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TWI883698B - Pressing mechanism and processing apparatus - Google Patents

Pressing mechanism and processing apparatus Download PDF

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Publication number
TWI883698B
TWI883698B TW112147681A TW112147681A TWI883698B TW I883698 B TWI883698 B TW I883698B TW 112147681 A TW112147681 A TW 112147681A TW 112147681 A TW112147681 A TW 112147681A TW I883698 B TWI883698 B TW I883698B
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Taiwan
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temperature control
space
control unit
crimping
heat exchange
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TW112147681A
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Chinese (zh)
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TW202524089A (en
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謝旼達
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鴻勁精密股份有限公司
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Abstract

The pressing mechanism includes a supporter, a pressing jig, and a temperature control mechanism, which is arranged between the supporter and the pressing jig. The first heat-exchanged fluid by the pressing jig in the first space is transported to the third space of the third temperature control unit by the transporter of the first temperature control unit of the temperature control mechanism, The first heat-exchanged fluid is hot and undergoes a second heat-exchanging with the first temperature control member of the second space of the second temperature control unit when flowing through the third space. The second heat-exchanged fluid in the third space is cooled down is injected into the first space by the transporter for heat dissipation. Thus, the temperature beside the pressing jig can be reduced, and the heat can be quickly dissipated to reduce the cost.

Description

壓接機構及作業設備Crimping mechanism and operating equipment

本發明提供一種節省處理高溫流體能源成本及提高散熱使用效能之壓接機構。The present invention provides a crimping mechanism that saves energy costs for processing high-temperature fluids and improves heat dissipation efficiency.

在現今,請參閱圖1、2,電子元件11製作完成後,業者以測試器12承置複數個電子元件11,並搬運至作業設備(例如電性測試作業設備或預燒測試作業設備)執行測試作業。測試器12包含電性連接之電路板121及複數個測試座122,測試座122以供承置及測試電子元件11,並配置外蓋123,外蓋123蓋合測試座122而限位電子元件11。然電子元件11之測試過程中,其自身會產生高溫 ,為避免過當之高溫影響測試品質,測試器12於外蓋123之頂面設置複數片的散熱鰭片124加以散熱。 Nowadays, please refer to Figures 1 and 2. After the electronic component 11 is manufactured, the operator uses a tester 12 to hold multiple electronic components 11 and transports them to an operating equipment (such as an electrical testing operating equipment or a pre-burning testing operating equipment) to perform testing operations. The tester 12 includes an electrically connected circuit board 121 and multiple test sockets 122. The test sockets 122 are used to hold and test the electronic components 11, and are equipped with an outer cover 123. The outer cover 123 covers the test sockets 122 to limit the electronic components 11. However, during the testing process of the electronic component 11, it will generate high temperature. In order to avoid excessive high temperature affecting the test quality, the tester 12 is equipped with multiple heat sinks 124 on the top of the outer cover 123 for heat dissipation.

以預燒測試作業設備為例,其預燒爐體13的作業空間131設有複數層之承架132,以供承置具有複數個電子元件11之測試器12,預燒爐體13之一側設有入風流道133,以供氣體處理裝置(圖未示出)輸入具有預設熱度之氣體,並供氣體流入作業空間131,使電子元件11於模擬日後應用之高溫環境進行預燒測試作業;然複數層之各測試器12利用散熱鰭片124加以散熱,並使散熱出之高溫氣體流入作業空間131,作業空間131之大量高溫氣體再流入預燒爐體13另一側設置之出風流道134,出風流道134將大量高溫氣體輸送至氣體處理裝置,由氣體處理裝置將大量高溫氣體處理降溫至預設熱度,方可將具有預設熱度之氣體輸送回入風流道133。Taking the pre-burning test operation equipment as an example, the working space 131 of the pre-burning furnace body 13 is provided with a plurality of layers of racks 132 for holding the tester 12 having a plurality of electronic components 11. One side of the pre-burning furnace body 13 is provided with an air inlet channel 133 for the gas processing device (not shown) to input gas with a preset temperature and for the gas to flow into the working space 131, so that the electronic components 11 can be pre-burned in a high temperature environment simulating future applications. Each of the testers 12 on several layers uses heat dissipation fins 124 to dissipate heat, and the high-temperature gas released by the heat dissipation flows into the working space 131. The large amount of high-temperature gas in the working space 131 then flows into the air outlet duct 134 set on the other side of the pre-calcination furnace body 13. The air outlet duct 134 transports the large amount of high-temperature gas to the gas processing device, and the gas processing device processes the large amount of high-temperature gas and cools it to a preset temperature before transporting the gas with the preset temperature back to the air inlet duct 133.

惟,數十個或上百個之測試座122的散熱鰭片124所流散出於作業空間131之大量高溫氣體,導致測試座122周遭的環境溫度超過原本預設之環境溫度,溫度過高的大量高溫氣體再經由出風通道134輸送至氣體處理裝置,以致預燒測試作業設備必需配置較大功率之氣體處理裝置方可將龐大流量且溫度過高之氣體處理降溫至預設溫度,致使相當耗費能源及成本。However, the large amount of high-temperature gas released from the heat sink fins 124 of dozens or hundreds of test sockets 122 into the working space 131 causes the ambient temperature around the test sockets 122 to exceed the originally preset ambient temperature. The large amount of high-temperature gas with excessive temperature is then transported to the gas processing device through the air outlet duct 134, so that the pre-burn test operating equipment must be equipped with a larger power gas processing device to cool down the large flow and excessive temperature gas to the preset temperature, resulting in considerable energy consumption and cost.

