TWI755191B - Electronic device with radiation structure - Google Patents

Abstract

An electronic device with radiation structure including a first machine body, a second machine body, a hinge module, and a heat conduction component is provided. The first machine body has a front cover, a back cover, a display panel, a plurality of airflow channels, a plurality of air inlet, and a plurality of air outlets. The display panel is located between the front cover and the back cover. The air inlets and the air outlets are communicated with the airflow channels. The second machine has a least one heat source. The hinge module is connected to the first machine body and the second machine body. The first machine body and the second machine body are adapted to be folded or unfolded with each other by using the hinge module. The heat conduction component is disposed in the first machine body and the second machine body. The heat of the at least one heat source is transferred from the first machine body to second machine body, the external air is adapted to enter the airflow channels through the air inlets and discharged from the air outlets.

Description

Electronic device with heat dissipation structure

The present invention relates to an electronic device, and more particularly, to an electronic device with a heat dissipation structure.

The existing notebook computer has the characteristics of small size and easy portability, so it is widely used in daily life, work or education. Compared with the desktop computer, the internal space of the notebook computer is small, so the heat generated by the electronic components It is easy to accumulate inside and it is not easy to dissipate heat, and the high temperature will cause the operating performance of the notebook computer to decrease, and even cause damage to the central processing unit and graphics chip.

In the existing notebook computer, a metal material with high heat dissipation efficiency is used as a heat-conducting sheet, one end of the heat-conducting sheet is attached to the central processing unit, a graphics chip, etc. Connected, the heat generated by the CPU, graphics chip and other components will be transferred to the heat dissipation fins through the heat conduction sheet, and then the built-in fan will draw cold air to contact the heat dissipation fins to cool down, thereby achieving the purpose of heat dissipation. However, due to the thin structure of the notebook computer, the area size of the side air outlet and the heat dissipation fin is limited, resulting in a lack of thermal convection space inside the notebook computer, which is not conducive to the intake of cold air and the discharge of hot air. It will still cause overheating problems with time use.

The present invention provides an electronic device with a heat dissipation structure, which has high heat transfer efficiency and can use external cold air for heat dissipation, so as to improve the overall heat dissipation effect of the electronic device.

The electronic device with heat dissipation structure of the present invention includes a first body, a second body, a hinge module and a heat conduction member. The first body has a front cover, a rear cover, a display panel, a plurality of air passages, a plurality of air inlets and a plurality of air outlets. The plurality of air inlets and the plurality of air outlets communicate with the plurality of air flow channels, the display panel is located between the front cover and the rear cover, and at least a part of the plurality of air flow channels is formed on the rear cover. The second body has at least one heat source for processing electronic signals. The hinge module is connected to the first body and the second body. The first body and the second body are suitable for relative unfolding or relative folding through the hinge module. The heat conduction member is arranged on the first body and the second body. The heat of the at least one heat source is conducted from the first body to the second body through the heat conduction member. The outside air is adapted to enter the plurality of air flow channels from the plurality of air inlets and be discharged from the plurality of air outlets.

Based on the above, the electronic device with heat dissipation structure of the present invention has thermal conduction members, which are respectively connected to the first body and the second body, and contact at least one heat source located in the second body, so as to dissipate the heat generated by the heat source during operation. Conducted from the second body to the first body to avoid overheating caused by accumulation of heat in the second body. Further, the external air can enter the plurality of air passages through the plurality of air inlets and be discharged from the plurality of air outlets. During the air transfer process, the heat conduction member in the first body will be cooled to achieve the purpose of heat dissipation.

1A is a schematic perspective view of an electronic device with a heat dissipation structure according to an embodiment of the present invention. FIG. 1B is a schematic perspective view of the electronic device with the heat dissipation structure of FIG. 1A in another direction.

Referring to FIG. 1A and FIG. 1B , an electronic device with a heat dissipation structure of the present invention is, for example, a notebook computer, a tablet computer or a similar electronic device, and includes a first body 110 , a second body 120 , a hinge module 130 and A thermally conductive member 140 .

