TWM650398U - Test socket - Google Patents
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- TWM650398U TWM650398U TW112207966U TW112207966U TWM650398U TW M650398 U TWM650398 U TW M650398U TW 112207966 U TW112207966 U TW 112207966U TW 112207966 U TW112207966 U TW 112207966U TW M650398 U TWM650398 U TW M650398U
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Abstract
Description
本創作係關於半導體測試之技術,尤指一種測試座。 This work is about semiconductor testing technology, especially a test socket.
於半導體封裝測試中,通常使用具有複數探針之測試座(Socket)供例如半導體封裝件或晶片之待測物置入,再藉由各探針與半導體封裝件或晶片電性連接後,使測試訊號經各探針傳送至半導體封裝件或晶片,以達到測試之目的。 In semiconductor packaging testing, a test socket (Socket) with a plurality of probes is usually used for placing an object under test such as a semiconductor package or chip, and then each probe is electrically connected to the semiconductor package or chip to conduct the test. The signal is transmitted to the semiconductor package or chip through each probe for testing purposes.
隨著測試條件逐漸嚴苛,測試過程中對訊號品質要求愈來愈高,因此,探針與待測物之間的傳遞路徑,在測試介面上扮演著非常重要的角色,是以,如何縮短傳遞路徑或是提升接觸介面之間的接觸性成為業界待解課題之一。 As the test conditions become increasingly stringent, the requirements for signal quality during the test process are getting higher and higher. Therefore, the transmission path between the probe and the object under test plays a very important role in the test interface. Therefore, how to shorten the The delivery path or improving the contact between contact interfaces has become one of the issues to be solved in the industry.
如圖1所示,為習知測試座對待測物進行測試之示意圖,如圖所示,測試插座100包括具有複數導通孔102之底座101以及分設於各該導通孔102中之探針103,其中,該測試插座100係設於一測試設備104上,以自該測試設備104接收測試訊號,其中,該測試設備104可例如為一印刷電路板(Printed circuit board,PCB)。於測試時,將具有複數導電塊91(例如焊球)之待測物9置於該底座101上,且向下對待測物9施力,使待測物9之導電塊91
與探針103之探針頭直接電性接觸,測試訊號即可經過各該探針103及各該導電塊91而傳送至待測物9,以進行待測物9之測試。
As shown in Figure 1, it is a schematic diagram of a conventional test socket for testing an object under test. As shown in the figure, the
惟,於測試過程中,探針103之探針頭常為圓球狀或針狀結構,且測試插座100之探針103與待測物9之導電塊91皆為固態的硬質金屬,故該探針頭與該導電塊91之間以點接觸之方式相接,是以,兩者之間存在接觸性不佳且穩定性差之問題,此將導致於介面處(即該探針頭與該導電塊91之接觸處)產生較高的接觸阻值,隨著接觸阻值升高,又將造成測試訊號之電流通過探針頭與導電塊91之接觸處時發生嚴重的電熱效應,而電熱效應所產生的高溫又將影響探針103之彈力,使探針103之彈力下降,此後,探針103與待測物9的接觸性因之不穩而變差,最終引發一連串的惡性循環;另外,由於習知之探針103於測試時,探針頭受到內部之彈簧的彈力驅使而推頂待測物9之導電塊91,此將使得探針頭磨損,更因之產生金屬碎屑而造成探針頭髒汙以及前述之接觸阻值升高,甚者還可能造成導電塊91或探針頭之間短路而損壞待測物9,故須常利用特殊之清潔物品進行探針頭之清潔,以避免前述之各種不良反應;又,於發生前述探針頭磨耗致探針103損壞時,必須對不堪使用之探針103進行更換,但測試插座100中設置許多探針103,要在眾多探針103中尋找損壞者相當困難且耗時,十分不便。
However, during the test process, the probe head of the
鑑於上述問題,如何提供一種測試座,特別是,可提供探針與待測物之間良好的接觸穩定性,同時能有效降低接觸阻值,避免隨之產生的電熱效應發生,此將成為目前本技術領域人員急欲追求之目標。 In view of the above problems, how to provide a test socket that can provide good contact stability between the probe and the object under test, and at the same time effectively reduce the contact resistance and avoid the resulting electrothermal effect, will become a current issue. A goal that people in this technical field are eager to pursue.
為解決上述現有技術之問題,本創作揭露一種測試座,係包括:基座,具有第一表面、相對該第一表面之第二表面以及連通該第一表面及該第二表面之複數通孔;導電彈性片,位該基座之該第一表面上方;以及複數彈力金屬件,分別設於各該複數通孔中,其中,各該彈力金屬件具有朝向該導電彈性片之第一接觸端,且該第一接觸端包含適於沒入該導電彈性片之凸塊。 In order to solve the above-mentioned problems in the prior art, the present invention discloses a test base, which includes: a base having a first surface, a second surface opposite to the first surface, and a plurality of through holes connecting the first surface and the second surface. ; The conductive elastic piece is located above the first surface of the base; and a plurality of elastic metal parts are respectively provided in each of the plurality of through holes, wherein each elastic metal piece has a first contact end facing the conductive elastic piece , and the first contact end includes a bump suitable for being embedded in the conductive elastic piece.
於一實施例中,各該彈力金屬件之該凸塊係適於刺穿該導電彈性片之表面,以沒入該導電彈性片之內部。 In one embodiment, the protrusions of each elastic metal component are adapted to pierce the surface of the conductive elastic piece so as to be submerged into the interior of the conductive elastic piece.
於一具體實施例中,各該彈力金屬件之該凸塊為複數個,且為尖狀。 In a specific embodiment, each of the elastic metal parts has a plurality of bumps and is pointed.
於另一實施例中,各該彈力金屬件之該凸塊係壓抵該導電彈性片而陷入該導電彈性片,使該導電彈性片包覆該凸塊。 In another embodiment, the bumps of each elastic metal piece press against the conductive elastic piece and sink into the conductive elastic piece, so that the conductive elastic piece covers the bump.
於另一實施例中,各該彈力金屬件係為彈簧探針、垂直式探針或微機電探針。 In another embodiment, each of the elastic metal parts is a spring probe, a vertical probe or a micro-electromechanical probe.
於另一實施例中,該導電彈性片設於該基座之一框座上,以與各該彈力金屬件之該凸塊間有一間隔距離。 In another embodiment, the conductive elastic piece is disposed on a frame of the base to have a distance from the bumps of each elastic metal part.
於另一實施例中,該凸塊之長度大於等於0.01毫米(mm)且小於該導電彈性片之厚度。 In another embodiment, the length of the bump is greater than or equal to 0.01 millimeter (mm) and less than the thickness of the conductive elastic sheet.
於另一實施例中,各該彈力金屬件復包括用以設於各該通孔中之彈性體、可轉動地設於該彈性體且供該第一接觸端連接之金屬塊以及與該金屬塊連接且朝向該第二表面延伸之第二接觸端。 In another embodiment, each elastic metal component further includes an elastic body disposed in each through hole, a metal block rotatably disposed on the elastic body and connected to the first contact end, and a metal block connected to the metal. The block is connected to a second contact end extending toward the second surface.
於另一實施例中,該基座為金屬座體,該導電彈性片包括分別對應各該彈力金屬件之複數導電彈性區以及分布於各該導電彈性區內之複數導電粒子,其中,各該導電彈性區之寬度大於各該通孔之孔徑,使各該導電彈性區接觸該基座。 In another embodiment, the base is a metal base body, and the conductive elastic sheet includes a plurality of conductive elastic areas corresponding to each of the elastic metal parts and a plurality of conductive particles distributed in each of the conductive elastic areas, wherein each of The width of the conductive elastic region is larger than the diameter of each through hole, so that each conductive elastic region contacts the base.
於另一實施例中,該導電彈性片之厚度大於等於0.15毫米且小於或等於2毫米。 In another embodiment, the thickness of the conductive elastic sheet is greater than or equal to 0.15 mm and less than or equal to 2 mm.
於另一實施例中,該導電彈性片之厚度大於等於0.15毫米且小於等於0.4毫米。 In another embodiment, the thickness of the conductive elastic sheet is greater than or equal to 0.15 mm and less than or equal to 0.4 mm.
於另一實施例中,該導電彈性片包括基板以及分布於該基板內之複數導電粒子。 In another embodiment, the conductive elastic sheet includes a substrate and a plurality of conductive particles distributed in the substrate.
於另一實施例中,各該導電粒子粒徑大於等於0.005毫米且小於等於0.1毫米。 In another embodiment, the particle size of each conductive particle is greater than or equal to 0.005 mm and less than or equal to 0.1 mm.
於另一實施例中,該複數導電粒子於該導電彈性片中之占比為大於等於30%且小於等於90%。 In another embodiment, the proportion of the plurality of conductive particles in the conductive elastic sheet is greater than or equal to 30% and less than or equal to 90%.
於另一實施例中,復包括另一導電彈性片位於該基座之該第二表面下方。 In another embodiment, another conductive elastic piece is included below the second surface of the base.
