TWI877871B - Processing device and pre-heating device of electronic component - Google Patents

Abstract

The processing device having a supporter, a heat-dissipation member, and a driving unit. The supporter has at least one layer of supporting rack in a working space in order to receive a circuit board having a testing seat. The heat-dissipation member is disposed in the working space and has a heat-dissipation element to dissipate the heat from the electronic component on the testing seat. The driving unit has a moving arm which is movable along at least one direction to drive one of the supporting rack and the heat-dissipation member to move toward the other one so as to dissipate the heat from the electronic component which is pre-heated. Thus, the cost of the testing seat and the loading of the circuit board can be reduced. Therefore, the performance of pre-heating device can be enhanced.

Description

Working equipment and electronic component pre-burning equipment

The present invention provides an operating device which greatly reduces the cost of a test socket and the load of a circuit board to improve the performance.

Nowadays, please refer to Figures 1 and 2. After the production of multiple electronic components 11 is completed, if a longer test time and high temperature test are required, the industry uses a pre-burning module 12 to hold multiple electronic components 11 and transports them to the pre-burning equipment to perform the pre-burning test operation. The pre-burning module 12 includes an electrically connected circuit board 121 and a plurality of test sockets 122. The circuit board 121 is used to electrically connect to the electrical control connection board of the pre-burning equipment (not shown in the figure), and the test socket 122 is used to hold and test the electronic components 11, and is equipped with an outer cover 123. When the outer cover 123 covers the test socket 122, it can limit the electronic component 11. However, the electronic component 11 will generate high temperature during the test. To prevent the excessive high temperature from affecting the test quality, the pre-burning module 12 is provided with a plurality of heat sink fins 124 on the top surface of the outer cover 123 to perform heat dissipation on the electronic component 11 through heat exchange of the outer cover 123, so that the electronic component 11 can be tested at the preset pre-burning test temperature. In order to more accurately control the pre-burning test temperature of the electronic component 11, a heating element 125 is arranged on the bottom surface of the outer cover 123, and the heating element 125 is used to attach the electronic component 11 to assist in adjusting the pre-burning test temperature of the electronic component 11. Furthermore, the pre-firing furnace body 13 of the pre-firing equipment is provided with a plurality of layers of supports 133 in the working space 132 of the furnace rack 131 for respectively placing the pre-firing modules 12 having a plurality of electronic components 11. An air inlet channel 134 is provided on one side of the furnace rack 131 of the pre-firing furnace body 13 for conveying high-temperature gas into the working space 132 so that the electronic components 11 can be pre-firing tested in a high-temperature environment simulating future applications. An air outlet channel 135 is provided on the other side of the furnace rack 131 for exhausting the high-temperature gas. However, if each pre-burn module 12 is provided with dozens or hundreds of test sockets 122, dozens or hundreds of outer covers 123, heat sink fins 124 and heating elements 125 must be configured accordingly, which not only consumes considerable component costs but also complicates assembly. The large number of outer covers 123, heat sink fins 124 and heating elements 125 also increase the weight of the circuit board 121, which is not conducive to transportation. Furthermore, the electronic components 11 that have been pre-burned and tested in the test sockets 122 will still be attached to the high-temperature heating element 125, so it takes time to wait for the electronic components 11 to cool down, which is not conducive to transportation to the next device, thereby reducing production efficiency.

The first object of the present invention is to provide a working device, comprising a mounting device, at least one heat sink and a driving unit, wherein the mounting device is provided with at least one working space, the working space is provided with at least one layer of a support frame for supporting a circuit board with a test seat, at least one heat sink is arranged in the working space of the mounting device, and is provided with a heat dissipation component for performing a heat dissipation operation on the electronic components of the test seat, and the driving unit is provided with at least one transfer arm, and the transfer arm can be used for at least one side The heat sink can be displaced in the direction of the heat sink to drive one of the support frame and the heat sink to move toward the other, so that the heat sink can dissipate heat for the electronic components in the pre-burn-in operation, thereby ensuring that the electronic components are tested at the preset pre-burn-in test temperature; thereby, it is not necessary to configure a heat sink and a heating element on each test socket on each circuit board, and it is even unnecessary to configure an outer cover for accommodating the heat sink and the heating element, thereby greatly reducing the component configuration and effectively saving costs.

The second object of the present invention is to provide an operating device, wherein a driving unit can drive one of a support frame and a heat sink to move toward the other, so that the heat sink performs a heat dissipation operation on the electronic components in the pre-burn-in operation; thereby, it is not necessary to configure a heat sink and a heating element on each test seat, thereby simplifying the test seat, thereby greatly reducing the load of the circuit board, and achieving a use efficiency that is conducive to transportation.