The first body 110 is a display body and has a plurality of air passages AC, a plurality of air inlets IT and a plurality of air outlets OT. The plurality of air inlets IT and the plurality of air outlets OT communicate with the plurality of air flow channels AC. The second body 120 is a system body for installing various electronic components such as computing units, storage units, input and output units, and power supply units, and has at least one heat source 121 , which specifically includes a central processing unit, a graphics chip, or a memory with electronic signals such as a central processing unit, a graphics chip, or a memory. Heating elements for processing functions.

The hinge module 130 is connected between the first body 110 and the second body 120 . The first body 110 and the second body 120 are adapted to be relatively unfolded through the hinge module 130 to switch to the working mode or relatively folded to switch to the storage mode.

The heat conduction member 140 is disposed on the first body 110 and the second body 120 and is in surface contact with the first body 110 and the second body 120 . The arrangement of the surface contact is beneficial to improve the heat conduction characteristics of the electronic device 100 . The heat conduction member 140 contacts at least one heat source 121 (see FIG. 3A below). Further, there is a gap between a part of the heat conduction member 140 between the first body 110 and the second body 120 and the hinge module 130, that is, the heat conduction member 140 bypasses the hinge module 130, so that the heat conduction member 140 and the hinge The modules 130 do not touch each other.

Referring to FIGS. 1A and 1B , the heat H of at least one heat source 121 is conducted from the second body 120 to the first body 110 through the heat conduction member 140 , and the external air AR is adapted to enter the plurality of air flow channels AC from the plurality of air inlets IT The plurality of air outlets OT are discharged, and when the air AR passes through the plurality of air flow channels AC, it will contact the heat conduction member 140 to achieve heat convection or heat conduction.

In the present embodiment, the plurality of air flow channels AC are communicated with each other and present in an array pattern.

In other embodiments, the plurality of airflow channels AC are, for example, disconnected from each other or partially connected, depending on heat dissipation requirements and structural design, and the present invention is not limited thereto.

FIG. 2A is a schematic cross-sectional view of the first body of FIG. 1A having a single-sided airflow channel. FIG. 2B is a partially enlarged schematic view of FIG. 2A . 2C is a schematic cross-sectional view of the first body having a single-sided airflow channel according to another embodiment of FIG. 1A . 2D is a schematic cross-sectional view of the first body having double-sided airflow channels according to another embodiment of FIG. 1A .

Referring to FIG. 2A , the first body 110 has a front cover 111 , a rear cover 112 and a display panel 113 . The front cover 111 is a U-shaped structure and forms a closed cavity together with the rear cover 112 . The display panel 113 is located between the front cover 111 and the rear cover 112 and is located in the closed cavity. At least one of the plurality of airflow channels AC Part of it is formed on the back cover 112 . The second body 120 has an upper case 122 and a lower case 123 , and at least one heat source 121 is located between the upper case 122 and the lower case 123 .

Referring to FIG. 2A and FIG. 2B , in this embodiment, a plurality of airflow channels AC are formed on an inner side surface IS of the rear cover 112 adjacent to the display panel 113 . Referring to FIG. 2C , a plurality of airflow channels AC are formed on an outer side OS of the rear cover 112 away from the display panel 113 .

Referring to FIG. 2D , in this embodiment, a plurality of airflow channels AC are formed on the inner side IS of the rear cover 112 adjacent to the display panel 113 and on the outer side OS away from the display panel 113 . The heat conduction member 140 is attached to the outer side OS of the back cover 112 to cover the corresponding plurality of air flow channels AC. When the air AR passes through the air flow channels AC, it will come into contact with the heat conduction member 140 .

Further, the cross-sectional shape of each airflow channel AC includes a triangle, a trapezoid, a semicircle, a polygon, a rectangle or other shapes. Compared with the embodiment shown in FIGS. 2A-2B , the air flow rate of this embodiment is doubled, so it has better heat dissipation effect.

3A is a schematic side view of an electronic device with a heat dissipation structure according to another embodiment. 3B is a schematic side view of an electronic device with a heat dissipation structure according to another embodiment. 3C is a schematic side view of an electronic device with a heat dissipation structure according to another embodiment. 3D is a schematic plan view of the thermally conductive member of FIGS. 3A-3C .