於另一實施例中,該導電彈性片具有相對之第一接觸面以及第二接觸面,且該導電彈性片以該第一接觸面朝該第一表面設置於該基座上,且該第二接觸面對應各該彈力金屬件處具有凸出該第二接觸面之複數凸墊。 In another embodiment, the conductive elastic piece has a first contact surface and a second contact surface opposite each other, and the conductive elastic piece is disposed on the base with the first contact surface facing the first surface, and the third contact surface is disposed on the base. The two contact surfaces have a plurality of convex pads protruding from the second contact surface corresponding to each elastic metal component.
於另一實施例中,該導電彈性片覆蓋於該基座之該第一表面,以密封各該通孔。 In another embodiment, the conductive elastic sheet covers the first surface of the base to seal each through hole.
於另一實施例中,該基座復包括設於該導電彈性片周側且具有一流體入口及一流體出口之架體,該導電彈性片設於該基座之該第一表面上,且該架體與該導電彈性片之上側面形成與該流體入口及該流體出口連通以供流體進入之流體空間。 In another embodiment, the base further includes a frame disposed around the conductive elastic sheet and having a fluid inlet and a fluid outlet, the conductive elastic sheet being disposed on the first surface of the base, and The frame body and the upper side of the conductive elastic sheet form a fluid space connected to the fluid inlet and the fluid outlet for fluid to enter.
於另一實施例中,該導電彈性片包括具有複數導電彈性區的基板以及分布於各該導電彈性區內之複數導電粒子,且至少一該導電彈性區對應至少二該彈力金屬件。 In another embodiment, the conductive elastic sheet includes a substrate with a plurality of conductive elastic areas and a plurality of conductive particles distributed in each conductive elastic area, and at least one of the conductive elastic areas corresponds to at least two of the elastic metal parts.
於另一實施例中,本創作復復包括一導電件,且該導電彈性片包括具有分別對應各該彈力金屬件之複數導電彈性區的基板以及分布於各該導電彈性區內之複數導電粒子,其中,該導電件電性連接至少二該導電彈性區。 In another embodiment, the present invention includes a conductive component, and the conductive elastic sheet includes a substrate having a plurality of conductive elastic areas corresponding to each of the elastic metal components and a plurality of conductive particles distributed in each of the conductive elastic areas. , wherein the conductive member is electrically connected to at least two of the conductive elastic regions.
於另一實施例中,該彈力金屬件為接地探針或電源探針。 In another embodiment, the elastic metal component is a ground probe or a power probe.
於另一實施例中,該導電彈性片之周側設有支撐體,該導電彈性片藉由該支撐體設於該基座上,使該導電彈性片與該第一表面或該第二表面之間具有間隙,以供各該彈力金屬件之兩端能分別凸出該基座之該第一表面和該第二表面,且與該導電彈性片接觸。 In another embodiment, a support body is provided on the peripheral side of the conductive elastic piece, and the conductive elastic piece is disposed on the base through the support body, so that the conductive elastic piece is in contact with the first surface or the second surface. There is a gap therebetween so that the two ends of each elastic metal piece can respectively protrude from the first surface and the second surface of the base and contact the conductive elastic piece.
於又一實施例中,各該彈力金屬件之該凸塊刺穿該導電彈性片之下表面而沒入該導電彈性片時,該凸塊之頂端與該導電彈性片之上表面之距離小於0.35毫米,或是該凸塊之頂端與該導電彈性片之上表面之間的距離於該導電彈性片之厚度的佔比為85%以下。 In yet another embodiment, when the bump of each elastic metal piece penetrates the lower surface of the conductive elastic piece and is submerged into the conductive elastic piece, the distance between the top of the bump and the upper surface of the conductive elastic piece is less than 0.35 mm, or the distance between the top of the bump and the upper surface of the conductive elastic sheet accounts for less than 85% of the thickness of the conductive elastic sheet.
本創作復揭露一種測試座,係包括:基座,具有第一表面、相對該第一表面之第二表面以及連通該第一表面及該第二表面之複數通孔;複數 彈力金屬件,分別設於各該複數通孔中;以及導電彈性片,位於該基座及該複數彈力金屬件上方,且厚度小於等於2毫米。 The present invention further discloses a test base, which includes: a base having a first surface, a second surface opposite to the first surface, and a plurality of through holes connecting the first surface and the second surface; Elastic metal parts are respectively provided in each of the plurality of through holes; and a conductive elastic piece is located above the base and the plurality of elastic metal parts, and has a thickness of less than or equal to 2 mm.
於一實施例中,該導電彈性片之厚度為小於等於0.4毫米。 In one embodiment, the thickness of the conductive elastic sheet is less than or equal to 0.4 mm.
於另一實施例中,各該彈力金屬件具有朝向該導電彈性片之第一接觸端,該第一接觸端包含適於刺穿該導電彈性片之表面的凸塊,使該凸塊能沒入該導電彈性片之內部。 In another embodiment, each elastic metal member has a first contact end facing the conductive elastic piece, and the first contact end includes a protrusion adapted to pierce the surface of the conductive elastic piece, so that the protrusion can disappear. into the conductive elastic sheet.
於另一實施例中,該凸塊為複數個,且為尖狀。 In another embodiment, there are a plurality of bumps and they are pointed.
於另一實施例中,該凸塊之長度大於等於0.01毫米且小於該導電彈性片之厚度。 In another embodiment, the length of the bump is greater than or equal to 0.01 mm and less than the thickness of the conductive elastic sheet.
於另一實施例中,該基座為金屬座體,該導電彈性片包括分別對應各該彈力金屬件之複數導電彈性區以及分布於各該導電彈性區內之複數導電粒子,其中,各該導電彈性區之寬度大於各該通孔之孔徑,使各該導電彈性區接觸該基座。 In another embodiment, the base is a metal base body, and the conductive elastic sheet includes a plurality of conductive elastic areas corresponding to each of the elastic metal parts and a plurality of conductive particles distributed in each of the conductive elastic areas, wherein each of The width of the conductive elastic region is larger than the diameter of each through hole, so that each conductive elastic region contacts the base.
於另一實施例中,該導電彈性片之該厚度大於等於0.15毫米且小於等於0.4毫米。 In another embodiment, the thickness of the conductive elastic sheet is greater than or equal to 0.15 mm and less than or equal to 0.4 mm.
於另一實施例中,該導電彈性片包括基板以及分布於該基板內之複數導電粒子。 In another embodiment, the conductive elastic sheet includes a substrate and a plurality of conductive particles distributed in the substrate.
於另一實施例中,該基座復包括設於該導電彈性片周側且具有一流體入口及一流體出口之架體,該導電彈性片設於該基座之該第一表面上,以密封各該通孔,且該架體與該導電彈性片之上側面形成與該流體入口及該流體出口連通以供流體進入之流體空間。 In another embodiment, the base further includes a frame disposed around the conductive elastic sheet and having a fluid inlet and a fluid outlet, and the conductive elastic sheet is disposed on the first surface of the base to Each through hole is sealed, and the frame body and the upper side of the conductive elastic sheet form a fluid space connected to the fluid inlet and the fluid outlet for fluid to enter.
於又一實施例中,復包括一導電件,且該導電彈性片包括具有分別對應各該彈力金屬件之複數導電彈性區的基板以及分布於各該導電彈性區內之複數導電粒子,其中,該導電件電性連接至少二該導電彈性區。 In another embodiment, it further includes a conductive member, and the conductive elastic sheet includes a substrate having a plurality of conductive elastic areas corresponding to each of the elastic metal members and a plurality of conductive particles distributed in each of the conductive elastic areas, wherein, The conductive component is electrically connected to at least two conductive elastic areas.
本創作復揭露一種測試座,係包括:基座;導電彈性片,係位於該基座上;以及複數彈力金屬件,係設於該基座內,其中,該彈力金屬件沒入該導電彈性片時,該彈力金屬件與該導電彈性片之間的接觸阻值,小於該彈力金屬件碰觸待測元件之導電塊的接觸阻值。 This invention further discloses a test base, which includes: a base; a conductive elastic piece located on the base; and a plurality of elastic metal parts located in the base, wherein the elastic metal parts are submerged in the conductive elastic piece. When the elastic metal piece contacts the conductive elastic piece, the contact resistance between the elastic metal piece and the conductive elastic piece is smaller than the contact resistance between the elastic metal piece and the conductive block of the component under test.
於一實施例中,該基座包括相對之第一表面與第二表面以及連通該第一表面及該第二表面之複數通孔,且該第一表面用於供該導電彈性片設置,而各該通孔供各該彈力金屬件設置。 In one embodiment, the base includes an opposing first surface and a second surface and a plurality of through holes connecting the first surface and the second surface, and the first surface is used for disposing the conductive elastic sheet, and Each through hole is provided for each elastic metal component.
於另一實施例中,各該彈力金屬件具有朝向該導電彈性片之第一接觸端,且該第一接觸端包含適於沒入該導電彈性片之凸塊。 In another embodiment, each elastic metal member has a first contact end facing the conductive elastic piece, and the first contact end includes a protrusion adapted to be submerged in the conductive elastic piece.
