CN109814696B - Electronic equipment - Google Patents

Abstract

The present application discloses an electronic device, including a first body, a second body and a connecting device; wherein the second body is provided with a first heat dissipation structure for dissipating heat outwards; the connecting device is rotatably connected to the first body and the second body, and the connecting device is provided with a second heat dissipation structure for dissipating heat to the second body. During the application of the present application, on the one hand, the second body dissipates heat outwards through the first heat dissipation structure, and on the other hand, the second heat dissipation structure of the connecting device dissipates heat to the second body, so the first heat dissipation structure and the second heat dissipation structure can be used to dissipate heat at the same time, thereby improving the heat dissipation performance and being better suitable for electronic devices with increasingly higher system power consumption and configuration.

Description

An electronic device

Technical Field

The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment with good heat dissipation performance.

Background technique

The heat dissipation performance of electronic devices such as laptop computers is one of the main factors affecting the working performance of electronic devices. In the prior art, the heat dissipation performance of electronic devices such as laptop computers is not very ideal, which greatly affects the overall working performance of the electronic devices.

Application Contents

In view of this, the present application provides an electronic device, providing the following technical solutions:

An electronic device, comprising:

First entity;

The second body is provided with a first heat dissipation structure for dissipating heat outwards;

A connecting device is used to rotatably connect the first body and the second body. The connecting device is provided with a second heat dissipation structure for dissipating heat from the second body.

Preferably, in the above electronic device, the second body has an input surface, the connecting device is arranged on the input surface and divides the input surface into a first part and a second part, and the first part is provided with an input device;

The first heat dissipation structure includes a first heat dissipation through hole, and the first heat dissipation through hole is arranged on a side surface of the second body and adjacent to the second part.

Preferably, in the above electronic device, the second heat dissipation structure comprises:

The heat conducting component is used to conduct heat away from the second body.

Preferably, in the above electronic device, the first end of the heat-conducting component is connected to the second body or the first heat dissipation structure;

Wherein, the second heat dissipation structure further includes:

The heat exchange component is connected to the second end of the heat conduction component and is used for heat exchange with the air outside the electronic device.

Preferably, in the above electronic device, a transmission path is provided in the connecting device, and the transmission path contains a transmission component, and the transmission component is used to transmit signals between the first body and the second body;

The heat conducting component utilizes at least a portion of the transmission passage to conduct heat in the second body to the connecting device.

Preferably, in the above electronic device, the second heat dissipation structure further includes:

The second heat dissipation through hole is provided on the connecting device and can be communicated with the air outside the electronic device.

Preferably, in the above electronic device, the second heat dissipation through hole includes a plurality of heat dissipation sub-holes arranged along the axial direction of the connecting device.

Preferably, in the above electronic device, the connecting device comprises:

The first rotating shaft;

a second rotating shaft, coaxially arranged with the first rotating shaft and spaced apart from the first rotating shaft;

The shell has one end rotatably connected to the first rotating shaft and the other end rotatably connected to the second rotating shaft, and a receiving cavity is formed at a position corresponding to the interval, and the second heat dissipation structure is arranged in the receiving cavity and/or on the shell.

Preferably, in the above electronic device, the connecting device comprises a rotating shaft, and the rotating shaft comprises:

a first solid segment and a second solid segment;

The hollow section has a containing cavity, connecting the first solid section and the second solid section, and the second heat dissipation structure is arranged in the hollow section.

Preferably, in the above electronic device, the plurality of heat sinks of the second heat dissipation structure are arranged in the accommodating cavity along the axial direction of the connecting device.

It can be seen from the above technical solution that the electronic device provided in the present application includes a first body, a second body and a connecting device; wherein the second body is provided with a first heat dissipation structure for dissipating heat outward; the connecting device is rotatably connected to the first body and the second body, and the connecting device is provided with a second heat dissipation structure for dissipating heat to the second body.

During the application of this application, on the one hand, the second body dissipates heat outwards through the first heat dissipation structure, and on the other hand, the second heat dissipation structure of the connecting device dissipates heat to the second body, so the first heat dissipation structure and the second heat dissipation structure can be used to dissipate heat at the same time, thereby improving the heat dissipation performance and being better suitable for electronic devices with increasingly higher system power consumption and configuration.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

FIG1 is a schematic diagram of a three-dimensional structure of an electronic device provided in an embodiment of the present application;

FIG2 is a side view of an electronic device provided in an embodiment of the present application;

FIG3 is a partial cross-sectional view of an electronic device provided in an embodiment of the present application;

FIG. 4 is a partial enlarged view of A in FIG. 3 .

