TWI883698B - Pressing mechanism and processing apparatus - Google Patents
Pressing mechanism and processing apparatus Download PDFInfo
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- TWI883698B TWI883698B TW112147681A TW112147681A TWI883698B TW I883698 B TWI883698 B TW I883698B TW 112147681 A TW112147681 A TW 112147681A TW 112147681 A TW112147681 A TW 112147681A TW I883698 B TWI883698 B TW I883698B
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本發明提供一種節省處理高溫流體能源成本及提高散熱使用效能之壓接機構。The present invention provides a crimping mechanism that saves energy costs for processing high-temperature fluids and improves heat dissipation efficiency.
在現今,請參閱圖1、2,電子元件11製作完成後,業者以測試器12承置複數個電子元件11,並搬運至作業設備(例如電性測試作業設備或預燒測試作業設備)執行測試作業。測試器12包含電性連接之電路板121及複數個測試座122,測試座122以供承置及測試電子元件11,並配置外蓋123,外蓋123蓋合測試座122而限位電子元件11。然電子元件11之測試過程中,其自身會產生高溫
,為避免過當之高溫影響測試品質,測試器12於外蓋123之頂面設置複數片的散熱鰭片124加以散熱。
Nowadays, please refer to Figures 1 and 2. After the
以預燒測試作業設備為例,其預燒爐體13的作業空間131設有複數層之承架132,以供承置具有複數個電子元件11之測試器12,預燒爐體13之一側設有入風流道133,以供氣體處理裝置(圖未示出)輸入具有預設熱度之氣體,並供氣體流入作業空間131,使電子元件11於模擬日後應用之高溫環境進行預燒測試作業;然複數層之各測試器12利用散熱鰭片124加以散熱,並使散熱出之高溫氣體流入作業空間131,作業空間131之大量高溫氣體再流入預燒爐體13另一側設置之出風流道134,出風流道134將大量高溫氣體輸送至氣體處理裝置,由氣體處理裝置將大量高溫氣體處理降溫至預設熱度,方可將具有預設熱度之氣體輸送回入風流道133。Taking the pre-burning test operation equipment as an example, the
惟,數十個或上百個之測試座122的散熱鰭片124所流散出於作業空間131之大量高溫氣體,導致測試座122周遭的環境溫度超過原本預設之環境溫度,溫度過高的大量高溫氣體再經由出風通道134輸送至氣體處理裝置,以致預燒測試作業設備必需配置較大功率之氣體處理裝置方可將龐大流量且溫度過高之氣體處理降溫至預設溫度,致使相當耗費能源及成本。However, the large amount of high-temperature gas released from the
又,較大功率之氣體處理裝置相對具有較大體積,以致相當佔用預燒測試作業設備之周遭空間,不利空間配置。In addition, the gas treatment device with a relatively large power is relatively large in size, so that it occupies a considerable amount of space around the pre-burning test operation equipment, which is not conducive to space allocation.
本發明之目的一,提供一種壓接機構,包含至少一架置器、至少一壓接治具及至少一溫控結構;架置器以供裝配至少一溫控結構,溫控結構包含第一溫控單元、第二溫控單元及第三溫控單元,第一溫控單元以供裝配壓接治具,並設置具有輸送器之第一空間,輸送器能夠輸送第一空間內且與壓接治具作第一次熱交換之流體,第二溫控單元之第二空間以供配置具有預設溫度之第一溫控件,第三溫控單元配置於第一溫控單元與第二溫控單元之間,並設有第三空間,以供輸送器輸入第一次熱交換之流體,第一次熱交換且高溫之流體於第三空間流動過程中,能夠與第二空間之第一溫控件作第二次熱交換,第一溫控單元再以輸送器將第三空間內之第二次熱交換且降溫的流體輸入於第一空間而循環流動;藉以避免壓接治具周遭之環境溫度過高,尤其在數量繁多之溫控結構同時運作狀態下,毋需配置大功率之流體處理裝置,進而有效節省能源成本。The first object of the present invention is to provide a crimping mechanism, comprising at least one mounting device, at least one crimping fixture and at least one temperature control structure; the mounting device is used to assemble at least one temperature control structure, the temperature control structure comprises a first temperature control unit, a second temperature control unit and a third temperature control unit, the first temperature control unit is used to assemble the crimping fixture, and is provided with a first space having a conveyor, the conveyor can convey the fluid in the first space and perform the first heat exchange with the crimping fixture, the second space of the second temperature control unit is used to configure a first temperature control unit with a preset temperature, and the third temperature control unit is configured on the first temperature control unit. A third space is provided between the first temperature control unit and the second temperature control unit for conveying the fluid of the first heat exchange. The high-temperature fluid of the first heat exchange can be heat exchanged for the second time with the first temperature control unit of the second space during the flow in the third space. The first temperature control unit then uses the conveyor to convey the fluid of the second heat exchange and cooling in the third space into the first space for circulation. This can avoid the environment temperature around the crimping fixture from being too high. In particular, when a large number of temperature control structures are in operation at the same time, there is no need to configure a high-power fluid processing device, thereby effectively saving energy costs.
