TWI871658B - Multi-heat source cooling module - Google Patents

Abstract

The present invention is a multi-heat source heat dissipation module, which is used to be arranged between two circuit boards, and the two circuit boards respectively have high-power and low-power chips; the multi-heat source heat dissipation module includes a heat pipe, which is used to be attached to each high-power chip; a plurality of heat sinks, which are respectively fixed to the heat pipe and used to be attached to each low-power chip; a heat sink fin group, which is arranged at one end of the heat pipe; by using the heat pipe to contact the chip with higher power, the high heat can be directly and quickly transferred to the heat sink fin group for heat dissipation, and by using the heat sink to contact the chip with lower power, the low heat can be indirectly transferred to the heat pipe and then transferred to the heat sink fin group for heat dissipation. The heat dissipation performance can be improved by configuring the chips with different powers in an appropriate heat dissipation manner, and it has the advantages of reducing the overall volume and weight of the product.

Description

Multi-heat source cooling module

The present invention relates to a heat dissipation device, in particular to a multi-heat source heat dissipation module for heat dissipating chips.

Nowadays, due to the advancement of wireless transmission technology, wireless networks have entered the WIFI 7 generation. In order to cope with the high-speed transmission rate, the chips used in the signal booster for WIFI 7 also have relatively high computing speeds, so the chips generate more heat. Please refer to FIG. 11, which shows a heat dissipation device provided for the signal booster of WIFI 7 in the prior art. The heat dissipation device mainly includes a copper plate 90 and a heat sink fin block 91. The shape of the copper plate 90 corresponds to the shape of the circuit board of the signal booster. The heat sink fin block 91 is provided on one side of the copper plate 90. The copper plate 90 is covered on the circuit board and abuts against each chip to conduct heat and achieve the effect of heat dissipation.

However, the circuit board of the signal booster mainly includes a main board and a WIFI board. During assembly, the main board and the WIFI board are relatively combined and the heat sink is sandwiched therebetween. However, since the chip on the main board and the chip on the WIFI board are arranged at different positions and thicknesses, the contact surface between the chip and the copper plate 90 is easily uneven during the combination process, resulting in a reduction in the contact area and a decrease in the heat conduction efficiency, thereby increasing the thermal resistance and affecting the heat dissipation performance. In addition, since the copper plate 90 used has a large area, it will also increase the overall weight of the signal booster. Therefore, the overall structure of the heat sink of the prior art has the above-mentioned problems and shortcomings, which really need to be improved.

In view of the shortcomings of the prior art, the present invention provides a multi-heat source heat dissipation module, which achieves the purpose of improving heat dissipation performance and reducing costs by combining heat pipes and heat sinks with high-power chips and low-power chips on a circuit board.

In order to achieve the above-mentioned invention purpose, the technical means adopted by the present invention is to design a multi-heat source heat dissipation module, which is used to be arranged between a first circuit board and a second circuit board arranged at intervals. The first circuit board and the second circuit board are electrically connected. The first circuit board is provided with a plurality of first main chips and a plurality of first time chips, and the second circuit board is provided with a plurality of second main chips and a plurality of second time chips. The side of the first circuit board provided with each of the first main chips and each of the first time chips and the side of the second circuit board provided with each of the second main chips and each of the second time chips are adjacent sides. The power of each of the first main chips is higher than the power of each of the first time chips, and the power of each of the second main chips is higher than the power of each of the second time chips. The multi-heat source heat dissipation module includes: A heat pipe, which is used to be attached to each of the first main chips and each of the second main chips; A plurality of heat sinks, each of which is fixed to the heat pipe, and each of which is used to be attached to each of the first chips and each of the second chips; A heat sink fin assembly, which is arranged at one end of the heat pipe.

Furthermore, in the multi-heat source heat dissipation module, the heat pipe is a flat tube having a top surface and a bottom surface, each heat sink has a first connecting section, a second connecting section and a turning section, the turning section is located between the first connecting section and the second connecting section, and each heat sink is fixed to the heat pipe by the second connecting section.

Furthermore, in the multi-heat source heat dissipation module, the shape of the bend of the heat pipe corresponds to the shape of the connection formed by connecting the positions of each of the first main chips and each of the second main chips.

Furthermore, in the multi-heat source heat dissipation module, the heat dissipation fin assembly includes a plurality of heat dissipation fins, each of the heat dissipation fins is arranged at intervals and forms a plurality of air guide ports, and the heat dissipation fin assembly is arranged at one end of the heat pipe.