In Figures 1-4 above,

1-first body, 2-second body, 21-first heat dissipation through hole, 3-first rotating shaft, 4-second rotating shaft, 5-shell, 51-heat dissipation sub-hole, 6-heat sink, 7-heat pipe.

Detailed ways

The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

Please refer to Figures 1-4 (the figures are only specific implementation plans of the present application and are not limited to the solutions shown in the figures. The present application also includes other solutions not shown in the figures). The electronic device provided in the embodiment of the present application includes a first body 1, a second body 2 and a connecting device; wherein the second body 2 is provided with a first heat dissipation structure for dissipating heat to the outside; the connecting device is rotatably connected to the first body 1 and the second body 2, and the connecting device is provided with a second heat dissipation structure for dissipating heat to the second body 2.

During the application of this application, on the one hand, the second body 2 dissipates heat outwards through the first heat dissipation structure, and on the other hand, the second heat dissipation structure of the connecting device dissipates heat to the second body 2, so the first heat dissipation structure and the second heat dissipation structure can be used to dissipate heat at the same time, thereby improving the heat dissipation performance and being better suitable for electronic devices with increasingly higher system power consumption and configuration.

It should be noted that the second heat dissipation structure can be a complete heat dissipation path, or it can have an overlapping intersection with the first heat dissipation structure, that is, the first heat dissipation structure and the second heat dissipation structure are used to separate a heat dissipation path into two heat dissipation branches, as long as the structure can achieve the heat dissipation purpose.

The electronic device may be a notebook computer, a flip phone or other device having two connected structures.

Preferably, the second body 2 has an input surface; a connecting device is arranged on the input surface and divides the input surface into a first part and a second part, and the first part is provided with the input device; the first heat dissipation structure includes a first heat dissipation through hole 21, and the first heat dissipation through hole 21 is arranged on the side of the second body 2 and adjacent to the second part.

The input device refers to an input component array used for character input, which can be a physical input component array such as a keyboard or a virtual input component array such as a touch pad or touch screen that can display a keyboard.

When the electronic device is a notebook computer, the first body 1 is a screen portion, the second body 2 is a host base, and the connecting device is a hinge device; the host base is provided with a first heat dissipation structure, and the hinge device is provided with a second heat dissipation structure.

The above-mentioned input surface specifically refers to the top surface of the host base where the input device is set. The hinge device is set on the top surface of the host base and divides the top surface into a first part and a second part distributed front and back. Specifically, when the hinge device includes two left and right shaft sections, the connection line of the left and right shaft sections and the extension line of the connection line realize the separation; when the hinge device includes an entire long axis, the extension line of the long axis realizes the separation.

The keyboard is arranged in the first part of the front, and the first heat dissipation hole 21 of the second heat dissipation structure is arranged on the back and left and right sides corresponding to the second part of the rear, so that the blowing direction of the first heat dissipation hole 21 will not be toward the screen part, thereby avoiding affecting the screen part; of course, the first heat dissipation hole 21 can also be arranged only on the back or left side or right side of the second part for the design considerations of the heat dissipation air path.

Specifically, the first body 1 and the second body 2 are both plate-shaped. When the first body 1 is folded on the second body 2, the front-to-back length of the first body 1 is shorter than the front-to-back length of the second body 2. The front ends of the first body 1 and the second body 2 are aligned, and the rear end of the second body 2 protrudes from the rear end of the first body 1. The rear end face of the second body 2 can be an overall flat surface, or it can be an uneven surface with protrusions at both ends, one end or the middle. The first heat dissipation hole 21 is set at the protrusion, and the interface of the second body 2 is set at the recess.

In this embodiment, the present application sets the connection device on one side of the overall thickness of the second body 2, without occupying the thickness of the second body 2, thereby maximizing the area of the first heat dissipation structure set on the second body 2, ensuring the heat dissipation effect. Of course, the connection device can also be set at other positions of the second body 2, such as the back side of the second body 2 adjacent to the input surface, that is, the rear side.

The second heat dissipation structure includes a heat conduction component for conducting heat out of the second body 2. In a specific embodiment, the heat conduction component is a through hole connecting the second body 2 and the connecting device to conduct heat out of the second body 2.