本發明之目的二,提供一種壓接機構,其溫控結構可使已熱交換且高溫之流體於第一、三空間循環流動而避免向外流散,以有效避免壓接治具周遭的環境溫度過高,毋需配置體積大之流體處理裝置,進而有效縮減體積以利作業設備之周遭空間配置。The second object of the present invention is to provide a crimping mechanism, whose temperature control structure can make the heat-exchanged and high-temperature fluid circulate in the first and third spaces to avoid dissipating outward, so as to effectively prevent the ambient temperature around the crimping fixture from being too high. There is no need to configure a large-volume fluid processing device, thereby effectively reducing the volume to facilitate the configuration of the surrounding space of the operating equipment.
本發明之目的三,提供一種作業設備,包含機架、至少一本發明壓接機構及中央控制裝置;機架設置至少一承架,以供承置至少一測試器;至少一本發明壓接機構裝配於機架,以供壓接及溫控該測試器;中央控制裝置以供控制及整合壓接機構作動而執行自動化作業。The third object of the present invention is to provide an operating equipment, including a frame, at least one crimping mechanism of the present invention and a central control device; the frame is provided with at least one support frame for supporting at least one tester; at least one crimping mechanism of the present invention is mounted on the frame for crimping and temperature control of the tester; the central control device is used to control and integrate the movement of the crimping mechanism to perform automated operations.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:
請參閱圖3、4,本發明壓接機構應用於作業設備,作業設備可為電子元件之電性測試作業設備或預燒測試作業設備。作業設備包含機架、至少一本發明壓接機構及中央控制裝置(圖未示出);機架設置至少一承架,以供承置至少一測試器;至少一本發明壓接機構裝配於機架,包含至少一架置器、至少一壓接治具及至少一溫控結構,以供壓接及溫控測試器;中央控制裝置以供控制及整合壓接機構作動而執行自動化作業。Please refer to Figures 3 and 4. The crimping mechanism of the present invention is applied to an operating equipment, which can be an electrical test operating equipment or a pre-burn-in test operating equipment for electronic components. The operating equipment includes a rack, at least one crimping mechanism of the present invention and a central control device (not shown); the rack is provided with at least one support frame for supporting at least one tester; at least one crimping mechanism of the present invention is mounted on the rack, including at least one mount, at least one crimping fixture and at least one temperature control structure for crimping and temperature control of the tester; the central control device is used to control and integrate the crimping mechanism to perform automated operations.