Furthermore, in the multi-heat source heat dissipation module, the first circuit board and the second circuit board are disposed in a housing, a fan is disposed in the housing, and the air outlet of the fan is aligned with each of the air guide ports of the heat dissipation fin assembly.

The advantage of the present invention is that by contacting the first main chips and the second main chips with higher power or lower temperature limit through the heat pipe, high heat can be directly and quickly transferred to the heat sink fin assembly for heat dissipation, and by contacting the first chip and the second chip with lower power or higher temperature limit through the heat sink, low heat can be indirectly transferred to the heat pipe and then to the heat sink fin assembly for heat dissipation. Configuring chips of different power in an appropriate heat dissipation manner can not only improve the heat dissipation performance, but also reduce the overall volume and weight of the product. Moreover, chips set at different heights can all have a complete abutment state to reduce thermal resistance and improve thermal conduction efficiency.

The following is a combination of drawings and preferred embodiments of the present invention to further illustrate the technical means adopted by the present invention to achieve the intended purpose of the invention.

Please refer to FIG. 1 and FIG. 6 , the multi-heat source heat dissipation module of the present invention is used to be arranged between a first circuit board 40 and a second circuit board 50 which are arranged at intervals. The first circuit board 40 and the second circuit board 50 are electrically connected. The first circuit board 40 is provided with a plurality of first main chips 41 and a plurality of first sub-chips 42, and the second circuit board 50 is provided with a plurality of second main chips 51 and a plurality of second sub-chips 52. 0 is provided with each first main chip 41 and each first sub-chip 42 and the side of the second circuit board 50 is provided with each second main chip 51 and each second sub-chip 52 is adjacent to the side, the power of the first main chip 41 mentioned above is higher than the power of the first sub-chip 42, the power of the second main chip 51 is higher than the power of the second sub-chip 52, and the multi-heat source heat dissipation module includes a heat pipe 10, a plurality of heat sinks 20 and a heat sink fin assembly 30.

Please refer to Figures 2, 3 and 6. The heat pipe 10 is a flat tube in a bent shape, which has a top surface 11 and a bottom surface 12. The top surface 11 and the bottom surface 12 are two side surfaces that are opposite to each other. The bent shape of the heat pipe 10 corresponds to the arrangement position of each first main chip 41 and each second main chip 51, but is not limited to this. The shape of the heat pipe 10 can be changed according to user needs.

Please refer to FIG. 3 to FIG. 6 , each heat sink 20 is fixed to the heat pipe 10. In this embodiment, each heat sink 20 is a single piece, which can be made by bending processing technology. It has a first connecting section 21, a second connecting section 22 and a turning section 23. The turning section 23 is located between the first connecting section 21 and the second connecting section 22. The first connecting section 21 and the second connecting section 22 are arranged at intervals and located at different plane positions. Each heat sink 20 is fixed to the bottom surface 12 of the heat pipe 10 by the second connecting section 22, and the first connecting section 21 of each heat sink 20 is adjacent to the top surface 11 of the heat pipe 10 and is flush with the top surface 11 of the heat pipe 10, so that when the heat pipe 10 and each heat sink 20 contact the corresponding chips of the same height, they can be completely attached, but not limited to this, the shape, material and fixing method of each heat sink 20 can be changed according to user needs.

The heat sink fin assembly 30 is a block structure composed of a plurality of heat sink fins 31. The heat sink fins 31 are arranged at intervals and form a plurality of air guide ports 32. The heat sink fin assembly 30 is disposed on the top surface 11 of one end of the heat pipe 10, but is not limited thereto. The form of the heat sink fin assembly 30 can be changed according to user needs, and the heat sink fin assembly 30 may not be disposed.

When the present invention is assembled, please refer to FIG. 7 to FIG. 10, which is applied to a signal booster as an example, but not limited to this. The signal booster has a shell (not shown in the figure), and the shell surrounds an internal space. The first circuit board 40 and the second circuit board 50 are arranged in the shell with a vertical interval. The first circuit board 40 is a mainboard, and the second circuit board 50 is a WIFI board. The present invention is arranged between the first circuit board 40 and the second circuit board 50. The heat pipe 10 is attached to each first main chip 41 and each second main chip 51, and each heat sink 20 is attached to each first chip 42 and each second chip 52. A fan 60 is fixed in the housing and the air outlet is aligned with each air guide port 32 of the heat sink fin assembly 30, but this is not limited to it. The installation position of the fan 60 can be changed according to user needs, such as being directly installed on the first circuit board 40 or the second circuit board 50, or the fan 60 may not be installed.