於另一實施例中,各該彈力金屬件之該凸塊係適於刺穿該導電彈性片之表面,以沒入該導電彈性片之內部。 In another embodiment, the bumps of each elastic metal part are adapted to pierce the surface of the conductive elastic piece so as to be submerged into the interior of the conductive elastic piece.
於另一實施例中,各該彈力金屬件之該凸塊為複數個,且為尖狀。 In another embodiment, the bumps of each elastic metal part are plural and are pointed.
於另一實施例中,該凸塊之長度大於等於0.01毫米且小於該導電彈性片之厚度。 In another embodiment, the length of the bump is greater than or equal to 0.01 mm and less than the thickness of the conductive elastic sheet.
於另一實施例中,該導電彈性片包括基板以及分布於該基板內之複數導電粒子。 In another embodiment, the conductive elastic sheet includes a substrate and a plurality of conductive particles distributed in the substrate.
於另一實施例中,該基座復包括設於該導電彈性片周側且具有一流體入口及一流體出口之架體,該導電彈性片設於該基座之該第一表面上, 以密封各該通孔,且該架體與該導電彈性片之上側面形成與該流體入口及該流體出口連通以供流體進入之流體空間。 In another embodiment, the base further includes a frame disposed around the conductive elastic sheet and having a fluid inlet and a fluid outlet, and the conductive elastic sheet is disposed on the first surface of the base, Each through hole is sealed, and the upper side of the frame body and the conductive elastic sheet forms a fluid space connected to the fluid inlet and the fluid outlet for fluid to enter.
於又一實施例中,該導電彈性片之厚度為小於等於0.4毫米。 In another embodiment, the thickness of the conductive elastic sheet is less than or equal to 0.4 mm.
由上可知,本創作之測試座,藉由使各彈力金屬件之第一接觸端之凸塊沒入導電彈性片中,增加該第一接觸端與該導電彈性片之接觸面積,以達到降低接觸阻值之目的,且在凸塊為該導電彈性片包覆下,可使各該彈力金屬件不易產生晃動,因而具有穩定接觸之功效;另外,於該凸塊刺入該導電彈性片中時,能與各該導電粒子直接接觸,故可達到快速降低阻值以及清潔該第一接觸端之表面之目的;另外,藉由該導電彈性片密封各該通孔,能避免雜物進入通孔中而造成各該彈力金屬件有髒汙之問題。 It can be seen from the above that the test socket of this invention increases the contact area between the first contact end and the conductive elastic piece by making the bumps of the first contact end of each elastic metal piece sink into the conductive elastic piece, so as to achieve the reduction of For the purpose of contact resistance, and when the bump is covered with the conductive elastic piece, the elastic metal parts can be prevented from shaking easily, thus having the effect of stable contact; in addition, when the bump penetrates into the conductive elastic piece can directly contact the conductive particles, so the resistance value can be quickly reduced and the surface of the first contact end can be cleaned; in addition, the conductive elastic sheet seals the through holes to prevent debris from entering the through holes. hole, causing the elastic metal parts to become dirty.
1,1’:測試座 1,1’: test seat
11,11’:基座 11,11’: base
111:第一表面 111: First surface
112:第二表面 112: Second surface
113:通孔 113:Through hole
1311:凸塊 1311:Bump
114:框座 114:Frame base
115,115’:流體入口 115,115’: Fluid inlet
116,116’:流體出口 116,116’: Fluid outlet
117:架體 117: Frame
118:流體空間 118:Fluid space
119:密封蓋 119:Sealing cover
12,12’,12”:導電彈性片 12, 12’, 12”: conductive elastic sheet
121:第一接觸面 121: First contact surface
122:第二接觸面 122: Second contact surface
123,123’:基板 123,123’:Substrate
124:導電粒子 124:Conductive particles
125:支撐體 125:Support
126:凸墊 126:convex pad
13,13’:彈力金屬件 13,13’: Elastic metal parts
131,131’:第一接觸端 131,131’: first contact end
132,132’:第二接觸端 132,132’: Second contact end
133:主體 133:Subject
135,135’:彈性件 135,135’: Elastic part
136:彈性體 136:Elastomer
137:金屬塊 137:Metal block
14:導電件 14: Conductive parts
2,2’:待測物 2,2’: object to be tested
21:導電塊 21:Conductive block
22:導電墊 22:Conductive pad
4:測試裝置 4:Test device
5:測試晶圓 5: Test wafer
9:待測物 9:Object to be tested
91:導電塊 91:Conductive block
100:測試插座 100:Test socket
101:底座 101:Base
102:導通孔 102: Via hole
103:探針 103:Probe
104:測試設備 104:Test equipment
A-A:剖面線 A-A: hatch line
D:寬度 D:Width
d:孔徑 d:Aperture
F:施力 F: Apply force
G:間隙 G: Gap
H:間隔距離 H: separation distance
L:長度 L: length
R:導電彈性區 R: Conductive elastic zone
S:區域 S: area
T:厚度 T:Thickness
t:距離 t: distance
圖1係習知測試座對待測物進行測試之架構圖。 Figure 1 is a structural diagram of a conventional test stand for testing the object under test.
圖2係本創作之測試座之立體分解圖。 Figure 2 is a three-dimensional exploded view of the test seat of this creation.
圖3係本創作之測試座之立體結構圖。 Figure 3 is a three-dimensional structural diagram of the test seat of this creation.
圖4係圖3之A-A剖面線之剖面圖。 Figure 4 is a cross-sectional view along the line A-A in Figure 3.
圖5係本創作之測試座置放待測物之測試示意圖。 Figure 5 is a schematic diagram of the test of placing the object under test on the test socket of this invention.
圖6係圖5中區域S之局部放大圖。 Figure 6 is a partial enlarged view of area S in Figure 5.
圖7係本創作之測試座中導電彈性片具有凸墊之結構示意圖。 Figure 7 is a schematic structural diagram of the conductive elastic sheet with convex pads in the test socket of this invention.
圖8係本創作之測試座中導電彈性片具有凸墊之使用狀態示意圖。 Figure 8 is a schematic diagram of the use state of the conductive elastic sheet with convex pads in the test socket of this invention.
圖9係本創作之測試座具有框座之結構示意圖。 Figure 9 is a schematic structural diagram of the test base of this invention with a frame base.
圖10A-10B係本創作之測試座具有架體之結構示意圖。 Figures 10A-10B are schematic structural diagrams of the test socket of this invention with a frame.
圖11係本創作之測試座應用於晶圓之架構圖。 Figure 11 is a structural diagram of the test socket of this invention applied to the wafer.
圖12係本創作之測試座應用於四端點測量(Kelvin contact)之架構圖。 Figure 12 is a structural diagram of the test socket of this creation used in four-point measurement (Kelvin contact).
圖13A-13B係本創作之測試座於導電彈性片上設置導電件之結構圖。 Figures 13A-13B are structural diagrams of the test socket of this invention with conductive elements on the conductive elastic sheet.
圖14A-14C係本創作之測試座不同設計之彈力金屬件之結構圖。 Figures 14A-14C are structural diagrams of elastic metal parts of different designs of the test seat of this invention.
圖15A-15B係習知測試座之探針與待測物之導電塊之阻值及彈力金屬件之彈力的關係圖。 15A-15B are diagrams showing the relationship between the resistance of the probe of the conventional test socket and the conductive block of the object under test, and the elastic force of the elastic metal part.
圖16A-16B係本創作之測試座之彈力金屬件與待測物之導電塊之阻值及彈力金屬件之彈力的關係圖。 Figures 16A-16B are diagrams showing the relationship between the resistance of the elastic metal part of the test seat of the present invention, the conductive block of the object under test, and the elastic force of the elastic metal part.
圖17A-17B分別係習知測試座之探針與本創作測試座之彈力金屬件未經表面處理時之阻值及彈力金屬件之彈力的關係圖。 Figures 17A-17B are respectively diagrams showing the relationship between the resistance value and the elastic force of the elastic metal part of the probe of the conventional test seat and the elastic metal part of the test seat of this invention without surface treatment.
圖18係習知測試座之探針與本創作測試座之彈力金屬件經多次測試下之阻值變化圖。 Figure 18 is a diagram of the resistance changes of the probe of the conventional test socket and the elastic metal part of the test socket of this invention after multiple tests.
圖19A-19B分別係習知測試座之探針第一次使用及經300次測試後之阻值及彈力金屬件之彈力的關係圖。 Figures 19A-19B are respectively diagrams showing the relationship between the resistance value and the elastic force of the elastic metal part of the probe of the conventional test socket after the first use and after 300 tests.
圖20A-20B分別係本創作測試座之彈力金屬件第一次使用及經300次測試後之阻值及彈力的關係圖。 Figures 20A-20B are respectively diagrams showing the relationship between the resistance and elasticity of the elastic metal part of the test seat of this invention after the first use and after 300 tests.