依作業需求,作業設備可配置一個或複數個本發明壓接機構;於本實施例,作業設備為電子元件預燒測試作業設備,機架21以複數個架體圍構成一作業空間211,並於呈Z方向配置之二側架212間設有至少一承架213,承架213可為一字型架、L型架、機台板或承板等,以供承置至少一測試器(圖未示出
);於本實施例,二側架212之內面分別設置複數層且兩兩相對配置之承架213,各層相對之二承架213呈X方向配置。
According to the working requirements, the working equipment can be equipped with one or more crimping mechanisms of the present invention; in this embodiment, the working equipment is an electronic component pre-burning test working equipment, the
依作業需求,機架21能夠設置至少一第二驅動器(圖未示出),第二驅動器以供驅動承架213沿壓接軸向(例如Z方向)位移;亦即承架213承置測試器,第二驅動器可驅動承架213及測試器朝向壓接治具作Z方向位移。According to the working requirements, the
依作業需求,預燒測試作業設備需於作業空間211流入所需預設溫度之熱氣時,可於機架21之兩側配置相通作業空間211之入風流道(圖未示出
)及出風流道(圖未示出),亦無不可,不受限於本實施例。
According to the operation requirements, when the pre-burning test operation equipment needs to flow hot air of the required preset temperature into the
本發明壓接機構裝配於機架21,包含至少一架置器、至少一壓接治具及至少一溫控結構。The crimping mechanism of the present invention is mounted on the
至少一架置器為固定式或可活動式配置,例如架置器為搬運車架之固定式車架或預燒測試作業設備之固定式機架21。例如架置器為電性測試作業設備之可活動式移載臂或預燒測試作業設備之可活動式機架。承上述,架置器可為獨立架體、移載臂或機架21之側架212;於本實施例,架置器為預燒測試作業設備之固定式機架21的側架212,側架212呈Z方向配置。At least one mounter is fixed or movable, for example, the mounter is a fixed frame of a transport frame or a fixed
至少一壓接治具22,以供壓接電子元件。依作業需求,壓接治具22可執行壓接電子元件之作業,或者設有至少一抽氣部(圖未示出),以供執行移載及壓接電子元件之作業;於本實施例,壓接治具22可執行壓接電子元件之作業。At least one crimping
依作業需求,壓接機構更包含至少一第二溫控件,第二溫控件裝配於壓接治具22,以供溫控調整電子元件之預設測試溫度;例如電子元件未逹到預設測試溫度,可啟動第二溫控件,以升溫或降溫調整電子元件之測試溫度
;例如電子元件已逹到預設測試溫度,可關閉第二溫控件。更進一步,第二溫控件可裝配於溫控結構與壓接治具22之間,或裝配於壓接治具22之內部、底部等適當位置,亦無不可。承上述,第二溫控件可為加熱件、致冷晶片或具流體之溫控座;於本實施例,第二溫控件為加熱件23,並配置於壓接治具22之內部。
According to the operation requirements, the crimping mechanism further includes at least one second temperature control unit, which is mounted on the
至少一溫控結構裝配於架置器,包含至少一第一溫控單元、至少一第二溫控單元及至少一第三溫控單元,第一溫控單元以供裝配壓接治具,並設置具有至少一輸送器之第一空間,輸送器能夠輸送第一空間內且與壓接治具作第一次熱交換之流體;第二溫控單元設有第二空間以供配置第一溫控件,第三溫控單元配置於第一溫控單元與第二溫控單元之間,並設有第三空間以供輸入第一次熱交換之流體,第一次熱交換之流體於第三空間流動過程中,能夠與第二空間之第一溫控件作第二次熱交換,第一溫控單元再以輸送器輸送第三空間內之第二次熱交換且降溫的流體輸入於第一空間而循環流動。At least one temperature control structure is assembled on the mounter, including at least one first temperature control unit, at least one second temperature control unit and at least one third temperature control unit. The first temperature control unit is used to assemble the compression jig, and is provided with a first space having at least one conveyor, and the conveyor can convey the fluid in the first space and undergo the first heat exchange with the compression jig; the second temperature control unit is provided with a second space for configuring the first temperature control unit, and the third temperature control unit is configured between the first temperature control unit and the second temperature control unit, and is provided with a third space for inputting the fluid for the first heat exchange. During the flow of the fluid for the first heat exchange in the third space, it can undergo the second heat exchange with the first temperature control unit in the second space. The first temperature control unit then uses the conveyor to transport the fluid in the third space that has undergone the second heat exchange and has been cooled, and inputs it into the first space for circulation.
依作業需求,輸送器可為風扇或抽吸泵等,以供將流體輸入或輸出於第一空間或第三空間,不受限於本實施例。According to the operation requirements, the conveyor can be a fan or a suction pump, etc., to input or output the fluid into or out of the first space or the third space, and is not limited to this embodiment.