In another specific embodiment, the first end of the heat conducting component is connected to the second body 2, or connected to the first heat dissipation structure. The heat conducting component is a heat pipe 7, and the first end of the heat pipe 7 is connected to the second body 2 or the first heat dissipation structure. The heat conducting component can also be a heat conducting plate, etc. The heat pipe 7 is specifically a copper pipe, which directly outputs the heat of the second body 2 through its own good thermal conductivity or indirectly outputs the heat of the second body 2 through the first heat dissipation structure, thereby achieving the purpose of heat dissipation.

In a further embodiment, in order to speed up the heat dissipation, the second heat dissipation structure also includes a heat exchange component, which is connected to the second end of the heat conductive component and is used for heat exchange with the air outside the electronic device. The heat exchange component is specifically a heat sink 6 or a heat dissipation housing connected to the second end of the heat pipe 7. The heat in the second body 2 is first exported through the heat pipe 7, and then the heat is exported out of the electronic device through the heat sink 6 or the heat dissipation housing. The present application can also use through holes to export the heat in the second body 2, and then export the heat out of the electronic device through the heat sink 6 or the heat dissipation housing. The second heat dissipation structure of the present application can also be configured without a heat exchange component, and heat is only exported through a heat conductive component to achieve heat dissipation.

In another embodiment of the present application, a transmission path is provided in the connection device, and the transmission path contains a transmission component, and the transmission component is used to transmit signals between the first body 1 and the second body 2; the heat conduction component uses at least part of the transmission path to export the heat in the second body 2 to the connection device. The present application uses at least part of the transmission path of the connection device itself to form a heat conduction component, and uses the transmission path to realize the heat export of the second body 2, without the need to set a special through hole connecting the second body 2 and the connection device, thereby simplifying the structure. Of course, the present application can also use a dual structure of a partial transmission path and a special through hole to realize heat conduction.

In another embodiment of the present application, the second heat dissipation structure further includes a second heat dissipation through hole, which is provided on the connection device and can be connected to the air outside the electronic device. The present application firstly conducts heat from the second body 2 through the heat conduction component, and then conducts heat out of the electronic device through the heat sink 6 or the second heat dissipation through hole, thereby improving the heat dissipation effect.

Specifically, the second heat dissipation through hole and the first heat dissipation through hole 21 have the same opening direction, and can both face upward and backward to ensure the consistency of the heat dissipation and air outlet directions. Of course, the opening directions of the two holes can also be different.

It can be understood that the second heat dissipation structure of the present application can also include a heat conducting component, a heat exchange component and a second heat dissipation hole. As shown in Figure 4, the heat in the second body 2 is first exported to the heat exchange component through the heat conducting component, and the heat dissipated by the heat exchange component is heat exchanged with the external air through the second heat dissipation hole, thereby improving the heat dissipation effect.

As shown in Figure 3, the second heat dissipation through hole includes a plurality of heat dissipation sub-holes 51 arranged along the axial direction of the connection device, which can ensure the heat dissipation effect while ensuring the structural strength. It is understandable that the second heat dissipation through hole can also be arranged along the direction of the rectangular array, or can be an integral heat dissipation hole.

In a specific embodiment of the present application, the connecting device includes a first rotating shaft 3, a second rotating shaft 4, and a housing 5; the second rotating shaft 4 is coaxially arranged with the first rotating shaft 3 and has a gap between the first rotating shaft 3; one end of the housing 5 is rotatably connected to the first rotating shaft 3, and the other end is rotatably connected to the second rotating shaft 4, and a receiving cavity is formed at a position corresponding to the above-mentioned gap, and a second heat dissipation structure is arranged in the receiving cavity and/or on the housing 5. The connecting device of this embodiment includes two rotating shafts, the first rotating shaft 3 and the second rotating shaft 4, and the receiving cavity is formed by using the gap between the first rotating shaft 3 and the second rotating shaft 4 and the housing 5. The present application adopts the invalid space between the first rotating shaft 3 and the second rotating shaft 4 to set the second heat dissipation structure to achieve greater power consumption and heat dissipation requirements of the system, save space, and make the structure more compact.

In another specific embodiment of the present application, the connecting device includes a rotating shaft, and the rotating shaft includes a first solid section and a second solid section; the hollow section has a receiving cavity, which connects the first solid section and the second solid section, and the second heat dissipation structure is arranged in the hollow section. The connecting device of this embodiment includes a rotating shaft, and by providing a hollow section in the middle of the rotating shaft, the second heat dissipation structure is arranged using the receiving cavity of the hollow section, thereby saving space and making the structure more compact.

