TW201809695A - Temperature control device for electronic component test sorting machine and temperature control method applying by the same effectively improving the reliability of the test operations performed by electronic components - Google Patents

Abstract

A temperature control device for an electronic component test sorting machine and a temperature control method applying by the same, which mainly ensure that a first batch of electronic components implement test operations within a preset temperature range. The temperature control device comprises a first temperature control device which preheats electronic components, a second temperature control device which preheats the test seat, wherein the first temperature control device preheats the first batch of electronic components to an extent that the surface temperature exceeds the present temperature value by 10-60%, and the second temperature control device preheats the test seat to an extent that the temperature exceeds the preset temperature value by 10%~60%. Thus, when the first batch of electronic components perform the test operation, the internal temperature of the electronic components will not be uncontrolled within the preset temperature range due to heat conduction to the testing device, thereby effectively improving the reliability of the test operations performed by the first batch of electronic components and the effectiveness of the test operation capacity.

Description

Temperature control device for electronic component test classifier and temperature control method for application thereof

The invention particularly relates to a temperature control device for an electronic component test classification machine which can ensure that the first batch of electronic components can ensure that they are within a preset temperature range when performing a test operation, thereby effectively improving reliability Application of temperature control method.

According to the continuous development and innovation of today's technology, the work that could only be completed by the combination of many large electronic circuits in the past has been completely replaced by integrated circuits (ICs). Because ICs undergo multiple channels in the production process, Processing procedures, so in order to ensure product quality, after the IC is manufactured, the industry will perform a circuit test operation to detect whether the IC has been damaged during the manufacturing process, and then detect defective products.

When the IC performs a circuit test operation, the IC is mainly electrically connected to the test machine, and the test program built in the test machine performs the test operation on the IC. However, in order to make the test operation of the IC to automatically supply, test and Sorting and receiving, the equipment industry has designed a test sorting machine. The testing and classifying machine is mainly equipped with a feeding device, a carrying device and a sorting and collecting device. The test provided by the packaging and testing industry is installed in the test area. In addition, the test classification machine is provided with a central control unit. The central control unit is a signal connected to the test machine, and the test machine provides a signal of the test result to the central control unit. The central control unit controls the automation of each device. Feeding, testing and sorting and receiving; that is, the testing and classifying machine made by the equipment manufacturer are all hardware equipment, and the testing machine provided by the packaging and testing industry are all software equipment. Set on the test classifier, the test classifier can The test result signals automatically supply, test, and classify and collect. Therefore, the foregoing is mainly to explain the differences between the test classifier and the tester. As mentioned earlier, the testing machine is provided by the packaging and testing industry, and the testing machine has many built-in testing programs and testing information. Because this information involves a lot of trade secrets, the packaging and testing industry usually does not provide this information to the public. The test classifiers made for equipment manufacturers have caused equipment manufacturers to make test classifiers that meet the needs of packaging and testing operators as much as possible, making it impossible to avoid some false test situations during the test operation.

In terms of the test temperature of electronic components, different electronic components may be applied in high-temperature operating environments or low-temperature operating environments. Therefore, when performing test operations, the electronic components must be simulated in the actual operating environment. The test is performed within a preset temperature range, so the test classifier must be additionally equipped with a temperature control device to enable the electronic components to perform hot or cold test operations within the preset temperature range. However, electronic components can distinguish between internal temperature (Tj) and surface temperature (Tc). In the temperature control process of testing operations, the packaging and testing industry uses the internal temperature (Tj) of electronic components as the preset temperature range standard, and The internal temperature (Tj) of the electronic component must be read through the electrical connection of the tester. When the tester of the packaging and testing industry does not open the internal temperature (Tj) of the electronic component, the test classification made by the equipment supplier The machine can only read the surface temperature (Tc) of the electronic component by contacting the surface of the electronic component with the temperature sensor of the temperature control device, and estimate whether the internal temperature (Tj) of the electronic component is based on the surface temperature (Tc) of the electronic component. Within the preset temperature range, and when the temperature of the test machine and the temperature of the electronic component have a large temperature difference and the heat conduction effect is aggravated, the internal temperature (Tj) of the electronic component often cannot be In the temperature range, this situation is common in the first batch of testing of electronic components.