依作業需求,第一溫控件可為液體、氣體或致冷晶片等,不受限於本實施例。According to the operation requirements, the first temperature control element can be liquid, gas or cooling chip, etc., and is not limited to this embodiment.
依作業需求,壓接機構更包含至少一第一驅動器,第一驅動器裝配於架置器,以供驅動溫控結構沿壓接軸向(例如Z軸向)位移。更進一步,第一驅動器可為線性馬達、壓缸或包含馬達及至少一傳動組,傳動組可為皮帶輪組或螺桿螺座組;於本實施例,壓接機構於機架21之二側架212內面配置複數層之複數個第一驅動器,各層二相對配置之第一驅動器為壓缸24,並呈Z方向配置。According to the operation requirements, the press-fit mechanism further includes at least one first driver, which is mounted on the mount to drive the temperature control structure to move along the press-fit axis (e.g., Z axis). Furthermore, the first driver can be a linear motor, a pressure cylinder, or a motor and at least one transmission set, and the transmission set can be a belt pulley set or a screw seat set; in this embodiment, the press-fit mechanism is configured with a plurality of first drivers of a plurality of layers on the inner surface of the two
依作業需求,第一溫控單元之第一空間或/及第三溫控單元之第三空間設有至少一鰭片,以供散熱。According to the operation requirements, the first space of the first temperature control unit and/or the third space of the third temperature control unit is provided with at least one fin for heat dissipation.
於本實施例,壓接機構配置複數層溫控結構,各層之溫控結構包含複數個第一溫控單元、一第二溫控單元及複數個第三溫控單元,複數個第一溫控單元裝配於複數個第三溫控單元的下方,第二溫控單元及第三溫控單元裝配於壓缸24,使得壓缸24能夠帶動複數個第一溫控單元、一第二溫控單元及複數個第三溫控單元於機架21之作業空間211沿壓接軸向同步位移。In this embodiment, the crimping mechanism is configured with multiple layers of temperature control structures, each layer of the temperature control structure includes multiple first temperature control units, a second temperature control unit and multiple third temperature control units. The multiple first temperature control units are assembled below the multiple third temperature control units, and the second temperature control unit and the third temperature control unit are assembled on the
第一溫控單元設置複數個第一板件251以圍構成第一空間252,並以位於底部之第一板件251供裝配壓接治具22。更進一步,第一溫控單元之第一板件251的內面朝向第一空間252設有複數個為第一鰭片253之鰭片。第一溫控單元於第一空間252之內部設置一為風扇254之輸送器,風扇254能夠朝向第一鰭片253吹送第一空間252內且為氣體之流體,第一空間252能夠輸出已與第一鰭片253、壓接治具22作第一次熱交換且高溫的氣體至第三溫控單元。The first temperature control unit is provided with a plurality of
第二溫控單元設置複數個第二板件261以圍構成至少一第二空間262;第一溫控件為液體,第二空間262之一側設有一連通液體輸送裝置(圖未示出)之入口263,以供輸入具有預設低溫之液體,液體可為冷卻水或冷媒;於本實施例,液體為冷卻水,入口263以供輸入具有預設低溫之冷卻水,冷卻水沿第二空間262之液體流動路徑由一側朝向另一側之出口264流動,出口264以供輸出已熱交換之冷卻水。又第二溫控單元之複數個第二板件261的兩側裝配連接壓缸24,而可由壓缸24驅動複數個第二板件261沿壓接軸向位移。The second temperature control unit is provided with a plurality of
第三溫控單元位於第一溫控單元與第二溫控單元之間,並設置複數個第三板件271A、271B…以圍構至少一第三空間272;然第三溫控單元可配置獨立之第三板件作為頂板,或以第二溫控單元位於底部之第二板件261作為頂板,亦無不可。於本實施例,第三溫控單元以第二溫控單元位於底部之第二板件261作為頂板,並配置一獨立之第三板件271A作為底板,第二板件261與第三板件271A呈上下相對且X方向配置,並於二者間以複數個第三板件271B分隔複數個第三空間272。更進一步,第二板件261與第三板件271A朝向第三空間272的一面設有複數個為第二鰭片273之鰭片。第三溫控單元之第三板件271A的兩側裝配連接壓缸24,而可由壓缸24驅動沿壓接軸向位移。The third temperature control unit is located between the first temperature control unit and the second temperature control unit, and a plurality of