The third object of the present invention is to provide an operating device, wherein a driving unit can drive a heat sink and a test socket on a support frame to separate from each other, so that the electronic components in the test socket can be quickly heated up, so as to facilitate the transportation of the circuit board with the test socket to the next device, thereby improving the use efficiency.

The fourth object of the present invention is to provide an electronic component pre-burning equipment, comprising a pre-burning furnace body and the operating device of the present invention; the pre-burning furnace body is provided with a gas supply device for conveying gas having a pre-burning test temperature into the furnace; the operating device of the present invention is arranged inside the pre-burning furnace body, and comprises a mount, at least one heat sink and a drive unit for holding at least one circuit board having a test socket, so that the electronic components of the test socket perform a pre-burning test operation in the pre-burning furnace body, and perform a heat dissipation operation on the electronic components in the test socket.

In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:

Please refer to FIG. 3 , which shows a first embodiment of the operating device of the present invention, including a mounting device 21, at least one heat sink and a driving unit.

The mounting device 21 is provided with at least one working space, and the working space is provided with at least one layer of support frames for supporting at least one circuit board with a test socket. Furthermore, the mounting device 21 can be a fixed frame or a movable frame, for example, the mounting device 21 is a movable transport frame for moving into or out of the pre-sintering furnace body (not shown). For example, the mounting device 21 is a fixed furnace frame of the pre-sintering furnace body.

In this embodiment, the pre-burning equipment includes a pre-burning furnace body 31 and the operating device of the present invention. The pre-burning furnace body 31 is provided with a gas supply device (not shown) for transporting gas with a pre-burning test temperature into the furnace, so as to perform a pre-burning test operation on electronic components. The mounting device 21 of the operating device is arranged inside the pre-calcining furnace body 31, and as a furnace frame, a working space 213 is defined between the first side plate 211 and the second side plate 212 of the mounting device 21, and a plurality of horizontally arranged supporting frames 214 are fixedly installed in the working space 213, and the first surface (for example, the top surface) of each supporting frame 214 is a supporting surface 2141 for supporting a circuit board with a plurality of test sockets (not shown in the figure), and the second surface (for example, the bottom surface) is a supporting surface 2142, which can be used to assemble the drive unit according to the working requirements. Furthermore, at least one side of the holder 21 is provided with at least one first opening 215 communicating with the working space 213. In the present embodiment, the holder 21 has a plurality of first openings 215 communicating with the working space 213 on the first side plate 211 for the inflow of gas having the pre-burning test temperature, and a plurality of second openings 216 communicating with the working space 213 on the second side plate 212 for the outflow of gas.

Furthermore, at least one flow channel is provided between the precalcining furnace body 31 and the rack 21, and the flow channel communicates with the working space 213 of the rack 21 for transporting gas. In this embodiment, an air inlet flow channel 311 is formed between the first side plate 211 of the rack 21 and the precalcining furnace body 31, so that the gas of the gas supply device of the precalcining furnace body 31 flows into the working space 213 of the rack 21 through the air inlet flow channel 311 and the first opening 215, and an air outlet flow channel 312 is formed between the second side plate 212 of the rack 21 and the precalcining furnace body 31, so that the gas in the working space 213 flows out to the air outlet flow channel 312 through the second opening 216.

At least one heat sink is disposed in the working space 213 of the mounting device 21 and is provided with at least one heat dissipation component for performing heat dissipation operations on the electronic components of the test socket. Furthermore, the heat dissipation component of the heat sink can be a heat dissipation fin, or include a heat dissipation channel and a fluid flowing in the heat dissipation channel.

According to the operation requirements, the heat sink is equipped with at least one temperature control unit to control the test temperature of the electronic components. Furthermore, the temperature control unit can be a heating element, a cooling chip or a temperature control seat with fluid.

In this embodiment, the heat sink includes a body 221, a heat dissipation component which may be a heat dissipation fin 222, a joint 223 and a temperature control unit which may be a heating unit 224. A plurality of upright heat dissipation fins 222 are provided above the body 221, and a joint 223 is provided below the body 221. The joint 223 can directly contact the electronic components in the test seat or the outer cover of the test seat according to the operation requirements. The heating unit 224 is arranged inside the joint 223 to control the test temperature of the electronic components.