又,較大功率之氣體處理裝置相對具有較大體積,以致相當佔用預燒測試作業設備之周遭空間,不利空間配置。In addition, the gas treatment device with a relatively large power is relatively large in size, so that it occupies a considerable amount of space around the pre-burning test operation equipment, which is not conducive to space allocation.

本發明之目的一,提供一種壓接機構,包含至少一架置器、至少一壓接治具及至少一溫控結構;架置器以供裝配至少一溫控結構,溫控結構包含第一溫控單元、第二溫控單元及第三溫控單元,第一溫控單元以供裝配壓接治具,並設置具有輸送器之第一空間,輸送器能夠輸送第一空間內且與壓接治具作第一次熱交換之流體,第二溫控單元之第二空間以供配置具有預設溫度之第一溫控件,第三溫控單元配置於第一溫控單元與第二溫控單元之間,並設有第三空間,以供輸送器輸入第一次熱交換之流體,第一次熱交換且高溫之流體於第三空間流動過程中,能夠與第二空間之第一溫控件作第二次熱交換,第一溫控單元再以輸送器將第三空間內之第二次熱交換且降溫的流體輸入於第一空間而循環流動;藉以避免壓接治具周遭之環境溫度過高,尤其在數量繁多之溫控結構同時運作狀態下,毋需配置大功率之流體處理裝置,進而有效節省能源成本。The first object of the present invention is to provide a crimping mechanism, comprising at least one mounting device, at least one crimping fixture and at least one temperature control structure; the mounting device is used to assemble at least one temperature control structure, the temperature control structure comprises a first temperature control unit, a second temperature control unit and a third temperature control unit, the first temperature control unit is used to assemble the crimping fixture, and is provided with a first space having a conveyor, the conveyor can convey the fluid in the first space and perform the first heat exchange with the crimping fixture, the second space of the second temperature control unit is used to configure a first temperature control unit with a preset temperature, and the third temperature control unit is configured on the first temperature control unit. A third space is provided between the first temperature control unit and the second temperature control unit for conveying the fluid of the first heat exchange. The high-temperature fluid of the first heat exchange can be heat exchanged for the second time with the first temperature control unit of the second space during the flow in the third space. The first temperature control unit then uses the conveyor to convey the fluid of the second heat exchange and cooling in the third space into the first space for circulation. This can avoid the environment temperature around the crimping fixture from being too high. In particular, when a large number of temperature control structures are in operation at the same time, there is no need to configure a high-power fluid processing device, thereby effectively saving energy costs.

本發明之目的二,提供一種壓接機構,其溫控結構可使已熱交換且高溫之流體於第一、三空間循環流動而避免向外流散,以有效避免壓接治具周遭的環境溫度過高,毋需配置體積大之流體處理裝置,進而有效縮減體積以利作業設備之周遭空間配置。The second object of the present invention is to provide a crimping mechanism, whose temperature control structure can make the heat-exchanged and high-temperature fluid circulate in the first and third spaces to avoid dissipating outward, so as to effectively prevent the ambient temperature around the crimping fixture from being too high. There is no need to configure a large-volume fluid processing device, thereby effectively reducing the volume to facilitate the configuration of the surrounding space of the operating equipment.

本發明之目的三,提供一種作業設備,包含機架、至少一本發明壓接機構及中央控制裝置;機架設置至少一承架,以供承置至少一測試器;至少一本發明壓接機構裝配於機架,以供壓接及溫控該測試器;中央控制裝置以供控制及整合壓接機構作動而執行自動化作業。The third object of the present invention is to provide an operating equipment, including a frame, at least one crimping mechanism of the present invention and a central control device; the frame is provided with at least one support frame for supporting at least one tester; at least one crimping mechanism of the present invention is mounted on the frame for crimping and temperature control of the tester; the central control device is used to control and integrate the movement of the crimping mechanism to perform automated operations.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:

請參閱圖3、4,本發明壓接機構應用於作業設備,作業設備可為電子元件之電性測試作業設備或預燒測試作業設備。作業設備包含機架、至少一本發明壓接機構及中央控制裝置(圖未示出);機架設置至少一承架,以供承置至少一測試器;至少一本發明壓接機構裝配於機架,包含至少一架置器、至少一壓接治具及至少一溫控結構,以供壓接及溫控測試器;中央控制裝置以供控制及整合壓接機構作動而執行自動化作業。Please refer to Figures 3 and 4. The crimping mechanism of the present invention is applied to an operating equipment, which can be an electrical test operating equipment or a pre-burn-in test operating equipment for electronic components. The operating equipment includes a rack, at least one crimping mechanism of the present invention and a central control device (not shown); the rack is provided with at least one support frame for supporting at least one tester; at least one crimping mechanism of the present invention is mounted on the rack, including at least one mount, at least one crimping fixture and at least one temperature control structure for crimping and temperature control of the tester; the central control device is used to control and integrate the crimping mechanism to perform automated operations.

