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TWI799949B - Close loop liquid cooling burn-in apparatus and temperature control method thereof - Google Patents

Close loop liquid cooling burn-in apparatus and temperature control method thereof Download PDF

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Publication number
TWI799949B
TWI799949B TW110130349A TW110130349A TWI799949B TW I799949 B TWI799949 B TW I799949B TW 110130349 A TW110130349 A TW 110130349A TW 110130349 A TW110130349 A TW 110130349A TW I799949 B TWI799949 B TW I799949B
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TW
Taiwan
Prior art keywords
control method
temperature control
liquid cooling
close loop
loop liquid
Prior art date
Application number
TW110130349A
Other languages
Chinese (zh)
Other versions
TW202310709A (en
Inventor
孫偉志
劉少淇
陳蘊函
洪義豪
楊志明
宋定謙
Original Assignee
伊士博國際商業股份有限公司
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Application filed by 伊士博國際商業股份有限公司 filed Critical 伊士博國際商業股份有限公司
Priority to TW110130349A priority Critical patent/TWI799949B/en
Publication of TW202310709A publication Critical patent/TW202310709A/en
Application granted granted Critical
Publication of TWI799949B publication Critical patent/TWI799949B/en

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TW110130349A 2021-08-17 2021-08-17 Close loop liquid cooling burn-in apparatus and temperature control method thereof TWI799949B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110130349A TWI799949B (en) 2021-08-17 2021-08-17 Close loop liquid cooling burn-in apparatus and temperature control method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110130349A TWI799949B (en) 2021-08-17 2021-08-17 Close loop liquid cooling burn-in apparatus and temperature control method thereof

Publications (2)

Publication Number Publication Date
TW202310709A TW202310709A (en) 2023-03-01
TWI799949B true TWI799949B (en) 2023-04-21

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TW110130349A TWI799949B (en) 2021-08-17 2021-08-17 Close loop liquid cooling burn-in apparatus and temperature control method thereof

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI862047B (en) * 2023-06-09 2024-11-11 穎崴科技股份有限公司 Test socket
TWI884620B (en) * 2023-12-06 2025-05-21 志聖工業股份有限公司 Array flow field structure
TWI886742B (en) * 2024-01-10 2025-06-11 台灣光罩股份有限公司 Device test system with high-precision thermal control

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM508705U (en) * 2015-06-12 2015-09-11 Cooler Master Co Ltd Electronic device and liquid cooling heat dissipation structure thereof
JP2020129605A (en) * 2019-02-08 2020-08-27 富士電機株式会社 Semiconductor module, semiconductor device, and method of manufacturing the same
JP2020186658A (en) * 2019-05-10 2020-11-19 株式会社村田製作所 Cooling module and circuit board
TWM612914U (en) * 2021-03-17 2021-06-01 奇鋐科技股份有限公司 Liquid-cooling heat dissipation structure
TWM615379U (en) * 2021-01-19 2021-08-11 伊士博國際商業股份有限公司 Burn-in socket with flexible electrical connection built therein
TWM621477U (en) * 2021-08-17 2021-12-21 伊士博國際商業股份有限公司 Close loop liquid cooling burn-in apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM508705U (en) * 2015-06-12 2015-09-11 Cooler Master Co Ltd Electronic device and liquid cooling heat dissipation structure thereof
JP2020129605A (en) * 2019-02-08 2020-08-27 富士電機株式会社 Semiconductor module, semiconductor device, and method of manufacturing the same
JP2020186658A (en) * 2019-05-10 2020-11-19 株式会社村田製作所 Cooling module and circuit board
TWM615379U (en) * 2021-01-19 2021-08-11 伊士博國際商業股份有限公司 Burn-in socket with flexible electrical connection built therein
TWM612914U (en) * 2021-03-17 2021-06-01 奇鋐科技股份有限公司 Liquid-cooling heat dissipation structure
TWM621477U (en) * 2021-08-17 2021-12-21 伊士博國際商業股份有限公司 Close loop liquid cooling burn-in apparatus

Also Published As

Publication number Publication date
TW202310709A (en) 2023-03-01

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