Please refer to FIG. 1. The test sorting machine made by the equipment manufacturer is provided with a pressing arm 21 that can be driven up and down by a driving source. A cooling chip 22 is installed at the end of the pressing arm 21. In the heating mode, The direction of current is to make the cooling chip 22 The heat generating surface at the lower side generates a hot surface, and the upper side is a heat absorbing end. The hot surface generated by the cooling chip 22 when energized can exchange cold and heat with the electronic component 30. The end of the pressing arm 21 is provided with a heat absorption surface. The mouth 23 and a protrusion are provided with a temperature sensor 24, which is pushed out by the end of the spring 25 to push out the end of the pressing arm 21, and the signal is connected to the signal converter 26 by a line, and the signal is converted The device 26 is further connected to a central control unit 27. The central control unit 27 is connected to a power supply 28. The power supply 28 can control the amount of current output to the cooling chip 22, and adjust and control the cooling chip 22. The output power is used to control the heating degree of the cooling chip 22; a test base 40 which can be electrically connected to the electronic component 30, and the test base 40 is electrically connected to a testing machine 41 provided by a packaging and testing industry. The testing machine 41 The signal is connected to the central control unit 27 of the test classification machine, and the test machine 41 provides a signal of the test result to the central control unit 27, and the central control unit 27 controls each device to automatically supply, test and classify the material. When the pressing arm 21 picks up and down the electronic component 30 and performs the test operation on the test base 40, the temperature sensor 24 can keep contact with the surface of the electronic component 30 by the elastic force of the spring 25, and sense the electronic component. The surface temperature (Tc) signal of 30 is transmitted to the signal converter 26. The signal converter 26 converts the temperature signal and then transmits it to the central control unit 27. After receiving the temperature signal, the central control unit 27 performs the preset temperature range. The comparison operation is performed, and the temperature difference obtained after the comparison operation is converted into the amount of current required for the cooling chip 22, and then the required amount of current is output to the cooling chip 22 by the power supply 28, and the cooling is adjusted and controlled The output power (P) of the wafer 22 is used to control the heating degree of the cooled wafer 22. As mentioned above, the packaging and testing industry uses the internal temperature (Tj) of the electronic component 30 as a preset temperature range standard, and the internal temperature (Tj) of the electronic component 30 must be obtained by reading the test machine 41. When the testing machine 41 of the packaging and testing industry is not open to provide the internal temperature (Tj) of the electronic component 30, the test classification machine made by the equipment industry can only be read by the surface temperature (Tc) of the electronic component through the temperature sensor 24. Estimate its internal temperature (Tj) Whether the temperature is within a preset temperature range, but this method often causes a mismeasurement during the test operation of the first batch of electronic components. For example, the preset temperature range is 130 ± 10 ° C. The cold wafer 22 can heat the surface temperature (Tc) of the electronic component 30 in a temperature range of 130 ± 10 ° C. However, since the temperature of the tester 41 during the initial test is only about 15-25 ° C, the electronic component The internal temperature (Tj) of 30 will be transmitted to the testing machine 41 through the test base 40, resulting in the internal temperature (Tj) of the electronic component 30 being lower than the preset temperature range of 130 ± 10 ° C. The temperature (Tj) is lower than the preset temperature range. At this time, the tester 41 sends a signal to the central control unit 27 as a defective product, and the electronic component 30 is placed in the defective product area. Actually, the electronic component 30 It is not a real defective product, it is just that the internal temperature (Tj) is lower than the preset temperature range due to heat conduction to the test machine 41, and this kind of mismeasurement must be continued until the test machine 41 heats up to a considerable degree through heat conduction Can make subsequent electrons The thermal conductivity of the electronic component is reduced, and the internal temperature (Tj) of the subsequent electronic components will approach the surface temperature (Tc) and improve. Generally speaking, after testing about 3 or 4 first batch of electronic components, this kind of The situation of mistesting can be improved. Since the first 3 or 4 first batch of electronic components are not truly defective, the last 3 or 4 first batch of electronic components are finally retested, which will affect the Test classifier test capacity.

In view of this, the inventor then used his years of research and development and production experience in related industries to conduct in-depth research on the current problems. After long-term research and trial work, he finally developed an electronic component that enables the first batch of electronic components. Effectively improve the reliability when performing the test operation, and then effectively avoid the problem of re-testing due to mis-testing, which is the design purpose of the present invention.

