TWI862191B - Test socket - Google Patents
Test socket Download PDFInfo
- Publication number
- TWI862191B TWI862191B TW112137138A TW112137138A TWI862191B TW I862191 B TWI862191 B TW I862191B TW 112137138 A TW112137138 A TW 112137138A TW 112137138 A TW112137138 A TW 112137138A TW I862191 B TWI862191 B TW I862191B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive
- conductive elastic
- elastic sheet
- test
- elastic
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 196
- 229910052751 metal Inorganic materials 0.000 claims abstract description 187
- 239000002184 metal Substances 0.000 claims abstract description 186
- 239000000523 sample Substances 0.000 claims description 105
- 239000012530 fluid Substances 0.000 claims description 55
- 239000002245 particle Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 23
- 238000010586 diagram Methods 0.000 description 35
- 230000000694 effects Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 9
- 230000008859 change Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 3
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 206010067484 Adverse reaction Diseases 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- 230000006838 adverse reaction Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Examining Or Testing Airtightness (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
本發明係關於半導體測試之技術,尤指一種測試座。 The present invention relates to semiconductor testing technology, particularly a test socket.
於半導體封裝測試中,通常使用具有複數探針之測試座(Socket)供例如半導體封裝件或晶片之待測物置入,再藉由各探針與半導體封裝件或晶片電性連接後,使測試訊號經各探針傳送至半導體封裝件或晶片,以達到測試之目的。 In semiconductor package testing, a test socket with multiple probes is usually used to place the object to be tested, such as a semiconductor package or chip. After each probe is electrically connected to the semiconductor package or chip, the test signal is transmitted to the semiconductor package or chip through each probe to achieve the purpose of testing.
隨著測試條件逐漸嚴苛,測試過程中對訊號品質要求愈來愈高,因此,探針與待測物之間的傳遞路徑,在測試介面上扮演著非常重要的角色,是以,如何縮短傳遞路徑或是提升接觸介面之間的接觸性成為業界待解課題之一。 As test conditions become increasingly stringent, the signal quality requirements during the test process are becoming increasingly higher. Therefore, the transmission path between the probe and the DUT plays a very important role in the test interface. Therefore, how to shorten the transmission path or improve the contact between the contact interfaces has become one of the issues to be solved in the industry.
如圖1所示,為習知測試座對待測物進行測試之示意圖,如圖所示,測試插座100包括具有複數導通孔102之底座101以及分設於各該導通孔102中之探針103,其中,該測試插座100係設於一測試設備104上,以自該測試設備104接收測試訊號,其中,該測試設備104可例如為一印刷電路板(Printed circuit board,PCB)。於測試時,將具有複數導電塊91(例如焊球)之待測物9置於該底座101上,且向下對待測物9施力,使待測物9
之導電塊91與探針103之探針頭直接電性接觸,測試訊號即可經過各該探針103及各該導電塊91而傳送至待測物9,以進行待測物9之測試。
As shown in FIG. 1 , it is a schematic diagram of a conventional test socket testing a DUT. As shown in the figure, a
惟,於測試過程中,探針103之探針頭常為圓球狀或針狀結構,且測試插座100之探針103與待測物9之導電塊91皆為固態的硬質金屬,故該探針頭與該導電塊91之間以點接觸之方式相接,是以,兩者之間存在接觸性不佳且穩定性差之問題,此將導致於介面處(即該探針頭與該導電塊91之接觸處)產生較高的接觸阻值,隨著接觸阻值升高,又將造成測試訊號之電流通過探針頭與導電塊91之接觸處時發生嚴重的電熱效應,而電熱效應所產生的高溫又將影響探針103之彈力,使探針103之彈力下降,此後,探針103與待測物9的接觸性因之不穩而變差,最終引發一連串的惡性循環;另外,由於習知之探針103於測試時,探針頭受到內部之彈簧的彈力驅使而推頂待測物9之導電塊91,此將使得探針頭磨損,更因之產生金屬碎屑而造成探針頭髒汙以及前述之接觸阻值升高,甚者還可能造成導電塊91或探針頭之間短路而損壞待測物9,故須常利用特殊之清潔物品進行探針頭之清潔,以避免前述之各種不良反應;又,於發生前述探針頭磨耗致探針103損壞時,必須對不堪使用之探針103進行更換,但測試插座100中設置許多探針103,要在眾多探針103中尋找損壞者相當困難且耗時,十分不便。
However, during the test process, the probe head of the
鑑於上述問題,如何提供一種測試座,特別是,可提供探針與待測物之間良好的接觸穩定性,同時能有效降低接觸阻值,避免隨之產生的電熱效應發生,此將成為目前本技術領域人員急欲追求之目標。 In view of the above problems, how to provide a test socket, especially one that can provide good contact stability between the probe and the object to be tested, and at the same time effectively reduce the contact resistance and avoid the resulting electrothermal effect, will become a goal that people in this technical field are eager to pursue.
為解決上述現有技術之問題,本發明揭露一種測試座,係包括:基座,具有第一表面、相對該第一表面之第二表面以及連通該第一表面及該第二表面之複數通孔;導電彈性片,位該基座之該第一表面上方;以及複數彈力金屬件,分別設於各該複數通孔中,其中,各該彈力金屬件具有朝向該導電彈性片之第一接觸端,且該第一接觸端包含適於沒入該導電彈性片之凸塊。 In order to solve the above-mentioned problems of the prior art, the present invention discloses a test seat, which includes: a base having a first surface, a second surface opposite to the first surface, and a plurality of through holes connecting the first surface and the second surface; a conductive elastic sheet located above the first surface of the base; and a plurality of elastic metal parts respectively disposed in each of the plurality of through holes, wherein each of the elastic metal parts has a first contact end facing the conductive elastic sheet, and the first contact end includes a bump suitable for being immersed in the conductive elastic sheet.
於一實施例中,各該彈力金屬件之該凸塊係適於刺穿該導電彈性片之表面,以沒入該導電彈性片之內部。 In one embodiment, the protrusion of each elastic metal piece is suitable for piercing the surface of the conductive elastic sheet to penetrate into the interior of the conductive elastic sheet.
於一具體實施例中,各該彈力金屬件之該凸塊為複數個,且為尖狀。 In a specific embodiment, the protrusions of each elastic metal part are plural and pointed.
於另一實施例中,各該彈力金屬件之該凸塊係壓抵該導電彈性片而陷入該導電彈性片,使該導電彈性片包覆該凸塊。 In another embodiment, the protrusion of each elastic metal part is pressed against the conductive elastic sheet and sunk into the conductive elastic sheet, so that the conductive elastic sheet covers the protrusion.
於另一實施例中,各該彈力金屬件係為彈簧探針、垂直式探針或微機電探針。 In another embodiment, each of the elastic metal parts is a spring probe, a vertical probe or a micro-electromechanical probe.
於另一實施例中,該導電彈性片設於該基座之一框座上,以與各該彈力金屬件之該凸塊間有一間隔距離。 In another embodiment, the conductive elastic sheet is disposed on a frame of the base so as to have a spacing distance between the protrusions of each of the elastic metal parts.
於另一實施例中,該凸塊之長度大於等於0.01毫米(mm)且小於該導電彈性片之厚度。 In another embodiment, the length of the bump is greater than or equal to 0.01 millimeters (mm) and less than the thickness of the conductive elastic sheet.
於另一實施例中,各該彈力金屬件復包括用以設於各該通孔中之彈性體、可轉動地設於該彈性體且供該第一接觸端連接之金屬塊以及與該金屬塊連接且朝向該第二表面延伸之第二接觸端。 In another embodiment, each of the elastic metal parts further includes an elastic body disposed in each of the through holes, a metal block rotatably disposed on the elastic body and connected to the first contact end, and a second contact end connected to the metal block and extending toward the second surface.
於另一實施例中,該基座為金屬座體,該導電彈性片包括分別對應各該彈力金屬件之複數導電彈性區以及分布於各該導電彈性區內之複數導電粒子,其中,各該導電彈性區之寬度大於各該通孔之孔徑,使各該導電彈性區接觸該基座。 In another embodiment, the base is a metal base, and the conductive elastic sheet includes a plurality of conductive elastic regions corresponding to each of the elastic metal parts and a plurality of conductive particles distributed in each of the conductive elastic regions, wherein the width of each of the conductive elastic regions is greater than the aperture of each of the through holes, so that each of the conductive elastic regions contacts the base.
於另一實施例中,該導電彈性片之厚度大於等於0.15毫米且小於或等於2毫米。 In another embodiment, the thickness of the conductive elastic sheet is greater than or equal to 0.15 mm and less than or equal to 2 mm.
於另一實施例中,該導電彈性片之厚度大於等於0.15毫米且小於等於0.4毫米。 In another embodiment, the thickness of the conductive elastic sheet is greater than or equal to 0.15 mm and less than or equal to 0.4 mm.
於另一實施例中,該導電彈性片包括基板以及分布於該基板內之複數導電粒子。 In another embodiment, the conductive elastic sheet includes a substrate and a plurality of conductive particles distributed in the substrate.
於另一實施例中,各該導電粒子粒徑大於等於0.005毫米且小於等於0.1毫米。 In another embodiment, the particle size of each conductive particle is greater than or equal to 0.005 mm and less than or equal to 0.1 mm.
於另一實施例中,該複數導電粒子於該導電彈性片中之占比為大於等於30%且小於等於90%。 In another embodiment, the proportion of the plurality of conductive particles in the conductive elastic sheet is greater than or equal to 30% and less than or equal to 90%.