圖21A-21B分別係習知測試座之探針與本創作測試座之彈力金屬件通以6A電流時之彈力及溫度變化趨勢圖。 Figures 21A-21B are respectively graphs of the elastic force and temperature change trends of the probe of the conventional test socket and the elastic metal part of the test socket of this invention when a current of 6A is passed therethrough.
圖22A-22C係習知測試座之新舊探針以及本創作測試座之已使用彈力金屬件通以3A電流時之彈力及溫度變化趨勢圖。 Figures 22A-22C are graphs of elasticity and temperature change trends of the old and new probes of the conventional test socket and the used elastic metal parts of the test socket of this invention when a current of 3A is passed through.
以下藉由特定的具體實施形態說明本創作之技術內容,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本創作之優點與功效。然本創作亦可藉由其他不同的具體實施形態加以施行或應用。 The following describes the technical content of this invention through specific implementation forms. Those familiar with this technology can easily understand the advantages and effects of this invention from the content disclosed in this specification. However, this invention can also be implemented or applied through other different specific implementation forms.
圖2為本創作之測試座之立體分解圖,圖3為本創作之測試座之立體結構圖,圖4為圖3之A-A剖面線之剖面圖。如圖所示,本創作之測試座1包括基座11、位於該基座11上方之導電彈性片12以及朝向該導電彈性片12延伸而設於該基座11中之複數彈力金屬件13,於一具體實施例中,本創作之測試座1可為探針座或探針卡,且可設置於測試裝置4上,使各該彈力金屬件13自該測試裝置4接收測試訊號,其中,該彈力金屬件13可為探針。有關本創作之測試座1的詳細說明,如下所陳。
Figure 2 is a three-dimensional exploded view of the test seat of this invention. Figure 3 is a three-dimensional structural view of the test seat of this invention. Figure 4 is a cross-sectional view along the A-A section line in Figure 3. As shown in the figure, the
該基座11係為供待測物2(例如圖5中所示)放置之座體,具體地,該基座11包括第一表面111、相對於該第一表面111之第二表面112以及連通該第一表面111及該第二表面112之複數通孔113,藉由該第二表面112設置於提供測試訊號之測試裝置4上。再者,基座11之該第一表面111上方可供例如半導體封裝件、晶片或晶圓等待測物2設置,於一實施例中,該基座11由該第一表面111之周側朝該第二表面112之方向(如圖2所示之下方)延伸而形成側壁。另外,該基座11可為金屬材質所製成之座體,於一具體實施例中,該基座11可為一同軸式測試基座,可用於高頻測試。
The
該導電彈性片12可為具有優異的機械性能(例如延展性和韌性)之薄片,其位於該基座11之第一表面111上,具體而言,該導電彈性片12包括相對之第一接觸面121以及第二接觸面122,且導電彈性片12可為導電介質所製成之軟性片狀結構,其中,該導電介質受擠壓時,能沿著擠壓方向形成一導電路徑,使得電路上下導通,以達測試目的;另外,該導電彈性片12可貼附於該第一表面111上,亦即,該導電彈性片12可覆蓋該基座11之第一表面111而密封各通孔113,據此,可避免金屬碎屑、灰塵或液體掉入各通孔113,不僅使各通孔113及其內之彈力金屬件13能保持清潔,且能降低彈力金屬件13與氧氣接觸,減少彈力金屬件13發生金屬氧化之問題。
The conductive
於一具體實施例中,如圖2-4所示,該導電彈性片12可包括對應複數彈力金屬件13而定義有複數導電彈性區R之基板123,以及分布於各該導電彈性區R內之複數導電粒子124,據此,該導電彈性片12僅於各該導電彈性區R內分布有導電粒子124,基板123中非導電彈性區R之區域不具有導電粒子124,亦即,導電彈性片12中具有由分布有導電粒子之各導電彈性區R所形成之複數導電彈性墊(Bump Pad),是以,該導電彈性片12之第一接觸面121及第二接觸面122之間僅於各導電彈性區R(或各導電彈性墊)處形成導電路徑,可避免相鄰之導電彈性墊中所形成之導電路徑之間發生短路的現象,或有導電路徑之電流外溢至另一導電路徑之問題。
In a specific embodiment, as shown in Figures 2-4, the conductive
各該彈力金屬件13分別具有第一接觸端131及第二接觸端132且設於各該通孔113內,各彈力金屬件13能基於內部彈力而令其第一接觸端131朝基座11之第一表面111方向位移,或受到擠壓力而朝向通孔113內之方向移動。於一具體實施例中,本創作之彈力金屬件13可為例如彈簧探針、
垂直式探針或微機電探針等探針或其他具有彈力伸展而可提供行程以對待測物2進行封裝測試之元件,但不以此為限。
Each of the
特別的是,各彈力金屬件13之第一接觸端131朝向該導電彈性片12且包含適於沒入導電彈性片12中之凸塊1311,本創作透過增加凸塊1311與導電彈性片12的接觸面積,以達較低的接觸阻值,若與第一接觸端131直接電性連接待測物2相比較,能提供更佳的接觸阻值,亦即,於彈力金屬件13之凸塊1311沒入導電彈性片12時,該凸塊1311與該導電彈性片12之間的接觸阻值可小於該第一接觸端131直接接觸待測物2的接觸阻值。
In particular, the
經實驗驗證,若以彈力金屬件13直接接觸待測物2時,其實際阻值約為37.7毫歐姆(mΩ),另外,若本創作之測試座1之導電彈性片12採用厚度為0.2毫米時,在彈力金屬件13之凸塊1311沒入導電彈性片12中後,其接觸阻值可具有30.4毫歐姆(mΩ)之表現,顯見本創作之設計可提供較佳的測試環境。
It has been experimentally verified that if the
另外,第一接觸端131之凸塊1311適於沒入導電彈性片12包含兩種型態,第一種為第一接觸端131以凸塊1311擠壓導電彈性片12後,因導電彈性片12產生形變而使凸塊1311全部或部分被導電彈性片12包覆,第二種為凸塊1311直接穿刺導電彈性片12並嵌入導電彈性片12內。更具體來說,對於第一種之未嵌入型態,第一接觸端131之凸塊1311在不刺穿導電彈性片12表面下,透過陷入導電彈性片12表面,達到沒入導電彈性片12內部之結果,亦即,使導電彈性片12包覆凸塊1311全部或部分,據此,可增加彈力金屬件13與導電彈性片12之間的接觸面積;另外,對於第二種之嵌入型態,使第一接觸端131以凸塊1311刺穿導電彈性片12之表面(如圖4的
第一接觸面121)並進入到導電彈性片12內部,同樣能增加彈力金屬件13與導電彈性片12之間的接觸面積。
In addition, the
圖5為本創作之測試座置放待測物之測試示意圖,以及圖6為圖5中區域S之局部放大圖,請一併參考圖4。如圖4所示,導電彈性片12於導電彈性區中之第一接觸面121與第二接觸面122未受擠壓時,各導電粒子124之間可不相互電性連接;如圖5-6所示,於待測物2受施力F擠壓時,因導電彈性片12具彈性,不僅待測物2之導電塊21可陷入導電彈性片12,同時彈力金屬件13之凸塊1311也會沒入導電彈性片12,導電塊21與凸塊1311上下擠壓下,擠壓方向的各導電粒子124之間的距離漸小,進而相互接觸,即於各導電彈性區R中沿受擠壓方向提供第一接觸面121及第二接觸面122之間電性連接的導電路徑,據此,於待測物2測試過程,使測試訊號所形成之電流通過各導電彈性區R中所形成之導電路徑時,不致外溢至其他導電彈性區R中之導電路徑,即便待測物2之導電塊21密集,或隨著半導體製程演進而使待測物2微型化愈甚,仍可達到確保測試訊號於其導電路徑中傳遞之目的,具有各導電路徑之間互不干擾之功效。
Figure 5 is a schematic diagram of the testing of the object under test on the test socket of this invention, and Figure 6 is a partial enlarged view of the area S in Figure 5. Please refer to Figure 4 as well. As shown in Figure 4, when the
於實際應用上,如圖4-圖6所示,本創作之測試座1的初始狀態(如圖4所示)中,各彈力金屬件13之凸塊1311未沒入於導電彈性片12內,即各彈力金屬件13與導電彈性片12處於分離或僅相互接觸之狀態。進行測試時,基座11能自測試裝置4接收測試訊號,具體地,將具有複數導電塊21(例如焊球)之待測物2置入基座11以及導電彈性片12上後,使各導電塊21與對應之彈力金屬件13相對配置,待測物2受施力F而向下壓抵導電彈性片12時,待測物2與各彈力金屬件13上下擠壓導電彈性片12之導電彈性