Referring to FIG. 1A , FIG. 1B and FIG. 3A , in this embodiment, the thermally conductive member 140 has a thermally conductive plate 141 , a metal block 142 and a contact outer layer 143 .

Two ends of the heat conducting plate 141 are respectively attached to the rear cover 112 of the first body 110 and penetrated through the second body 120 . In detail, the heat conducting plate 141 is, for example, a graphene copper sheet and is used for the horizontal direction conduction of heat.

The metal block 142 is made of, for example, copper, and is disposed on the side of the heat-conducting plate 141 away from the lower case 123 and contacts the at least one heat source 121 for transferring the heat generated by the at least one heat source 121 to the heat-conducting plate 141 . The contact outer layer 143 is stacked on the other side of the thermal conductive plate 141 opposite to the metal block 142 and attached to the lower shell 123 . The contact outer layer 143 is made of artificial leather, silicon material, rubber or cloth, and the thermal conductive silicone sheet 1431 is embedded in the contact outer layer. 143 is used to protect the heat-conducting plate 141 and provide a beautiful appearance.

Referring to FIG. 3A , one end E1 of the heat conducting plate 141 is attached to an outer side OS of the first body 110 and the other end E2 is passed through the second body 120 , and the end contacting the outer layer 143 is passed through the second body 120 and attached to the second body 120 . An inner side surface of the lower shell 123 of the second body 120 and the other end that contacts the outer layer 143 are disposed on the back cover 112 of the first body 110 .

Referring to FIG. 3D , the thermally conductive plate 141 includes a curved portion 1411 , two thermally conductive portions 1412 and a plurality of thermally conductive mediums 1413 . The curved portion 1411 covers the hinge module 130 . The two heat conducting portions 1412 are connected on both sides of the curved portion 1411 and contact the first body 110 and the second body 120 respectively. A plurality of thermally conductive mediums 1413 are respectively disposed on the two thermally conductive portions 1412 and used to contact at least one heat source 121 or metal block 142 , and each thermally conductive medium 1413 is used for heat conduction in a vertical direction and adopts thermally conductive silicone glue. In this embodiment, the curved portion 1411 and the two heat conducting portions 1412 are graphene copper sheets, and the plurality of heat conducting mediums 1413 are silicon sheets.

In short, the heat conduction member 140 exerts different material characteristics through the stacking and lamination of composite materials. The first body 110 and the second body 120 can be used as heat storage carriers. 1413 is an outlet for vertical conduction of heat, and the contact outer layer 143 is made of leather or cloth to produce a comfortable feel, and also to isolate the high heat of the first body or the second body.

Referring to FIG. 3B , in this embodiment, both ends E1 and E2 of the heat conducting plate 141 are respectively attached to the back cover 112 of the first body 110 and the two outer sides of the lower shell 123 of the second body 120 , and further includes a fixing member 150 , which penetrates through the lower shell 123 that contacts the outer layer 143 and the heat-conducting plate 141 and is fixed to the second body 120 .

Referring to FIG. 3C , in the present embodiment, one end E1 of the heat conducting plate 141 passes through the first body 110 and is attached to an inner side IS of the rear cover 112 of the first body 110 . The other end E2 of the heat conducting plate 141 is attached to an outer side surface OS of the lower shell 123 of the second body 120 . One end contacting the outer layer 143 passes through the first body 110 and is partially attached to an inner side IS of the back cover 112 of the first body 110 , and is partially stacked with the heat conducting plate 141 . It also includes a fixing member 150 , which penetrates through the lower shell 123 that contacts the outer layer 143 and the heat-conducting plate 141 and is fixed to the second body 120 .

4A to 4C are schematic plan views of the heat conduction members distributed in the first body and the second body of FIG. 1A .

Referring to FIGS. 4A to 4C , the area of the heat conduction member 140 distributed on the first body 110 in this embodiment is greater than, smaller than or equal to the area distributed on the second body 120 , which depends on the user's heat dissipation requirements.

5A to 5F are schematic plan views of the thermally conductive member in various shapes.

