TWI885889B - Portable electronic device - Google Patents
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- TWI885889B TWI885889B TW113116427A TW113116427A TWI885889B TW I885889 B TWI885889 B TW I885889B TW 113116427 A TW113116427 A TW 113116427A TW 113116427 A TW113116427 A TW 113116427A TW I885889 B TWI885889 B TW I885889B
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Abstract
Description
本發明是有關於一種電子裝置,且特別是有關於一種可攜式電子裝置。The present invention relates to an electronic device, and in particular to a portable electronic device.
筆記型電腦是由彼此樞接的第一機體與第二機體組成,其中第一機體為具備邏輯運算能力的主機,且第二機體為具備影像顯示能力的顯示器。一般而言,第一機體內部設有中央處理器及圖形處理器,其中中央處理器及圖形處理器作為第一機體內部的主要熱源,且於運行時會放出大量的熱。A laptop computer is composed of a first body and a second body connected to each other, wherein the first body is a host computer with logical computing capabilities, and the second body is a display with image display capabilities. Generally speaking, a central processing unit and a graphics processing unit are provided inside the first body, wherein the central processing unit and the graphics processing unit are the main heat sources inside the first body, and they will release a large amount of heat during operation.
常見的作法是在第一機體內部設置熱管、散熱鰭片及風扇,藉由風扇產生強制對流,以快速地將熱排出第一機體。因風扇運轉時會產生噪音,遂有無風扇設計的筆記型電腦被提出,例如在第一機體內設置均溫板或將熱傳導至第二機體並藉由第二機體的背蓋進行散熱,但無風扇設計存在著散熱效率不佳的問題。The common practice is to install heat pipes, heat sink fins and fans inside the first body, and use the fans to generate forced convection to quickly discharge heat from the first body. Because the fan generates noise when it is running, notebook computers without fans have been proposed, such as installing a temperature plate inside the first body or transferring the heat to the second body and dissipating the heat through the back cover of the second body. However, the fanless design has the problem of poor heat dissipation efficiency.
本發明提供一種可攜式電子裝置,具有極佳的散熱效率。The present invention provides a portable electronic device with excellent heat dissipation efficiency.
本發明提出一種可攜式電子裝置,包括第一機體、第二機體、熱源以及導熱元件。第二機體樞接於第一機體。第二機體具有底部、相對於底部的頂部、自底部延伸至頂部的散熱流道、位於底部的進氣口及位於頂部的排氣口。進氣口與排氣口連通於散熱流道。熱源設置於第一機體內。導熱元件自第一機體延伸至第二機體。導熱元件具有相對的第一端與第二端,其中第一端熱耦接於熱源,且第二端熱耦接於第二機體的底部。The present invention provides a portable electronic device, comprising a first body, a second body, a heat source and a heat conductive element. The second body is pivotally connected to the first body. The second body has a bottom, a top opposite to the bottom, a heat dissipation channel extending from the bottom to the top, an air inlet located at the bottom and an air exhaust port located at the top. The air inlet and the air exhaust port are connected to the heat dissipation channel. The heat source is disposed in the first body. The heat conductive element extends from the first body to the second body. The heat conductive element has a first end and a second end opposite to each other, wherein the first end is thermally coupled to the heat source, and the second end is thermally coupled to the bottom of the second body.
基於上述,熱源產生的熱可傳導至第二機體,避免因第一機體內部溫度過高而造成效能下滑。另外,傳導至第二機體的熱可藉由熱交換及冷熱空氣的對流快速地排至外界,故本發明的可攜式電子裝置具有極佳的散熱效率。Based on the above, the heat generated by the heat source can be transferred to the second body, avoiding the performance degradation caused by the excessive temperature inside the first body. In addition, the heat transferred to the second body can be quickly discharged to the outside through heat exchange and convection of cold and hot air, so the portable electronic device of the present invention has excellent heat dissipation efficiency.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the present invention more clearly understood, embodiments are specifically cited below and described in detail with reference to the accompanying drawings.