By utilizing the heat pipe 10 to contact the first main chips 41 and the second main chips 51 with higher power or lower temperature limit, the high heat can be directly and quickly transferred to the heat sink fin assembly 30 for heat dissipation. The heat sink 20 can contact the first main chips 42 and the second main chips 52 with lower power or higher temperature limit, and the low heat can be indirectly transferred to the heat pipe 10 and then transferred to the heat sink fin assembly 30 for heat dissipation. Compared with the prior art, in addition to reducing the overall volume and weight of the product, the heat dissipation performance can be improved by configuring the chips of different power in an appropriate heat dissipation manner, and the chips set at different heights can all have a complete abutment state to reduce thermal resistance and improve thermal conduction efficiency.

The above is only the best embodiment of the present invention and does not constitute any form of limitation on the present invention. Although the present invention has been disclosed as the best embodiment as above, it is not used to limit the present invention. Any person with ordinary knowledge in the relevant technical field can make some changes or modifications to the technical contents disclosed above as equivalent embodiments within the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

10: heat pipe 11: top surface 12: bottom surface 20: heat sink 21: first connection section 22: second connection section 23: turning section 30: heat sink fin assembly 31: heat sink fin 32: air duct 40: first circuit board 41: first main chip 42: first chip 50: second circuit board 51: second main chip 52: second chip 60: fan 90: copper plate 91: heat sink fin block

Figure 1 is a three-dimensional appearance diagram of the present invention. Figure 2 is an exploded view of the main components of the present invention. Figure 3 is an exploded view of the main components of the present invention from another angle. Figure 4 is a partial side view of the present invention. Figure 5 is a partial cross-sectional view of the present invention. Figure 6 is an appearance diagram of the first circuit board and the second circuit board of the present invention. Figure 7 is a schematic diagram of the appearance of the present invention in use. Figure 8 is a schematic diagram of the configuration of the present invention. Figure 9 is a schematic diagram of the side view of the present invention in use. Figure 10 is another schematic diagram of the side view of the present invention in use. Figure 11 is a schematic diagram of the prior art.

10: Heat pipe 11: Top surface 12: Bottom surface 20: Heat sink 21: First connecting section 22: Second connecting section 23: Turning section 30: Heat sink fin assembly 60: Fan

Claims (4)

A multi-heat source heat dissipation module is used to be arranged between a first circuit board and a second circuit board arranged at intervals. The first circuit board and the second circuit board are electrically connected. The first circuit board is provided with a plurality of first main chips and a plurality of first sub-chips. The second circuit board is provided with a plurality of second main chips and a plurality of second sub-chips. The side of the first circuit board provided with each of the first main chips and each of the first sub-chips is adjacent to the side of the second circuit board provided with each of the second main chips and each of the second sub-chips. The power of each of the first main chips is higher than the power of each of the first sub-chips. The power of each of the second main chips is higher than the power of each of the second sub-chips. In terms of the power of each secondary chip, the multi-heat source heat dissipation module includes: a heat pipe, which is used to be attached to each first main chip and each second main chip, and the heat pipe is a flat tube body, which has a top surface and a bottom surface; a plurality of heat sinks, each of which is fixed to the heat pipe, each of which is used to be attached to each first chip and each second chip, each of which has a first connecting section, a second connecting section and a turning section, the turning section is located between the first connecting section and the second connecting section, and each of which is fixed to the heat pipe with the second connecting section; a heat sink fin assembly, which is arranged at one end of the heat pipe. A multi-heat source heat dissipation module as described in claim 1, wherein the shape of the bend of the heat pipe corresponds to the shape of the connection formed by connecting the positions of each of the first main chips and each of the second main chips. A multi-heat source heat dissipation module as described in claim 1 or 2, wherein the heat dissipation fin assembly includes a plurality of heat dissipation fins, each of the heat dissipation fins is arranged at intervals and has a plurality of air guide ports. The multi-heat source heat dissipation module as described in claim 3, wherein the first circuit board and the second circuit board are disposed in a housing, a fan is disposed in the housing, and the air outlet of the fan is aligned with each of the air guide ports of the heat dissipation fin assembly.