依作業需求,作業設備可配置一個或複數個本發明壓接機構;於本實施例,作業設備為電子元件預燒測試作業設備,機架21以複數個架體圍構成一作業空間211,並於呈Z方向配置之二側架212間設有至少一承架213,承架213可為一字型架、L型架、機台板或承板等,以供承置至少一測試器(圖未示出 );於本實施例,二側架212之內面分別設置複數層且兩兩相對配置之承架213,各層相對之二承架213呈X方向配置。 According to the working requirements, the working equipment can be equipped with one or more crimping mechanisms of the present invention; in this embodiment, the working equipment is an electronic component pre-burning test working equipment, the frame 21 is surrounded by a plurality of frames to form a working space 211, and at least one support frame 213 is provided between two side frames 212 arranged in the Z direction, and the support frame 213 can be a straight frame, an L-shaped frame, a machine plate or a support plate, etc., for supporting at least one tester (not shown in the figure ); in this embodiment, the inner surfaces of the two side frames 212 are respectively provided with a plurality of layers of support frames 213 arranged opposite to each other, and the two opposite support frames 213 on each layer are arranged in the X direction.

依作業需求,機架21能夠設置至少一第二驅動器(圖未示出),第二驅動器以供驅動承架213沿壓接軸向(例如Z方向)位移;亦即承架213承置測試器,第二驅動器可驅動承架213及測試器朝向壓接治具作Z方向位移。According to the working requirements, the frame 21 can be provided with at least one second driver (not shown), and the second driver is used to drive the support frame 213 to move along the crimping axis (for example, the Z direction); that is, the support frame 213 supports the tester, and the second driver can drive the support frame 213 and the tester to move toward the crimping fixture in the Z direction.

依作業需求,預燒測試作業設備需於作業空間211流入所需預設溫度之熱氣時,可於機架21之兩側配置相通作業空間211之入風流道(圖未示出 )及出風流道(圖未示出),亦無不可,不受限於本實施例。 According to the operation requirements, when the pre-burning test operation equipment needs to flow hot air of the required preset temperature into the operation space 211, an air inlet flow channel (not shown in the figure ) and an air outlet flow channel (not shown in the figure) that communicate with the operation space 211 can be configured on both sides of the rack 21, which is also possible and is not limited to this embodiment.

本發明壓接機構裝配於機架21,包含至少一架置器、至少一壓接治具及至少一溫控結構。The crimping mechanism of the present invention is mounted on the frame 21, and includes at least one mounting device, at least one crimping fixture, and at least one temperature control structure.

至少一架置器為固定式或可活動式配置,例如架置器為搬運車架之固定式車架或預燒測試作業設備之固定式機架21。例如架置器為電性測試作業設備之可活動式移載臂或預燒測試作業設備之可活動式機架。承上述,架置器可為獨立架體、移載臂或機架21之側架212;於本實施例,架置器為預燒測試作業設備之固定式機架21的側架212,側架212呈Z方向配置。At least one mounter is fixed or movable, for example, the mounter is a fixed frame of a transport frame or a fixed frame 21 of a pre-burn test operation equipment. For example, the mounter is a movable transfer arm of an electrical test operation equipment or a movable frame of a pre-burn test operation equipment. Based on the above, the mounter can be an independent frame, a transfer arm or a side frame 212 of the frame 21; in this embodiment, the mounter is a side frame 212 of a fixed frame 21 of a pre-burn test operation equipment, and the side frame 212 is arranged in the Z direction.

至少一壓接治具22,以供壓接電子元件。依作業需求,壓接治具22可執行壓接電子元件之作業,或者設有至少一抽氣部(圖未示出),以供執行移載及壓接電子元件之作業;於本實施例,壓接治具22可執行壓接電子元件之作業。At least one crimping fixture 22 is provided for crimping electronic components. According to the operation requirements, the crimping fixture 22 can perform the operation of crimping electronic components, or be provided with at least one exhaust portion (not shown) for performing the operation of transferring and crimping electronic components; in this embodiment, the crimping fixture 22 can perform the operation of crimping electronic components.

依作業需求,壓接機構更包含至少一第二溫控件,第二溫控件裝配於壓接治具22,以供溫控調整電子元件之預設測試溫度;例如電子元件未逹到預設測試溫度,可啟動第二溫控件,以升溫或降溫調整電子元件之測試溫度 ;例如電子元件已逹到預設測試溫度,可關閉第二溫控件。更進一步,第二溫控件可裝配於溫控結構與壓接治具22之間,或裝配於壓接治具22之內部、底部等適當位置,亦無不可。承上述,第二溫控件可為加熱件、致冷晶片或具流體之溫控座;於本實施例,第二溫控件為加熱件23,並配置於壓接治具22之內部。 According to the operation requirements, the crimping mechanism further includes at least one second temperature control unit, which is mounted on the crimping fixture 22 for temperature control to adjust the preset test temperature of the electronic component; for example, if the electronic component has not reached the preset test temperature, the second temperature control unit can be activated to increase or decrease the temperature to adjust the test temperature of the electronic component ; for example, if the electronic component has reached the preset test temperature, the second temperature control unit can be closed. Furthermore, the second temperature control unit can be mounted between the temperature control structure and the crimping fixture 22, or mounted in an appropriate position such as the inside or bottom of the crimping fixture 22. Based on the above, the second temperature control unit can be a heating element, a cooling chip or a temperature control seat with a fluid; in this embodiment, the second temperature control unit is a heating element 23, and is arranged inside the crimping fixture 22.