承上述,第三溫控單元之第三空間272與第一溫控單元之第一空間252設有相通之第一流道及第二流道,第一流道以供第一空間252內之第一次熱交換且高溫的氣體輸出至第三空間272,第二流道以供第三空間272之第二次熱交換且降溫的氣體輸入第一空間252。於本實施例,第三溫控單元於第三板件271A設有相通第三空間272與第一空間252的第一流道274及第二流道275,第一流道274以供第一空間252內且與壓接治具22作第一次熱交換升溫之氣體流入第三空間272,第二流道275以供第三空間272內且與冷卻水作第二次熱交換降溫之氣體流出至第一空間252,使得第一空間252、第三空間272、第一流道274及第二流道275形成一循環氣體流動路徑,能夠避免第一次熱交換且高溫之氣體向外流散於壓接治具22周遭之作業空間211。Based on the above, the
承上述,第三溫控單元之第三板件271A的底面可供裝配複數個第一溫控單元,使得複數個第一溫控單元可隨第三溫控單元同步位移。Based on the above, the bottom surface of the
承上述,第二溫控單元可設置單一第二空間262,單一第二空間262的面積含蓋複數個第三空間272之上方,或者第二溫控單元依第三空間272之數量而配置相對數量之第二空間262,亦無不可。於本實施例,第二溫控單元設有單一第二空間262,單一第二空間262的面積含蓋複數個第三空間272之上方,亦即第二空間262的液體流動路徑含蓋複數個第三空間272之上方,使冷卻水能夠流經複數個第三空間272之上方。Based on the above, the second temperature control unit can be provided with a single
請參閱圖5至圖7,一測試器包含電性連接之電路板31及複數個測試座32,測試座32配置有外蓋33,並能夠承置及測試電子元件34。於本實施例
,預燒測試作業設備之機架21的每一層承架213供承置一具有複數個測試座32及電子元件34之電路板31,每一層之複數個測試座32及複數個電子元件34位於機架21之作業空間211,且測試座32位於相對之壓接治具22的下方。
Please refer to Figures 5 to 7. A tester includes an electrically connected
壓接機構之每一層壓缸24帶動第一溫控單元、第二溫控單元、第三溫控單元及壓接治具22等同步沿壓接軸向(如Z方向)向下位移,令壓接治具22壓接於測試座32之外蓋33,並以加熱件23溫控測試座32內之電子元件34而執行測試作業。Each layer of the
於電子元件34測試過程中,電子元件34經壓接治具22將高溫傳導至第一鰭片253,第一溫控單元以風扇254朝下吹送第一空間252內的氣體,令氣體與第一鰭片253、壓接治具22作第一次熱交換,使壓接治具22散熱,並使電子元件34保持預設測試溫度而於測試座32內執行測試作業。第一空間252內之第一次熱交換且高溫的氣體由第一流道274流入於第三空間272,由於第三空間272僅供相對應第一溫控單元之第一空間252內的第一次熱交換氣體流入,在流量少之第一次熱交換氣體的狀態下,利用第二溫控單元之第二空間262一側的入口263輸入冷卻水,冷卻水沿第二空間262之液體流動路徑朝向另一側之出口264流動
,使位於第二空間262下方之第三空間272內的第一次熱交換且高溫的氣體於流動過程中,不僅可與第二鰭片273作熱交換且產生紊流而散熱,更能夠與第二空間262內的冷卻水作第二次熱交換而降溫,第二空間262已熱交換之冷卻水則由出口264流出;第三空間272內之第二次熱交換且降溫的氣體再由風扇254經第二流道275抽吸輸入於第一空間252,且朝向第一鰭片253吹送而散熱。
During the test of the
因此,第一、二次熱交換之氣體可於第一空間252及第三空間272作循環流動,第一次熱交換且高溫之氣體並不會流出至機架21之作業空間211,以避免壓接治具22周遭之環境溫度過高,不僅毋需配置大功率且體積大之氣體處理裝置(圖未示出),而有效節省能源成本及利於空間配置,更加迅速確保測試座32及電子元件34於預設測試溫度執行測試作業,進而提高測試品質。Therefore, the gas of the first and second heat exchanges can circulate in the
[習知]
電子元件11
測試器12
電路板121
測試座122
外蓋123
散熱鰭片124
預燒爐體13
作業空間131
承架132
入風流道133
出風流道134
[本發明]
機架21
作業空間211
側架212
承架213
壓接治具22
加熱件23
壓缸24
第一板件251
第一空間252
第一鰭片253
風扇254
第二板件261
第二空間262
入口263
出口264
第三板件271A、271B
第三空間272
第二鰭片273
第一流道274
第二流道275
電路板31
測試座32
外蓋33
電子元件34
[Knowledge]
圖1:習知預燒作業設備之局部使用示意圖。 圖2:習知圖1之局部放大示意圖。 圖3:本發明作業設備之局部示意圖。 圖4:本發明壓接機構之示意圖。 圖5至圖7:本發明壓接機構之使用示意圖。 Figure 1: A partial schematic diagram of the known pre-burning operation equipment. Figure 2: A partial enlarged schematic diagram of the known Figure 1. Figure 3: A partial schematic diagram of the operation equipment of the present invention. Figure 4: A schematic diagram of the crimping mechanism of the present invention. Figures 5 to 7: Schematic diagrams of the use of the crimping mechanism of the present invention.
21:機架 21: Rack