於另一實施例中,復包括另一導電彈性片位於該基座之該第二表面下方。 In another embodiment, another conductive elastic sheet is further included below the second surface of the base.
於另一實施例中,該導電彈性片具有相對之第一接觸面以及第二接觸面,且該導電彈性片以該第一接觸面朝該第一表面設置於該基座上,且該第二接觸面對應各該彈力金屬件處具有凸出該第二接觸面之複數凸墊。 In another embodiment, the conductive elastic sheet has a first contact surface and a second contact surface opposite to each other, and the conductive elastic sheet is disposed on the base with the first contact surface facing the first surface, and the second contact surface has a plurality of protruding pads protruding from the second contact surface at locations corresponding to each of the elastic metal parts.
於另一實施例中,該導電彈性片覆蓋於該基座之該第一表面,以密封各該通孔。 In another embodiment, the conductive elastic sheet covers the first surface of the base to seal each of the through holes.
於另一實施例中,該基座復包括設於該導電彈性片周側且具有一流體入口及一流體出口之架體,該導電彈性片設於該基座之該第一表面上,且該架體與該導電彈性片之上側面形成與該流體入口及該流體出口連通以供流體進入之流體空間。 In another embodiment, the base further includes a frame disposed around the conductive elastic sheet and having a fluid inlet and a fluid outlet. The conductive elastic sheet is disposed on the first surface of the base, and the frame and the upper side of the conductive elastic sheet form a fluid space connected to the fluid inlet and the fluid outlet for fluid to enter.
於另一實施例中,該導電彈性片包括具有複數導電彈性區的基板以及分布於各該導電彈性區內之複數導電粒子,且至少一該導電彈性區對應至少二該彈力金屬件。 In another embodiment, the conductive elastic sheet includes a substrate having a plurality of conductive elastic regions and a plurality of conductive particles distributed in each of the conductive elastic regions, and at least one of the conductive elastic regions corresponds to at least two of the elastic metal parts.
於另一實施例中,本發明復復包括一導電件,且該導電彈性片包括具有分別對應各該彈力金屬件之複數導電彈性區的基板以及分布於各該導電彈性區內之複數導電粒子,其中,該導電件電性連接至少二該導電彈性區。 In another embodiment, the present invention further comprises a conductive member, and the conductive elastic sheet comprises a substrate having a plurality of conductive elastic regions respectively corresponding to each of the elastic metal members and a plurality of conductive particles distributed in each of the conductive elastic regions, wherein the conductive member electrically connects at least two of the conductive elastic regions.
於另一實施例中,該彈力金屬件為接地探針或電源探針。 In another embodiment, the elastic metal part is a ground probe or a power probe.
於另一實施例中,該導電彈性片之周側設有支撐體,該導電彈性片藉由該支撐體設於該基座上,使該導電彈性片與該第一表面或該第二表面之間具有間隙,以供各該彈力金屬件之兩端能分別凸出該基座之該第一表面和該第二表面,且與該導電彈性片接觸。 In another embodiment, a supporting body is provided around the conductive elastic sheet, and the conductive elastic sheet is provided on the base through the supporting body, so that there is a gap between the conductive elastic sheet and the first surface or the second surface, so that the two ends of each of the elastic metal parts can protrude from the first surface and the second surface of the base respectively and contact the conductive elastic sheet.
於又一實施例中,各該彈力金屬件之該凸塊刺穿該導電彈性片之下表面而沒入該導電彈性片時,該凸塊之頂端與該導電彈性片之上表面之距離小於0.35毫米,或是該凸塊之頂端與該導電彈性片之上表面之間的距離於該導電彈性片之厚度的佔比為85%以下。 In another embodiment, when the bump of each elastic metal part pierces the lower surface of the conductive elastic sheet and sinks into the conductive elastic sheet, the distance between the top of the bump and the upper surface of the conductive elastic sheet is less than 0.35 mm, or the distance between the top of the bump and the upper surface of the conductive elastic sheet accounts for less than 85% of the thickness of the conductive elastic sheet.
本發明復揭露一種測試座,係包括:基座,具有第一表面、相對該第一表面之第二表面以及連通該第一表面及該第二表面之複數通孔;複 數彈力金屬件,分別設於各該複數通孔中;以及導電彈性片,位於該基座及該複數彈力金屬件上方,且厚度小於等於2毫米。 The present invention further discloses a test stand, comprising: a base having a first surface, a second surface opposite to the first surface, and a plurality of through holes connecting the first surface and the second surface; a plurality of elastic metal parts, respectively disposed in each of the plurality of through holes; and a conductive elastic sheet, located above the base and the plurality of elastic metal parts, and having a thickness of less than or equal to 2 mm.
於一實施例中,該導電彈性片之厚度為小於等於0.4毫米。 In one embodiment, the thickness of the conductive elastic sheet is less than or equal to 0.4 mm.
於另一實施例中,各該彈力金屬件具有朝向該導電彈性片之第一接觸端,該第一接觸端包含適於刺穿該導電彈性片之表面的凸塊,使該凸塊能沒入該導電彈性片之內部。 In another embodiment, each of the elastic metal parts has a first contact end facing the conductive elastic sheet, and the first contact end includes a protrusion suitable for piercing the surface of the conductive elastic sheet so that the protrusion can be immersed in the interior of the conductive elastic sheet.
於另一實施例中,該凸塊為複數個,且為尖狀。 In another embodiment, the bumps are plural and pointed.
於另一實施例中,該凸塊之長度大於等於0.01毫米且小於該導電彈性片之厚度。 In another embodiment, the length of the bump is greater than or equal to 0.01 mm and less than the thickness of the conductive elastic sheet.
於另一實施例中,該基座為金屬座體,該導電彈性片包括分別對應各該彈力金屬件之複數導電彈性區以及分布於各該導電彈性區內之複數導電粒子,其中,各該導電彈性區之寬度大於各該通孔之孔徑,使各該導電彈性區接觸該基座。 In another embodiment, the base is a metal base, and the conductive elastic sheet includes a plurality of conductive elastic regions corresponding to each of the elastic metal parts and a plurality of conductive particles distributed in each of the conductive elastic regions, wherein the width of each of the conductive elastic regions is greater than the aperture of each of the through holes, so that each of the conductive elastic regions contacts the base.
於另一實施例中,該導電彈性片之該厚度大於等於0.15毫米且小於等於0.4毫米。 In another embodiment, the thickness of the conductive elastic sheet is greater than or equal to 0.15 mm and less than or equal to 0.4 mm.
於另一實施例中,該導電彈性片包括基板以及分布於該基板內之複數導電粒子。 In another embodiment, the conductive elastic sheet includes a substrate and a plurality of conductive particles distributed in the substrate.
於另一實施例中,該基座復包括設於該導電彈性片周側且具有一流體入口及一流體出口之架體,該導電彈性片設於該基座之該第一表面上,以密封各該通孔,且該架體與該導電彈性片之上側面形成與該流體入口及該流體出口連通以供流體進入之流體空間。 In another embodiment, the base further includes a frame disposed around the conductive elastic sheet and having a fluid inlet and a fluid outlet. The conductive elastic sheet is disposed on the first surface of the base to seal each of the through holes, and the frame and the upper side of the conductive elastic sheet form a fluid space connected to the fluid inlet and the fluid outlet for fluid to enter.
於又一實施例中,復包括一導電件,且該導電彈性片包括具有分別對應各該彈力金屬件之複數導電彈性區的基板以及分布於各該導電彈性區內之複數導電粒子,其中,該導電件電性連接至少二該導電彈性區。 In another embodiment, a conductive element is further included, and the conductive elastic sheet includes a substrate having a plurality of conductive elastic regions corresponding to each of the elastic metal elements and a plurality of conductive particles distributed in each of the conductive elastic regions, wherein the conductive element electrically connects at least two of the conductive elastic regions.
本發明復揭露一種測試座,係包括:基座;導電彈性片,係位於該基座上;以及複數彈力金屬件,係設於該基座內,其中,該彈力金屬件沒入該導電彈性片時,該彈力金屬件與該導電彈性片之間的接觸阻值,小於該彈力金屬件碰觸待測元件之導電塊的接觸阻值。 The present invention further discloses a test seat, which includes: a base; a conductive elastic sheet located on the base; and a plurality of elastic metal parts arranged in the base, wherein when the elastic metal parts are immersed in the conductive elastic sheet, the contact resistance between the elastic metal parts and the conductive elastic sheet is less than the contact resistance of the elastic metal parts contacting the conductive block of the device to be tested.
於一實施例中,該基座包括相對之第一表面與第二表面以及連通該第一表面及該第二表面之複數通孔,且該第一表面用於供該導電彈性片設置,而各該通孔供各該彈力金屬件設置。 In one embodiment, the base includes a first surface and a second surface opposite to each other and a plurality of through holes connecting the first surface and the second surface, and the first surface is used for the conductive elastic sheet to be set, and each of the through holes is used for the elastic metal parts to be set.
於另一實施例中,各該彈力金屬件具有朝向該導電彈性片之第一接觸端,且該第一接觸端包含適於沒入該導電彈性片之凸塊。 In another embodiment, each of the elastic metal parts has a first contact end facing the conductive elastic sheet, and the first contact end includes a protrusion suitable for being immersed in the conductive elastic sheet.