A first object of the present invention is to provide a temperature control device for an electronic component test classification machine and a temperature control method for the same. The temperature control device includes an electronic component A first temperature control device for pre-warming means and a second temperature control device for pre-warming means for the test stand. The first temperature control device pre-heats the surface temperature of the first batch of electronic components beyond a preset temperature. The temperature value is 10% ~ 60%, and the second temperature control device preheats the test seat to a preset temperature value of 10% ~ 60%; thus, when the first batch of electronic components is performing a test operation At this time, the internal temperature of the electronic component cannot be controlled within a preset temperature range due to heat conduction to the testing machine, thereby effectively improving the reliability of the first batch of electronic components performing the test operation.

The second object of the present invention is to provide a temperature control device for an electronic component test classification machine and a temperature control method for the application, which mainly make the first batch of electronic components to ensure that their internal temperature is within In the set temperature range, the situation of retesting due to mismeasurement is avoided to achieve the benefit of effectively increasing the test capacity.

Learning part:

21‧‧‧Press arm

22‧‧‧Refrigerated Chip

23‧‧‧Nozzle

24‧‧‧ Temperature Sensor

25‧‧‧Spring

26‧‧‧Signal Converter

27‧‧‧ Central Control Unit

28‧‧‧ Power Supply

30‧‧‧Electronic components

40‧‧‧Test Block

41‧‧‧testing machine

Part of the invention:

50‧‧‧feeding device

51‧‧‧ tray

60‧‧‧Receiving device

61‧‧‧Tray

70‧‧‧ conveyor

71‧‧‧The first material transfer mechanism

711‧‧‧The first feeder

72‧‧‧Reproduced by

721‧‧‧The first feeding platform

722‧‧‧Second feeding platform

723‧‧‧The first receiving platform

724‧‧‧Second receiving platform

725‧‧‧First pressing arm

726‧‧‧Second pressing arm

727‧‧‧Nozzle

728‧‧‧Nozzle

73‧‧‧Second material transfer mechanism

731‧‧‧second feeder

80‧‧‧test device

81‧‧‧test circuit board

82‧‧‧Test Block

90‧‧‧Pre-warming plate

91‧‧‧Refrigerated chip

92‧‧‧Temperature Sensor

921‧‧‧Spring

93‧‧‧Signal Converter

94‧‧‧ Power Supply

95‧‧‧ closed container

96‧‧‧ temperature fluid supply line

100‧‧‧ Central Control Unit

110‧‧‧testing machine

120‧‧‧Electronic components

Figure 1: Schematic diagram of the temperature control architecture of a conventional electronic component test classifier.

Fig. 2: Schematic diagram of the configuration of the electronic component test classifier of the present invention.

Fig. 3: Schematic diagram of the temperature control architecture of the electronic component test and classification machine of the present invention.

Figure 4: Schematic diagram of the temperature control process of the electronic component test and classification machine of the present invention.

Figure 5: Schematic diagram of the temperature control operation of the electronic component test and classification machine of the present invention (1).

Figure 6: Schematic diagram of the temperature control operation of the electronic component test and classification machine of the present invention (2).

Figure 7: Schematic diagram of the temperature control operation of the electronic component test and classification machine of the present invention (3).