至少一溫控結構裝配於架置器,包含至少一第一溫控單元、至少一第二溫控單元及至少一第三溫控單元,第一溫控單元以供裝配壓接治具,並設置具有至少一輸送器之第一空間,輸送器能夠輸送第一空間內且與壓接治具作第一次熱交換之流體;第二溫控單元設有第二空間以供配置第一溫控件,第三溫控單元配置於第一溫控單元與第二溫控單元之間,並設有第三空間以供輸入第一次熱交換之流體,第一次熱交換之流體於第三空間流動過程中,能夠與第二空間之第一溫控件作第二次熱交換,第一溫控單元再以輸送器輸送第三空間內之第二次熱交換且降溫的流體輸入於第一空間而循環流動。At least one temperature control structure is assembled on the mounter, including at least one first temperature control unit, at least one second temperature control unit and at least one third temperature control unit. The first temperature control unit is used to assemble the compression jig, and is provided with a first space having at least one conveyor, and the conveyor can convey the fluid in the first space and undergo the first heat exchange with the compression jig; the second temperature control unit is provided with a second space for configuring the first temperature control unit, and the third temperature control unit is configured between the first temperature control unit and the second temperature control unit, and is provided with a third space for inputting the fluid for the first heat exchange. During the flow of the fluid for the first heat exchange in the third space, it can undergo the second heat exchange with the first temperature control unit in the second space. The first temperature control unit then uses the conveyor to transport the fluid in the third space that has undergone the second heat exchange and has been cooled, and inputs it into the first space for circulation.

依作業需求,輸送器可為風扇或抽吸泵等,以供將流體輸入或輸出於第一空間或第三空間,不受限於本實施例。According to the operation requirements, the conveyor can be a fan or a suction pump, etc., to input or output the fluid into or out of the first space or the third space, and is not limited to this embodiment.

依作業需求,第一溫控件可為液體、氣體或致冷晶片等,不受限於本實施例。According to the operation requirements, the first temperature control element can be liquid, gas or cooling chip, etc., and is not limited to this embodiment.

依作業需求,壓接機構更包含至少一第一驅動器,第一驅動器裝配於架置器,以供驅動溫控結構沿壓接軸向(例如Z軸向)位移。更進一步,第一驅動器可為線性馬達、壓缸或包含馬達及至少一傳動組,傳動組可為皮帶輪組或螺桿螺座組;於本實施例,壓接機構於機架21之二側架212內面配置複數層之複數個第一驅動器,各層二相對配置之第一驅動器為壓缸24,並呈Z方向配置。According to the operation requirements, the press-fit mechanism further includes at least one first driver, which is mounted on the mount to drive the temperature control structure to move along the press-fit axis (e.g., Z axis). Furthermore, the first driver can be a linear motor, a pressure cylinder, or a motor and at least one transmission set, and the transmission set can be a belt pulley set or a screw seat set; in this embodiment, the press-fit mechanism is configured with a plurality of first drivers of a plurality of layers on the inner surface of the two side frames 212 of the frame 21, and the first drivers of the two oppositely arranged layers on each layer are pressure cylinders 24, and are arranged in the Z direction.

依作業需求,第一溫控單元之第一空間或/及第三溫控單元之第三空間設有至少一鰭片,以供散熱。According to the operation requirements, the first space of the first temperature control unit and/or the third space of the third temperature control unit is provided with at least one fin for heat dissipation.

於本實施例,壓接機構配置複數層溫控結構,各層之溫控結構包含複數個第一溫控單元、一第二溫控單元及複數個第三溫控單元,複數個第一溫控單元裝配於複數個第三溫控單元的下方,第二溫控單元及第三溫控單元裝配於壓缸24,使得壓缸24能夠帶動複數個第一溫控單元、一第二溫控單元及複數個第三溫控單元於機架21之作業空間211沿壓接軸向同步位移。In this embodiment, the crimping mechanism is configured with multiple layers of temperature control structures, each layer of the temperature control structure includes multiple first temperature control units, a second temperature control unit and multiple third temperature control units. The multiple first temperature control units are assembled below the multiple third temperature control units, and the second temperature control unit and the third temperature control unit are assembled on the pressure cylinder 24, so that the pressure cylinder 24 can drive the multiple first temperature control units, the second temperature control unit and the multiple third temperature control units to synchronously displace along the crimping axis in the working space 211 of the frame 21.