Referring to FIG. 5A , the heat conducting plate 141 of the heat conducting member 140 is a rectangular structure with equal lengths on both sides of the opposite curved portion 1411 . Referring to FIG. 5B and FIG. 5C , the heat-conducting plate 141 of the heat-conducting member 140 has a trapezoidal structure with unequal lengths on both sides of the opposite curved portion 1411 . Referring to FIG. 5D and FIG. 5E , the heat conducting member 140 further includes another heat conducting plate 141 , and the two heat conducting plates 141 are separated from each other or overlapped with each other. Referring to FIG. 5F , the thermally conductive plate 141 of the thermally conductive member 140 is an integrally formed X-shaped structure.

6A is a schematic side plan view of an electronic device with a heat dissipation structure of the present invention using a heat conduction member with three bends. FIG. 6B is an exploded schematic diagram of the components of the electronic device with the heat dissipation structure in FIG. 6A . FIG. 6C is a partially enlarged schematic view of the electronic device with the heat dissipation structure in FIG. 6A in a closed state. 6D is a schematic side plan view of the electronic device with the heat dissipation structure of the present invention using a heat conduction member with two bends. 6E is a schematic side plan view of the electronic device with the heat dissipation structure of the present invention using a heat conduction member with six bends.

6A to 6C , the thermal conduction member 140a of this embodiment differs from the thermal conduction member 140 of FIG. 3A in that the thermal conduction member 140a has a thermal conduction plate 141a, a metal block 142a and a contact outer layer 143a. The heat-conducting plates 141a respectively pass through the first body 110a and the second body 120a. The heat-conducting plates 141a are made of graphene copper sheets, for example, and are used to conduct heat in the horizontal direction. The metal block 142a is disposed on one side of the heat-conducting plate 141a and is clamped to the lower shell 123a of the second body 120a and contacts the at least one heat source 121a. The metal block 142a is made of copper, for example, to transfer the heat generated by the at least one heat source 121a. to the thermally conductive plate 141a. The contact outer layer 143a is stacked on the other side of the thermally conductive plate 141a opposite to the metal block 142a. The contacting outer layer 143a is made of artificial leather, silicon, rubber or cloth to protect the thermally conductive plate 141a and provide a beautiful appearance.

In addition, the thermally conductive plate 141a is made of a flexible composite material with high thermal conductivity, including silver, copper, gold, aluminum, graphite, thermally conductive plastic, silicone, ceramic or other similar materials, and is pre-bent to a specific shape before installation. shape.

3D and FIGS. 6A to 6C , the thermally conductive plate 141a includes a curved portion 1411a, two thermally conductive portions 1412a and a plurality of thermally conductive mediums 1413a. The bent portion 1411a is adjacent to the hinge module 130a and has a plurality of bent segments BP. The two heat conducting portions 1412a are connected to both sides of the curved portion 1411a and contact the first body 110a and the second body 120a respectively. The plurality of heat transfer mediums 1413a are respectively arranged on the two heat transfer portions 1412a. Further, the second body 120a has a groove G, wherein a heat-conducting portion 1412a is disposed in the groove G, and the contacting outer layer 143a is attached to the heat-conducting portion 1412a in the groove G and is in close contact with the second body 120a. The number of the plurality of bending segments BP is three, wherein another heat conducting portion 1412a is attached to the rear cover 112a of the first body 110a.

Referring to FIG. 6D , in this embodiment, the number of the plurality of bending segments BP is two, which depends on the design requirements.

Further, the curved portion 1411a can adopt various shapes such as arc, zigzag, S-shaped or fine bending, wherein the cross-section of the arc-shaped curved portion 1411a is single arc, double arc or multiple arcs, and the zigzag is curved The cross-section of the portion 1411a is an acute angle and is combined with an arc, and the cross-section of the S-shaped curved portion 1411a is combined with multiple arcs. The cross section of the micro-bending type bending portion 1411a is a plurality of micro-bending structures, which are formed by the above-mentioned shapes to improve the recovery strength of the bending portion 1411a before and after bending.

In detail, since the thermally conductive plate 141a of the present invention is composed of a pre-shaped composite material, it can return to its original state after being deformed by an external force. The bent portion 1411a of the thermally conductive plate 141a is formed by a single or several bent segments BP. The pre-bent shape can effectively protect the heat-conducting plate 141a from being damaged by severe bending. In addition, the pre-bent heat-conducting plate 141a can avoid surface wear caused by friction with the first body 110a and the second body 120a. , which affects the thermal conductivity.