According to the operation requirements, the heat sink can be equipped with a temperature control unit on the bottom surface of the body 221, and the temperature control unit can be used as a joint 223 to directly contact the electronic component or the outer cover of the test socket, which is not limited to this embodiment.

The driving unit is provided with at least one transfer arm 23 for driving one of the support frame 214 and the heat sink to move toward the other. Furthermore, the driving unit includes the transfer arm 23 and a drive source (not shown) that can drive the transfer arm 23 to move. The drive source can be a linear motor, a cylinder, or a motor and a transmission set. The transmission set can be a belt pulley set or a screw screw seat set.

According to the working requirements, the driving unit is provided with a transfer arm 23 capable of displacement in at least one direction (for example, the Z direction) at the bottom of the support frame 214 of the mount 21, and the transfer arm 23 is used to drive the radiator to move toward the support frame 214; or the mount 21 is provided with a cross frame (not shown) above the support frame 214, and the driving unit can be provided with a transfer arm 23 capable of displacement in at least one direction (for example, the Z direction) at the bottom of the cross frame, and the transfer arm 23 is used to drive the radiator to move toward the support frame 214.

In this embodiment, the driving unit sets a plurality of transfer arms 23 that can be driven by a driving source (not shown) to move in the Z direction on the supporting surface 2142 of the plurality of supports 214 of the mount 21. The transfer arms 23 are assembled and connected to the main body 221 of the heat sink, and can drive the heat sink to move toward the support frame 214, so that when the support frame 214 supports a circuit board (not shown) with a plurality of test sockets, the heat sink can contact the outer cover of the test socket to perform a heat dissipation operation.

Please refer to Figures 4 to 6. A circuit board 41 is mounted and electrically connected to a plurality of test sockets 42 having outer covers 43. The test sockets 42 are used to hold and test electronic components 44. Since a plurality of transfer arms 23 are mounted below the support frame 214 of the mount 21, the transfer arms 23 drive the heat sink and the temperature control unit to perform heat dissipation and temperature control operations on the electronic components 44 of the test sockets 42, so that each test socket on each circuit board 41 can be electrically connected to the test sockets 42. The test socket 42 does not need to be equipped with a heat sink and a temperature control unit, and even does not need to be equipped with an outer cover 43. Therefore, a large number of circuit boards 41 can be relatively greatly reduced in number. Even better, a large number of outer covers 43 can be reduced. Therefore, not only is the structure of the test socket 42 simplified and the cost of test components is greatly saved, but the load of the circuit board 41 can also be greatly reduced to facilitate transportation.

Open the door panel of the pre-sintering furnace body 31 (not shown in the figure), place the plurality of circuit boards 41 with test sockets 42 on the bearing surfaces 2141 of the plurality of brackets 214 of the mounting device 21, and place them in the working space 213. The circuit boards 41 are electrically connected to the electric control connection board (not shown in the figure) of the pre-sintering equipment by means of gold fingers or flat cables, and the plurality of test sockets 42 of the circuit boards 41 are aligned with the joints 223 of the plurality of heat sinks; close the door. The gas supply device of the pre-burning furnace body 31 delivers the gas with the pre-burning test temperature to the air inlet channel 311, and the gas in the air inlet channel 311 flows into the working space 213 through the first opening 215 of the first side plate 211 of the holder 21, so that the working space 213 of the holder 21 forms a test environment with the pre-burning test temperature, so that the electronic components 44 of the test socket 42 can perform the pre-burning test operation in the pre-burning furnace body 31. The driving unit drives the transfer arm 23 to move downward in the Z direction with a driving source (not shown in the figure). The transfer arm 23 drives the body 221, the heat sink fins 222, the joint 223 and the heating element 224 of the heat sink to move toward the support frame 214 and the test seat 42, and the joint 223 contacts the outer cover 43 of the test seat 42, and uses a plurality of heat sink fins 222 to perform heat dissipation operations on the body 221 and the electronic components 44, and uses the heating element 224 to accurately control the temperature of the electronic components 44 in the test seat 42 to maintain the pre-burning test temperature to perform the test operation; the gas in the working space 213 of the mount 21 then flows out from the second port 216 of the second side plate 212 to the air outlet channel 312 of the pre-burning furnace body 31 and is discharged.

