TWI488887B - 聚醯亞胺,由此形成之塗料組合物及其用途 - Google Patents
聚醯亞胺,由此形成之塗料組合物及其用途 Download PDFInfo
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- TWI488887B TWI488887B TW102105405A TW102105405A TWI488887B TW I488887 B TWI488887 B TW I488887B TW 102105405 A TW102105405 A TW 102105405A TW 102105405 A TW102105405 A TW 102105405A TW I488887 B TWI488887 B TW I488887B
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- polyimine
- alkyl
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- 239000008199 coating composition Substances 0.000 title claims description 23
- 229920001721 polyimide Polymers 0.000 title description 5
- 239000004642 Polyimide Substances 0.000 title description 2
- 239000000203 mixture Substances 0.000 claims description 36
- 125000000962 organic group Chemical group 0.000 claims description 18
- -1 methoxy, ethoxy Chemical group 0.000 claims description 16
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 12
- 125000000524 functional group Chemical group 0.000 claims description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 239000004848 polyfunctional curative Substances 0.000 claims description 10
- 229910052736 halogen Inorganic materials 0.000 claims description 8
- 150000002367 halogens Chemical class 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 150000002431 hydrogen Chemical group 0.000 claims description 4
- 125000002971 oxazolyl group Chemical group 0.000 claims description 3
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 125000005605 benzo group Chemical group 0.000 claims description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 239000011593 sulfur Substances 0.000 claims description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims 1
- 150000002513 isocyanates Chemical class 0.000 claims 1
- 125000003396 thiol group Chemical class [H]S* 0.000 claims 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 15
- 239000010408 film Substances 0.000 description 15
- 239000000126 substance Substances 0.000 description 13
- 239000008096 xylene Substances 0.000 description 13
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 12
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000003786 synthesis reaction Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 238000009472 formulation Methods 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 8
- 150000004985 diamines Chemical class 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 238000004383 yellowing Methods 0.000 description 6
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 5
- 239000004640 Melamine resin Substances 0.000 description 5
- 229920000877 Melamine resin Polymers 0.000 description 5
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- OLAPPGSPBNVTRF-UHFFFAOYSA-N naphthalene-1,4,5,8-tetracarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1C(O)=O OLAPPGSPBNVTRF-UHFFFAOYSA-N 0.000 description 5