211:作業空間 211:Working space
213:承架 213: Frame
22:壓接治具 22: Press-fitting fixture
23:加熱件 23: Heating element
24:壓缸 24: Cylinder
252:第一空間 252: First Space
253:第一鰭片 253: First fin
254:風扇 254: Fan
262:第二空間 262: Second Space
264:出口 264:Export
272:第三空間 272: The Third Space
273:第二鰭片 273: Second fin
274:第一流道 274: First flow channel
275:第二流道 275: Second flow channel
31:電路板 31: Circuit board
32:測試座 32: Test seat
33:外蓋 33: Outer cover
34:電子元件 34: Electronic components
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| TW112147681A TWI883698B (en) | 2023-12-07 | 2023-12-07 | Pressing mechanism and processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112147681A TWI883698B (en) | 2023-12-07 | 2023-12-07 | Pressing mechanism and processing apparatus |
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| Publication Number | Publication Date |
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| TWI883698B true TWI883698B (en) | 2025-05-11 |
| TW202524089A TW202524089A (en) | 2025-06-16 |
Family
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Country Status (1)
| Country | Link |
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| TW (1) | TWI883698B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060097337A1 (en) * | 2001-08-13 | 2006-05-11 | Haji-Sheikh Michael J | Methods of conducting wafer level burn-in of electronic devices |
| TW201910784A (en) * | 2017-08-14 | 2019-03-16 | 鴻勁精密股份有限公司 | Crimping device for an electronic component crimping mechanism, and test categorization equipment applying the same to quickly dissipate the heat from electronic components for keeping the electronic components in the preset test temperature range, and effectively reduce the assembly space of the jet unit |
| TW202008107A (en) * | 2018-07-24 | 2020-02-16 | 致茂電子股份有限公司 | High/low-temperature testing apparatus and method |
-
2023
- 2023-12-07 TW TW112147681A patent/TWI883698B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060097337A1 (en) * | 2001-08-13 | 2006-05-11 | Haji-Sheikh Michael J | Methods of conducting wafer level burn-in of electronic devices |
| TW201910784A (en) * | 2017-08-14 | 2019-03-16 | 鴻勁精密股份有限公司 | Crimping device for an electronic component crimping mechanism, and test categorization equipment applying the same to quickly dissipate the heat from electronic components for keeping the electronic components in the preset test temperature range, and effectively reduce the assembly space of the jet unit |
| TW202008107A (en) * | 2018-07-24 | 2020-02-16 | 致茂電子股份有限公司 | High/low-temperature testing apparatus and method |
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| Publication number | Publication date |
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| TW202524089A (en) | 2025-06-16 |
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