In order to make your reviewing committee further understand the present invention, the preferred embodiment will be given in conjunction with the drawings, and detailed as follows: Please refer to Figs. 2 and 3, the electronic component test classifier of the present invention includes a feeding device 50. Receiving device 60, conveying device 70, testing device 80, temperature control device and central control unit 100. The feeding device 50 is arranged on the machine. It is used to accommodate at least one electronic component to be tested. In this embodiment, the feeding device 50 is configured with at least one tray 51 for containing the electronic component to be tested. The receiving device 60 is configured on the machine. It is used for accommodating at least one electronic component under test. In this embodiment, a plurality of trays 61 capable of holding different levels of electronic components under test are provided. The test device 80 is provided with a test circuit board with a test base 82. 81. The test base 82 is provided with a probe and is electrically connected to the testing machine 110 provided by the packaging and testing industry. The conveying device 70 is arranged on the machine and is provided with at least one material transfer mechanism with a material transfer device. Used to transfer electronic components. In this embodiment, the conveying device 70 includes a first transfer mechanism 71, a transfer mechanism 72, and a second transfer mechanism 73. The first transfer mechanism 71 is provided with at least one A first transfer device 711 is used to transfer the electronic components to be tested between the feeding device 50 and the transfer mechanism 72. The second transfer mechanism 73 is provided with at least one second transfer device 731 for transferring The tested electronic components are transferred between the mechanism 72 and the receiving device 60. The reprint mechanism 72 is for testing. The two sides of the device 80 are respectively provided with a first feeding stage 721, a second feeding stage 722, a first receiving stage 723, and a second receiving stage 724, which are used for the first material moving mechanism 71 and The second material transfer mechanism 73 carries the electronic components to be tested / completed. In addition, in order to reproduce the electronic components to be tested on the first feeding stage 721 and the second feeding stage 722 on the test base 82, and The electronic components tested in the test base 82 are reproduced on the first receiving stage 723 and the second receiving stage 724. The first pressing arm 725 and the second pressing arm 726 are respectively provided at the front and rear of the test base 82. In addition to the first pressing arm 725 and the second pressing arm 726 provided with suction nozzles 727 and 728 for picking and placing the reprinted electronic component, respectively, when the electronic component is reprinted in the test base 82, the electronic component can also be pressed down, The electronic component ensures that the probe is electrically connected to the probe in the test base 82, so that the tester 110 performs a test operation on the electronic component by using a built-in test program, and transmits the test result to the central control unit 100. The central control unit 100 Controls the operation of each device based on the test results. Process known as learning technology, and This is not the focus of this case, so it will not be repeated; the temperature control device includes a first temperature control device for pre-warming means for electronic components, and a second temperature control device for pre-warming means for test base 82. A temperature control device uses a first temperature generator and a temperature sensor to pre-warm the electronic components. The first temperature generator may be a pre-temperature plate 90 provided on the machine table, so that the electronic components to be tested are placed. Pre-heating on the pre-temperature plate 90 before the test base 82, the first temperature generator may be a heater provided on the first feeding stage 721 and the second feeding stage 722, so that the first supply stage The material carrier 721 and the second supply carrier 722 pre-heat the electronic components to be measured during the reloading process. The first temperature generator may be one of the first and second pressing arms 725 and 726. The heater enables the first pressing arm 725 and the second pressing arm 726 to pre-heat the electronic components to be measured during reprinting. In this embodiment (taking the first pressing arm 725 as an example, the second pressing arm 726 Is the same as the first pressing arm 725), and the first temperature generator is a refrigerating chip 91 (such as the third (Shown), and the temperature sensor 92 is disposed below the first pressing arm 725, and the temperature sensor 92 can be protruded from the end of the first pressing arm 725 by the ejection of the spring 921, In order to sense the surface temperature of the electronic component, the temperature sensor 92 also connects a signal to a signal converter 93 by a line. The signal converter 93 is further connected to a central control unit 100, which is connected to a power supply. 94. The power supply 94 can control the amount of current output to the cooling chip 91, and adjust the output power of the cooling chip 91 to control the degree of cooling and heating of the cooling chip 91. In addition, the second temperature control device is based on The second temperature generator pre-heats the test base 82. The second temperature generator may be a heater provided on the test base 82, so that the test base 82 is pre-warmed before placing the electronic components. The second temperature The generator may be a heater provided on the first pressing arm 725, so that the test base 82 presses the probe in the testing base 82 with the heater on the first pressing arm 725 before placing the electronic component, The test base 82 is pre-warmed. The second temperature generator may be set at the test position. The closed chamber 95 measured by the test seat 82 weekly, and the closed chamber The temperature fluid supply line 96 is connected in the chamber 95, so that the test base 82 is pre-warmed by injecting temperature fluid before placing the electronic components (as shown in FIG. 3).