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 4
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 4
- 102100031503 Barrier-to-autointegration factor-like protein Human genes 0.000 description 4
- WVOLTBSCXRRQFR-SJORKVTESA-N Cannabidiolic acid Natural products OC1=C(C(O)=O)C(CCCCC)=CC(O)=C1[C@@H]1[C@@H](C(C)=C)CCC(C)=C1 WVOLTBSCXRRQFR-SJORKVTESA-N 0.000 description 4
- 101000729827 Homo sapiens Barrier-to-autointegration factor-like protein Proteins 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 4
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 4
- WVOLTBSCXRRQFR-DLBZAZTESA-M cannabidiolate Chemical compound OC1=C(C([O-])=O)C(CCCCC)=CC(O)=C1[C@H]1[C@H](C(C)=C)CCC(C)=C1 WVOLTBSCXRRQFR-DLBZAZTESA-M 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 4
- 238000013007 heat curing Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- MHRLWUPLSHYLOK-UHFFFAOYSA-N thiomorpholine-3,5-dicarboxylic acid Chemical compound OC(=O)C1CSCC(C(O)=O)N1 MHRLWUPLSHYLOK-UHFFFAOYSA-N 0.000 description 4
- LCSAOPVSVLGDLE-UHFFFAOYSA-N 2-[[4-[9-[4-(oxiran-2-ylmethoxy)phenyl]fluoren-9-yl]phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1C1(C2=CC=CC=C2C2=CC=CC=C21)C(C=C1)=CC=C1OCC1CO1 LCSAOPVSVLGDLE-UHFFFAOYSA-N 0.000 description 3
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 239000012776 electronic material Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000007363 ring formation reaction Methods 0.000 description 3
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- CGSKOGYKWHUSLC-UHFFFAOYSA-N 1-(4-aminophenyl)-1,3,3-trimethyl-2h-inden-5-amine Chemical compound C12=CC=C(N)C=C2C(C)(C)CC1(C)C1=CC=C(N)C=C1 CGSKOGYKWHUSLC-UHFFFAOYSA-N 0.000 description 2
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 description 2
- DOVZUKKPYKRVIK-UHFFFAOYSA-N 1-methoxypropan-2-yl propanoate Chemical compound CCC(=O)OC(C)COC DOVZUKKPYKRVIK-UHFFFAOYSA-N 0.000 description 2
- FVFYRXJKYAVFSB-UHFFFAOYSA-N 2,3,5,6-tetrafluorobenzene-1,4-diamine Chemical compound NC1=C(F)C(F)=C(N)C(F)=C1F FVFYRXJKYAVFSB-UHFFFAOYSA-N 0.000 description 2
- HMOZDINWBHMBSQ-UHFFFAOYSA-N 2-[3-(4,5-dihydro-1,3-oxazol-2-yl)phenyl]-4,5-dihydro-1,3-oxazole Chemical compound O1CCN=C1C1=CC=CC(C=2OCCN=2)=C1 HMOZDINWBHMBSQ-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- BNCADMBVWNPPIZ-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n,6-n-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCN(COC)C1=NC(N(COC)COC)=NC(N(COC)COC)=N1 BNCADMBVWNPPIZ-UHFFFAOYSA-N 0.000 description 2
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 2
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 2