Referring to FIG. 6E , in this embodiment, the two heat conducting portions 1412b of the heat conducting member 140b are of equal length and are respectively attached to the first body 110b and the second body 120b, and the curved portion 1411b has six bending segments BP. The thermally conductive member 140b of this embodiment is suitable for multi-angle electronic devices, and can be turned over by 180-360 degrees, and the six bending segments BP of the bending portion 1411b are not limited to a symmetrical type.

In other embodiments, the heat conduction member 140a is, for example, an integrally formed member and is directly disposed on the first body 110a and the second body 120a (see FIG. 6A ), or the heat conduction member 140a is, for example, a separate member and disposed in the first body 110a In the second body 120a, redundant space can be planned to facilitate the placement of electronic components or cables.

7A is a schematic side plan view of an electronic device with a heat dissipation structure of the present invention using a two-piece heat conduction member. FIG. 7B is a schematic side plan view of another two-piece heat conduction member used in the electronic device with the heat dissipation structure of the present invention. 7C is a schematic perspective view of a two-piece heat conduction member using a connector according to an embodiment of the present invention. FIG. 7D is a schematic plan view of a two-piece heat conduction member using a magnetic member according to an embodiment of the present invention.

Referring to FIG. 7A , the thermally conductive plate 141c of the present embodiment is a separate structure and includes a first thermally conductive portion 1411c, a second thermally conductive portion 1412c and a connecting member 1413c. The first heat-conducting portion 1411c passes through the first body 110c, and the second heat-conducting portion 1412c passes through the second body 120c. The connector 1413c is located between the first body 110c and the second body 120c and is configured to connect the first heat conducting portion 1411c and the second heat conducting portion 1412c.

The connector 1413c serves as a medium for connecting the first thermally conductive portion 1411c and the second thermally conductive portion 1412c and has the function of shielding the appearance and is, for example, a material with high thermal conductivity, including silver, copper, gold, aluminum, graphite, thermally conductive plastic, silicone, Ceramic or other similar materials.

Referring to FIG. 7A , the first heat conducting portion 1411c and the second heat conducting portion 1412c are respectively attached to the two outer wall surfaces S of the connecting member 1413c. Referring to FIG. 7A , the connecting member 1413c has at least one receiving groove AG for holding the first heat conducting portion 1411c and the second heat conducting portion 1412c.

Referring to FIG. 7C , the connecting member 1413c includes a first magnetic member M1 and a second magnetic member M2, which are respectively disposed on the first heat conducting portion 1411c and the second heat conducting portion 1412c and are adapted to magnetically attract each other to connect the first heat conducting portion 1411c and the second heat conducting portion 1412c. Referring to FIG. 7D , the connecting member 1413c includes an adhesive member M3 disposed between the first heat conducting portion 1411c and the second heat conducting portion 1412c to connect the first heat conducting portion 1411c and the second heat conducting portion 1412c.

8A is a schematic plan view of airflow channels in a hexagonal array according to an embodiment of the present invention. 8B is a schematic plan view of a double-sided airflow channel in a hexagonal array according to an embodiment of the present invention. 8C is a schematic plan view of an air flow channel in a narrowed hexagonal array according to an embodiment of the present invention.

8A to 8C , a plurality of airflow channels AC are formed on the rear cover 112 of the first body 110 and present in a honeycomb arrangement, a compound hexagonal arrangement, a narrowed hexagonal arrangement or a dense hexagonal arrangement. Further, the airflow channel AC is composed of a variety of different unit variations, and the front and back sides are alternately formed, so as to achieve the purpose of reducing the thickness of the back cover 112 and reducing the weight at the same time.

9A is a schematic plan view of an air flow channel extending in an arc according to an embodiment of the present invention. 9B is a schematic plan view of an airflow channel extending in a straight line according to an embodiment of the present invention. 9C is a schematic plan view of an airflow channel extending obliquely on both sides according to an embodiment of the present invention.