於另一實施例中,各該彈力金屬件之該凸塊係適於刺穿該導電彈性片之表面,以沒入該導電彈性片之內部。 In another embodiment, the protrusion of each elastic metal piece is suitable for piercing the surface of the conductive elastic sheet to be immersed in the interior of the conductive elastic sheet.
於另一實施例中,各該彈力金屬件之該凸塊為複數個,且為尖狀。 In another embodiment, the protrusions of each elastic metal part are plural and pointed.
於另一實施例中,該凸塊之長度大於等於0.01毫米且小於該導電彈性片之厚度。 In another embodiment, the length of the bump is greater than or equal to 0.01 mm and less than the thickness of the conductive elastic sheet.
於另一實施例中,該導電彈性片包括基板以及分布於該基板內之複數導電粒子。 In another embodiment, the conductive elastic sheet includes a substrate and a plurality of conductive particles distributed in the substrate.
於另一實施例中,該基座復包括設於該導電彈性片周側且具有一流體入口及一流體出口之架體,該導電彈性片設於該基座之該第一表面上, 以密封各該通孔,且該架體與該導電彈性片之上側面形成與該流體入口及該流體出口連通以供流體進入之流體空間。 In another embodiment, the base further includes a frame disposed around the conductive elastic sheet and having a fluid inlet and a fluid outlet, the conductive elastic sheet is disposed on the first surface of the base to seal each of the through holes, and the frame and the upper side of the conductive elastic sheet form a fluid space connected to the fluid inlet and the fluid outlet for fluid to enter.
於又一實施例中,該導電彈性片之厚度為小於等於0.4毫米。 In another embodiment, the thickness of the conductive elastic sheet is less than or equal to 0.4 mm.
由上可知,本發明之測試座,藉由使各彈力金屬件之第一接觸端之凸塊沒入導電彈性片中,增加該第一接觸端與該導電彈性片之接觸面積,以達到降低接觸阻值之目的,且在凸塊為該導電彈性片包覆下,可使各該彈力金屬件不易產生晃動,因而具有穩定接觸之功效;另外,於該凸塊刺入該導電彈性片中時,能與各該導電粒子直接接觸,故可達到快速降低阻值以及清潔該第一接觸端之表面之目的;另外,藉由該導電彈性片密封各該通孔,能避免雜物進入通孔中而造成各該彈力金屬件有髒汙之問題。 As can be seen from the above, the test socket of the present invention achieves the purpose of reducing the contact resistance by making the bump of the first contact end of each elastic metal part sink into the conductive elastic sheet to increase the contact area between the first contact end and the conductive elastic sheet. In addition, when the bump is covered by the conductive elastic sheet, the elastic metal parts are not easy to shake, thus having a stable In addition, when the bump penetrates into the conductive elastic sheet, it can directly contact each conductive particle, so the purpose of quickly reducing the resistance and cleaning the surface of the first contact end can be achieved; in addition, by sealing each through hole with the conductive elastic sheet, it can prevent foreign matter from entering the through hole and causing the problem of contamination of each elastic metal part.
1,1’:測試座 1,1’: Test socket
11,11’:基座 11,11’: base
111:第一表面 111: First surface
112:第二表面 112: Second surface
113:通孔 113:Through hole
1311:凸塊 1311: Bump
114:框座 114: Frame seat
115,115’:流體入口 115,115’: Fluid inlet
116,116’:流體出口 116,116’: Fluid outlet
117:架體 117:Frame
118:流體空間 118: Fluid Space
119:密封蓋 119: Sealing cover
12,12’,12”:導電彈性片 12,12’,12”: Conductive elastic sheet
121:第一接觸面 121: First contact surface
122:第二接觸面 122: Second contact surface
123,123’:基板 123,123’: Substrate
124:導電粒子 124: Conductive particles
125:支撐體 125: Support body
126:凸墊 126: Pad
13,13’:彈力金屬件 13,13’: Elastic metal parts
131,131’:第一接觸端 131,131’: First contact end
132,132’:第二接觸端 132,132’: Second contact end
133:主體 133: Subject
135,135’:彈性件 135,135’: Elastic parts
136:彈性體 136: Elastic body
137:金屬塊 137:Metal block
14:導電件 14: Conductive parts
2,2’:待測物 2,2’: Object to be tested
21:導電塊 21: Conductive block
22:導電墊 22: Conductive pad
4:測試裝置 4: Test equipment
5:測試晶圓 5: Test wafer
9:待測物 9: Object to be tested
91:導電塊 91: Conductive block
100:測試插座 100: Test socket
101:底座 101: Base
102:導通孔 102: Conductive hole
103:探針 103:Probe
104:測試設備 104:Testing equipment
A-A:剖面線 A-A: Section line
D:寬度 D: Width
d:孔徑 d: aperture
F:施力 F: Force
G:間隙 G: Gap
H:間隔距離 H: Spacing distance
L:長度 L: Length
R:導電彈性區 R: Conductive elastic region
S:區域 S: Area
T:厚度 T:Thickness
t:距離 t: distance
圖1係習知測試座對待測物進行測試之架構圖。 Figure 1 is a diagram showing the structure of a test socket for testing an object under test.
圖2係本發明之測試座之立體分解圖。 Figure 2 is a three-dimensional exploded view of the test stand of the present invention.
圖3係本發明之測試座之立體結構圖。 Figure 3 is a three-dimensional structural diagram of the test stand of the present invention.
圖4係圖3之A-A剖面線之剖面圖。 Figure 4 is a cross-sectional view taken along the A-A section line of Figure 3.
圖5係本發明之測試座置放待測物之測試示意圖。 Figure 5 is a test diagram of the test seat of the present invention placing the object to be tested.
圖6係圖5中區域S之局部放大圖。 Figure 6 is a partial enlarged view of area S in Figure 5.
圖7係本發明之測試座中導電彈性片具有凸墊之結構示意圖。 Figure 7 is a schematic diagram of the structure of the conductive elastic sheet with a protruding pad in the test seat of the present invention.
圖8係本發明之測試座中導電彈性片具有凸墊之使用狀態示意圖。 Figure 8 is a schematic diagram of the conductive elastic sheet with a protruding pad in the test socket of the present invention in use.
圖9係本發明之測試座具有框座之結構示意圖。 Figure 9 is a schematic diagram of the structure of the test stand of the present invention having a frame seat.
圖10A-10B係本發明之測試座具有架體之結構示意圖。 Figures 10A-10B are schematic diagrams of the structure of the test stand of the present invention having a frame.
圖11係本發明之測試座應用於晶圓之架構圖。 Figure 11 is a structural diagram of the test socket of the present invention applied to a wafer.
圖12係本發明之測試座應用於四端點測量(Kelvin contact)之架構圖。 Figure 12 is a schematic diagram of the test socket of the present invention used for four-end point measurement (Kelvin contact).
圖13A-13B係本發明之測試座於導電彈性片上設置導電件之結構圖。 Figures 13A-13B are structural diagrams of the test stand of the present invention with conductive components arranged on a conductive elastic sheet.
圖14A-14C係本發明之測試座不同設計之彈力金屬件之結構圖。 Figures 14A-14C are structural diagrams of elastic metal parts of different designs of the test stand of the present invention.
圖15A-15B係習知測試座之探針與待測物之導電塊之阻值及彈力金屬件之彈力的關係圖。 Figures 15A-15B are diagrams showing the relationship between the probe of the test socket, the resistance of the conductive block of the object to be tested, and the elastic force of the elastic metal part.
圖16A-16B係本發明之測試座之彈力金屬件與待測物之導電塊之阻值及彈力金屬件之彈力的關係圖。 Figures 16A-16B are diagrams showing the relationship between the elastic metal part of the test socket of the present invention, the resistance of the conductive block of the object to be tested, and the elastic force of the elastic metal part.
圖17A-17B分別係習知測試座之探針與本發明測試座之彈力金屬件未經表面處理時之阻值及彈力金屬件之彈力的關係圖。 Figures 17A-17B are respectively the relationship diagrams between the resistance value of the probe of the conventional test socket and the elastic metal part of the test socket of the present invention when the surface is not treated and the elastic force of the elastic metal part.
圖18係習知測試座之探針與本發明測試座之彈力金屬件經多次測試下之阻值變化圖。 Figure 18 is a graph showing the resistance changes of the probe of the conventional test socket and the elastic metal part of the test socket of the present invention after multiple tests.
圖19A-19B分別係習知測試座之探針第一次使用及經300次測試後之阻值及彈力金屬件之彈力的關係圖。 Figures 19A-19B are graphs showing the relationship between the resistance of the probe of the test socket when it is used for the first time and after 300 tests and the elastic force of the elastic metal part.
圖20A-20B分別係本發明測試座之彈力金屬件第一次使用及經300次測試後之阻值及彈力的關係圖。 Figures 20A-20B are respectively the relationship diagrams between the resistance and elasticity of the elastic metal parts of the test socket of the present invention when it is used for the first time and after 300 tests.
圖21A-21B分別係習知測試座之探針與本發明測試座之彈力金屬件通以6A電流時之彈力及溫度變化趨勢圖。 Figures 21A-21B are respectively the elastic force and temperature change trend diagrams of the probe of the conventional test socket and the elastic metal part of the test socket of the present invention when a current of 6A is passed through them.