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- AEGPZKKVNZQMHQ-UHFFFAOYSA-N 5,6-dimethyl-5-phenylcyclohexa-1,3-diene-1,2-diamine Chemical group CC1(C(C(=C(C=C1)N)N)C)C1=CC=CC=C1 AEGPZKKVNZQMHQ-UHFFFAOYSA-N 0.000 description 2
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 2
- FMACFWAQBPYRFO-UHFFFAOYSA-N 5-[9-(1,3-dioxo-2-benzofuran-5-yl)fluoren-9-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 FMACFWAQBPYRFO-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000000010 aprotic solvent Substances 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 229940113088 dimethylacetamide Drugs 0.000 description 2
- ASQQEOXYFGEFKQ-UHFFFAOYSA-N dioxirane Chemical compound C1OO1 ASQQEOXYFGEFKQ-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- WDAXFOBOLVPGLV-UHFFFAOYSA-N ethyl isobutyrate Chemical compound CCOC(=O)C(C)C WDAXFOBOLVPGLV-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 2
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 2
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 238000006798 ring closing metathesis reaction Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 2
- SWLMAOZSUXXKNR-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ylbenzene Chemical compound FC(F)(F)C(C(F)(F)F)C1=CC=CC=C1 SWLMAOZSUXXKNR-UHFFFAOYSA-N 0.000 description 1
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- CPLBLNGVYBSVPU-UHFFFAOYSA-N 1,3,3-trimethyl-1,2-dihydroindene Chemical compound C1=CC=C2C(C)CC(C)(C)C2=C1 CPLBLNGVYBSVPU-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- DGVSYJXJJQOOTG-UHFFFAOYSA-N 1-(3,4-dicarboxyphenyl)-1,3,3-trimethyl-2h-indene-5,6-dicarboxylic acid Chemical compound C12=CC(C(O)=O)=C(C(O)=O)C=C2C(C)(C)CC1(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 DGVSYJXJJQOOTG-UHFFFAOYSA-N 0.000 description 1
- OJGWYOJJYMAKRJ-UHFFFAOYSA-N 1-(3,4-dicarboxyphenyl)-3-methyl-2,3-dihydro-1h-indene-5,6-dicarboxylic acid Chemical compound C12=CC(C(O)=O)=C(C(O)=O)C=C2C(C)CC1C1=CC=C(C(O)=O)C(C(O)=O)=C1 OJGWYOJJYMAKRJ-UHFFFAOYSA-N 0.000 description 1
- ULHFFAFDSSHFDA-UHFFFAOYSA-N 1-amino-2-ethoxybenzene Chemical compound CCOC1=CC=CC=C1N ULHFFAFDSSHFDA-UHFFFAOYSA-N 0.000 description 1
- MLCFMTKUMPZHJF-UHFFFAOYSA-N 2,3,6,7-tetrachloro-4h-naphthalene-1,3,5,8-tetracarboxylic acid Chemical compound ClC1=C(Cl)C(C(O)=O)=C2C(C(=O)O)=C(Cl)C(Cl)(C(O)=O)CC2=C1C(O)=O MLCFMTKUMPZHJF-UHFFFAOYSA-N 0.000 description 1
- SDWGBHZZXPDKDZ-UHFFFAOYSA-N 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic acid Chemical compound C1=C(Cl)C(C(O)=O)=C2C(C(=O)O)=CC(Cl)=C(C(O)=O)C2=C1C(O)=O SDWGBHZZXPDKDZ-UHFFFAOYSA-N 0.000 description 1
- JZWGLBCZWLGCDT-UHFFFAOYSA-N 2,7-dichloronaphthalene-1,4,5,8-tetracarboxylic acid Chemical compound ClC1=CC(C(O)=O)=C2C(C(=O)O)=CC(Cl)=C(C(O)=O)C2=C1C(O)=O JZWGLBCZWLGCDT-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- IIQLVLWFQUUZII-UHFFFAOYSA-N 2-amino-5-(4-amino-3-carboxyphenyl)benzoic acid Chemical compound C1=C(C(O)=O)C(N)=CC=C1C1=CC=C(N)C(C(O)=O)=C1 IIQLVLWFQUUZII-UHFFFAOYSA-N 0.000 description 1
