the testing process, the object under test 8 can be dissipated heat.

In one specific embodiment, the temperature control head 3 includes a flow guide member 31 having a first flow channel 311. In another embodiment, the flow guide member 31 may further include a third flow channel 312. The test system 100 of the present invention may include a first fluid 4 provided to the third flow channel 312 and a second fluid 5 (e.g., coolant) provided to the first flow channel 311. In this embodiment, the first flow channel 311 is not located on the frame 14 but is instead located within the flow guide member 31 and connected to the flow channel 16. Consequently, when the temperature control head 3 is coupled to the test socket 1, the conductive elastic sheet 13 is electrically connected to each of the elastic metal members 12, and the first flow channel 311, the flow channel 16, and the second flow channel 142 are interconnected.

In this embodiment, since the first flow channel 311 is located within the flow guide member 31, the horizontal position of the first flow channel 311 is higher than the horizontal position of the second flow channel 142 of the frame 14. This utilizes the potential energy difference between the first flow channel 311 and the second flow channel 142 to improve the fluidity of the coolant.

In practical applications, the object under test 8 to be tested comprises a substrate 81, a chip 82 mounted on the substrate 81, and a support member 83. The support member 83 surrounds the chip 82 to strengthen the package or provide support when a heat sink is installed on the package. The flow guide member 31 further comprises a corresponding upper surface 315 and a lower surface 316, as well as a receiving space 313 connecting the upper and lower surfaces 315 and 316 and corresponding to the chip 82. The third flow channel 312 connects the receiving space 313 with the outside and is used to guide the first fluid 4 (e.g., air) into the receiving space 313. In one embodiment, the testing system 100 of the present invention further includes an air blowing device 23 connected to the third flow channel 312 and configured to supply the first fluid 4. In another embodiment, the air blowing device 23 may be further connected to the controller 22. After the test is completed, the controller 22 switches valves to allow air to flow into the first flow channel 311 and the second flow channel 142, thereby forcing any remaining second fluid 5 (e.g., coolant) in the first flow channel 311 and the second flow channel 142 to the outside.

Furthermore, the temperature-controlled head 3 further includes a press member 32 having a cover 321 disposed on the upper surface 315 of the flow guide member 31 and covering the accommodating space 313, and a pressing portion 322 extending from the cover 321 into the accommodating space 313 to contact the chip 82. When the pressing member 32 is pressed against the chip 82 by the pressing portion 322, the cover 321, the outer sidewalls of the pressing portion 322, the inner sidewalls of the accommodating space 313, and the substrate 81 are sealed to form a chamber 314, thereby forming the aforementioned accommodating space 313 for the first fluid 4 to enter. The chamber 314 is connected to the third flow channel 312, allowing the first fluid 4, such as air, to enter the chamber 314 through the third flow channel 312.

Taking gas as an example, the first fluid 4, the testing system 100 of the present invention can blow gas into the chamber 314 via the third flow channel 312. The air pressure within the chamber 314 should be maintained within a set value range. Therefore, the air blowing device 23 can continuously provide gas at a constant pressure, or the third flow channel 312 can be closed when the air pressure within the chamber 314 reaches the set value range to ensure that the air pressure within the chamber 314 remains within the set value range.

FIG7 is a top view of the object to be tested, and FIG8 is a cross-sectional view along the B-B section line in FIG7. As shown in the figure, please refer to FIG6 at the same time. When the object to be tested 8 is provided with a support member 83, adhesive 84 is filled between the support member 83 and the substrate 81 to fix the support member 83 to the substrate 81 and provide a sealing effect between the support member 83 and the substrate 81. However, in the actual manufacturing process, a gap 7 is designed at the glue filling point between the support member 83 and the substrate 81. However, this gap 7 will cause Coolant could flow into chamber 314 and affect the operation of chip 82 or the temperature control effect of temperature control head 3. Therefore, gas is supplied to chamber 314 through third flow channel 312 to maintain the fluid pressure in chamber 314 within a set range. The coolant pressure is kept equal to or lower than the fluid pressure in chamber 314, thus preventing coolant from flowing into chamber 314 through notch 7.

Furthermore, as shown in Figure 6 , the test system 100 of the present invention can be further provided with a seal 33 between the flow guide 31 and the support 83 to ensure a tight seal between the flow guide 31 and the support 83, preventing the coolant from cooling the press-fit member 32 and affecting temperature control. Similar seals can also be provided between the press-fit member 32 and the flow guide 31, as well as between the flow guide 31 and the frame 14, to ensure a tight seal between the fluid.

In summary, the test seat of the present invention isolates the cooling liquid from the elastic metal part by the conductive elastic sheet, so that the cooling liquid cannot affect the test results of the test seat; furthermore, the cooling system of the present invention forms a flow channel between the conductive elastic sheet and the object to be tested, so that the cooling liquid flows through the flow channel to provide a cooling effect for the object to be tested; and the test system of the present invention forms a flow channel between the conductive elastic sheet and the object to be tested in the test seat. A flow channel is formed so that when the temperature-controlled head is coupled to the test socket, the first flow channel of the temperature-controlled head is connected to the flow channel to provide cooling during the testing of the object under test. By maintaining pressure balance between the chamber for inputting gas and the flow channel for the coolant to flow, or by ensuring that the gas pressure in the chamber is greater than the liquid pressure in the flow channel, the coolant is prevented from entering the chamber and affecting the operation of the chip or the temperature control effect of the temperature-controlled head.