圖22A-22C係習知測試座之新舊探針以及本發明測試座之已使用彈力金屬件通以3A電流時之彈力及溫度變化趨勢圖。 Figures 22A-22C are the elastic force and temperature change trend diagrams of the old and new probes of the conventional test socket and the used elastic metal parts of the test socket of the present invention when a 3A current is passed through them.
以下藉由特定的具體實施形態說明本發明之技術內容,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之優點與功效。然本發明亦可藉由其他不同的具體實施形態加以施行或應用。 The following describes the technical content of the present invention through a specific concrete implementation form. People familiar with this technology can easily understand the advantages and effects of the present invention from the content disclosed in this manual. However, the present invention can also be implemented or applied through other different specific implementation forms.
圖2為本發明之測試座之立體分解圖,圖3為本發明之測試座之立體結構圖,圖4為圖3之A-A剖面線之剖面圖。如圖所示,本發明之測試座1包括基座11、位於該基座11上方之導電彈性片12以及朝向該導電彈性片12延伸而設於該基座11中之複數彈力金屬件13,於一具體實施例中,本發明之測試座1可為探針座或探針卡,且可設置於測試裝置4上,使各該彈力金屬件13自該測試裝置4接收測試訊號,其中,該彈力金屬件13可為探針。有關本發明之測試座1的詳細說明,如下所陳。
FIG2 is a three-dimensional exploded view of the test seat of the present invention, FIG3 is a three-dimensional structural view of the test seat of the present invention, and FIG4 is a cross-sectional view of the A-A section line of FIG3. As shown in the figure, the
該基座11係為供待測物2(例如圖5中所示)放置之座體,具體地,該基座11包括第一表面111、相對於該第一表面111之第二表面112以及連通該第一表面111及該第二表面112之複數通孔113,藉由該第二表面112設置於提供測試訊號之測試裝置4上。再者,基座11之該第一表面111上方可供例如半導體封裝件、晶片或晶圓等待測物2設置,於一實施例中,該基座11由該第一表面111之周側朝該第二表面112之方向(如圖2所示之下方)延伸而形成側壁。另外,該基座11可為金屬材質所製成之座體,於一具體實施例中,該基座11可為一同軸式測試基座,可用於高頻測試。
The
該導電彈性片12可為具有優異的機械性能(例如延展性和韌性)之薄片,其位於該基座11之第一表面111上,具體而言,該導電彈性片12包括相對之第一接觸面121以及第二接觸面122,且導電彈性片12可為導電介質所製成之軟性片狀結構,其中,該導電介質受擠壓時,能沿著擠壓方向形成一導電路徑,使得電路上下導通,以達測試目的;另外,該導電彈性片12可貼附於該第一表面111上,亦即,該導電彈性片12可覆蓋該基座11之第一表面111而密封各通孔113,據此,可避免金屬碎屑、灰塵或液體掉入各通孔113,不僅使各通孔113及其內之彈力金屬件13能保持清潔,且能降低彈力金屬件13與氧氣接觸,減少彈力金屬件13發生金屬氧化之問題。
The conductive
於一具體實施例中,如圖2-4所示,該導電彈性片12可包括對應複數彈力金屬件13而定義有複數導電彈性區R之基板123,以及分布於各該導電彈性區R內之複數導電粒子124,據此,該導電彈性片12僅於各該導電彈性區R內分布有導電粒子124,基板123中非導電彈性區R之區域不具有導電粒子124,亦即,導電彈性片12中具有由分布有導電粒子之各導電彈性區R所形成之複數導電彈性墊(Bump Pad),是以,該導電彈性片12之第一接觸面121及第二接觸面122之間僅於各導電彈性區R(或各導電彈性墊)處形成導電路徑,可避免相鄰之導電彈性墊中所形成之導電路徑之間發生短路的現象,或有導電路徑之電流外溢至另一導電路徑之問題。
In a specific embodiment, as shown in FIGS. 2-4 , the conductive
各該彈力金屬件13分別具有第一接觸端131及第二接觸端132且設於各該通孔113內,各彈力金屬件13能基於內部彈力而令其第一接觸端131朝基座11之第一表面111方向位移,或受到擠壓力而朝向通孔113內之方向移動。於一具體實施例中,本發明之彈力金屬件13可為例如彈簧探針、
垂直式探針或微機電探針等探針或其他具有彈力伸展而可提供行程以對待測物2進行封裝測試之元件,但不以此為限。
Each of the
特別的是,各彈力金屬件13之第一接觸端131朝向該導電彈性片12且包含適於沒入導電彈性片12中之凸塊1311,本發明透過增加凸塊1311與導電彈性片12的接觸面積,以達較低的接觸阻值,若與第一接觸端131直接電性連接待測物2相比較,能提供更佳的接觸阻值,亦即,於彈力金屬件13之凸塊1311沒入導電彈性片12時,該凸塊1311與該導電彈性片12之間的接觸阻值可小於該第一接觸端131直接接觸待測物2的接觸阻值。
In particular, the
經實驗驗證,若以彈力金屬件13直接接觸待測物2時,其實際阻值約為37.7毫歐姆(mΩ),另外,若本發明之測試座1之導電彈性片12採用厚度為0.2毫米時,在彈力金屬件13之凸塊1311沒入導電彈性片12中後,其接觸阻值可具有30.4毫歐姆(mΩ)之表現,顯見本發明之設計可提供較佳的測試環境。
According to experimental verification, when the
另外,第一接觸端131之凸塊1311適於沒入導電彈性片12包含兩種型態,第一種為第一接觸端131以凸塊1311擠壓導電彈性片12後,因導電彈性片12產生形變而使凸塊1311全部或部分被導電彈性片12包覆,第二種為凸塊1311直接穿刺導電彈性片12並嵌入導電彈性片12內。更具體來說,對於第一種之未嵌入型態,第一接觸端131之凸塊1311在不刺穿導電彈性片12表面下,透過陷入導電彈性片12表面,達到沒入導電彈性片12內部之結果,亦即,使導電彈性片12包覆凸塊1311全部或部分,據此,可增加彈力金屬件13與導電彈性片12之間的接觸面積;另外,對於第二種之嵌入型態,使第一接觸端131以凸塊1311刺穿導電彈性片12之表面(如圖4的第一接觸面121)並進入到導電彈性片12內部,同樣能增加彈力金屬件13與導電彈性片12之間的接觸面積。
In addition, there are two types of the
圖5為本發明之測試座置放待測物之測試示意圖,以及圖6為圖5中區域S之局部放大圖,請一併參考圖4。如圖4所示,導電彈性片12於導電彈性區中之第一接觸面121與第二接觸面122未受擠壓時,各導電粒子124之間可不相互電性連接;如圖5-6所示,於待測物2受施力F擠壓時,因導電彈性片12具彈性,不僅待測物2之導電塊21可陷入導電彈性片12,同時彈力金屬件13之凸塊1311也會沒入導電彈性片12,導電塊21與凸塊1311上下擠壓下,擠壓方向的各導電粒子124之間的距離漸小,進而相互接觸,即於各導電彈性區R中沿受擠壓方向提供第一接觸面121及第二接觸面122之間電性連接的導電路徑,據此,於待測物2測試過程,使測試訊號所形成之電流通過各導電彈性區R中所形成之導電路徑時,不致外溢至其他導電彈性區R中之導電路徑,即便待測物2之導電塊21密集,或隨著半導體製程演進而使待測物2微型化愈甚,仍可達到確保測試訊號於其導電路徑中傳遞之目的,具有各導電路徑之間互不干擾之功效。
FIG. 5 is a test schematic diagram of the test base of the present invention for placing the object to be tested, and FIG. 6 is a partial enlarged diagram of the area S in FIG. 5 , please refer to FIG. 4 together. As shown in FIG4 , when the
於實際應用上,如圖4-圖6所示,本發明之測試座1的初始狀態(如圖4所示)中,各彈力金屬件13之凸塊1311未沒入於導電彈性片12內,即各彈力金屬件13與導電彈性片12處於分離或僅相互接觸之狀態。進行測試時,基座11能自測試裝置4接收測試訊號,具體地,將具有複數導電塊21(例如焊球)之待測物2置入基座11以及導電彈性片12上後,使各導電塊21與對應之彈力金屬件13相對配置,待測物2受施力F而向下壓抵導電彈性片12時,待測物2與各彈力金屬件13上下擠壓導電彈性片12之導電彈性
墊(即分布有導電粒子之導電彈性區R),此時,各彈力金屬件13以凸塊1311沒入導電彈性片12中,使導電彈性片12中相對應之導電塊21與彈力金屬件13之間形成導電路徑(如圖6所示),據此,相對應之導電塊21以及彈力金屬件13透過導電路徑而電性連接,測試訊號經彈力金屬件13、導電彈性片12以及導電塊21傳送到待測物2,以對待測物2進行測試,由於彈力金屬件13以凸塊1311沒入導電彈性片12中,因而可獲得較大的接觸面積,能降低接觸阻值,且由於導電彈性片12透過導電彈性墊的設計,可避免相鄰之間的導電彈性墊中所形成的導電路徑相互干擾之問題。
In practical application, as shown in FIGS. 4-6 , in the initial state of the
另於測試完成後,將待測物2移除後,導電彈性片12無受到施力F擠壓,由於導電彈性片12具有彈性,會將第一接觸端131之凸塊1311推出,其中,凸塊1311於測試過程中,可能造成表面氧化而增加接觸阻值,故於沒入和推出過程中,凸塊1311之表面與導電彈性片12之間相互摩擦,能將氧化之表面磨除,不僅能確保接觸阻值之穩定,更具清潔凸塊1311之功效,故即便凸塊1311在未經電鍍或其他表面處理下,仍可維持接觸阻值之穩定性。另外,在彈力金屬件13上設置導電彈性片12,能避免彈力金屬件13之凸塊1311直接與待測物2之導電塊21壓抵而有磨損之情況,亦即,導電彈性片12復可提供凸塊1311緩衝及保護之功能,降低彈力金屬件13損壞可能,較佳者,於導電彈性片12受有損耗時,僅須替換導電彈性片12即可恢復本發明之測試座的測試效能,如此,可減少習知測試座在探針損壞下需從眾多探針尋找損壞者之程序,可達節省時間及成本之目的。此外,即便該導電彈性片12於測試過程中受到彈力金屬件13之凸塊1311擠壓或刺入,但由於導電彈性片12具有彈力,因而將凸塊1311推出後,可回復至未被擠壓的
狀態,或使被刺入之位置稍微恢復,因此,即便導電彈性片12受到凸塊1311刺入,仍可具有良好的使用壽命。
Furthermore, after the test is completed and the object to be tested 2 is removed, the conductive