- FFXSDAGPJYALFE-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenoxy)phenol Chemical compound C1=C(O)C(N)=CC=C1OC1=CC=C(N)C(O)=C1 FFXSDAGPJYALFE-UHFFFAOYSA-N 0.000 description 1
- KHAFBBNQUOEYHB-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(O)C(N)=CC=C1S(=O)(=O)C1=CC=C(N)C(O)=C1 KHAFBBNQUOEYHB-UHFFFAOYSA-N 0.000 description 1
- RCYNJDVUURMJOZ-UHFFFAOYSA-N 2-amino-5-[(4-amino-3-hydroxyphenyl)methyl]phenol Chemical compound C1=C(O)C(N)=CC=C1CC1=CC=C(N)C(O)=C1 RCYNJDVUURMJOZ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- IVVWBIJMWBNKFV-UHFFFAOYSA-N 3,3'-Dichloro-4,4'-diaminodiphenyl ether Chemical compound C1=C(Cl)C(N)=CC=C1OC1=CC=C(N)C(Cl)=C1 IVVWBIJMWBNKFV-UHFFFAOYSA-N 0.000 description 1
- HUWXDEQWWKGHRV-UHFFFAOYSA-N 3,3'-Dichlorobenzidine Chemical compound C1=C(Cl)C(N)=CC=C1C1=CC=C(N)C(Cl)=C1 HUWXDEQWWKGHRV-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- CDVZKYLSVNAIHH-UHFFFAOYSA-N 3,6-bis(trifluoromethyl)benzene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(F)(F)F)=C(C(O)=O)C(C(O)=O)=C1C(F)(F)F CDVZKYLSVNAIHH-UHFFFAOYSA-N 0.000 description 1
- SMDGQEQWSSYZKX-UHFFFAOYSA-N 3-(2,3-dicarboxyphenoxy)phthalic acid Chemical compound OC(=O)C1=CC=CC(OC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O SMDGQEQWSSYZKX-UHFFFAOYSA-N 0.000 description 1
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 description 1
- PEQMXHDQUPCPQJ-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)-1,1,3-trimethyl-2h-indene-4,5-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=C(C(O)=O)C2=C1C(C)(C)CC2(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 PEQMXHDQUPCPQJ-UHFFFAOYSA-N 0.000 description 1
- QPWBTLYTNOIFFC-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)-1-methyl-2,3-dihydro-1h-indene-4,5-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=C(C(O)=O)C2=C1C(C)CC2C1=CC=C(C(O)=O)C(C(O)=O)=C1 QPWBTLYTNOIFFC-UHFFFAOYSA-N 0.000 description 1
- GDGWSSXWLLHGGV-UHFFFAOYSA-N 3-(4-aminophenyl)-1,1,3-trimethyl-2h-inden-5-amine Chemical compound C12=CC(N)=CC=C2C(C)(C)CC1(C)C1=CC=C(N)C=C1 GDGWSSXWLLHGGV-UHFFFAOYSA-N 0.000 description 1
- VIUDTWATMPPKEL-UHFFFAOYSA-N 3-(trifluoromethyl)aniline Chemical compound NC1=CC=CC(C(F)(F)F)=C1 VIUDTWATMPPKEL-UHFFFAOYSA-N 0.000 description 1
- NJCOLSAFYMXOGO-UHFFFAOYSA-N 3-(trifluoromethyl)benzene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C(C(F)(F)F)=C1C(O)=O NJCOLSAFYMXOGO-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- ZWQOXRDNGHWDBS-UHFFFAOYSA-N 4-(2-phenylphenoxy)aniline Chemical group C1=CC(N)=CC=C1OC1=CC=CC=C1C1=CC=CC=C1 ZWQOXRDNGHWDBS-UHFFFAOYSA-N 0.000 description 1