墊(即分布有導電粒子之導電彈性區R),此時,各彈力金屬件13以凸塊1311沒入導電彈性片12中,使導電彈性片12中相對應之導電塊21與彈力金屬件13之間形成導電路徑(如圖6所示),據此,相對應之導電塊21以及彈力金屬件13透過導電路徑而電性連接,測試訊號經彈力金屬件13、導電彈性片12以及導電塊21傳送到待測物2,以對待測物2進行測試,由於彈力金屬件13以凸塊1311沒入導電彈性片12中,因而可獲得較大的接觸面積,能降低接觸阻值,且由於導電彈性片12透過導電彈性墊的設計,可避免相鄰之間的導電彈性墊中所形成的導電路徑相互干擾之問題。
In practical applications, as shown in Figures 4-6, in the initial state of the
另於測試完成後,將待測物2移除後,導電彈性片12無受到施力F擠壓,由於導電彈性片12具有彈性,會將第一接觸端131之凸塊1311推出,其中,凸塊1311於測試過程中,可能造成表面氧化而增加接觸阻值,故於沒入和推出過程中,凸塊1311之表面與導電彈性片12之間相互摩擦,能將氧化之表面磨除,不僅能確保接觸阻值之穩定,更具清潔凸塊1311之功效,故即便凸塊1311在未經電鍍或其他表面處理下,仍可維持接觸阻值之穩定性。另外,在彈力金屬件13上設置導電彈性片12,能避免彈力金屬件13之凸塊1311直接與待測物2之導電塊21壓抵而有磨損之情況,亦即,導電彈性片12復可提供凸塊1311緩衝及保護之功能,降低彈力金屬件13損壞可能,較佳者,於導電彈性片12受有損耗時,僅須替換導電彈性片12即可恢復本創作之測試座的測試效能,如此,可減少習知測試座在探針損壞下需從眾多探針尋找損壞者之程序,可達節省時間及成本之目的。此外,即便該導電彈性片12於測試過程中受到彈力金屬件13之凸塊1311擠壓或刺入,但由於導電彈性片12具有彈力,因而將凸塊1311推出後,可回復至未被擠壓的
狀態,或使被刺入之位置稍微恢復,因此,即便導電彈性片12受到凸塊1311刺入,仍可具有良好的使用壽命。
In addition, after the test is completed, after the
特別是,對於前述第二種之嵌入型態(彈力金屬件13之凸塊1311刺穿導電彈性片12之表面並進入到導電彈性片12內部),將具備以下特點。第一,第一接觸端131以凸塊1311與導電彈性片12內之導電粒子124直接電性接觸,能達到電性快速導通之效果,且由於凸塊1311嵌入(插入)導電彈性片12中而與更多的導電粒子124接觸,能有效降低接觸阻值;第二,各彈力金屬件13以凸塊1311刺穿導電彈性片12之表面時,因插入到導電彈性片12內部,使各彈力金屬件13之凸塊1311被導電彈性片12完整包覆而不易晃動,於測試過程中將具保持穩固及接觸穩定之效果,即各彈力金屬件13相對待測物2之導電塊21不易產生位移(即準確對位),可避免習知測試環境下因探針與待測物之間接觸面積小,而有位移以致探針損壞之情況;第三,彈力金屬件13之凸塊1311於測試時會插入導電彈性片12內部,且於測試結束時受導電彈性片12之彈力推出,是以,彈力金屬件13於插入與移出的過程中增加與導電彈性片12摩擦程度,將能提供清潔效果,特別是,凸塊1311之表面因氧化或其他老化所致之表面不潔的狀況,透過兩者之摩擦將得到改善,且由於前述之清潔效果,使凸塊1311之表面隨時保持如新,故彈力金屬件13之凸塊1311無須額外進行表面加工之維護,更可降低成本。
In particular, the second embedding type mentioned above (the
於一實施例中,該導電彈性片12(即指基板123)之厚度T為大於等於0.15毫米(mm)且小於等於2毫米,簡言之,若導電彈性片12厚度不足,容易被刺穿,若導電彈性片12厚度太厚,則會因傳導路徑過長,而致整體阻值上升。於另一實施例中,較佳者,0.150毫米≦厚度T≦1.5毫米,且
依據實驗結果,當導電彈性片12之厚度T≦0.4毫米時,可在接觸阻值不明顯增加下,同樣得到良好導電效果。另外,該導電彈性片12可透過調整厚度T以及彈力金屬件13之沒入深度來調控接觸阻值,舉例來說,在增加導電彈性片12之厚度T時,可透過增加彈力金屬件13進入導電彈性片12之深度,使接觸阻值維持在所需範圍內。
In one embodiment, the thickness T of the conductive elastic sheet 12 (ie, the substrate 123) is greater than or equal to 0.15 millimeters (mm) and less than or equal to 2 mm. In short, if the thickness of the conductive
又如圖6所示,各彈力金屬件13之凸塊1311刺穿該導電彈性片12之下表面而沒入該導電彈性片12時,凸塊1311之頂端與該導電彈性片之上表面之距離t可為小於0.35毫米,或是凸塊1311之頂端與該導電彈性片12之上表面之間的距離t於導電彈性片12之厚度T的佔比為85%以下,據此,即便導電彈性片12之厚度改變,仍可透過調整凸塊1311嵌入導電彈性片12內之程度而維持良好的接觸阻值。
As shown in FIG. 6 , when the
於另一具體實施例中,各該導電粒子124之粒徑,其大小可為大於等於0.005毫米且小於等於0.1毫米,亦即,若粒徑太小,粒子間的間隙層過多,阻值會過高,若粒徑太大,會使彈力金屬件13易磨損,且接觸面積變少;另外,該些複數導電粒子124於該導電彈性片12中所佔百分比,較佳者為大於等於30%且小於等於90%,易言之,若粒子密度過低,阻值會較高,若粒子密度過高,表示導電彈性片12內膠體成分少,導電彈性片12耐用度也會下降。
In another specific embodiment, the particle size of each
圖7為本創作之測試座中導電彈性片具有凸墊之結構示意圖,圖8為本創作之測試座中導電彈性片具有凸墊之使用狀態示意圖。如圖7所示,該導電彈性片12”以第一接觸面121面對第一表面111設置於基座11上,而第二接觸面122對應各彈力金屬件13處具有凸出該第二接觸面122之複數
凸墊126,據此,如圖8所示,可供具有複數導電墊22之待測物2’,透過各導電墊22對應各凸墊126而置於導電彈性片12”上,另外,於另一實施例中,當待測物之導電墊22為凹陷之結構(圖未繪示)時,藉由各該凸墊126進入對應之凹陷的導電墊22中,而於待測物2’測試過程中形成導電路徑。
Figure 7 is a schematic diagram of the structure of the conductive elastic piece with protruding pads in the test socket of this invention. Figure 8 is a schematic diagram of the use state of the conductive elastic piece in the test socket of this invention with protruding pads. As shown in FIG. 7 , the conductive
圖9為本創作之測試座具有框座之結構示意圖。如圖所示,於一實施例中,該導電彈性片12設於基座11之一框座114上,以與各彈力金屬件13之凸塊1311間有一間隔距離H,亦與該第一表面111保持一間隙,其中該導電彈性片12係可浮動地於垂直方向上進行位移,相較於圖4中部分彈力金屬件13之凸塊1311恰接觸導電彈性片12之表面或已穿刺至導電彈性片12內之態樣,本實施例之各凸塊1311於測試時,才會與導電彈性片12接觸,且於每進行一次壓測時,凸塊1311才會穿刺至導電彈性片12,亦即凸塊1311並不會在未進行測試的狀態下一直存在於導電彈性片12內,再者,凸塊1311每一次穿刺導電彈性片12的位置亦可能有所不同,不會重覆穿刺同一區域,故本實施例更可提供導電彈性片12回復之時間,有助於延長導電彈性片12之使用壽命。
Figure 9 is a schematic structural diagram of the test seat of this invention with a frame base. As shown in the figure, in one embodiment, the conductive
圖10A及圖10B為本創作之測試座具有架體之結構示意圖。如圖10A所示,測試座1之基座11復包括有設於導電彈性片12之基板123周側之架體117,具體來說,架體117設於(例如以膠黏固)基座11之第一表面111上,而導電彈性片12可被架體117包圍。詳言之,導電彈性片12設於基座11之第一表面111上且密封各通孔113,該架體117與該導電彈性片12之基板123的上表面(即導電彈性片12之第二接觸面122)之間形成供流體進入的空間,亦即,於待測物2置於導電彈性片12上方時,使待測物2之底面與導電彈性片12之第二接
觸面122之間形成流體空間118,以於待測物2測試過程中,將液體或氣體等不導電之流體引入流體空間118中,流體於流體空間118中流動(如圖中箭頭所示),而對待測物2進行散熱,以達到待測物2降溫之目的,亦即,藉由於該架體117開設與該流體空間118連通之流體入口115及流體出口116之方式,使流體能進入流體空間118。
Figures 10A and 10B are structural schematic diagrams of the test seat with a frame of this invention. As shown in Figure 10A, the
另外,如圖10B所示,亦可藉由於該架體117上方設置具有流體入口115’及流體出口116’之密封蓋119的方式,使流體自流體入口115’流入流體空間118中流動(如圖中箭頭所示),且由流體出口116’導出,以達前述散熱及降溫之目的,於實際應用上,密封蓋119可為例如半導體分類機之熱傳導裝置的一部分。於流體流入流體空間118時,由於導電彈性片12密封各通孔113,可避免流體流入各通孔113中,且於測試完成後,僅須透過抽出液體、灌入氣流或以其他電控方式將流體移除,不僅可對流體空間118進行清潔,也可避免測試過程中金屬碎屑或灰塵掉落各通孔113內而影響各彈力金屬件13之阻值,此外,導電彈性片12可避免流體(例如冷卻液體)於測試過程中進入通孔113中而影響各彈力金屬件13之高頻電性。
In addition, as shown in FIG. 10B , a sealing