第一溫控單元設置複數個第一板件251以圍構成第一空間252,並以位於底部之第一板件251供裝配壓接治具22。更進一步,第一溫控單元之第一板件251的內面朝向第一空間252設有複數個為第一鰭片253之鰭片。第一溫控單元於第一空間252之內部設置一為風扇254之輸送器,風扇254能夠朝向第一鰭片253吹送第一空間252內且為氣體之流體,第一空間252能夠輸出已與第一鰭片253、壓接治具22作第一次熱交換且高溫的氣體至第三溫控單元。The first temperature control unit is provided with a plurality of first plates 251 to enclose a first space 252, and the first plate 251 located at the bottom is provided for assembling the press-fitting jig 22. Furthermore, the inner surface of the first plate 251 of the first temperature control unit is provided with a plurality of first fins 253 facing the first space 252. The first temperature control unit is provided with a conveyor, which is a fan 254, inside the first space 252. The fan 254 can blow the fluid in the first space 252, which is a gas, toward the first fin 253, and the first space 252 can output the high-temperature gas that has undergone the first heat exchange with the first fin 253 and the press-fitting jig 22 to the third temperature control unit.

第二溫控單元設置複數個第二板件261以圍構成至少一第二空間262;第一溫控件為液體,第二空間262之一側設有一連通液體輸送裝置(圖未示出)之入口263,以供輸入具有預設低溫之液體,液體可為冷卻水或冷媒;於本實施例,液體為冷卻水,入口263以供輸入具有預設低溫之冷卻水,冷卻水沿第二空間262之液體流動路徑由一側朝向另一側之出口264流動,出口264以供輸出已熱交換之冷卻水。又第二溫控單元之複數個第二板件261的兩側裝配連接壓缸24,而可由壓缸24驅動複數個第二板件261沿壓接軸向位移。The second temperature control unit is provided with a plurality of second plates 261 to enclose at least one second space 262; the first temperature control element is a liquid, and one side of the second space 262 is provided with an inlet 263 connected to a liquid conveying device (not shown) for inputting a liquid with a preset low temperature, and the liquid can be cooling water or a refrigerant; in this embodiment, the liquid is cooling water, and the inlet 263 is used for inputting cooling water with a preset low temperature, and the cooling water flows along the liquid flow path of the second space 262 from one side to the outlet 264 on the other side, and the outlet 264 is used to output the cooling water that has been heat exchanged. The two sides of the plurality of second plates 261 of the second temperature control unit are assembled and connected to the cylinder 24, and the cylinder 24 can drive the plurality of second plates 261 to move along the axial direction of the press connection.

第三溫控單元位於第一溫控單元與第二溫控單元之間,並設置複數個第三板件271A、271B…以圍構至少一第三空間272;然第三溫控單元可配置獨立之第三板件作為頂板,或以第二溫控單元位於底部之第二板件261作為頂板,亦無不可。於本實施例,第三溫控單元以第二溫控單元位於底部之第二板件261作為頂板,並配置一獨立之第三板件271A作為底板,第二板件261與第三板件271A呈上下相對且X方向配置,並於二者間以複數個第三板件271B分隔複數個第三空間272。更進一步,第二板件261與第三板件271A朝向第三空間272的一面設有複數個為第二鰭片273之鰭片。第三溫控單元之第三板件271A的兩側裝配連接壓缸24,而可由壓缸24驅動沿壓接軸向位移。The third temperature control unit is located between the first temperature control unit and the second temperature control unit, and a plurality of third plates 271A, 271B, etc. are provided to enclose at least one third space 272; however, the third temperature control unit may be configured with an independent third plate as the top plate, or with the second plate 261 of the second temperature control unit located at the bottom as the top plate. In this embodiment, the third temperature control unit uses the second plate 261 of the second temperature control unit located at the bottom as the top plate, and configures an independent third plate 271A as the bottom plate. The second plate 261 and the third plate 271A are opposite to each other and are arranged in the X direction, and a plurality of third spaces 272 are separated by a plurality of third plates 271B between the two. Furthermore, a plurality of second fins 273 are provided on the second plate 261 and the third plate 271A facing the third space 272. The two sides of the third plate 271A of the third temperature control unit are assembled and connected to the pressure cylinder 24, and can be driven by the pressure cylinder 24 to move along the compression axis.

承上述,第三溫控單元之第三空間272與第一溫控單元之第一空間252設有相通之第一流道及第二流道,第一流道以供第一空間252內之第一次熱交換且高溫的氣體輸出至第三空間272,第二流道以供第三空間272之第二次熱交換且降溫的氣體輸入第一空間252。於本實施例,第三溫控單元於第三板件271A設有相通第三空間272與第一空間252的第一流道274及第二流道275,第一流道274以供第一空間252內且與壓接治具22作第一次熱交換升溫之氣體流入第三空間272,第二流道275以供第三空間272內且與冷卻水作第二次熱交換降溫之氣體流出至第一空間252,使得第一空間252、第三空間272、第一流道274及第二流道275形成一循環氣體流動路徑,能夠避免第一次熱交換且高溫之氣體向外流散於壓接治具22周遭之作業空間211。Based on the above, the third space 272 of the third temperature control unit and the first space 252 of the first temperature control unit are provided with a first flow channel and a second flow channel which are in communication. The first flow channel is used for the first heat exchange in the first space 252 and the high-temperature gas is output to the third space 272. The second flow channel is used for the second heat exchange in the third space 272 and the cooled gas is input into the first space 252. In this embodiment, the third temperature control unit is provided with a first flow channel 274 and a second flow channel 275 on the third plate 271A, which are connected to the third space 272 and the first space 252. The first flow channel 274 allows the gas in the first space 252 and subjected to the first heat exchange with the crimping fixture 22 to flow into the third space 272, and the second flow channel 275 allows the gas in the third space 272 and subjected to the second heat exchange with the cooling water to flow out to the first space 252, so that the first space 252, the third space 272, the first flow channel 274 and the second flow channel 275 form a circulating gas flow path, which can prevent the high-temperature gas from being dispersed outward in the working space 211 around the crimping fixture 22 after the first heat exchange.