- OMHDKWZCHRDYQA-UHFFFAOYSA-N 4-(4-amino-3-chlorophenyl)sulfanyl-2-chloroaniline Chemical compound C1=C(Cl)C(N)=CC=C1SC1=CC=C(N)C(Cl)=C1 OMHDKWZCHRDYQA-UHFFFAOYSA-N 0.000 description 1
- JIYCXGLGOPBQSU-UHFFFAOYSA-N 4-(4-amino-3-chlorophenyl)sulfonyl-2-chloroaniline Chemical compound C1=C(Cl)C(N)=CC=C1S(=O)(=O)C1=CC=C(N)C(Cl)=C1 JIYCXGLGOPBQSU-UHFFFAOYSA-N 0.000 description 1
- HGPTYGHIMKRTRN-UHFFFAOYSA-N 4-(4-amino-3-methoxyphenoxy)-2-methoxyaniline Chemical compound C1=C(N)C(OC)=CC(OC=2C=C(OC)C(N)=CC=2)=C1 HGPTYGHIMKRTRN-UHFFFAOYSA-N 0.000 description 1
- XNGFPOPFNVFCFM-UHFFFAOYSA-N 4-(4-amino-3-methoxyphenyl)sulfanyl-2-methoxyaniline Chemical compound C1=C(N)C(OC)=CC(SC=2C=C(OC)C(N)=CC=2)=C1 XNGFPOPFNVFCFM-UHFFFAOYSA-N 0.000 description 1
- YQDPRQNMTIDSJA-UHFFFAOYSA-N 4-(4-amino-3-methylphenyl)sulfanyl-2-methylaniline Chemical compound C1=C(N)C(C)=CC(SC=2C=C(C)C(N)=CC=2)=C1 YQDPRQNMTIDSJA-UHFFFAOYSA-N 0.000 description 1
- JYBYGQRODBVTDZ-UHFFFAOYSA-N 4-(4-amino-3-methylphenyl)sulfonyl-2-methylaniline Chemical compound C1=C(N)C(C)=CC(S(=O)(=O)C=2C=C(C)C(N)=CC=2)=C1 JYBYGQRODBVTDZ-UHFFFAOYSA-N 0.000 description 1
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 1
- LKHVCEWNPKEPBT-UHFFFAOYSA-N 4-[(4-amino-3-methoxyphenyl)methyl]-2-methoxyaniline Chemical compound C1=C(N)C(OC)=CC(CC=2C=C(OC)C(N)=CC=2)=C1 LKHVCEWNPKEPBT-UHFFFAOYSA-N 0.000 description 1
- URUOZJKXQGKJQQ-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)-3-tert-butylphenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C(C(C)(C)C)=CC=1OC1=CC=C(N)C=C1 URUOZJKXQGKJQQ-UHFFFAOYSA-N 0.000 description 1
- VKDNRNGLVAFJTR-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline 3-(trifluoromethyl)-4-[2-(trifluoromethyl)phenyl]cyclohexa-1,5-diene-1,4-diamine Chemical compound FC(C1=C(C=CC(=C1)N)C1=C(C=C(N)C=C1)C(F)(F)F)(F)F.FC(C1C(C=CC(=C1)N)(C1=C(C=CC=C1)C(F)(F)F)N)(F)F VKDNRNGLVAFJTR-UHFFFAOYSA-N 0.000 description 1
- MYFJHUCULJNTOF-UHFFFAOYSA-N 4-chloro-6-methylbenzene-1,3-diamine Chemical compound CC1=CC(Cl)=C(N)C=C1N MYFJHUCULJNTOF-UHFFFAOYSA-N 0.000 description 1
- WXAIEIRYBSKHDP-UHFFFAOYSA-N 4-phenyl-n-(4-phenylphenyl)-n-[4-[4-(4-phenyl-n-(4-phenylphenyl)anilino)phenyl]phenyl]aniline Chemical compound C1=CC=CC=C1C1=CC=C(N(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC=CC=2)C=C1 WXAIEIRYBSKHDP-UHFFFAOYSA-N 0.000 description 1
- 229940044174 4-phenylenediamine Drugs 0.000 description 1
- KZSXRDLXTFEHJM-UHFFFAOYSA-N 5-(trifluoromethyl)benzene-1,3-diamine Chemical compound NC1=CC(N)=CC(C(F)(F)F)=C1 KZSXRDLXTFEHJM-UHFFFAOYSA-N 0.000 description 1
- VFALDCWSTKEUED-UHFFFAOYSA-N 5-chloro-4-methylbenzene-1,3-diamine Chemical compound CC1=C(N)C=C(N)C=C1Cl VFALDCWSTKEUED-UHFFFAOYSA-N 0.000 description 1
- UMVPZZVDSLEPDE-UHFFFAOYSA-N 9-(4-aminophenyl)-9-phenylfluoren-3-amine Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC=CC=2)C2=CC=C(N)C=C2C2=CC=CC=C21 UMVPZZVDSLEPDE-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 1