圖11為本創作之測試座應用於晶圓之架構圖。如圖所示,在基座11’之第一表面111及第二表面112分別設有導電彈性片12及導電彈性片12’,其中,導電彈性片12’之基板123’的周側設有支撐體125,該導電彈性片12’藉該支撐體125設於該基座11’上,使得該導電彈性片12’形成帳篷狀結構,且該基板123’與第二表面112之間具有間隙G,以供各彈力金屬件13’之第二接觸端132’凸出該基座11’之第二表面112,且與該導電彈性片12’接觸,於本實施例中,彈力金屬件13’可為垂直式探針(Cobra探針)。另需說明
者,上述說明導電彈性片12’可設於該基座11’之第二表面112那端,但不以此為限,亦即,導電彈性片12’可設於該基座11’之第一表面111那端,結構設計相似,於此不再贅述。
Figure 11 is a structural diagram of the test socket of this invention applied to the wafer. As shown in the figure, a conductive
舉例而言,本創作之測試座1’應用於晶圓測試時,測試座1’可為探針卡且用於測試晶圓5,其中,測試座1’包括具有複數通孔之基座11’,各彈力金屬件13’分設於基座11’之各通孔中且包括由各通孔之上開口及下開口凸出之第一接觸端131’及第二接觸端132’以及設於各該通孔中且分別推抵該第一接觸端131’及該第二接觸端132’之彈性件135’,藉此,該測試座1’可透過將導電彈性片12設於基座11’之第一表面111上,以供待測物2設置其上,另外,可將具有支撐體125之導電彈性片12’設於基座11’之第二表面112上,使導電彈性片12’之第二接觸面(圖中朝上者)不會接觸該基座11’之第二表面112,於測試時,導電彈性片12’之第一接觸面(圖中朝下者)會接觸測試晶圓5之表面以進行測試。
For example, when the test socket 1' of the present invention is used for wafer testing, the test socket 1' can be a probe card and used to test the
圖12為本創作之測試座應用於四端點測量(Kelvin contact)之架構圖。如圖12所示,可依需求而使一導電彈性區R對應複數個彈力金屬件13’,例如應用於四端點測量(Kelvin contact)技術時,令一導電彈性區R對應兩個彈力金屬件13’,即兩個彈力金屬件13’共用一導電彈性區R,據以供待測物2之一導電塊21與複數彈力金屬件13’透過導電彈性區R而連接,以進行測試程序。
Figure 12 is a structural diagram of the test socket of this creation applied to four-end point measurement (Kelvin contact). As shown in Figure 12, a conductive elastic region R can be made to correspond to a plurality of elastic metal parts 13' according to requirements. For example, when applying the four-point measurement (Kelvin contact) technology, a conductive elastic region R can be made to correspond to two elastic metal parts. Component 13', that is, two elastic metal components 13' share a conductive elastic area R, which is used for connecting one of the
圖13A-13B為本創作之測試座於導電彈性片上設置導電件之架構圖。如圖13A所示,本創作之測試座1復包括對應至少二彈力金屬件13且設於導電彈性片12之第一接觸面121或第二接觸面122之導電件14(圖中以
第一接觸面121為例),導電件14可用以電性連接鄰近之各彈力金屬件,詳言之,當彈力金屬件13為接地探針時,能透過該導電件14電性連接鄰近之接地探針,或當彈力金屬件13為電源探針時,能透過該導電件14電性連接相鄰之電源探針,其中,於一實施例中,如圖所示,導電件14係設於導電彈性片12之第一接觸面121;於另一實施例中,導電件14復可設於導電彈性片12之第二接觸面122,亦即,位於彈力金屬件13及導電彈性片12之間,且本實施例中,因導電件14位於彈力金屬件13及導電彈性片12之間,故於彈力金屬件13對應處具有鏤空部(圖未繪),以供彈力金屬件13可經該鏤空部而與導電彈性片12接觸。另外,如圖13B所示,本創作之測試座1復包括位於基座11之第二表面112下另一導電彈性片12以及對應至少二彈力金屬件13且位於該另一導電彈性片12之下表面上的導電件14,其中,該導電件14可作為導電線路或接地。綜上,透過在導電彈性片12上設置導電件14,提供待測物2之複數導電塊21之間透過導電線路進行連接或共地,再者,於提供高電流之電源訊號時,亦可據以作為分流之功能,另外,該導電彈性片12可藉由增加導電彈性區之面積或位置,強化與基座11之第一表面111或第二表面112的接觸,亦可提供接地之功能。
Figures 13A-13B are structural diagrams of the test socket of this invention with conductive elements on the conductive elastic sheet. As shown in FIG. 13A , the
再者,如圖13B所示,該基座11為金屬座體,且導電彈性片12之各導電彈性區之寬度大於各通孔113之孔徑,使各該導電彈性區能接觸該基座11,亦即,通孔113之孔徑d(如第二表面112之孔徑所示)小於導電彈性片12之各導電彈性區R之寬度D,易言之,即d小於D,據此,各彈力金屬件13可透過各導電彈性墊而與金屬之基座11電性連接,據以提升各彈力金屬件13之接地機率,因此,導電件14亦可省略不設置。
Furthermore, as shown in FIG. 13B , the
圖14A-14C為本創作之測試座不同設計之彈力金屬件之結構圖。如圖14A所示,各彈力金屬件13之凸塊1311為可為尖狀結構,於一實施例中,該凸塊1311之長度L為大於等於0.01毫米且小於導電彈性片之厚度T(如圖4所示)。易言之,第一接觸端131之凸塊1311僅須可刺穿導電彈性片並進入其內部且不穿透導電彈性片即可,其長度L並不以此為限,亦即,復可藉由控制彈力金屬件13之第一接觸端131的移動行程(或推動第一接觸端131移動之彈力),以於測試時令凸塊1311穿入導電彈性片至少0.01毫米,據以達到降低彈力金屬件13與導電彈性片之間的接觸阻值。
Figures 14A-14C are structural diagrams of elastic metal parts of different designs of the test seat of this invention. As shown in FIG. 14A , the
如圖14B所示,於一實施例中,彈力金屬件13包括具有管孔之主體133、分別設於該管孔之二端的第一接觸端131與第二接觸端132、以及位於該管孔內且分別推抵該第一接觸端131及該第二接觸端132之彈性件135(例如彈簧)。於一實施例中,本創作之彈力金屬件13之第一接觸端131具有粗糙或呈凹凸之表面,能提供較大接觸面積,以達降低接觸阻值之目的。具體來說,該第一接觸端131具有複數凸塊1311,於一具體實施例中,各凸塊1311為尖形結構,第一接觸端131整體可為冠狀結構,使彈力金屬件13可藉由各尖狀結構刺入導電彈性片中,據此,透過具有冠狀的第一接觸端131以各凸塊1311刺入導電彈性片後,具有聚集導電粒子(請參考圖6)的效果,亦即,可將導電子限縮於冠狀結構所圍繞的範圍內,可於形成導電路徑時,使導電路徑具有更好的導電效果。
As shown in FIG. 14B , in one embodiment, the
如圖14C所示,於另一實施例中,各該彈性金屬件13’復包括有用以設於通孔113中之彈性體136及可轉動地設於該彈性體136之金屬塊137,該金屬塊137朝向基座11之第一表面111延伸而連接第一接觸端131’,
且朝向該基座11之第二表面112延伸而連接第二接觸端132’。於又一實施例中,該彈性金屬件13’復可為如圖8應用於探針卡中之結構,其結構說明已如上述,不再贅言。
As shown in Figure 14C, in another embodiment, each elastic metal component 13' further includes an
後續透過實驗說明本創作測試座之功效,為顯示本創作之測試座(例如圖2-4所示)前述功效相較於習知測試座(如圖1所示)之差異,於測試過程中,本創作與習知之測試座採用同款之彈力金屬件(例如探針),且以相同之實驗環境與條件進行測驗,其相關說明如下。 Subsequent experiments will be used to illustrate the efficacy of the test socket of this creation. In order to show the difference in the aforementioned efficacy of the test socket of this creation (for example, as shown in Figure 2-4) compared with the conventional test socket (as shown in Figure 1), during the test process , this creation uses the same type of elastic metal parts (such as probes) as the conventional test seat, and is tested in the same experimental environment and conditions. The relevant instructions are as follows.