承上述,第三溫控單元之第三板件271A的底面可供裝配複數個第一溫控單元,使得複數個第一溫控單元可隨第三溫控單元同步位移。Based on the above, the bottom surface of the third plate 271A of the third temperature control unit can be used to assemble a plurality of first temperature control units, so that the plurality of first temperature control units can be displaced synchronously with the third temperature control unit.

承上述,第二溫控單元可設置單一第二空間262,單一第二空間262的面積含蓋複數個第三空間272之上方,或者第二溫控單元依第三空間272之數量而配置相對數量之第二空間262,亦無不可。於本實施例,第二溫控單元設有單一第二空間262,單一第二空間262的面積含蓋複數個第三空間272之上方,亦即第二空間262的液體流動路徑含蓋複數個第三空間272之上方,使冷卻水能夠流經複數個第三空間272之上方。Based on the above, the second temperature control unit can be provided with a single second space 262, the area of which covers the tops of a plurality of third spaces 272, or the second temperature control unit can be configured with a relative number of second spaces 262 according to the number of third spaces 272. In this embodiment, the second temperature control unit is provided with a single second space 262, the area of which covers the tops of a plurality of third spaces 272, that is, the liquid flow path of the second space 262 covers the tops of a plurality of third spaces 272, so that cooling water can flow through the tops of a plurality of third spaces 272.

請參閱圖5至圖7,一測試器包含電性連接之電路板31及複數個測試座32,測試座32配置有外蓋33,並能夠承置及測試電子元件34。於本實施例 ,預燒測試作業設備之機架21的每一層承架213供承置一具有複數個測試座32及電子元件34之電路板31,每一層之複數個測試座32及複數個電子元件34位於機架21之作業空間211,且測試座32位於相對之壓接治具22的下方。 Please refer to Figures 5 to 7. A tester includes an electrically connected circuit board 31 and a plurality of test sockets 32. The test sockets 32 are provided with an outer cover 33 and are capable of holding and testing electronic components 34. In this embodiment, each layer of the rack 21 of the pre-burn test operation equipment is provided with a circuit board 31 having a plurality of test sockets 32 and electronic components 34. The plurality of test sockets 32 and the plurality of electronic components 34 on each layer are located in the working space 211 of the rack 21, and the test sockets 32 are located below the corresponding crimping fixtures 22.

壓接機構之每一層壓缸24帶動第一溫控單元、第二溫控單元、第三溫控單元及壓接治具22等同步沿壓接軸向(如Z方向)向下位移,令壓接治具22壓接於測試座32之外蓋33,並以加熱件23溫控測試座32內之電子元件34而執行測試作業。Each layer of the pressing cylinder 24 of the pressing mechanism drives the first temperature control unit, the second temperature control unit, the third temperature control unit and the pressing fixture 22 to move downward along the pressing axis (such as the Z direction) synchronously, so that the pressing fixture 22 is pressed against the outer cover 33 of the test seat 32, and the heating element 23 is used to control the temperature of the electronic components 34 in the test seat 32 to perform the test operation.

於電子元件34測試過程中,電子元件34經壓接治具22將高溫傳導至第一鰭片253,第一溫控單元以風扇254朝下吹送第一空間252內的氣體,令氣體與第一鰭片253、壓接治具22作第一次熱交換,使壓接治具22散熱,並使電子元件34保持預設測試溫度而於測試座32內執行測試作業。第一空間252內之第一次熱交換且高溫的氣體由第一流道274流入於第三空間272,由於第三空間272僅供相對應第一溫控單元之第一空間252內的第一次熱交換氣體流入,在流量少之第一次熱交換氣體的狀態下,利用第二溫控單元之第二空間262一側的入口263輸入冷卻水,冷卻水沿第二空間262之液體流動路徑朝向另一側之出口264流動 ,使位於第二空間262下方之第三空間272內的第一次熱交換且高溫的氣體於流動過程中,不僅可與第二鰭片273作熱交換且產生紊流而散熱,更能夠與第二空間262內的冷卻水作第二次熱交換而降溫,第二空間262已熱交換之冷卻水則由出口264流出;第三空間272內之第二次熱交換且降溫的氣體再由風扇254經第二流道275抽吸輸入於第一空間252,且朝向第一鰭片253吹送而散熱。 During the test of the electronic component 34, the electronic component 34 transfers the high temperature to the first fin 253 through the crimping fixture 22. The first temperature control unit uses the fan 254 to blow the gas in the first space 252 downward, so that the gas exchanges heat with the first fin 253 and the crimping fixture 22 for the first time, so that the crimping fixture 22 dissipates heat and the electronic component 34 is kept at the preset test temperature while the test operation is performed in the test seat 32. The first heat exchanged and high-temperature gas in the first space 252 flows into the third space 272 from the first flow channel 274. Since the third space 272 is only for the first heat exchange gas in the first space 252 corresponding to the first temperature control unit to flow in, in the state of the first heat exchange gas with a small flow rate, cooling water is input through the inlet 263 on one side of the second space 262 of the second temperature control unit, and the cooling water flows along the liquid flow path of the second space 262 toward the outlet 264 on the other side. , so that the high-temperature gas in the third space 272 located below the second space 262 can not only exchange heat with the second fin 273 and generate turbulence to dissipate heat during the flow process, but also exchange heat with the cooling water in the second space 262 for a second time to cool down. The cooling water in the second space 262 that has exchanged heat flows out from the outlet 264; the gas in the third space 272 that has exchanged heat for the second time and cooled down is then sucked into the first space 252 by the fan 254 through the second flow channel 275, and blown toward the first fin 253 to dissipate heat.