圖1A是本發明第一實施例的可攜式電子裝置的示意圖。圖1B是圖1A的可攜式電子裝置沿剖線I-I的局部剖面示意圖。請參考圖1A與圖1B,在本實施例中,可攜式電子裝置100可為筆記型電腦,且包括第一機體110、第二機體120、熱源130以及導熱元件140。第二機體120樞接於第一機體110,其中熱源130設置於第一機體110內,且可以是中央處理器或圖形處理器。FIG. 1A is a schematic diagram of a portable electronic device according to a first embodiment of the present invention. FIG. 1B is a partial cross-sectional schematic diagram of the portable electronic device of FIG. 1A along the section line I-I. Referring to FIG. 1A and FIG. 1B, in this embodiment, the portable
第二機體120具有底部121與相對於底部121的頂部122,其中底部121樞接於第一機體110,且導熱元件140自第一機體110延伸至第二機體120。詳細而言,導熱元件140具有相對的第一端141與第二端142,其中第一端141熱耦接於熱源130,且第二端142熱耦接於第二機體120的底部121。因此,熱源130產生的熱可經由導熱元件140傳導至第二機體120,避免因第一機體110內部溫度過高而造成效能下滑。The
舉例來說,導熱元件140可為採用銅、鋁、石墨或其他高導熱材料製成的線材或片材,且適於受力撓曲而不易斷裂。For example, the
如圖1B所示,第二機體120還具有自底部121延伸至頂部122的散熱流道123、位於底部121的進氣口124及位於頂部122的排氣口125。導熱元件140的第二端142位於散熱流道123內。因此,熱源130產生的熱可經由導熱元件140傳導至散熱流道123,並在散熱流道123中靠近底部121的區域形成高溫區。As shown in FIG. 1B , the
另一方面,外界的冷空氣可經由進氣口124進入散熱流道123,並在散熱流道123的高溫區內進行熱交換,以形成熱空氣。因熱空氣的密度小於冷空氣的密度而產生浮力,熱空氣可在散熱流道123內上升,以往第二機體120的頂部122流動,最後經由排氣口125排放至外界。也就是說,傳導至第二機體120的熱可藉由熱交換及冷熱空氣的對流快速地排至外界,故可攜式電子裝置100具有極佳的散熱效率。On the other hand, the cold air from the outside can enter the
如圖1B所示,可攜式電子裝置100更包括樞接件150,其中第二機體120透過樞接件150樞接於第一機體110,且導熱元件140穿過樞接件150。進一步而言,樞接件150連接於或一體成型於第二機體120的底部121,其中樞接件150具有供導熱元件140穿設的通道151,且通道151的相對兩端分別連通於第一機體110內部與散熱流道123。As shown in FIG. 1B , the portable
另一方面,散熱流道123具有底面1231、相對於底面1231的頂面1232、第一壁面1233及相對於第一壁面1233的第二壁面1234,其中進氣口124貫穿底面1231,且排氣口125貫穿頂面1232。進一步來說,第一壁面1233與第二壁面1234自底面1231延伸至頂面1232,且導熱元件140的第二端142接觸或貼附於第一壁面1233。On the other hand, the
如圖1B所示,第一壁面1233與第二壁面1234之間的距離D1自底面1231往頂面1232逐漸縮減。進一步來說,散熱流道123可為截面積自進氣口124往排氣口125逐漸縮減的漸縮流道,以加速熱空氣在散熱流道123內往排氣口125流動的流速,使得熱空氣快速地經由排氣口125排放至外界,同時加速外界的冷空氣經由進氣口124引入散熱流道123的速度,不僅能夠避免熱積累於第二機體120,也能夠提升對流效率。As shown in FIG. 1B , the distance D1 between the
舉例來說,第一壁面1233與可為平面,而第二壁面1234可為斜面,但不以此為限。在其他示例中,第二壁面1234可為弧面、階梯面、鋸齒面、波浪面或具有其他幾何形狀的表面。For example, the
圖1C是圖1A的第二機體的示意圖。如圖1C所示,第二機體120還具有相對的二個導流部126。二個導流部126自底部121延伸至頂部122,且散熱流道123位於二個導流部126之間。舉例來說,散熱流道123可以是第二機體120的內部空間的一部分,並由二個導流部126在內部空間中界定出散熱流道123的分布範圍。FIG1C is a schematic diagram of the second body of FIG1A. As shown in FIG1C, the
如圖1B與圖1C所示,第一壁面1233與第二壁面1234之間的距離D1定義出散熱流道123的截面的短邊,且二個導流部126之間的距離D2定義出散熱流道123的截面的長邊。As shown in FIG. 1B and FIG. 1C , the distance D1 between the
如圖1C所示,二個導流部126之間的距離D2自底部121往頂部122逐漸縮減。進一步來說,散熱流道123可為截面積自進氣口124往排氣口125逐漸縮減的漸縮流道,以加速熱空氣在散熱流道123內往排氣口125流動的流速,使得熱空氣快速地經由排氣口125排放至外界,同時加速外界的冷空氣經由進氣口124引入散熱流道123的速度,不僅能夠避免熱積累於第二機體120,也能夠提升對流效率。As shown in FIG. 1C , the distance D2 between the two
在一示例中,第二機體未配置二個導流部,其中散熱流道可以是第二機體的內部空間的整體,且第一壁面與第二壁面之間的距離自底面往頂面逐漸縮減。In one example, the second body is not equipped with two guide parts, wherein the heat dissipation channel can be the entire internal space of the second body, and the distance between the first wall surface and the second wall surface gradually decreases from the bottom surface to the top surface.
