TWI780992B - 聚醯亞胺、黏著劑、薄膜狀黏著材料、黏著層、黏著片、附有樹脂之銅箔、覆銅積層板、印刷線路板、以及多層線路板及其製造方法 - Google Patents
聚醯亞胺、黏著劑、薄膜狀黏著材料、黏著層、黏著片、附有樹脂之銅箔、覆銅積層板、印刷線路板、以及多層線路板及其製造方法 Download PDFInfo
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- TWI780992B TWI780992B TW110144133A TW110144133A TWI780992B TW I780992 B TWI780992 B TW I780992B TW 110144133 A TW110144133 A TW 110144133A TW 110144133 A TW110144133 A TW 110144133A TW I780992 B TWI780992 B TW I780992B
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- diamine
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- 239000000853 adhesive Substances 0.000 title claims abstract description 100
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 239000011889 copper foil Substances 0.000 title claims abstract description 42
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- 150000004985 diamines Chemical class 0.000 claims abstract description 100
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- 238000000034 method Methods 0.000 claims description 11
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Classifications
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
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| JP2017066034 | 2017-03-29 | ||
| JP2017-066034 | 2017-03-29 |
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| TW202219124A TW202219124A (zh) | 2022-05-16 |
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| TW110144133A TWI780992B (zh) | 2017-03-29 | 2018-03-29 | 聚醯亞胺、黏著劑、薄膜狀黏著材料、黏著層、黏著片、附有樹脂之銅箔、覆銅積層板、印刷線路板、以及多層線路板及其製造方法 |
| TW107110960A TWI743345B (zh) | 2017-03-29 | 2018-03-29 | 聚醯亞胺、黏著劑、薄膜狀黏著材料、黏著層、黏著片、附有樹脂之銅箔、覆銅積層板、印刷線路板、以及多層線路板及其製造方法 |
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| TW107110960A TWI743345B (zh) | 2017-03-29 | 2018-03-29 | 聚醯亞胺、黏著劑、薄膜狀黏著材料、黏著層、黏著片、附有樹脂之銅箔、覆銅積層板、印刷線路板、以及多層線路板及其製造方法 |
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| KR (2) | KR102388938B1 (ja) |
| CN (1) | CN108690193B (ja) |
| TW (2) | TWI780992B (ja) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210214501A1 (en) | 2019-02-01 | 2021-07-15 | Lg Chem, Ltd. | Polyimide-based polymer film, substrate for display device, and optical device using the same |
| TWI855057B (zh) * | 2019-04-19 | 2024-09-11 | 美商設計者分子公司 | 高分子量撓性可固化聚醯亞胺 |
| TWI695865B (zh) * | 2019-05-31 | 2020-06-11 | 達邁科技股份有限公司 | 底漆組成物、金屬積層板及其製法 |
| CN112048240B (zh) * | 2019-06-06 | 2022-03-01 | 达迈科技股份有限公司 | 底漆组成物、金属积层板及其制法 |
| JP7259575B2 (ja) * | 2019-06-17 | 2023-04-18 | 荒川化学工業株式会社 | ポリイミド、接着剤、フィルム状接着剤、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法 |
| KR102699413B1 (ko) | 2019-08-01 | 2024-08-28 | 가부시키가이샤 가네카 | 열경화성 수지 조성물, 열경화성 수지막, 열경화막, 적층체, 그리고 프린트 배선판 및 그의 제조 방법 |
| KR102754554B1 (ko) * | 2019-12-16 | 2025-01-14 | 아라까와 가가꾸 고교 가부시끼가이샤 | 접착제 조성물, 필름상 접착제, 접착층, 접착시트, 수지가 부착된 동박, 동박 적층판, 프린트 배선판, 및 다층 배선판과 그 제조방법 |
| TWI730757B (zh) * | 2020-05-11 | 2021-06-11 | 晉一化工股份有限公司 | 熱固性聚醯亞胺樹脂及其製造方法、組成物、預聚物、薄膜、黏著劑、及其用途 |
| JP6881664B1 (ja) * | 2020-10-15 | 2021-06-02 | 荒川化学工業株式会社 | ポリイミド樹脂組成物、接着剤組成物、フィルム状接着材、接着シート、樹脂付銅箔、銅張積層板、プリント配線板及びポリイミドフィルム |
| JP7511448B2 (ja) | 2020-11-13 | 2024-07-05 | 信越化学工業株式会社 | ポリウレタン、ポリウレタンの製造方法、導電性ペースト組成物、導電配線および導電配線の製造方法 |
| TWI748898B (zh) * | 2021-03-15 | 2021-12-01 | 晉一化工股份有限公司 | 熱固性樹脂組成物、難燃樹脂組成物、液態封裝材及其用途、薄膜及其用途 |
| WO2022202769A1 (ja) * | 2021-03-23 | 2022-09-29 | 株式会社カネカ | ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド基板および積層体ならびにそれらの製造方法 |
| CN113563584A (zh) * | 2021-07-07 | 2021-10-29 | 北京科技大学 | 低介电共聚聚酰亚胺薄膜及其制备方法 |
| JP7150962B1 (ja) | 2021-10-15 | 2022-10-11 | 信越化学工業株式会社 | ポリウレタン、ポリウレタンの製造方法、導電性ペースト組成物、導電配線および導電配線の製造方法 |
| TW202346527A (zh) * | 2022-03-03 | 2023-12-01 | 日商東洋紡Ｍｃ股份有限公司 | 黏接劑組成物、以及含有其之黏接片、疊層體及印刷配線板 |
| JP2024139565A (ja) * | 2023-03-27 | 2024-10-09 | 株式会社タムラ製作所 | ポリアミック酸、ポリアミック酸組成物、ポリイミド、ポリイミドフィルム及びプリント配線板 |
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| JP2015180750A (ja) * | 2015-07-08 | 2015-10-15 | 新日鉄住金化学株式会社 | 溶剤可溶性ポリイミド樹脂 |
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| KR102485693B1 (ko) | 2023-01-06 |
| JP2022033144A (ja) | 2022-02-28 |
| TWI743345B (zh) | 2021-10-21 |
| CN108690193B (zh) | 2022-09-09 |
| KR20220050860A (ko) | 2022-04-25 |
| CN108690193A (zh) | 2018-10-23 |
| JP7003794B2 (ja) | 2022-01-21 |
| TW202219124A (zh) | 2022-05-16 |
| KR20180110632A (ko) | 2018-10-10 |
| JP7044200B2 (ja) | 2022-03-30 |
| KR102388938B1 (ko) | 2022-04-20 |
| JP2018168370A (ja) | 2018-11-01 |
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