因此,第一、二次熱交換之氣體可於第一空間252及第三空間272作循環流動,第一次熱交換且高溫之氣體並不會流出至機架21之作業空間211,以避免壓接治具22周遭之環境溫度過高,不僅毋需配置大功率且體積大之氣體處理裝置(圖未示出),而有效節省能源成本及利於空間配置,更加迅速確保測試座32及電子元件34於預設測試溫度執行測試作業,進而提高測試品質。Therefore, the gas of the first and second heat exchanges can circulate in the first space 252 and the third space 272, and the high-temperature gas of the first heat exchange will not flow out to the working space 211 of the rack 21, so as to avoid the ambient temperature around the crimping fixture 22 being too high. Not only is it unnecessary to configure a high-power and large-volume gas processing device (not shown), but it can effectively save energy costs and facilitate space configuration, and more quickly ensure that the test socket 32 and the electronic component 34 perform the test operation at the preset test temperature, thereby improving the test quality.

[習知] 電子元件11 測試器12 電路板121 測試座122 外蓋123 散熱鰭片124 預燒爐體13 作業空間131 承架132 入風流道133 出風流道134 [本發明] 機架21 作業空間211 側架212 承架213 壓接治具22 加熱件23 壓缸24 第一板件251 第一空間252 第一鰭片253 風扇254 第二板件261 第二空間262 入口263 出口264 第三板件271A、271B 第三空間272 第二鰭片273 第一流道274 第二流道275 電路板31 測試座32 外蓋33 電子元件34 [Knowledge] Electronic component 11 Tester 12 Circuit board 121 Test seat 122 Cover 123 Heat sink fin 124 Pre-sintering furnace body 13 Working space 131 Support frame 132 Air inlet channel 133 Air outlet channel 134 [Present invention] Frame 21 Working space 211 Side frame 212 Support frame 213 Pressing fixture 22 Heating element 23 Cylinder 24 First plate 251 First space 252 First fin 253 Fan 254 Second plate 261 Second space 262 Inlet 263 Outlet 264 Third plate 271A, 271B Third space 272 Second fin 273 First flow channel 274 Second flow channel 275 Circuit board 31 Test socket 32 Outer cover 33 Electronic component 34

圖1:習知預燒作業設備之局部使用示意圖。 圖2:習知圖1之局部放大示意圖。 圖3:本發明作業設備之局部示意圖。 圖4:本發明壓接機構之示意圖。 圖5至圖7:本發明壓接機構之使用示意圖。 Figure 1: A partial schematic diagram of the known pre-burning operation equipment. Figure 2: A partial enlarged schematic diagram of the known Figure 1. Figure 3: A partial schematic diagram of the operation equipment of the present invention. Figure 4: A schematic diagram of the crimping mechanism of the present invention. Figures 5 to 7: Schematic diagrams of the use of the crimping mechanism of the present invention.

21:機架 21: Rack

211:作業空間 211:Working space

213:承架 213: Frame

22:壓接治具 22: Press-fitting fixture

23:加熱件 23: Heating element

24:壓缸 24: Cylinder

252:第一空間 252: First Space

253:第一鰭片 253: First fin

254:風扇 254: Fan

262:第二空間 262: Second Space

264:出口 264:Export

272:第三空間 272: The Third Space

273:第二鰭片 273: Second fin

274:第一流道 274: First flow channel

275:第二流道 275: Second flow channel

31:電路板 31: Circuit board

32:測試座 32: Test seat

33:外蓋 33: Outer cover

34:電子元件 34: Electronic components

Claims (9)