Referring to FIG. 9A , each air passage AC extends in arc shape from each air inlet IT to each air outlet OT, and the air passages AC are distributed on the upper and lower sides of the first body 110 , thereby increasing the longitudinal strength of the first body 110 .

Referring to FIG. 9B , each airflow channel AC extends obliquely from each air inlet IT to each air outlet OT, and some of the multiple air outlets OT are formed on the left and right sides of the first body 110, which is beneficial to extend the air in the airflow channel AC. flow time, thereby improving heat dissipation efficiency.

Referring to FIGS. 2D and 9C, a plurality of airflow channels AC are formed on the inner side IS and the outer side OS of the rear cover 112 of the first body 110, respectively, and the multiple airflow channels AC extend obliquely and interlace with each other, and some of the multiple airflow channels AC The tuyere OT is formed on the left and right sides of the first body 110 , which is beneficial to prolong the flow time of the air in the air passage AC and double the air flow, thereby improving the heat dissipation efficiency.

To sum up, the electronic device with heat dissipation structure of the present invention has heat conduction members, which are respectively connected to the first body and the second body, and are in contact with at least one heat source located in the second body, so as to dissipate the heat generated by the heat source during operation. The heat is conducted from the second body to the first body to avoid overheating caused by heat accumulation in the second body. Further, the external air can enter multiple airflow channels through multiple air inlets and exit from multiple air outlets. Exhaust, in the process of air transfer, the heat conduction member in the first body will be cooled to achieve the purpose of heat dissipation.

In short, the present invention adopts a heat conduction member and an air flow channel, the use of the heat conduction member can avoid the overheating of the body, and the air flow channel can introduce external air to assist heat dissipation, thereby improving the overall heat dissipation efficiency to meet the requirements of thin and high-performance electronic devices. Use requirements to ensure a stable user experience.

100: Electronic device with heat dissipation structure 110, 110a, 110b, 110c: the first body 111: Front cover 112, 112a: back cover 113: Display panel 120, 120b, 120c: Second body 121: heat source 122: upper shell 123: Lower shell 130, 130a: Hinge module 140, 140a, 140b: heat conduction members 141, 141a, 141c: Thermal plate 1411, 1411a, 1411b: Bending part 1411c: The first heat conduction part 1412, 1412a, 1412b: heat conduction part 1412c: Second heat conducting part 1413, 1413a: Thermally conductive medium 1413c: Connectors 142, 142a: metal block 143, 143a: Contact outer layer 1431: Thermal Silicone Sheet G: Groove H: heat S: outer wall surface AC: Airflow channel AG: accommodating slot AR: Air BP: Bend segment E1, E2: terminal IS: inner side IT: air inlet M1: The first magnetic piece M2: Second magnetic piece M3: Paste OS: Outside OT: air outlet

1A is a schematic perspective view of an electronic device with a heat dissipation structure according to an embodiment of the present invention. FIG. 1B is a schematic perspective view of the electronic device with the heat dissipation structure of FIG. 1A in another direction. FIG. 2A is a schematic cross-sectional view of the first body of FIG. 1A having a single-sided airflow channel. FIG. 2B is a partially enlarged schematic view of FIG. 2A . 2C is a schematic cross-sectional view of the first body having a single-sided airflow channel according to another embodiment of FIG. 1A . 2D is a schematic cross-sectional view of the first body having double-sided airflow channels according to another embodiment of FIG. 1A . 3A is a schematic side view of an electronic device with a heat dissipation structure according to another embodiment. 3B is a schematic side view of an electronic device with a heat dissipation structure according to another embodiment. 3C is a schematic side view of an electronic device with a heat dissipation structure according to another embodiment. 3D is a schematic plan view of the thermally conductive member of FIGS. 3A-3C . 4A to 4C are schematic plan views of the heat conduction members distributed in the first body and the second body of FIG. 1A . 5A to 5F are schematic plan views of the thermally conductive member in various shapes. 6A is a schematic side plan view of an electronic device with a heat dissipation structure of the present invention using a heat conduction member with three bends. FIG. 6B is an exploded schematic diagram of the components of the electronic device with the heat dissipation structure in FIG. 6A . FIG. 6C is a partially enlarged schematic view of the electronic device with the heat dissipation structure in FIG. 6A in a closed state. 6D is a schematic side plan view of the electronic device with the heat dissipation structure of the present invention using a heat conduction member with two bends. 6E is a schematic side plan view of the electronic device with the heat dissipation structure of the present invention using a heat conduction member with six bends. 7A is a schematic side plan view of an electronic device with a heat dissipation structure of the present invention using a two-piece heat conduction member. FIG. 7B is a schematic side plan view of another two-piece heat conduction member used in the electronic device with the heat dissipation structure of the present invention. 7C is a schematic perspective view of a two-piece heat conduction member using a connector according to an embodiment of the present invention. FIG. 7D is a schematic plan view of a two-piece heat conduction member using a magnetic member according to an embodiment of the present invention. 8A is a schematic plan view of airflow channels in a hexagonal array according to an embodiment of the present invention. 8B is a schematic plan view of a double-sided airflow channel in a hexagonal array according to an embodiment of the present invention. 8C is a schematic plan view of an air flow channel in a narrowed hexagonal array according to an embodiment of the present invention. 9A is a schematic plan view of an air flow channel extending in an arc according to an embodiment of the present invention. 9B is a schematic plan view of an airflow channel extending in a straight line according to an embodiment of the present invention. 9C is a schematic plan view of an airflow channel extending obliquely on both sides according to an embodiment of the present invention.