特別是,對於前述第二種之嵌入型態(彈力金屬件13之凸塊1311刺穿導電彈性片12之表面並進入到導電彈性片12內部),將具備以下特點。第一,第一接觸端131以凸塊1311與導電彈性片12內之導電粒子124直接電性接觸,能達到電性快速導通之效果,且由於凸塊1311嵌入(插入)導電彈性片12中而與更多的導電粒子124接觸,能有效降低接觸阻值;第二,各彈力金屬件13以凸塊1311刺穿導電彈性片12之表面時,因插入到導電彈性片12內部,使各彈力金屬件13之凸塊1311被導電彈性片12完整包覆而不易晃動,於測試過程中將具保持穩固及接觸穩定之效果,即各彈力金屬件13相對待測物2之導電塊21不易產生位移(即準確對位),可避免習知測試環境下因探針與待測物之間接觸面積小,而有位移以致探針損壞之情況;第三,彈力金屬件13之凸塊1311於測試時會插入導電彈性片12內部,且於測試結束時受導電彈性片12之彈力推出,是以,彈力金屬件13於插入與移出的過程中增加與導電彈性片12摩擦程度,將能提供清潔效果,特別是,凸塊1311之表面因氧化或其他老化所致之表面不潔的狀況,透過兩者之摩擦將得到改善,且由於前述之清潔效果,使凸塊1311之表面隨時保持如新,故彈力金屬件13之凸塊1311無須額外進行表面加工之維護,更可降低成本。
In particular, the second embedding type (the
於一實施例中,該導電彈性片12(即指基板123)之厚度T為大於等於0.15毫米(mm)且小於等於2毫米,簡言之,若導電彈性片12厚度不足,容易被刺穿,若導電彈性片12厚度太厚,則會因傳導路徑過長,而致整體阻值上升。於另一實施例中,較佳者,0.150毫米≦厚度T≦1.5毫米,且
依據實驗結果,當導電彈性片12之厚度T≦0.4毫米時,可在接觸阻值不明顯增加下,同樣得到良好導電效果。另外,該導電彈性片12可透過調整厚度T以及彈力金屬件13之沒入深度來調控接觸阻值,舉例來說,在增加導電彈性片12之厚度T時,可透過增加彈力金屬件13進入導電彈性片12之深度,使接觸阻值維持在所需範圍內。
In one embodiment, the thickness T of the conductive elastic sheet 12 (i.e., the substrate 123) is greater than or equal to 0.15 mm and less than or equal to 2 mm. In short, if the thickness of the conductive
又如圖6所示,各彈力金屬件13之凸塊1311刺穿該導電彈性片12之下表面而沒入該導電彈性片12時,凸塊1311之頂端與該導電彈性片之上表面之距離t可為小於0.35毫米,或是凸塊1311之頂端與該導電彈性片12之上表面之間的距離t於導電彈性片12之厚度T的佔比為85%以下,據此,即便導電彈性片12之厚度改變,仍可透過調整凸塊1311嵌入導電彈性片12內之程度而維持良好的接觸阻值。
As shown in FIG. 6 , when the
於另一具體實施例中,各該導電粒子124之粒徑,其大小可為大於等於0.005毫米且小於等於0.1毫米,亦即,若粒徑太小,粒子間的間隙層過多,阻值會過高,若粒徑太大,會使彈力金屬件13易磨損,且接觸面積變少;另外,該些複數導電粒子124於該導電彈性片12中所佔百分比,較佳者為大於等於30%且小於等於90%,易言之,若粒子密度過低,阻值會較高,若粒子密度過高,表示導電彈性片12內膠體成分少,導電彈性片12耐用度也會下降。
In another specific embodiment, the particle size of each
圖7為本發明之測試座中導電彈性片具有凸墊之結構示意圖,圖8為本發明之測試座中導電彈性片具有凸墊之使用狀態示意圖。如圖7所示,該導電彈性片12”以第一接觸面121面對第一表面111設置於基座11上,而第二接觸面122對應各彈力金屬件13處具有凸出該第二接觸面122之複數
凸墊126,據此,如圖8所示,可供具有複數導電墊22之待測物2’,透過各導電墊22對應各凸墊126而置於導電彈性片12”上,另外,於另一實施例中,當待測物之導電墊22為凹陷之結構(圖未繪示)時,藉由各該凸墊126進入對應之凹陷的導電墊22中,而於待測物2’測試過程中形成導電路徑。
FIG. 7 is a schematic diagram showing the structure of the conductive elastic sheet with a protruding pad in the test socket of the present invention, and FIG. 8 is a schematic diagram showing the use state of the conductive elastic sheet with a protruding pad in the test socket of the present invention. As shown in FIG. 7 , the conductive
圖9為本發明之測試座具有框座之結構示意圖。如圖所示,於一實施例中,該導電彈性片12設於基座11之一框座114上,以與各彈力金屬件13之凸塊1311間有一間隔距離H,亦與該第一表面111保持一間隙,其中該導電彈性片12係可浮動地於垂直方向上進行位移,相較於圖4中部分彈力金屬件13之凸塊1311恰接觸導電彈性片12之表面或已穿刺至導電彈性片12內之態樣,本實施例之各凸塊1311於測試時,才會與導電彈性片12接觸,且於每進行一次壓測時,凸塊1311才會穿刺至導電彈性片12,亦即凸塊1311並不會在未進行測試的狀態下一直存在於導電彈性片12內,再者,凸塊1311每一次穿刺導電彈性片12的位置亦可能有所不同,不會重覆穿刺同一區域,故本實施例更可提供導電彈性片12回復之時間,有助於延長導電彈性片12之使用壽命。
FIG9 is a schematic diagram of the structure of the test seat of the present invention having a frame. As shown in the figure, in one embodiment, the conductive
圖10A及圖10B為本發明之測試座具有架體之結構示意圖。如圖10A所示,測試座1之基座11復包括有設於導電彈性片12之基板123周側之架體117,具體來說,架體117設於(例如以膠黏固)基座11之第一表面111上,而導電彈性片12可被架體117包圍。詳言之,導電彈性片12設於基座11之第一表面111上且密封各通孔113,該架體117與該導電彈性片12之基板123的上表面(即導電彈性片12之第二接觸面122)之間形成供流體進入的空間,亦即,於待測物2置於導電彈性片12上方時,使待測物2之底
面與導電彈性片12之第二接觸面122之間形成流體空間118,以於待測物2測試過程中,將液體或氣體等不導電之流體引入流體空間118中,流體於流體空間118中流動(如圖中箭頭所示),而對待測物2進行散熱,以達到待測物2降溫之目的,亦即,藉由於該架體117開設與該流體空間118連通之流體入口115及流體出口116之方式,使流體能進入流體空間118。
FIG10A and FIG10B are schematic diagrams of the test seat of the present invention having a frame. As shown in FIG10A , the
另外,如圖10B所示,亦可藉由於該架體117上方設置具有流體入口115’及流體出口116’之密封蓋119的方式,使流體自流體入口115’流入流體空間118中流動(如圖中箭頭所示),且由流體出口116’導出,以達前述散熱及降溫之目的,於實際應用上,密封蓋119可為例如半導體分類機之熱傳導裝置的一部分。於流體流入流體空間118時,由於導電彈性片12密封各通孔113,可避免流體流入各通孔113中,且於測試完成後,僅須透過抽出液體、灌入氣流或以其他電控方式將流體移除,不僅可對流體空間118進行清潔,也可避免測試過程中金屬碎屑或灰塵掉落各通孔113內而影響各彈力金屬件13之阻值,此外,導電彈性片12可避免流體(例如冷卻液體)於測試過程中進入通孔113中而影響各彈力金屬件13之高頻電性。
In addition, as shown in FIG. 10B , a sealing
圖11為本發明之測試座應用於晶圓之架構圖。如圖所示,在基座11’之第一表面111及第二表面112分別設有導電彈性片12及導電彈性片12’,其中,導電彈性片12’之基板123’的周側設有支撐體125,該導電彈性片12’藉該支撐體125設於該基座11’上,使得該導電彈性片12’形成帳篷狀結構,且該基板123’與第二表面112之間具有間隙G,以供各彈力金屬件13’之第二接觸端132’凸出該基座11’之第二表面112,且與該導電彈性片12’接觸,於本實施例中,彈力金屬件13’可為垂直式探針(Cobra探針)。另需說明者,上述說明導電彈性片12’可設於該基座11’之第二表面112那端,但不以此為限,亦即,導電彈性片12’可設於該基座11’之第一表面111那端,結構設計相似,於此不再贅述。
FIG. 11 is a schematic diagram showing the structure of the test base of the present invention applied to a wafer. As shown in the figure, a conductive
舉例而言,本發明之測試座1’應用於晶圓測試時,測試座1’可為探針卡且用於測試晶圓5,其中,測試座1’包括具有複數通孔之基座11’,各彈力金屬件13’分設於基座11’之各通孔中且包括由各通孔之上開口及下開口凸出之第一接觸端131’及第二接觸端132’以及設於各該通孔中且分別推抵該第一接觸端131’及該第二接觸端132’之彈性件135’,藉此,該測試座1’可透過將導電彈性片12設於基座11’之第一表面111上,以供待測物2設置其上,另外,可將具有支撐體125之導電彈性片12’設於基座11’之第二表面112上,使導電彈性片12’之第二接觸面(圖中朝上者)不會接觸該基座11’之第二表面112,於測試時,導電彈性片12’之第一接觸面(圖中朝下者)會接觸測試晶圓5之表面以進行測試。
For example, when the test base 1' of the present invention is applied to wafer testing, the test base 1' can be a probe card and is used to test the
圖12為本發明之測試座應用於四端點測量(Kelvin contact)之架構圖。如圖12所示,可依需求而使一導電彈性區R對應複數個彈力金屬件13’,例如應用於四端點測量(Kelvin contact)技術時,令一導電彈性區R對應兩個彈力金屬件13’,即兩個彈力金屬件13’共用一導電彈性區R,據以供待測物2之一導電塊21與複數彈力金屬件13’透過導電彈性區R而連接,以進行測試程序。
FIG12 is a schematic diagram of the test socket of the present invention applied to four-point measurement (Kelvin contact). As shown in FIG12, a conductive elastic region R can be made to correspond to a plurality of elastic metal parts 13' according to the needs. For example, when applied to four-point measurement (Kelvin contact) technology, a conductive elastic region R is made to correspond to two elastic metal parts 13', that is, two elastic metal parts 13' share a conductive elastic region R, so that a