一種壓接機構,包含: 至少一架置器; 至少一壓接治具:以供壓接電子元件; 至少一溫控結構:裝配於該架置器,包含至少一第一溫控單元、至少一第 二溫控單元及至少一第三溫控單元,該第一溫控單元以供裝配該壓接治具,並設置複數個第一板件以圍構成至少一第一空間,該第一空間具有至少一輸送器 ,該輸送器能夠輸送該第一空間內且與該壓接治具作第一次熱交換之流體,該第二溫控單元位於該第一溫控單元之上方,並以至少一第二板件區隔出至少一第二空間而供配置第一溫控件,該第三溫控單元配置於該第一溫控單元與該第二溫控單元之間,並設有至少一第三板件區隔出至少一第三空間,該第三空間相通該第一空間,以供輸入第一次熱交換之該流體,第一次熱交換之該流體能夠與該第二空間之該第一溫控件作第二次熱交換,該輸送器能夠將該第三空間之第二次熱交換的該流體輸入該第一空間而循環流動。 A crimping mechanism, comprising: At least one mounting device; At least one crimping fixture: for crimping electronic components; At least one temperature control structure: assembled on the mounting device, comprising at least one first temperature control unit, at least one second temperature control unit and at least one third temperature control unit, the first temperature control unit is for assembling the crimping fixture, and a plurality of first plates are arranged to enclose at least one first space, the first space has at least one conveyor , the conveyor can convey the fluid in the first space and undergo the first heat exchange with the crimping fixture, the second temperature control unit is located above the first temperature control unit, and is separated by at least one second plate to form at least one second space for configuring the first temperature control unit, the third temperature control unit is disposed between the first temperature control unit and the second temperature control unit, and is provided with at least one third plate to separate at least one third space, the third space communicates with the first space for inputting the fluid of the first heat exchange, the fluid of the first heat exchange can undergo the second heat exchange with the first temperature control unit of the second space, and the conveyor can input the fluid of the second heat exchange of the third space into the first space for circulation. 如請求項1所述之壓接機構,更包含至少一第一驅動器,該第一驅 動器裝配於該架置器,以供驅動該溫控結構沿壓接軸向位移。 The crimping mechanism as described in claim 1 further comprises at least one first actuator, which is mounted on the mount to drive the temperature control structure to move along the crimping axial direction. 如請求項1所述之壓接機構,其該第一溫控單元之該第一空間與該 第三溫控單元之該第三空間設有相通之第一流道及第二流道,該第一流道以供該第一空間內之第一次熱交換的該流體輸出至該第三空間,該第二流道以供該第三空間之第二次熱交換的該流體輸入至該第一空間。 In the compression mechanism described in claim 1, the first space of the first temperature control unit and the third space of the third temperature control unit are provided with a first flow channel and a second flow channel communicating with each other, the first flow channel is used for the fluid of the first heat exchange in the first space to be output to the third space, and the second flow channel is used for the fluid of the second heat exchange in the third space to be input to the first space. 如請求項1所述之壓接機構,其該第一溫控單元之該第一空間或/及 該第三溫控單元之該第三空間設有至少一鰭片。 In the crimping mechanism described in claim 1, the first space of the first temperature control unit and/or the third space of the third temperature control unit are provided with at least one fin. 如請求項1所述之壓接機構,其該第二溫控單元設置複數個該第二板件以圍構成該第二空間。In the crimping mechanism as described in claim 1, the second temperature control unit is provided with a plurality of second plates to enclose the second space. 如請求項1所述之壓接機構,其該第三溫控單元設置複數個該第三 板件以圍構成該第三空間。 As in the crimping mechanism described in claim 1, the third temperature control unit is provided with a plurality of the third plates to enclose the third space. 如請求項1所述之壓接機構,更包含至少一第二溫控件,該第二溫 控件裝配於該壓接治具。 The crimping mechanism as described in claim 1 further comprises at least one second temperature control unit, which is mounted on the crimping fixture. 一種作業設備,包含: 機架:設置至少一承架,以供承置至少一測試器; 至少一如請求項1至7中任一項所述之壓接機構:裝配於該機架,以供壓接 及溫控該測試器; 中央控制裝置:以供控制及整合該壓接機構作動而執行自動化作業。 A working equipment, comprising: A rack: provided with at least one support frame for supporting at least one tester; At least one crimping mechanism as described in any one of claims 1 to 7: mounted on the rack for crimping and temperature control of the tester; A central control device: for controlling and integrating the movement of the crimping mechanism to perform automated operations. 如請求項8所述之作業設備,其該機架設置至少一第二驅動器,以 供驅動該承架沿壓接軸向位移。 As described in claim 8, the frame of the operating equipment is provided with at least one second driver to drive the support frame to move along the axial direction of the press connection.
TW112147681A 2023-12-07 2023-12-07 Pressing mechanism and processing apparatus TWI883698B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060097337A1 (en) * 2001-08-13 2006-05-11 Haji-Sheikh Michael J Methods of conducting wafer level burn-in of electronic devices
TW201910784A (en) * 2017-08-14 2019-03-16 鴻勁精密股份有限公司 Crimping device for an electronic component crimping mechanism, and test categorization equipment applying the same to quickly dissipate the heat from electronic components for keeping the electronic components in the preset test temperature range, and effectively reduce the assembly space of the jet unit
TW202008107A (en) * 2018-07-24 2020-02-16 致茂電子股份有限公司 High/low-temperature testing apparatus and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060097337A1 (en) * 2001-08-13 2006-05-11 Haji-Sheikh Michael J Methods of conducting wafer level burn-in of electronic devices
TW201910784A (en) * 2017-08-14 2019-03-16 鴻勁精密股份有限公司 Crimping device for an electronic component crimping mechanism, and test categorization equipment applying the same to quickly dissipate the heat from electronic components for keeping the electronic components in the preset test temperature range, and effectively reduce the assembly space of the jet unit
TW202008107A (en) * 2018-07-24 2020-02-16 致茂電子股份有限公司 High/low-temperature testing apparatus and method

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