The present application may also provide a separate structure on one side of the rotating shaft as a second heat dissipation structure.

Preferably, a plurality of heat sinks 6 of the second heat dissipation structure are arranged in the accommodating cavity along the axial direction of the connecting device. Specifically, the heat pipes 7 and heat sinks 6 of the second heat dissipation structure are arranged in the accommodating cavity, and the second heat dissipation through holes are arranged on the shell 5 or on the wall thickness of the above-mentioned hollow section. The present application utilizes the space of the rotating shaft to accommodate the heat sink 6, which neither occupies the system space nor the system thickness, and makes full use of the invalid space to achieve a greater system heat dissipation requirement. The above-mentioned heat sinks 6 can be evenly arranged along the axial direction of the connecting device, or they can be unevenly arranged. Of course, the above-mentioned heat sinks 6 can also be arranged outside the accommodating cavity.

In order to further optimize the above technical solution, the first heat dissipation structure also includes a third heat dissipation through hole (not shown in the figure), which is arranged on the second part. In this embodiment, the third heat dissipation through hole is arranged on the top surface of the host base to achieve upper air outlet, and the first heat dissipation through hole 21 is arranged on the back and left and right sides of the host base to achieve rear air outlet and side air outlet, so that the second part is provided with heat dissipation through holes except the bottom support surface, achieving the maximum heat dissipation effect. Alternatively, the third heat dissipation through hole may not be arranged in this application.

In this specification, each part of the structure is described in a progressive manner, and the structure of each part focuses on the differences from the existing structure. The overall and partial structures of the electronic device can be obtained by combining the structures of the above multiple parts.

The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims (6)

1. An electronic device, comprising:

a first body;

The second body is provided with a first heat dissipation structure for dissipating heat outwards;

The connecting device is rotationally connected with the first body and the second body and is provided with a second heat dissipation structure for dissipating heat of the second body;

The second body is provided with an input surface, the connecting device is arranged on the input surface and divides the input surface into a first part and a second part, and the first part is provided with the input device;

The first heat dissipation structure comprises a first heat dissipation through hole, and the first heat dissipation through hole is arranged on the side surface of the second body, which is adjacent to the second part;

The end face of the rear end of the second body is a flat surface which is integrally flush; or the end face of the rear end of the second body is an uneven face, the first heat dissipation through hole is arranged at the convex part, and the interface of the second body is arranged at the concave part;

The connecting device comprises: a first rotating shaft; the second rotating shaft is coaxially arranged with the first rotating shaft and is spaced from the first rotating shaft; one end of the shell is rotationally connected with the first rotating shaft, the other end of the shell is rotationally connected with the second rotating shaft, a first accommodating cavity is formed at a position corresponding to the interval, and the second heat dissipation structure is arranged in the accommodating cavity and/or on the shell; the plurality of radiating fins of the second radiating structure are arranged in the first accommodating cavity along the axial direction of the connecting device; or alternatively, the first and second heat exchangers may be,

The connecting device includes the pivot, the pivot includes: a first solid segment and a second solid segment; the hollow section is provided with a second accommodating cavity, the first solid section is connected with the second solid section, and the second heat dissipation structure is arranged on the hollow section; the plurality of radiating fins of the second radiating structure are arranged in the second accommodating cavity along the axial direction of the connecting device.

2. The electronic device of claim 1, the second heat dissipation structure comprising:

and the heat conduction component is used for conducting out heat in the second body.

3. The electronic device of claim 2, the first end of the thermally conductive assembly being connected to the second body or the first heat dissipating structure;

Wherein, the second heat dissipation structure further includes:

and the heat exchange assembly is connected with the second end of the heat conduction assembly and is used for exchanging heat with air outside the electronic equipment.

4. The electronic device of claim 3, wherein a transmission path is provided in the connection means, the transmission path housing a transmission assembly for transmitting signals between the first body and the second body;

the heat conducting assembly conducts heat within the second body to the connection device using at least a portion of the transmission path.

5. The electronic device of claim 2, the second heat dissipation structure further comprising:

the second heat dissipation through hole is formed in the connecting device and can be communicated with air outside the electronic equipment.

6. The electronic device of claim 5, the second heat dissipation through-hole comprising a plurality of heat dissipation sub-holes arranged along an axial direction of the connection means.