圖15A-15B為習知測試座之探針與待測物之導電塊之阻值及彈力金屬件之彈力的關係圖,圖16A-16B為本創作之測試座之彈力金屬件與待測物之導電塊之阻值及彈力金屬件之彈力的關係圖。如圖15A所示,習知測試座之探針於使用初期中,其彈力為20.7克力(gf)以及阻值為43.2毫歐姆(mΩ),接著,如圖15B所示,經過一段時間的使用過後,習知測試座之探針之彈力下降至20.4gf,阻值更升高至155.6毫歐姆(mΩ);反之,如圖16A所示,本創作之測試座的探針(即彈力金屬件)於使用初期時,其彈力為21.4gf以及阻值為35.1毫歐姆(mΩ),接著,如圖16B所示,於使用一段時間後,本創作之探針的彈力仍可維持在21.5gf,且其阻值更降低至33.6毫歐姆(mΩ),顯見相同之探針利用於本創作之架構中,可維持探針之彈力,而於阻值表現方面,除可確保阻值不致如習知測試結果會倍增外,更可達到阻值降低之功效,另外,由圖16B之阻值表現可知,在行程0.4mm-0.6mm的阻值,本實施例線條平穩而不會有抖動變化之不穩定現象,更可確定本創作即使在低行程下即可提供良好之接觸穩定性。 Figures 15A-15B are diagrams showing the relationship between the resistance of the probe of the conventional test seat and the conductive block of the object under test and the elastic force of the elastic metal component. Figures 16A-16B are the relationship between the elastic metal component and the object under test of the test seat of this invention. The relationship between the resistance of the conductive block and the elastic force of the elastic metal part. As shown in Figure 15A, the probe of the conventional test socket has an elastic force of 20.7 grams of force (gf) and a resistance of 43.2 milliohms (mΩ) in the initial stage of use. Then, as shown in Figure 15B, after a period of time, After use, the elastic force of the probe of the conventional test socket dropped to 20.4gf, and the resistance increased to 155.6 milliohms (mΩ); conversely, as shown in Figure 16A, the probe of the test socket of the present invention (i.e. elastic metal (piece) at the initial stage of use, its elastic force is 21.4gf and its resistance is 35.1 milliohms (mΩ). Then, as shown in Figure 16B, after a period of use, the elastic force of the probe of this invention can still be maintained at 21.5gf. , and its resistance value is further reduced to 33.6 milliohms (mΩ). It is obvious that the same probe is used in the structure of this invention, which can maintain the elasticity of the probe. In terms of resistance performance, in addition to ensuring that the resistance value is not as usual It is known that the test results will not only be doubled, but also the resistance value can be reduced. In addition, from the resistance value performance in Figure 16B, it can be seen that at the resistance value of the stroke 0.4mm-0.6mm, the line of this embodiment is stable without jitter changes. Unstable phenomenon also confirms that this creation can provide good contact stability even at low strokes.
再者,由圖15A可見,習知之測試座隨著探針頭之行程變化,其阻值方可緩慢地降低至50毫歐姆(mΩ),以及如圖15B所示,在經過一段時間的使用後,甚至已無法降至50毫歐姆(mΩ);反之,如圖16A和圖16B所示,本創作之測試座與待測物之導電塊在受壓後,便可立即將阻值降低至50毫歐姆(mΩ)以下,即便經過一段時間的使用,仍可保持有前述特性。 Furthermore, it can be seen from Figure 15A that the resistance of the conventional test socket slowly decreases to 50 milliohms (mΩ) as the stroke of the probe head changes. As shown in Figure 15B, after a period of use, After that, it can no longer even be reduced to 50 milliohms (mΩ); on the contrary, as shown in Figure 16A and Figure 16B, the test socket and the conductive block of the object under test can immediately reduce the resistance to 50 milliohms (mΩ) after being compressed. Below 50 milliohms (mΩ), the aforementioned characteristics can still be maintained even after a period of use.
圖17A-17B分別為習知測試座之探針與本創作測試座之彈力金屬件未經表面處理時之阻值及彈力金屬件之彈力的關係圖。圖式係說明在探針之探針頭未經例如電鍍等表面處理的表現,值得注意的是,如圖17A所示,習知測試座之探針的阻值高達2081.5毫歐姆(mΩ),而如圖17B所示,本創作之測試座的探針(即彈力金屬件)仍可維持在50毫歐姆(mΩ)左右,即48.4毫歐姆(mΩ),據此可知,本創作之探針(彈力金屬件)之探針頭(第一接觸端之凸塊)可不經表面處理下仍優於習知設計,故有助於降低製造成本。 Figures 17A-17B are respectively diagrams showing the relationship between the resistance value and the elastic force of the elastic metal part of the probe of the conventional test seat and the elastic metal part of the test seat of this invention without surface treatment. The diagram illustrates the performance of the probe tip without surface treatment such as electroplating. It is worth noting that, as shown in Figure 17A, the resistance of the probe of the conventional test socket is as high as 2081.5 milliohms (mΩ). As shown in Figure 17B, the probe (i.e., the elastic metal piece) of the test seat of the present invention can still be maintained at about 50 milliohms (mΩ), that is, 48.4 milliohms (mΩ). From this, it can be seen that the probe of the present invention The probe head (bump of the first contact end) of the (elastic metal part) can still be better than the conventional design without surface treatment, so it helps to reduce the manufacturing cost.
圖18為習知測試座之探針與本創作測試座之彈力金屬件經多次測試下之阻值變化圖,圖19A-19B分別為習知測試座之探針第一次使用及經300次測試後之阻值及彈力金屬件之彈力的關係圖,圖20A-20B分別為本創作測試座之彈力金屬件第一次使用及經300次測試後之阻值及之彈力的關係圖。如圖18所示,說明在經歷多次使用後探針之阻質的變化趨勢,習知測試座中的探針在經幾次使用後,即發生阻值大幅升高,且由圖可見,其阻值更不穩定,反觀本創作測試座的探針即便經歷多次測試,仍可將阻值穩定維持在最佳的表現水平,亦即,即便使用多次,本創作之探針仍可維持新探針之阻值表現。 Figure 18 is a diagram showing the resistance changes of the probe of the conventional test socket and the elastic metal part of the test socket of the present invention after multiple tests. Figures 19A-19B are respectively the first use of the probe of the conventional test socket and after 300 cycles. The relationship between the resistance value and the elastic force of the elastic metal parts after the first test. Figures 20A and 20B are respectively the relationship between the resistance value and the elastic force of the elastic metal parts of the test seat after the first use and 300 tests. As shown in Figure 18, it illustrates the changing trend of the resistance of the probe after multiple uses. It is known that the resistance of the probe in the conventional test socket increases significantly after several uses. As can be seen from the figure, Its resistance value is more unstable. On the other hand, the probe of this creative test socket can still maintain the resistance value stably at the best performance level even after multiple tests. In other words, even if it is used many times, the probe of this creation can still maintain its resistance value at the best performance level. Maintain the resistance performance of new probes.
進一步地,如圖19A所示,習知探針在第一次使用時,其阻值及彈力有正常的表現,如圖19B所示,習知探針在經過300次使用後,其阻值已超過800毫歐姆(mΩ),已不堪使用;反之,如圖20A和圖20B所示,本創作之探針即便經過300次的使用,仍維持在接近初始狀態,具有良好的阻值。 Further, as shown in Figure 19A, the resistance and elasticity of the conventional probe have normal performance when used for the first time. As shown in Figure 19B, after being used 300 times, the resistance of the conventional probe It has exceeded 800 milliohms (mΩ) and is unusable; on the contrary, as shown in Figure 20A and Figure 20B, the probe of this invention still maintains close to the initial state and has a good resistance value even after 300 times of use.
圖21A-21B分別為習知測試座之探針與本創作測試座之彈力金屬件通以6A電流時之彈力及溫度變化趨勢圖。圖式說明在探針通以連續電流至6A下,探針彈力及溫度變化,如圖21A所示,習知測試座之探針在通以6A的電流後,其溫度升高至101.6℃,已然超過100℃,而其彈力更降至接近0g;相對地,如圖21B所示,在本創作測試座之探針之彈性可維持在大約25g的彈力,另外,溫度更僅有61.7℃,低於習知探針之溫度大約40℃,可見本創作之測試座即便應用於大電流之測試環境,仍有良好的效能表現。 Figures 21A-21B are respectively graphs of the elastic force and temperature change trends of the probe of the conventional test socket and the elastic metal part of the test socket of this invention when a current of 6A is passed therethrough. The diagram illustrates the changes in elasticity and temperature of the probe when a continuous current of 6A is applied to the probe. As shown in Figure 21A, the temperature of the probe of a conventional test socket rises to 101.6°C after a current of 6A is applied. It has exceeded 100°C, and its elasticity has dropped to close to 0g. In contrast, as shown in Figure 21B, the elasticity of the probe in the test seat of this invention can be maintained at about 25g. In addition, the temperature is only 61.7°C. The temperature is about 40°C lower than that of conventional probes. It can be seen that the test socket of the present invention still has good performance even if it is used in a high-current testing environment.