在一示例中,散熱流道可以是第二機體的內部空間的一部分,並由二個導流部在內部空間中界定出散熱流道的分布範圍。另外,第一壁面與第二壁面之間的距離自底面往頂面逐漸縮減,且二個導流部之間的距離自底部往頂部保持不變。In one example, the heat dissipation channel can be a part of the inner space of the second body, and the two guide parts define the distribution range of the heat dissipation channel in the inner space. In addition, the distance between the first wall surface and the second wall surface gradually decreases from the bottom surface to the top surface, and the distance between the two guide parts remains unchanged from the bottom to the top.
在一示例中,散熱流道可以是第二機體的內部空間的一部分,並由二個導流部在內部空間中界定出散熱流道的分布範圍。另外,第一壁面與第二壁面之間的距離自底面往頂面保持不變,且二個導流部之間的距離自底部往頂部逐漸縮減。In one example, the heat dissipation channel can be a part of the inner space of the second body, and the two guide parts define the distribution range of the heat dissipation channel in the inner space. In addition, the distance between the first wall surface and the second wall surface remains unchanged from the bottom surface to the top surface, and the distance between the two guide parts gradually decreases from the bottom to the top.
圖2A是本發明第二實施例的可攜式電子裝置的局部剖面示意圖。圖2B是本發明第二實施例的可攜式電子裝置中的第二機體的示意圖。請參考圖2A與圖2B,本實施例的可攜式電子裝置100A與第一實施例的可攜式電子裝置100的設計大致相同,兩者的主要差異在於:在本實施例的第二機體120a中,進氣口124貫穿第二壁面1234。FIG2A is a partial cross-sectional schematic diagram of a portable electronic device of a second embodiment of the present invention. FIG2B is a schematic diagram of a second body in the portable electronic device of the second embodiment of the present invention. Referring to FIG2A and FIG2B , the design of the portable
圖3A是本發明第三實施例的可攜式電子裝置的局部剖面示意圖。圖3B是本發明第三實施例的可攜式電子裝置中的第二機體的示意圖。請參考圖3A與圖3B,本實施例的可攜式電子裝置100B與第一實施例的可攜式電子裝置100的設計大致相同,兩者的主要差異在於:在本實施例的第二機體120b中,進氣口124的一部分貫穿底面1231,且進氣口124的另一部分貫穿第二壁面1234。FIG. 3A is a partial cross-sectional schematic diagram of a portable electronic device of a third embodiment of the present invention. FIG. 3B is a schematic diagram of a second body in the portable electronic device of the third embodiment of the present invention. Referring to FIG. 3A and FIG. 3B , the portable
綜上所述,熱源產生的熱可傳導至第二機體內的散熱流道,且外界的冷空氣可經由位於第二機體的底部的進氣口進入散熱流道。冷空氣在散熱流道內進行熱交換以形成熱空氣,且熱空氣在散熱流道內上升以往第二機體的頂部流動,最後經由位於第二機體的頂部的排氣口排放至外界。也就是說,熱源產生的熱可傳導至第二機體,避免因第一機體內部溫度過高而造成效能下滑。另外,傳導至第二機體的熱可藉由熱交換及冷熱空氣的對流快速地排至外界,故本發明的可攜式電子裝置具有極佳的散熱效率。In summary, the heat generated by the heat source can be transferred to the heat dissipation channel in the second body, and the cold air from the outside can enter the heat dissipation channel through the air inlet located at the bottom of the second body. The cold air performs heat exchange in the heat dissipation channel to form hot air, and the hot air rises in the heat dissipation channel and flows to the top of the second body, and finally is discharged to the outside through the exhaust port located at the top of the second body. In other words, the heat generated by the heat source can be transferred to the second body to avoid performance degradation caused by excessive temperature inside the first body. In addition, the heat transferred to the second body can be quickly discharged to the outside through heat exchange and convection of hot and cold air, so the portable electronic device of the present invention has excellent heat dissipation efficiency.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above by the embodiments, they are not intended to limit the present invention. Any person with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be defined by the scope of the attached patent application.