The above embodiments are provided for illustrative purposes only and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection for the present invention is defined by the patent application accompanying this invention. Any invention that does not affect the effectiveness and purpose of the present invention shall be covered by this disclosure.

1: Test socket

11: Base

111: First Surface

112: Second Surface

113: Through hole

12: Elastic metal parts

13: Conductive elastic sheet

Claims (18)

A test base for carrying a coolant comprises: a base including a first surface and a second surface facing each other and a plurality of through-holes connecting the first and second surfaces; a plurality of elastic metal members disposed in each of the through-holes; and a conductive elastic sheet located above the base for carrying the coolant and isolating the coolant from the elastic metal members. The test socket as described in claim 1 further comprises a frame coupled to the conductive elastic sheet and disposed on the first surface, wherein the frame has at least one first flow channel for the coolant to flow into or a second flow channel for the coolant to flow out of the test socket. The test stand as described in claim 2, wherein the frame is mounted on the base via a plurality of guide pins, such that the frame and the conductive elastic sheet are adapted to move relative to the base between the ends of each guide pin. The test socket as described in claim 2, wherein the frame and the conductive elastic sheet are fixed to the first surface of the base so that the conductive elastic sheet seals each of the through holes. A cooling system for cooling an object under test comprises: a cooling device adapted to provide a coolant; and a test base connected to the cooling device. The test base comprises: a base; a plurality of elastic metal parts disposed in the base; and a conductive elastic sheet disposed above the base and adapted to form a flow channel between the base and the object under test when the test object is supported, for passage of the coolant. The base comprises first and second opposing surfaces, and a plurality of through-holes connecting the first and second surfaces and adapted to receive each of the elastic metal parts, respectively. The flow channels are not connected to the through-holes. The cooling system of claim 5, wherein the test base further comprises a frame disposed on the base and coupled to a periphery of the conductive elastic sheet, such that the conductive elastic sheet is secured to the base via the frame. The frame and the conductive elastic sheet are adapted to move relative to the base so that the conductive elastic sheet contacts and electrically connects to each of the elastic metal parts during testing. The cooling system as described in claim 6, wherein the frame includes a first flow-guiding channel or a second flow-guiding channel connected to the flow channel. The cooling system of claim 7 further includes a controller connected to the cooling device and configured to control the cooling device to provide the cooling liquid, wherein the controller controls the cooling liquid to flow from the cooling device through the first flow guide channel into the flow channel and to be directed from the flow channel back to the cooling device through the second flow guide channel. A test system for testing an object under test comprises: a test base comprising a base, a plurality of elastic metal parts disposed in the base, and a conductive elastic sheet disposed on the base, wherein the conductive elastic sheet is adapted to form a flow channel between the object under test and the test base when the object under test is supported; and a temperature control head comprising a flow guide member having a first flow guide channel. The temperature control head is disposed corresponding to the test base and adapted to be coupled to the test base to connect the first flow guide channel with the flow channel. The base comprises first and second opposing surfaces, and a plurality of through-holes connecting the first and second surfaces and for receiving each of the elastic metal parts, wherein the flow channel is not connected to each of the through-holes. The test system as described in claim 9, wherein the test socket further includes a frame positioned around the conductive elastic sheet and having a second flow-guiding channel. The frame mounts the conductive elastic sheet on the base, and the frame and the conductive elastic sheet are adapted to move relative to the base so that when the temperature control head is coupled to the test socket for testing, the conductive elastic sheet is electrically connected to each of the elastic metal parts and the first flow-guiding channel, the flow channel, and the second flow-guiding channel are interconnected. The test system as described in claim 10, wherein the horizontal position of the second flow guiding channel is lower than the horizontal position of the first flow guiding channel. The test system as described in claim 10, wherein the object under test comprises a substrate, a chip disposed on the substrate, and a support member disposed on the substrate and surrounding the chip, and the flow guide member comprises corresponding upper and lower surfaces, a receiving space connecting the upper and lower surfaces and corresponding to the chip, and a third flow guide channel connecting the receiving space and the outside. The test system as described in claim 12, wherein the temperature control head further includes a pressing member having a cover disposed on the upper surface of the flow guide member and covering the accommodating space, and a pressing portion extending from the cover into the accommodating space to contact the chip. When the pressing member presses against the chip, a chamber communicating with the third flow guide channel is formed between the cover, the outer sidewall of the pressing portion, the inner sidewall of the accommodating space, and the substrate. In the test system of claim 12, the temperature control head further includes a sealing member disposed between the guide member and the support member. The testing system of claim 12 further includes a first fluid located in the third flow channel and a second fluid located in the first flow channel, the flow channel, and the second flow channel, wherein the fluid pressure of the first fluid is greater than the fluid pressure of the second fluid. The test system of claim 15 further includes a controller and a cooling device connected to the controller and configured to provide the second fluid. The controller is configured to control the second fluid to flow from the cooling device into the flow channel through the first flow guide hole, and to be directed from the flow channel back to the cooling device through the second flow guide hole. The test system of claim 15, wherein the first fluid is a gas and the second fluid is a non-conductive cooling liquid. The test system as described in claim 15 further includes a blowing device connected to the third flow channel to provide the first fluid.