圖13A-13B為本發明之測試座於導電彈性片上設置導電件之架構圖。如圖13A所示,本發明之測試座1復包括對應至少二彈力金屬件13且設於導電彈性片12之第一接觸面121或第二接觸面122之導電件14(圖中以第一接觸面121為例),導電件14可用以電性連接鄰近之各彈力金屬件,詳言之,當彈力金屬件13為接地探針時,能透過該導電件14電性連接鄰近之接地探針,或當彈力金屬件13為電源探針時,能透過該導電件14電性連接相鄰之電源探針,其中,於一實施例中,如圖所示,導電件14係設於導電彈性片12之第一接觸面121;於另一實施例中,導電件14復可設於導電彈性片12之第二接觸面122,亦即,位於彈力金屬件13及導電彈性片12之間,且本實施例中,因導電件14位於彈力金屬件13及導電彈性片12之間,故於彈力金屬件13對應處具有鏤空部(圖未繪),以供彈力金屬件13可經該鏤空部而與導電彈性片12接觸。另外,如圖13B所示,本發明之測試座1復包括位於基座11之第二表面112下另一導電彈性片12以及對應至少二彈力金屬件13且位於該另一導電彈性片12之下表面上的導電件14,其中,該導電件14可作為導電線路或接地。綜上,透過在導電彈性片12上設置導電件14,提供待測物2之複數導電塊21之間透過導電線路進行連接或共地,再者,於提供高電流之電源訊號時,亦可據以作為分流之功能,另外,該導電彈性片12可藉由增加導電彈性區之面積或位置,強化與基座11之第一表面111或第二表面112的接觸,亦可提供接地之功能。
Figures 13A-13B are structural diagrams of the test socket of the present invention with a conductive component disposed on a conductive elastic sheet. As shown in Figure 13A, the
再者,如圖13B所示,該基座11為金屬座體,且導電彈性片12之各導電彈性區之寬度大於各通孔113之孔徑,使各該導電彈性區能接觸該基座11,亦即,通孔113之孔徑d(如第二表面112之孔徑所示)小於導電彈性片12之各導電彈性區R之寬度D,易言之,即d小於D,據此,各彈力金屬件13可透過各導電彈性墊而與金屬之基座11電性連接,據以提升各彈力金屬件13之接地機率,因此,導電件14亦可省略不設置。
Furthermore, as shown in FIG. 13B , the
圖14A-14C為本發明之測試座不同設計之彈力金屬件之結構圖。如圖14A所示,各彈力金屬件13之凸塊1311為可為尖狀結構,於一實施例中,該凸塊1311之長度L為大於等於0.01毫米且小於導電彈性片之厚度T(如圖4所示)。易言之,第一接觸端131之凸塊1311僅須可刺穿導電彈性片並進入其內部且不穿透導電彈性片即可,其長度L並不以此為限,亦即,復可藉由控制彈力金屬件13之第一接觸端131的移動行程(或推動第一接觸端131移動之彈力),以於測試時令凸塊1311穿入導電彈性片至少0.01毫米,據以達到降低彈力金屬件13與導電彈性片之間的接觸阻值。
Figures 14A-14C are structural diagrams of elastic metal parts of different designs of the test seat of the present invention. As shown in Figure 14A, the
如圖14B所示,於一實施例中,彈力金屬件13包括具有管孔之主體133、分別設於該管孔之二端的第一接觸端131與第二接觸端132、以及位於該管孔內且分別推抵該第一接觸端131及該第二接觸端132之彈性件135(例如彈簧)。於一實施例中,本發明之彈力金屬件13之第一接觸端131具有粗糙或呈凹凸之表面,能提供較大接觸面積,以達降低接觸阻值之目的。具體來說,該第一接觸端131具有複數凸塊1311,於一具體實施例中,各凸塊1311為尖形結構,第一接觸端131整體可為冠狀結構,使彈力金屬件13可藉由各尖狀結構刺入導電彈性片中,據此,透過具有冠狀的第一接觸端131以各凸塊1311刺入導電彈性片後,具有聚集導電粒子(請參考圖6)的效果,亦即,可將導電子限縮於冠狀結構所圍繞的範圍內,可於形成導電路徑時,使導電路徑具有更好的導電效果。
As shown in FIG. 14B , in one embodiment, the
如圖14C所示,於另一實施例中,各該彈性金屬件13’復包括有用以設於通孔113中之彈性體136及可轉動地設於該彈性體136之金屬塊137,該金屬塊137朝向基座11之第一表面111延伸而連接第一接觸端131’,且朝向該基座11之第二表面112延伸而連接第二接觸端132’。於又一實施例中,該彈性金屬件13’復可為如圖8應用於探針卡中之結構,其結構說明已如上述,不再贅言。
As shown in FIG. 14C , in another embodiment, each of the
後續透過實驗說明本發明測試座之功效,為顯示本發明之測試座(例如圖2-4所示)前述功效相較於習知測試座(如圖1所示)之差異,於測試過程中,本發明與習知之測試座採用同款之彈力金屬件(例如探針),且以相同之實驗環境與條件進行測驗,其相關說明如下。 The following is an experiment to illustrate the effectiveness of the test socket of the present invention. In order to show the difference between the above-mentioned effectiveness of the test socket of the present invention (such as shown in Figures 2-4) and the conventional test socket (such as shown in Figure 1), during the test process, the present invention and the conventional test socket use the same elastic metal parts (such as probes) and are tested in the same experimental environment and conditions. The relevant description is as follows.
圖15A-15B為習知測試座之探針與待測物之導電塊之阻值及彈力金屬件之彈力的關係圖,圖16A-16B為本發明之測試座之彈力金屬件與待測物之導電塊之阻值及彈力金屬件之彈力的關係圖。如圖15A所示,習知測試座之探針於使用初期中,其彈力為20.7克力(gf)以及阻值為43.2毫歐姆(mΩ),接著,如圖15B所示,經過一段時間的使用過後,習知測試座之探針之彈力下降至20.4gf,阻值更升高至155.6毫歐姆(mΩ);反之,如圖16A所示,本發明之測試座的探針(即彈力金屬件)於使用初期時,其彈力為21.4gf以及阻值為35.1毫歐姆(mΩ),接著,如圖16B所示,於使用一段時間後,本發明之探針的彈力仍可維持在21.5gf,且其阻值更降低至33.6毫歐姆(mΩ),顯見相同之探針利用於本發明之架構中,可維持探針之彈力,而於阻值表現方面,除可確保阻值不致如習知測試結果會倍增外,更可達到阻值降低之功效,另外,由圖16B之阻值表現可知,在行程0.4mm-0.6mm的阻值,本實施例線條平穩而不會有抖動變化之不穩定現象,更可確定本發明即使在低行程下即可提供良好之接觸穩定性。 15A-15B are relationship diagrams of the probe of the conventional test socket and the resistance of the conductive block of the object to be tested and the elastic force of the elastic metal part, and FIGS. 16A-16B are relationship diagrams of the elastic metal part of the test socket of the present invention and the resistance of the conductive block of the object to be tested and the elastic force of the elastic metal part. As shown in FIG. 15A , the spring force of the probe of the conventional test base is 20.7 gf and the resistance is 43.2 mΩ in the initial use. Then, as shown in FIG. 15B , after a period of use, the spring force of the probe of the conventional test base decreases to 20.4 gf and the resistance increases to 155.6 mΩ. On the contrary, as shown in FIG. 16A , the spring force of the probe (i.e., the elastic metal part) of the test base of the present invention is 21.4 gf and the resistance is 35.1 mΩ in the initial use. Then, as shown in FIG. 16B , after a period of use, the spring force of the probe of the conventional test base decreases to 20.4 gf and the resistance increases to 155.6 mΩ. After the test, the spring force of the probe of the present invention can still be maintained at 21.5gf, and its resistance is further reduced to 33.6 milliohms (mΩ). It is obvious that the same probe can be used in the structure of the present invention to maintain the spring force of the probe. In terms of resistance performance, it can not only ensure that the resistance will not double as in the known test results, but also achieve the effect of reducing the resistance. In addition, from the resistance performance of Figure 16B, it can be seen that in the resistance range of 0.4mm-0.6mm, the line of this embodiment is stable without the unstable phenomenon of jitter change, which can confirm that the present invention can provide good contact stability even at a low stroke.