Please refer to Figures 4 and 5, taking the preset temperature range of 130 ± 10 ℃ for electronic components as an example. Since the temperature of the testing machine 110 during the initial test is only about 15 ~ 25 ℃, in order to avoid the A batch of electronic components will be conducted to the testing machine 110 through a large amount of heat from the test base 82, and the internal temperature (Tj) of the first batch of electronic components will be lower than the preset temperature range of 130 ± 10 ° C. The pre-heating means of the test base 82 is used to pre-warm the test base 82 to a preset temperature value of 10% to 60%. In this embodiment, the pre-heating means of the test base 82 is controlled by the central control unit 100. The second temperature generator of the two temperature control devices opens the temperature fluid supply pipe 96 to inject the temperature fluid into the closed chamber 95, so that the test base 82 is preheated to a temperature value that exceeds a preset temperature by 10% to 60%.

Please refer to FIGS. 4 and 6. After the test base 82 starts to warm up, the present invention pre-warms the first batch of electronic components 120 so that the surface temperature of the first batch of electronic components 120 is pre-warmed. The preset temperature value is 10% ~ 60%. In this embodiment, the pre-warming means of the first batch of electronic components 120 is placed in front of the test batch 82 of the first batch of electronic components 120 in the center. The control unit 100 controls the first temperature generator of the first temperature control device to pre-warm the first batch of electronic components 120. The central control unit 100 controls the first pressing arm 725 to reprint and suck the first batch of electronic components 120. At the same time, the cooling chip 91 is activated to heat the first batch of electronic components 120 at the same time, because the temperature sensor 92 is capable of sensing the surface temperature of the first batch of electronic components 120, and passing the sensing signal through the signal converter 93 is transmitted to the central control unit 100, and the central control unit 100 controls the amount of current output from the power supply 94 to the cooling chip 91, and adjusts and controls the output power of the cooling chip 91, thereby controlling the cooling chip 91 to heat the first batch Surface temperature of the sub-electronic component 120 exceeds Predetermined temperature value of 10 to 60% (about 160 ℃).

Please refer to FIGS. 4 and 7. When the first pressing arm 725 places the pre-warmed first batch of electronic components 120 in the test base 82, the first batch of electronic components 120 is about to exceed the preset temperature. The value of the thermal energy is transmitted to the test base 82 and the tester 110; thus, the present invention has pre-heated the test base 82 because the second temperature generator of the second temperature control device has pre-heated the first temperature generator of the first temperature control device. It also allows part of the thermal energy of the first batch of electronic components 120 to be transmitted to the test base 82, so that not only the test base 82 and the tester 110 can be heated to a preset temperature range close to 130 ± 10 ° C, which is closer to the electronic component performing the test operation, and The internal temperature of the first batch of electronic components 120 can be controlled within a preset temperature range of 130 ± 10 ° C, so that the first batch of electronic components 120 can perform a test operation within a preset temperature range, thereby effectively improving The reliability of the first batch of electronic components 120 to perform the test operation, thereby avoiding the situation that the test must be re-tested due to mis-measurement, and the benefit of effectively increasing the test productivity is achieved. According to the present invention, when the first batch of electronic components has completed the test operation, and the test base 82 and the tester 110 are heated to a preset temperature range approaching the preset temperature range of 130 ± 10 ° C for the electronic component to perform the test operation, the central control unit 100 is The current of the power supply 94 of the first temperature control device is controlled, and the output power of the cooling chip 91 is adjusted to reduce, so as to control the surface temperature of the electronic components of the cooling wafer 91 to heat subsequent batches to a preset temperature range of 130 ± 10 ℃, because the test base 82 and the testing machine 110 have heated up to the preset temperature range of 130 ± 10 ° C, which is close to the electronic component performing the test operation, the thermal energy of the subsequent batch of electronic components will not be conducted to the test in large quantities. The base 82 and the testing machine 110, and then the subsequent batch of electronic components can approach the surface temperature of the preset temperature range 130 ± 10 ° C to perform the test operation.

In summary, the temperature control device of the test classification machine of the present invention can not only pre-warm the electronic components and the test stand separately, so that the first batch of electronic components can be guaranteed in the preset temperature range when performing the test operation. It can also keep the electronic components of subsequent batches within the preset temperature range through the control of the central control unit. Effectively increasing the testing capacity is a practical and progressive design. However, the same products and publications have not been disclosed. This allows the invention patent application requirements to be met, and applications are submitted in accordance with the law.