Please refer to Figures 7 and 8. The second embodiment of the working device of the present invention is roughly the same as the first embodiment. The difference is that the mounting device 21 includes a fixed frame 217 and a movable frame 218. The fixed frame 217 is installed inside the precalciner body 31, and at least one cross frame 219 is set in the working space 213. The bottom of the cross frame 219 is used to assemble and connect the main body 221 of multiple radiators. The first opening 215 and the second opening 216 that communicate with the working space 213 are opened on both sides of the fixed frame 217 for the inflow and outflow of gas. The movable frame 218 is located inside the fixed frame 217. , and at least one support frame 214 is provided to support the circuit board 41. A third opening 2181 is provided on one side of the movable frame 218 to communicate with the working space 213 and the first opening 215, so as to allow the cross frame 219 to pass through and the gas to flow in. A fourth opening 2182 is provided on the other side of the movable frame 218 to communicate with the working space 213 and the second opening 216, so as to allow the cross frame 219 to pass through and the gas to flow out. The driving unit is connected with a transfer arm (not shown) The movable frame 218 can be driven to move in the Z direction. The movable frame 218 drives the plurality of supports 214 and the plurality of circuit boards 41 to move upward in the Z direction synchronously, so that the test seat 42 moves toward the joint 223 of the heat sink. The outer cover 43 of the test seat 42 contacts the joint 223 of the heat sink, so that the heat sink performs a heat dissipation operation on the electronic component 44, so as to ensure that the electronic component 44 performs a test operation at a preset pre-burn test temperature.

[Knowledge] Electronic component 11 Pre-burning module 12 Circuit board 121 Test seat 122 Cover 123 Heat sink 124 Heating element 125 Pre-burning furnace body 13 Furnace frame 131 Working space 132 Support frame 133 Air inlet channel 134 Air outlet channel 135 [Present invention] Mounting device 21 First side plate 211 Second side plate 212 Working space 213 Support frame 214 Support surface 2141 Support surface 2142 First opening 215 Second opening 216 Fixed frame 217 Movable frame 218 Third opening 2181 Fourth opening 2182 Horizontal frame 219 Main body 221 Heat sink fin 222 Joint 223 Heating element 224 Transfer arm 23 Pre-burning furnace body 31 Air inlet channel 311 Air outlet channel 312 Circuit board 41 Test seat 42 Cover 43 Electronic component 44

Figure 1: A partial schematic diagram of the known pre-burning equipment. Figure 2: A partial enlarged schematic diagram of the known Figure 1. Figure 3: A partial schematic diagram of the first embodiment of the working device of the present invention. Figures 4 to 6: Partial schematic diagrams of the first embodiment of the working device of the present invention in use. Figures 7 to 8: Partial schematic diagrams of the second embodiment of the working device of the present invention in use.

21: Mounting device

211: First side panel

212: Second side panel

213:Workspace

214: Frame

2141: Loading surface

2142: Mounting surface

215: First port

216: Second port

221:Entity

222: Heat sink fins

223:Joints

224: Heating element

23: Transfer arm

31: Pre-burning furnace body

311: Entering the wind channel

312: Windy Flow

Claims (5)

A working device, comprising: A mounting device: provided with at least one working space, the working space is equipped with at least one layer of support frames for supporting at least one circuit board with a test socket; At least one heat sink: arranged in the working space of the mounting device, and provided with at least one heat dissipation component, for performing heat dissipation operations on the electronic components of the test socket; A driving unit: provided with at least one transfer arm, the transfer arm can be displaced in at least one direction; Wherein, the mounting device is provided with a movable frame and a fixed frame, the movable frame is provided with the support frame, the fixed frame is provided with a cross frame above the support frame, the cross frame is provided with the heat sink, the two sides of the fixed frame are provided with at least one first opening and at least one second opening communicating with the working space, one side of the movable frame is provided with a The third opening is connected to the working space and the first opening, and a fourth opening is provided on the other side to communicate with the working space and the second opening. The transfer arm of the driving unit can drive the movable frame and the support frame to move toward the radiator. The operating device as described in claim 1, wherein the heat sink includes a main body, a heat sink component and a connector, wherein the main body is used to assemble the heat sink component, the heat sink component is used for heat dissipation, and the connector is arranged below the main body and the heat sink component to contact the outer cover of the electronic component or the test socket. In the operating device as described in claim 1 or 2, the radiator is equipped with at least one temperature control unit. An electronic component pre-burning device comprises: A pre-burning furnace body: provided with a gas supply device for conveying gas having a pre-burning test temperature into the furnace; At least one operating device as described in claim 1: located inside the pre-burning furnace body, with at least one support of a mounting device to support at least one circuit board having a test socket and electronic components. As described in claim 4, the electronic component pre-burning equipment has at least one flow channel between the pre-burning furnace body and the mounter, and the flow channel is connected to the working space of the mounter for conveying the gas.

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