再者,由圖15A可見,習知之測試座隨著探針頭之行程變化,其阻值方可緩慢地降低至50毫歐姆(mΩ),以及如圖15B所示,在經過一段時間的使用後,甚至已無法降至50毫歐姆(mΩ);反之,如圖16A和圖16B所示,本發明之測試座與待測物之導電塊在受壓後,便可立即將阻值降低至50毫歐姆(mΩ)以下,即便經過一段時間的使用,仍可保持有前述特性。 Furthermore, as shown in FIG15A, the resistance of the conventional test socket can slowly decrease to 50 milliohms (mΩ) as the travel of the probe tip changes, and as shown in FIG15B, after a period of use, it can no longer be reduced to 50 milliohms (mΩ); on the contrary, as shown in FIG16A and FIG16B, the test socket of the present invention and the conductive block of the object to be tested can immediately reduce the resistance to below 50 milliohms (mΩ) after being pressurized, and can still maintain the aforementioned characteristics even after a period of use.
圖17A-17B分別為習知測試座之探針與本發明測試座之彈力金屬件未經表面處理時之阻值及彈力金屬件之彈力的關係圖。圖式係說明在探針之探針頭未經例如電鍍等表面處理的表現,值得注意的是,如圖17A所示,習知測試座之探針的阻值高達2081.5毫歐姆(mΩ),而如圖17B所示,本發明之測試座的探針(即彈力金屬件)仍可維持在50毫歐姆(mΩ)左右,即48.4毫歐姆(mΩ),據此可知,本發明之探針(彈力金屬件)之探針頭(第一接觸端之凸塊)可不經表面處理下仍優於習知設計,故有助於降低製造成本。 17A-17B are diagrams showing the relationship between the resistance of the probe of the conventional test socket and the elastic metal part of the test socket of the present invention when the surface is not treated and the elastic force of the elastic metal part. The diagram illustrates the performance of the probe tip without surface treatment such as electroplating. It is worth noting that, as shown in FIG17A, the resistance of the probe of the conventional test socket is as high as 2081.5 milliohms (mΩ), while as shown in FIG17B, the probe of the test socket of the present invention (i.e., the elastic metal part) can still be maintained at about 50 milliohms (mΩ), i.e., 48.4 milliohms (mΩ). It can be seen that the probe tip (bump at the first contact end) of the probe (elastic metal part) of the present invention is better than the conventional design without surface treatment, so it helps to reduce manufacturing costs.
圖18為習知測試座之探針與本發明測試座之彈力金屬件經多次測試下之阻值變化圖,圖19A-19B分別為習知測試座之探針第一次使用及經300次測試後之阻值及彈力金屬件之彈力的關係圖,圖20A-20B分別為本發明測試座之彈力金屬件第一次使用及經300次測試後之阻值及之彈力的關係圖。如圖18所示,說明在經歷多次使用後探針之阻質的變化趨勢,習知測試座中的探針在經幾次使用後,即發生阻值大幅升高,且由圖可見,其阻值更不穩定,反觀本發明測試座的探針即便經歷多次測試,仍可將阻值穩定維持在最佳的表現水平,亦即,即便使用多次,本發明之探針仍可維持新探針之阻值表現。 FIG18 is a graph showing the resistance variation of the probe of the conventional test socket and the elastic metal part of the test socket of the present invention after multiple tests. FIG19A-19B are graphs showing the relationship between the resistance of the probe of the conventional test socket when it is used for the first time and after 300 tests and the elasticity of the elastic metal part. FIG20A-20B are graphs showing the relationship between the resistance of the elastic metal part of the test socket of the present invention when it is used for the first time and after 300 tests and the elasticity. As shown in Figure 18, the change trend of the resistance of the probe after multiple uses is illustrated. It is known that the resistance of the probe in the test socket increases significantly after several uses, and as can be seen from the figure, its resistance is more unstable. On the contrary, the probe of the test socket of the present invention can maintain the resistance at the best performance level even after multiple tests. That is, even if it is used multiple times, the probe of the present invention can still maintain the resistance performance of a new probe.
進一步地,如圖19A所示,習知探針在第一次使用時,其阻值及彈力有正常的表現,如圖19B所示,習知探針在經過300次使用後,其阻值已超過800毫歐姆(mΩ),已不堪使用;反之,如圖20A和圖20B所示,本發明之探針即便經過300次的使用,仍維持在接近初始狀態,具有良好的阻值。 Furthermore, as shown in FIG. 19A , the resistance and elasticity of the known probe are normal when used for the first time. As shown in FIG. 19B , after being used 300 times, the resistance of the known probe exceeds 800 milliohms (mΩ) and is no longer usable. On the contrary, as shown in FIG. 20A and FIG. 20B , the probe of the present invention remains close to the initial state even after being used 300 times, and has a good resistance.
圖21A-21B分別為習知測試座之探針與本發明測試座之彈力金屬件通以6A電流時之彈力及溫度變化趨勢圖。圖式說明在探針通以連續電流至6A下,探針彈力及溫度變化,如圖21A所示,習知測試座之探針在通以6A的電流後,其溫度升高至101.6℃,已然超過100℃,而其彈力更降至接近0g;相對地,如圖21B所示,在本發明測試座之探針之彈性可維持在大約25g的彈力,另外,溫度更僅有61.7℃,低於習知探針之溫度大約40℃,可見本發明之測試座即便應用於大電流之測試環境,仍有良好的效能表現。 21A-21B are respectively diagrams showing the elastic force and temperature change trends of the probe of the conventional test socket and the elastic metal part of the test socket of the present invention when a current of 6A is passed through the elastic metal part. The diagram illustrates the change in probe elasticity and temperature when a continuous current of 6A is passed through the probe. As shown in FIG21A, after a current of 6A is passed through the probe of the conventional test socket, its temperature rises to 101.6℃, which is already over 100℃, and its elasticity drops to nearly 0g. In contrast, as shown in FIG21B, the elasticity of the probe of the test socket of the present invention can be maintained at an elasticity of about 25g, and the temperature is only 61.7℃, which is about 40℃ lower than the temperature of the conventional probe. It can be seen that the test socket of the present invention still has good performance even when used in a large current test environment.
圖22A-22C為習知測試座之新舊探針以及本發明測試座之已使用彈力金屬件通以3A電流時之彈力及溫度變化趨勢圖。具體而言,習知探針未使用下量測到阻值為37.5毫歐姆(mΩ),在經過相當次數的測試使用後,習知探針之阻值將升至171.2毫歐姆(mΩ),而本發明採用已多次使用之探針(即彈力金屬件),其阻值為37.7毫歐姆(mΩ),基於上述條件下通以3A電流來進行實驗。如圖22A所示,為具有新探針之習知測試座,習知探針即便未使用下,在通以3A電流時,彈力雖能維持但溫度來到24.6℃;另外,如圖22B所示,為具有舊探針之習知測試座,習知探針隨著使用次數或時間增加其阻值升高至171.2毫歐姆(mΩ),在通以3A電流下,不僅彈力受影響,重點是其溫度升高超過80℃,高達89.680℃;反之,如圖22C所示,本發明測試座之探針即便為已多次使用,其阻值仍維持在37.7毫歐姆(mΩ),在通以3A電流下,仍可保持良好的彈力表現,且溫度僅為上升至25.8℃,是以,本發明之探針(即彈力金屬件),即便是多次使用後,仍能保持與習知技術下新探針的表現,足證本發明之測試座確實可達到良好的效能。 Figures 22A-22C are the elastic force and temperature change trend diagrams of the old and new probes of the conventional test socket and the used elastic metal parts of the test socket of the present invention when a current of 3A is passed through them. Specifically, the resistance value of the conventional probe before use is 37.5 milliohms (mΩ). After a considerable number of test uses, the resistance value of the conventional probe will rise to 171.2 milliohms (mΩ). The present invention uses a probe (i.e., an elastic metal part) that has been used many times, and its resistance value is 37.7 milliohms (mΩ). Based on the above conditions, a current of 3A is passed through it to conduct experiments. As shown in FIG22A, a new probe tip is used for the learning test socket. Even if the learning probe tip is not used, when a current of 3A is applied, the elastic force can be maintained but the temperature reaches 24.6°C. In addition, as shown in FIG22B, a used probe tip is used for the learning test socket. As the number of times or time of use increases, the resistance of the learning probe tip increases to 171.2 milliohms (mΩ). When a current of 3A is applied, not only the elastic force is affected, but more importantly, the temperature increases by more than 80°C, reaching 89. 680℃; on the contrary, as shown in FIG22C, the probe of the test socket of the present invention maintains a resistance of 37.7 milliohms (mΩ) even after being used many times. When a current of 3A is applied, it can still maintain good elastic performance, and the temperature only rises to 25.8℃. Therefore, the probe of the present invention (i.e., the elastic metal part) can still maintain the performance of a new probe under the prior art even after being used many times, which proves that the test socket of the present invention can indeed achieve good performance.