725‧‧‧First pressing arm

726‧‧‧Second pressing arm

727‧‧‧Nozzle

728‧‧‧Nozzle

81‧‧‧test circuit board

82‧‧‧Test Block

91‧‧‧Refrigerated chip

92‧‧‧Temperature Sensor

93‧‧‧Signal Converter

94‧‧‧ Power Supply

95‧‧‧ closed container

96‧‧‧ temperature fluid supply line

100‧‧‧ Central Control Unit

110‧‧‧testing machine

120‧‧‧Electronic components

Claims (10)

A temperature control device for an electronic component test classifier. The electronic component test classifier is provided with a feeding device, a receiving device, a conveying device, a test device, a temperature control device, and a central control unit. The test device is provided with a test device. The test circuit board of the base is electrically connected to the testing machine provided by the packaging and testing industry. The temperature control device includes: a first temperature control device: a first temperature generator and a temperature sensor to be tested The electronic components are pre-warmed. The first temperature generator pre-warms the electronic components to be tested, and the temperature sensor senses the surface temperature of the electronic components to be tested, and a signal is connected to the central control unit; The second temperature control device is a means for pre-warming the test stand of the test device with a second temperature generator. The temperature control device of the electronic component test and classification machine according to item 1 of the scope of the patent application, wherein the conveying device is provided with at least one pressing arm, and the pressing arm is provided with pick-and-place reproduction of the electronic component to be tested And press down the electronic component under test in the test base, so that the electronic component under test remains electrically connected to the test base, and the tester uses its built-in test program to test the electronic component under test. The electronic components perform test operations and transmit the test results to the central control unit. According to the temperature control device of the electronic component test classifier according to item 2 of the scope of the patent application, wherein the first temperature generator of the first temperature control device is a heater provided on the pressing arm, so that the pressing The arm pre-heats the electronic component to be tested when it is transferred and sucked. According to the temperature control device of the electronic component test classifier according to item 3 of the scope of the patent application, wherein the first temperature generator is a cooling chip, and the central control unit is connected to a power supply, the power supply Controllable output to the refrigeration The amount of current of the chip, and the output power of the cooling chip is adjusted and controlled. According to the temperature control device of the electronic component test and classification machine according to item 1 of the scope of the patent application, wherein the first temperature generator of the first temperature control device is a pre-temperature plate set on the machine, so that the The electronic components are pre-warmed on the pre-temperature plate before being placed in the test base. The temperature control device of the electronic component test and classification machine according to item 2 of the scope of patent application, wherein the second temperature generator of the second temperature control device is a heater provided on the pressing arm, so that the pressing The heater of the arm preheats the test stand. According to the temperature control device of the electronic component test classification machine according to item 1 of the scope of the patent application, wherein the second temperature generator of the second temperature control device is a closed chamber set at the periphery of the test base, and A temperature fluid supply pipeline is connected to the closed chamber, so that the temperature fluid supply pipeline pre-warms the test base with temperature fluid. According to the temperature control device of the electronic component test classifier according to item 1 of the scope of the patent application, wherein the second temperature generator of the second temperature control device is a heater provided on the test base, the heater is The test stand is pre-warmed. A temperature control method for a temperature control device of an electronic component test classification machine according to item 1 of the scope of patent application, which makes the first batch of electronic components to be tested perform a test operation within a preset temperature range. The control method includes: the pre-heating means of the test base: it uses the second temperature generator of the second temperature control device to pre-heat the test base to exceed the preset temperature value by 10% to 60%; Temperature means: It uses the first temperature generator of the first temperature control device to pre-warm the first batch of electronic components to be tested, and uses the temperature sensor to sense the first batch of electronic components to be tested. Surface temperature, the temperature sensor signal is connected to the central control Unit, the central control unit controls the first temperature generator of the first temperature control device, so that the surface temperature of the first batch of electronic components to be measured is pre-heated to exceed a preset temperature value by 10% to 60%. The temperature control method according to item 9 of the scope of patent application, wherein after the first batch of electronic components to be tested completes the test operation, the central control unit controls the first temperature generator of the first temperature control device The output power is reduced, so as to control the first temperature generator to pre-heat the surface temperature of the electronic components to be tested in subsequent batches to a preset temperature range and perform the test operation.