- SYRVLZWXDUKBHF-UHFFFAOYSA-N C1C2=C(C3=CC=CC=C31)C(=CC=C2)SC4=CC=CC5=C4C6=CC=CC=C6C5 Chemical compound C1C2=C(C3=CC=CC=C31)C(=CC=C2)SC4=CC=CC5=C4C6=CC=CC=C6C5 SYRVLZWXDUKBHF-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- RYOUYLIEVAJYAY-UHFFFAOYSA-N N1=C(N)N=C(N)N=C1N.C(CCC)C=O.C(CCC)C=O.CC=O.CC=O.CC=O.CC=O Chemical compound N1=C(N)N=C(N)N=C1N.C(CCC)C=O.C(CCC)C=O.CC=O.CC=O.CC=O.CC=O RYOUYLIEVAJYAY-UHFFFAOYSA-N 0.000 description 1
- DCAJEMMNOFXSKX-UHFFFAOYSA-N N1=C(N)N=C(N)N=C1N.CC=O.CC=O.CC=O.CC=O.CC=O.CC=O Chemical compound N1=C(N)N=C(N)N=C1N.CC=O.CC=O.CC=O.CC=O.CC=O.CC=O DCAJEMMNOFXSKX-UHFFFAOYSA-N 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- DBUQEARUZIATSV-UHFFFAOYSA-N N=C=O.N=C=O.CC1CCCCC1(C)C Chemical compound N=C=O.N=C=O.CC1CCCCC1(C)C DBUQEARUZIATSV-UHFFFAOYSA-N 0.000 description 1
- WGUAFSBAOMDTTA-UHFFFAOYSA-N NC1=CC=C(C=C1)C(C(CC)(CC)C1=CC=C(C=C1)N)CCCCCCCC Chemical compound NC1=CC=C(C=C1)C(C(CC)(CC)C1=CC=C(C=C1)N)CCCCCCCC WGUAFSBAOMDTTA-UHFFFAOYSA-N 0.000 description 1
- QJZKVGLXCHNXSU-UHFFFAOYSA-N NC1=CC=C(C=C1)C(CCCC(CCCC)(C1=CC=CC=C1)C1=CC=CC=C1)C1=CC=C(C=C1)N Chemical compound NC1=CC=C(C=C1)C(CCCC(CCCC)(C1=CC=CC=C1)C1=CC=CC=C1)C1=CC=C(C=C1)N QJZKVGLXCHNXSU-UHFFFAOYSA-N 0.000 description 1
- 108010039918 Polylysine Proteins 0.000 description 1
- 229920000037 Polyproline Polymers 0.000 description 1
- 201000001880 Sexual dysfunction Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 description 1
- SQNMYOLYEWHUCQ-UHFFFAOYSA-N acetic acid;methoxymethane;propane-1,2-diol Chemical compound COC.CC(O)=O.CC(O)CO SQNMYOLYEWHUCQ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- GCAIEATUVJFSMC-UHFFFAOYSA-N benzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1C(O)=O GCAIEATUVJFSMC-UHFFFAOYSA-N 0.000 description 1
- AGSPXMVUFBBBMO-UHFFFAOYSA-N beta-aminopropionitrile Chemical compound NCCC#N AGSPXMVUFBBBMO-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- BEWYHVAWEKZDPP-UHFFFAOYSA-N bornane Chemical compound C1CC2(C)CCC1C2(C)C BEWYHVAWEKZDPP-UHFFFAOYSA-N 0.000 description 1
- 229930006742 bornane Natural products 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- JLHMVTORNNQCRM-UHFFFAOYSA-N ethylphosphine Chemical compound CCP JLHMVTORNNQCRM-UHFFFAOYSA-N 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- HAMGRBXTJNITHG-UHFFFAOYSA-N methyl isocyanate Chemical compound CN=C=O HAMGRBXTJNITHG-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- KADGVXXDDWDKBX-UHFFFAOYSA-N naphthalene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C21 KADGVXXDDWDKBX-UHFFFAOYSA-N 0.000 description 1
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- XPEFOHCUPVNIAG-UHFFFAOYSA-N perylene-2,3,9,10-tetracarboxylic acid Chemical compound C1=CC2=C(C(O)=O)C(C(=O)O)=CC(C=3C4=C5C=CC(=C4C(C(O)=O)=CC=3)C(O)=O)=C2C5=C1 XPEFOHCUPVNIAG-UHFFFAOYSA-N 0.000 description 1