上述實施例僅為例示性說明,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修飾與改變。因此,本發明之權利保護範圍係由本發明所附之申請專利範圍所定義,只要不影響本發明之效果及實施目的,應涵蓋於此公開技術內容中。 The above embodiments are only illustrative and not intended to limit the present invention. Anyone familiar with this technology may modify and change the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application attached to the present invention. As long as it does not affect the effect and implementation purpose of the present invention, it should be covered by this public technical content.
1:測試座 1: Test socket
11:基座 11: Base
111:第一表面 111: First surface
112:第二表面 112: Second surface
113:通孔 113:Through hole
12:導電彈性片 12: Conductive elastic sheet
13:彈力金屬件 13: Elastic metal parts
131:第一接觸端 131: First contact end
1311:凸塊 1311: Bump
132:第二接觸端 132: Second contact end
4:測試裝置 4: Test equipment
R:導電彈性區 R: Conductive elastic region
Claims (17)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202363507337P | 2023-06-09 | 2023-06-09 | |
| US63/507,337 | 2023-06-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI862191B true TWI862191B (en) | 2024-11-11 |
| TW202449403A TW202449403A (en) | 2024-12-16 |
Family
ID=90120484
Family Applications (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112128446A TWI862047B (en) | 2023-06-09 | 2023-07-28 | Test socket |
| TW112207966U TWM650398U (en) | 2023-06-09 | 2023-07-28 | Test socket |
| TW112137138A TWI862191B (en) | 2023-06-09 | 2023-07-28 | Test socket |
| TW113120331A TWI901161B (en) | 2023-06-09 | 2024-05-31 | Test socket |
| TW113120333A TW202514119A (en) | 2023-06-09 | 2024-05-31 | Testing device and testing equipment |
| TW113121349A TWI901181B (en) | 2023-06-09 | 2024-06-07 | Test socket, cooling system and test system |
| TW113121351A TWI884802B (en) | 2023-06-09 | 2024-06-07 | Test socket |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112128446A TWI862047B (en) | 2023-06-09 | 2023-07-28 | Test socket |
| TW112207966U TWM650398U (en) | 2023-06-09 | 2023-07-28 | Test socket |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113120331A TWI901161B (en) | 2023-06-09 | 2024-05-31 | Test socket |
| TW113120333A TW202514119A (en) | 2023-06-09 | 2024-05-31 | Testing device and testing equipment |
| TW113121349A TWI901181B (en) | 2023-06-09 | 2024-06-07 | Test socket, cooling system and test system |
| TW113121351A TWI884802B (en) | 2023-06-09 | 2024-06-07 | Test socket |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN220584352U (en) |
| TW (7) | TWI862047B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118091377B (en) * | 2024-04-24 | 2024-06-21 | 安盈半导体技术(常州)有限公司 | Metal micro-particle medium chip test interface |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050091844A1 (en) * | 2000-11-30 | 2005-05-05 | Intel Corporation | Solderless electronics packaging and methods of manufacture |
| TW201530166A (en) * | 2013-12-24 | 2015-08-01 | Isc Co Ltd | Semiconductor device alignment socket unit and semiconductor device test apparatus including the same |
| TWM556016U (en) * | 2017-08-31 | 2018-02-21 | Winway Technology Co Ltd | Electronic component testing device and system thereof |
| TW201837486A (en) * | 2017-01-09 | 2018-10-16 | 美商三角設計公司 | Socket side thermal system |
| CN216117715U (en) * | 2021-09-29 | 2022-03-22 | 江苏捷策创电子科技有限公司 | Chip testing seat |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6249135B1 (en) * | 1997-09-19 | 2001-06-19 | Fujitsu Limited | Method and apparatus for passive optical characterization of semiconductor substrates subjected to high energy (MEV) ion implantation using high-injection surface photovoltage |
| JP3427086B2 (en) * | 2000-02-23 | 2003-07-14 | Necエレクトロニクス株式会社 | IC socket |
| US8102184B2 (en) * | 2006-01-17 | 2012-01-24 | Johnstech International | Test contact system for testing integrated circuits with packages having an array of signal and power contacts |
| JP2009139298A (en) * | 2007-12-10 | 2009-06-25 | Tokyo Electron Ltd | Probe card |
| US9804223B2 (en) * | 2009-11-30 | 2017-10-31 | Essai, Inc. | Systems and methods for conforming test tooling to integrated circuit device with heater socket |
| CN105008940B (en) * | 2013-02-19 | 2018-01-09 | 株式会社Isc | Test socket with high-density conductive part |
| EP3465238A4 (en) * | 2016-06-02 | 2020-01-22 | KES Systems, Inc. | SYSTEM AND METHOD FOR A SEMICONDUCTOR'S BURN-IN TEST |
| TWI758091B (en) * | 2021-02-08 | 2022-03-11 | 鴻勁精密股份有限公司 | Testing mechanism, connecting mechanism and handler using the same |
| TWI799949B (en) * | 2021-08-17 | 2023-04-21 | 伊士博國際商業股份有限公司 | Close loop liquid cooling burn-in apparatus and temperature control method thereof |
-
2023
- 2023-07-28 TW TW112128446A patent/TWI862047B/en active
- 2023-07-28 TW TW112207966U patent/TWM650398U/en unknown
- 2023-07-28 TW TW112137138A patent/TWI862191B/en active
- 2023-08-15 CN CN202322190858.6U patent/CN220584352U/en active Active
-
2024
- 2024-05-31 TW TW113120331A patent/TWI901161B/en active
- 2024-05-31 TW TW113120333A patent/TW202514119A/en unknown
- 2024-06-07 TW TW113121349A patent/TWI901181B/en active
- 2024-06-07 TW TW113121351A patent/TWI884802B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050091844A1 (en) * | 2000-11-30 | 2005-05-05 | Intel Corporation | Solderless electronics packaging and methods of manufacture |
| TW201530166A (en) * | 2013-12-24 | 2015-08-01 | Isc Co Ltd | Semiconductor device alignment socket unit and semiconductor device test apparatus including the same |
| TW201837486A (en) * | 2017-01-09 | 2018-10-16 | 美商三角設計公司 | Socket side thermal system |
| TWM556016U (en) * | 2017-08-31 | 2018-02-21 | Winway Technology Co Ltd | Electronic component testing device and system thereof |
| CN216117715U (en) * | 2021-09-29 | 2022-03-22 | 江苏捷策创电子科技有限公司 | Chip testing seat |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202449405A (en) | 2024-12-16 |
| TWI862047B (en) | 2024-11-11 |
| TW202449403A (en) | 2024-12-16 |
| TWI901181B (en) | 2025-10-11 |
| TWM650398U (en) | 2024-01-11 |
| TW202449404A (en) | 2024-12-16 |
| TWI901161B (en) | 2025-10-11 |
| CN220584352U (en) | 2024-03-12 |
| TW202449932A (en) | 2024-12-16 |
| TWI884802B (en) | 2025-05-21 |
| TW202514119A (en) | 2025-04-01 |
| TW202514120A (en) | 2025-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100734296B1 (en) | Socket pin for inspection device with self-cleaning function and inspection device including same | |
| KR100926777B1 (en) | Test socket with protruding conductive part on conductive pad | |
| KR101806472B1 (en) | Burn-in test socket having wire silicon rubber interposed between contact pin and semiconductor device | |
| US20080061809A1 (en) | Pogo pins and contact-type of test device having pogo pins for testing semiconductor device | |
| KR101057371B1 (en) | Inspection probe | |
| KR102473943B1 (en) | Pin for test socket and test socket having the same | |
| JP5119360B2 (en) | Socket for semiconductor chip inspection | |
| US9653833B2 (en) | Contact pin and electrical component socket | |
| TWI862191B (en) | Test socket | |
| US20240319227A1 (en) | Test socket | |
| KR20080056978A (en) | Pogo Pins for Semiconductor Test Equipment | |
| KR100979313B1 (en) | Semiconductor test socket | |
| KR102728126B1 (en) | Test socket with stroke control means | |
| KR102714657B1 (en) | Test socket | |
| KR20100045705A (en) | Test socket coupling tightly conductor to pad | |
| KR20190125842A (en) | Anisotropic conductive sheet | |
| US11802909B2 (en) | Compliant ground block and testing system having compliant ground block | |
| KR20090006326U (en) | Pogo pin | |
| US20110207343A1 (en) | Contact-type electronic inspection module | |
| KR200328984Y1 (en) | Test socket for high frequency | |
| KR101039569B1 (en) | Contact Electronic Inspection Module | |
| KR200430815Y1 (en) | Inspection probe | |
| KR100809578B1 (en) | Inspection probe | |
| KR102859196B1 (en) | Pin for test socket and test socket having the same | |
| KR101266927B1 (en) | Microguide for testing semiconductor |