100: Electronic device with heat dissipation structure

110: The first body

120: Second body

130: Hinge Module

140: heat conduction member

AC: Airflow channel

AR: Air

IT: air inlet

OT: air outlet

Claims (23)

An electronic device with a heat dissipation structure, comprising: a first body with a front cover and a rear cover, a display panel, a plurality of air passages, a plurality of air inlets and a plurality of air outlets, the air inlets and the The air outlet communicates with the airflow channels, wherein the display panel is located between the front cover and the rear cover and at least a part of the airflow channels is formed on the rear cover; a second body has at least one heat source, an electronic signal processing function; a hinge module connected to the first body and the second body, the first body and the second body are suitable for relative unfolding or relative folding through the hinge module; and a heat conduction member, Disposed between the first body and the second body, wherein the heat conduction member contacts the at least one heat source, the heat of the at least one heat source is conducted from the second body to the first body through the heat conduction member, and the outside air is suitable for The airflow channels are entered from the air inlets of the first body and discharged from the air outlets, wherein the airflow channels are arranged in a honeycomb arrangement, a compound hexagonal arrangement or a narrowed hexagonal arrangement. The electronic device with heat dissipation structure according to claim 1, wherein the airflow channels are formed on an inner side of the rear cover adjacent to the display panel or formed on an outer side of the rear cover away from the display panel, The cross-sectional shape of each of the airflow channels includes triangle, trapezoid, semicircle or polygon. The electronic device with heat dissipation structure as claimed in claim 1, wherein the airflow channels are formed on an inner side surface of the back cover adjacent to the display panel and away from the display panel. On an outer side of the display panel, the cross-sectional shape of each airflow channel includes a triangle, a trapezoid, a semicircle or a polygon. The electronic device with heat dissipation structure as claimed in claim 1, wherein the heat conduction member has a heat conduction plate, a metal block and a contact outer layer, the heat conduction plate is disposed on the first body and the second body, and the metal block is disposed On one side of the heat-conducting plate and in contact with the at least one heat source, the contact outer layer is stacked on the other side of the heat-conducting plate opposite to the metal block. The electronic device with heat dissipation structure as claimed in claim 4, wherein the heat conducting plate comprises a curved portion, two heat conducting portions and a plurality of heat conducting mediums, the curved portion is wrapped around the hinge module, and the two heat conducting portions are connected to Two sides of the curved portion are in contact with the first body and the second body respectively, and a plurality of heat-conducting mediums are respectively arranged on the two heat-conducting portions. The electronic device with heat dissipation structure as claimed in claim 5, wherein the curved portion and the two heat conducting portions are graphene copper sheets, and the heat conducting mediums are silicon sheets. The electronic device with heat dissipation structure as claimed in claim 5, wherein the heat conducting plate is a rectangular structure with equal lengths relative to both sides of the curved portion or a trapezoidal structure with unequal lengths relative to both sides of the curved portion . The electronic device with a heat dissipation structure as claimed in claim 4, further comprising another heat-conducting plate, the two heat-conducting plates being separated from each other or overlapping each other. The electronic device with heat dissipation structure as claimed in claim 4, wherein one end of the heat-conducting plate is attached to an outer side of the first body and the other end passes through the second body, and the end that contacts the outer layer passes through the The second body is attached to an inner side of the second body. The electronic device with heat dissipation structure as claimed in claim 4, wherein both ends of the heat-conducting plate are respectively attached to the two outer sides of the first body and the second body, and further comprises a fixing member passing through the contact The outer layer and the heat conducting plate are fixed on the second body. The electronic device with heat dissipation