100、100A、100B:可攜式電子裝置
110:第一機體
120、120a、120b:第二機體
121:底部
122:頂部
123:散熱流道
1231:底面
1232:頂面
1233:第一壁面
1234:第二壁面
124:進氣口
125:排氣口
126:導流部
130:熱源
140:導熱元件
141:第一端
142:第二端
150:樞接件
151:通道
D1、D2:距離
I-I:剖線
100, 100A, 100B: portable electronic device
110:
圖1A是本發明第一實施例的可攜式電子裝置的示意圖。 圖1B是圖1A的可攜式電子裝置沿剖線I-I的局部剖面示意圖。 圖1C是圖1A的第二機體的示意圖。 圖2A是本發明第二實施例的可攜式電子裝置的局部剖面示意圖。 圖2B是本發明第二實施例的可攜式電子裝置中的第二機體的示意圖。 圖3A是本發明第三實施例的可攜式電子裝置的局部剖面示意圖。 圖3B是本發明第三實施例的可攜式電子裝置中的第二機體的示意圖。 FIG. 1A is a schematic diagram of a portable electronic device of a first embodiment of the present invention. FIG. 1B is a schematic diagram of a partial cross-section of the portable electronic device of FIG. 1A along the section line I-I. FIG. 1C is a schematic diagram of a second body of FIG. 1A. FIG. 2A is a schematic diagram of a partial cross-section of a portable electronic device of a second embodiment of the present invention. FIG. 2B is a schematic diagram of a second body in a portable electronic device of a second embodiment of the present invention. FIG. 3A is a schematic diagram of a partial cross-section of a portable electronic device of a third embodiment of the present invention. FIG. 3B is a schematic diagram of a second body in a portable electronic device of a third embodiment of the present invention.
100:可攜式電子裝置 100: Portable electronic devices
110:第一機體 110: First Body
120:第二機體 120: Second body
121:底部 121: Bottom
122:頂部 122: Top
123:散熱流道 123: Heat dissipation channel
1231:底面 1231: Bottom surface
1232:頂面 1232: Top
1233:第一壁面 1233: First wall
1234:第二壁面 1234: Second wall
124:進氣口 124: Air intake
125:排氣口 125: Exhaust port
130:熱源 130: Heat source
140:導熱元件 140: Thermal conductive element
141:第一端 141: First end
142:第二端 142: Second end
150:樞接件 150: Joints
151:通道 151: Channel
D1:距離 D1: distance
Claims (8)
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| TW113116427A TWI885889B (en) | 2024-05-02 | 2024-05-02 | Portable electronic device |
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| TW113116427A TWI885889B (en) | 2024-05-02 | 2024-05-02 | Portable electronic device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI234064B (en) * | 2003-09-19 | 2005-06-11 | Fujitsu Ltd | Electronic device |
| TW201408181A (en) * | 2012-08-08 | 2014-02-16 | Asustek Comp Inc | Portable electronic apparatus and system |
| US20190041922A1 (en) * | 2018-08-01 | 2019-02-07 | Intel Corporation | Thermal dissipation in dual-chassis devices |
| TWI755191B (en) * | 2019-12-11 | 2022-02-11 | 仁寶電腦工業股份有限公司 | Electronic device with radiation structure |
| TW202401203A (en) * | 2022-06-29 | 2024-01-01 | 仁寶電腦工業股份有限公司 | Foldable electronic device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI234064B (en) * | 2003-09-19 | 2005-06-11 | Fujitsu Ltd | Electronic device |
| TW201408181A (en) * | 2012-08-08 | 2014-02-16 | Asustek Comp Inc | Portable electronic apparatus and system |
| US20190041922A1 (en) * | 2018-08-01 | 2019-02-07 | Intel Corporation | Thermal dissipation in dual-chassis devices |
| TWI755191B (en) * | 2019-12-11 | 2022-02-11 | 仁寶電腦工業股份有限公司 | Electronic device with radiation structure |
| TW202401203A (en) * | 2022-06-29 | 2024-01-01 | 仁寶電腦工業股份有限公司 | Foldable electronic device |
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