圖22A-22C為習知測試座之新舊探針以及本創作測試座之已使用彈力金屬件通以3A電流時之彈力及溫度變化趨勢圖。具體而言,習知探針未使用下量測到阻值為37.5毫歐姆(mΩ),在經過相當次數的測試使用後,習知探針之阻值將升至171.2毫歐姆(mΩ),而本創作採用已多次使用之探針(即彈力金屬件),其阻值為37.7毫歐姆(mΩ),基於上述條件下通以3A電流來進行實驗。如圖22A所示,為具有新探針之習知測試座,習知探針即便未使用下,在通以3A電流時,彈力雖能維持但溫度來到24.6℃;另外,如圖22B所示,為具有舊探針之習知測試座,習知探針隨著使用次數或時間增加其阻值升高至171.2毫歐姆(mΩ),在通以3A電流下,不僅彈力受影響,重點是其溫度升高超過80℃,高達89.680℃;反之,如圖22C所示,本創作測試 座之探針即便為已多次使用,其阻值仍維持在37.7毫歐姆(mΩ),在通以3A電流下,仍可保持良好的彈力表現,且溫度僅為上升至25.8℃,是以,本創作之探針(即彈力金屬件),即便是多次使用後,仍能保持與習知技術下新探針的表現,足證本創作之測試座確實可達到良好的效能。 Figures 22A-22C are graphs showing elasticity and temperature change trends of the old and new probes of the conventional test socket and the used elastic metal parts of the test socket of this invention when a current of 3A is passed through. Specifically, the conventional probe measured a resistance of 37.5 milliohms (mΩ) when not in use. After a considerable number of test uses, the resistance of the conventional probe will rise to 171.2 milliohms (mΩ). This creation uses a probe (i.e., an elastic metal piece) that has been used many times, with a resistance value of 37.7 milliohms (mΩ). Based on the above conditions, a 3A current is passed to conduct the experiment. As shown in Figure 22A, it is a conventional test socket with a new probe. Even if the conventional probe is not used, when a current of 3A is passed, the elastic force can be maintained but the temperature reaches 24.6°C; in addition, as shown in Figure 22B It shows that it is a conventional test socket with an old probe. As the number of times or time of use increases, the resistance of the conventional probe increases to 171.2 milliohms (mΩ). When a current of 3A is passed, not only the elasticity is affected, but also the key point is is that its temperature rises more than 80°C, reaching as high as 89.680°C; on the contrary, as shown in Figure 22C, the test of this creation Even though the probe in the holder has been used many times, its resistance still remains at 37.7 milliohms (mΩ). It can still maintain good elasticity under the current of 3A, and the temperature only rises to 25.8℃, so , the probe of this invention (i.e. the elastic metal piece) can still maintain the same performance as the new probe under the conventional technology even after being used many times, which proves that the test socket of this invention can indeed achieve good performance.
上述實施例僅為例示性說明,而非用於限制本創作。任何熟習此項技藝之人士均可在不違背本創作之精神及範疇下,對上述實施例進行修飾與改變。因此,本創作之權利保護範圍係由本創作所附之申請專利範圍所定義,只要不影響本創作之效果及實施目的,應涵蓋於此公開技術內容中。 The above embodiments are only illustrative descriptions and are not used to limit the invention. Anyone skilled in this art can modify and change the above embodiments without violating the spirit and scope of the invention. Therefore, the scope of rights protection for this creation is defined by the scope of the patent application attached to this creation. As long as the effect and implementation purpose of this creation are not affected, this disclosed technical content should be covered.
1:測試座 1:Test seat
11:基座 11: base
111:第一表面 111: First surface
112:第二表面 112: Second surface
113:通孔 113:Through hole
12:導電彈性片 12:Conductive elastic sheet
13:彈力金屬件 13: Elastic metal parts
131:第一接觸端 131: First contact end
1311:凸塊 1311:Bump
132:第二接觸端 132: Second contact end
4:測試裝置 4:Test device
R:導電彈性區 R: conductive elastic zone
Claims (42)
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|---|---|---|---|
| US202363507337P | 2023-06-09 | 2023-06-09 | |
| US63/507,337 | 2023-06-09 |
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| TW112207966U TWM650398U (en) | 2023-06-09 | 2023-07-28 | Test socket |
| TW112137138A TWI862191B (en) | 2023-06-09 | 2023-07-28 | Test socket |
| TW113120331A TWI901161B (en) | 2023-06-09 | 2024-05-31 | Test socket |
| TW113120333A TW202514119A (en) | 2023-06-09 | 2024-05-31 | Testing device and testing equipment |
| TW113121349A TWI901181B (en) | 2023-06-09 | 2024-06-07 | Test socket, cooling system and test system |
| TW113121351A TWI884802B (en) | 2023-06-09 | 2024-06-07 | Test socket |
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| TW112128446A TWI862047B (en) | 2023-06-09 | 2023-07-28 | Test socket |
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| Application Number | Title | Priority Date | Filing Date |
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| TW112137138A TWI862191B (en) | 2023-06-09 | 2023-07-28 | Test socket |
| TW113120331A TWI901161B (en) | 2023-06-09 | 2024-05-31 | Test socket |
| TW113120333A TW202514119A (en) | 2023-06-09 | 2024-05-31 | Testing device and testing equipment |
| TW113121349A TWI901181B (en) | 2023-06-09 | 2024-06-07 | Test socket, cooling system and test system |
| TW113121351A TWI884802B (en) | 2023-06-09 | 2024-06-07 | Test socket |
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| CN (1) | CN220584352U (en) |
| TW (7) | TWI862047B (en) |
Families Citing this family (1)
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| CN118091377B (en) * | 2024-04-24 | 2024-06-21 | 安盈半导体技术(常州)有限公司 | Metal micro-particle medium chip test interface |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6249135B1 (en) * | 1997-09-19 | 2001-06-19 | Fujitsu Limited | Method and apparatus for passive optical characterization of semiconductor substrates subjected to high energy (MEV) ion implantation using high-injection surface photovoltage |
| JP3427086B2 (en) * | 2000-02-23 | 2003-07-14 | Necエレクトロニクス株式会社 | IC socket |
| US6840777B2 (en) * | 2000-11-30 | 2005-01-11 | Intel Corporation | Solderless electronics packaging |
| US8102184B2 (en) * | 2006-01-17 | 2012-01-24 | Johnstech International | Test contact system for testing integrated circuits with packages having an array of signal and power contacts |
| JP2009139298A (en) * | 2007-12-10 | 2009-06-25 | Tokyo Electron Ltd | Probe card |
| US9804223B2 (en) * | 2009-11-30 | 2017-10-31 | Essai, Inc. | Systems and methods for conforming test tooling to integrated circuit device with heater socket |
| CN105008940B (en) * | 2013-02-19 | 2018-01-09 | 株式会社Isc | Test socket with high-density conductive part |
| KR101464990B1 (en) * | 2013-12-24 | 2014-11-26 | 주식회사 아이에스시 | Aligned semiconductor device socket unit and semiconductor device test apparatus |
| EP3465238A4 (en) * | 2016-06-02 | 2020-01-22 | KES Systems, Inc. | SYSTEM AND METHOD FOR A SEMICONDUCTOR'S BURN-IN TEST |
| US10782316B2 (en) * | 2017-01-09 | 2020-09-22 | Delta Design, Inc. | Socket side thermal system |
| TWM556016U (en) * | 2017-08-31 | 2018-02-21 | Winway Technology Co Ltd | Electronic component testing device and system thereof |
| TWI758091B (en) * | 2021-02-08 | 2022-03-11 | 鴻勁精密股份有限公司 | Testing mechanism, connecting mechanism and handler using the same |
| TWI799949B (en) * | 2021-08-17 | 2023-04-21 | 伊士博國際商業股份有限公司 | Close loop liquid cooling burn-in apparatus and temperature control method thereof |
| CN216117715U (en) * | 2021-09-29 | 2022-03-22 | 江苏捷策创电子科技有限公司 | Chip testing seat |
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2023
- 2023-07-28 TW TW112128446A patent/TWI862047B/en active
- 2023-07-28 TW TW112207966U patent/TWM650398U/en unknown
- 2023-07-28 TW TW112137138A patent/TWI862191B/en active
- 2023-08-15 CN CN202322190858.6U patent/CN220584352U/en active Active
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2024
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- 2024-05-31 TW TW113120333A patent/TW202514119A/en unknown
- 2024-06-07 TW TW113121349A patent/TWI901181B/en active
- 2024-06-07 TW TW113121351A patent/TWI884802B/en active
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| TW202449405A (en) | 2024-12-16 |
| TWI862191B (en) | 2024-11-11 |
| TWI862047B (en) | 2024-11-11 |
| TW202449403A (en) | 2024-12-16 |
| TWI901181B (en) | 2025-10-11 |
| TW202449404A (en) | 2024-12-16 |
| TWI901161B (en) | 2025-10-11 |
| CN220584352U (en) | 2024-03-12 |
| TW202449932A (en) | 2024-12-16 |
| TWI884802B (en) | 2025-05-21 |
| TW202514119A (en) | 2025-04-01 |
| TW202514120A (en) | 2025-04-01 |
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