structure as claimed in claim 4, wherein one end of the heat-conducting plate passes through the first body and is attached to an inner side surface of the first body, and the other end of the heat-conducting plate is attached to the first body An outer side surface of the second body, one end of the contact outer layer is penetrated through the first body and partially attached to an inner side surface of the first body, and also includes a fixing member, which is penetrated through the contact outer layer and the heat conduction The board is fixed on the second body. The electronic device with heat dissipation structure as claimed in claim 1, wherein the heat conduction member has a heat conduction plate, a metal block and a contact outer layer, the heat conduction plate is respectively penetrated through the first body and the second body, and the metal The block is arranged on one side of the heat-conducting plate and is clamped to the second body and contacts the at least one heat source, and the contact outer layer is stacked on the other side of the heat-conducting plate opposite to the metal block. The electronic device with heat dissipation structure as claimed in claim 12, wherein the heat conducting plate comprises a curved portion, two heat conducting portions and a plurality of heat conducting mediums, the curved portion is adjacent to the hinge module and has a plurality of bending sections The two heat-conducting parts are connected on both sides of the bending part and contact the first body and the second body respectively, and a plurality of heat-conducting mediums are respectively arranged on the two heat-conducting parts. The electronic device with heat dissipation structure as claimed in claim 13, wherein the second body has a groove, wherein one of the heat conducting parts is disposed in the groove, and the contact The outer layer is attached to one of the heat-conducting parts in the groove and is closely attached to the second body, the number of the bending sections is three, and the other of the heat-conducting parts is attached to the back cover of the first body . The electronic device with heat dissipation structure as claimed in claim 13, wherein the second body has a groove, wherein one of the heat-conducting portions is disposed in the groove, and the contact outer layer is attached to one of the heat-conducting portions in the groove And close to the second body, the number of the bending sections is two, and the other heat-conducting portion is attached to the front cover of the first body. The electronic device with a heat dissipation structure as claimed in claim 13, wherein the bending portion has six bending sections, and the lengths of the two heat conducting portions are equal. The electronic device with a heat dissipation structure as claimed in claim 1, wherein the heat conducting plate is a separate structure and includes a first heat conducting portion, a second heat conducting portion and a connecting member, the first heat conducting portion passing through the first heat conducting portion a body, the second heat-conducting part is passed through the second body, the connecting element is located between the first body and the second body and is configured to connect the first heat-conducting part and the second heat-conducting part. The electronic device with heat dissipation structure as claimed in claim 17, wherein the first heat-conducting portion and the second heat-conducting portion are respectively attached to two outer wall surfaces of the connecting member. The electronic device with heat dissipation structure as claimed in claim 17, wherein the connector has at least one receiving groove for holding the first heat conducting portion and the second heat conducting portion. The electronic device with a heat dissipation structure as claimed in claim 17, wherein the connecting member includes a first magnetic member and a second magnetic member, which are respectively disposed on the first heat-conducting portion and the second heat-conducting portion and are suitable for mutual Magnetic attraction to connect the first heat-conducting portion and the second heat-conducting portion. The electronic device with a heat dissipation structure according to any one of claims 1 to 20, wherein the airflow channels are connected with each other and present in an array pattern. The electronic device with a heat dissipation structure as claimed in claim 1, wherein the airflow channels are partially connected. The electronic device with a heat dissipation structure as claimed in claim 1, wherein a portion of the heat conduction member located between the first body and the second body and the hinge module have a gap.

Images