- JGGWKXMPICYBKC-UHFFFAOYSA-N phenanthrene-1,8,9,10-tetracarboxylic acid Chemical compound C1=CC=C(C(O)=O)C2=C(C(O)=O)C(C(O)=O)=C3C(C(=O)O)=CC=CC3=C21 JGGWKXMPICYBKC-UHFFFAOYSA-N 0.000 description 1
- 239000003880 polar aprotic solvent Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000656 polylysine Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 108010026466 polyproline Proteins 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- LNIPBWTWXMQUAL-UHFFFAOYSA-N propanal 1,3,5-triazine-2,4,6-triamine Chemical compound N1=C(N)N=C(N)N=C1N.C(C)C=O.C(C)C=O.C(C)C=O.C(C)C=O.C(C)C=O.C(C)C=O LNIPBWTWXMQUAL-UHFFFAOYSA-N 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- JRDBISOHUUQXHE-UHFFFAOYSA-N pyridine-2,3,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)N=C1C(O)=O JRDBISOHUUQXHE-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
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Description
本發明係關於一種兩端各具有2個-COOH封端基的聚醯亞胺及由該聚醯亞胺所形成的塗料組合物,及利用該塗料組合物之軟性元件。
聚醯亞胺(PI)係指具有下式官能基之化合物:
由於聚醯亞胺具有優異的熱安定性,且由其形成之膜通常具有良好的機械、電氣及化學性質,故聚醯亞胺一直是高性能高分子材料的首選。
在半導體工業上,聚醯亞胺被廣泛應用於鈍化膜、應力緩衝膜、α粒子遮蔽膜、乾式蝕刻防護罩、微機電和層間絕緣膜等。也可應用於各種電子構裝、漆包線、印刷電路板、感測元件、分離膜方面。另外,聚醯亞胺亦可用於主(被)動元件、光學材料、觸控面板、銅箔基板、軟性可撓性電子材料或積體電路元件之熱固型低溫硬化保護材料。
聚醯亞胺常見的材料可分為:未環化的聚醯亞胺前驅物,即聚
醯胺酸型(PAA)聚醯亞胺與已環化的可溶性聚醯亞胺(SPI)。目前製備聚醯胺酸型聚醯亞胺之反應流程可簡述如下:
於上述製備方法中,將二胺單體溶於非質子性極性溶劑中,再加入等莫耳二酸酐單體。其後進行縮合反應,形成聚醯亞胺前驅物,即聚醯胺酸。接著,以加熱方式進行聚醯胺酸的醯亞胺化(imidization),於縮合脫水環化反應之後,聚醯胺酸便可轉化為聚醯亞胺。上述製備方法的缺點為,必須於大約350℃之高溫下進行長時間(通常為數小時)之加熱才能得到100%醯亞胺化。如第一階段所得之聚醯胺酸分子量未達一定標準(即,分子量過小),於醯亞胺化後,無法得到具良好物性之聚醯亞胺膜。然,若第一階段所得聚醯胺酸之分子量過高,則其黏度便會太大,以致於操作性變差,易於塗佈時有流平性不良等缺點。舉例言之,於進行旋轉塗佈時,容易產生中凸與厚邊等不易流平現象。此外,過高之聚醯胺酸分子量,將於進行第二階段之醯亞胺化時,因分子間之交互作用以及分子鏈鍵長的縮短,產生極大內應力,致使所塗佈之基材彎曲變形。
已先環化的可溶性聚醯亞胺因已醯亞胺化,具有較低的熱固化溫度(<270℃)及優異的熱安定性,為了提升其物性,其通常於封端處
會具有活性基團,可進行熱固性聚合反應。可溶性聚醯亞胺之一個實例如下:
惟,上述可溶性聚醯亞胺於熱固化時會形成剛硬結構而變脆且交聯後交聯密度較低,耐化性不佳。
可溶性聚醯亞胺之另一個實例如下:
雖然上述可溶性聚醯亞胺於加熱反應性佳,惟,因本身結構問題(具有三鍵及N=C=O基)熱固化時亦會形成剛硬結構而變脆且容易黃變,產生信賴性問題。
由於材料特性與操作性之間往往存在著衝突,從事聚醯亞胺研究之人士始終無法兼顧。目前業界仍需要一種具有改良物性(特別是耐化性與優異的熱性質,如具較低的熱膨脹係數)之聚醯亞胺。
為解決上述問題,本發明主要目的在於提供一種兩端各具有2個-COOH封端基的可溶性聚醯亞胺。
本發明之又一目的為提供一種塗料組合物,其包含上述聚醯亞胺與具有2至6個可與-COOH反應的官能基之硬化劑。由本發明之塗料組合物所形成之聚醯亞胺塗層或聚醯亞胺膜具有優異的耐化性與熱性質,且不易黃變,透明性佳,可作為元件的保護材料或取代玻璃的薄
膜基材。
本發明之聚醯亞胺係具下式(I)之結構:
其中:A、C及E可為相同或不同,各自獨立為四價有機基團,且若n大於1,各C可為相同或不同之四價有機基團;各B可為相同或不同,各自獨立為二價有機基團;及n為大於0之整數。
A、C及E較佳係各別選自由下列基團所構成群組之四價有機基團:
其中:X各自獨立為氫、鹵素、直鏈或支鏈C1
-C4
全氟烷基或直鏈或支鏈C1
-C4
烷基;及A1
及B1
各自獨立為共價鍵、直鏈或支鏈C1
-C4
伸烷基、直鏈或支鏈C1
-C4
全氟伸烷基、伸烷氧基、-SiH2
-、氧、硫、羰基、、磺醯基、伸苯基、伸聯苯基、伸茀基或,其中,J為-O-、-SO2
-、-CH2
-、C(CF3
)2
及C(CH3
)2
,當A1
及B1
各自獨立為伸甲基或-SiH2
-時,可經-OH單取代或經選自-OH、-CF3
及-Me之基團二取代。
更佳地,A、C及E係各別選自由下列基團所構成群組之四價有機基團:
其中,Z為氫或鹵素。
尤其更佳地,A、C及E係各別選自由下列基團所構成群組之四價有機基團:
B較佳係各別選自由下列基團所構成群組之二價有機基團:
其中:R17
各自獨立為H、C1
-C4
烷基、C1
-C4
全氟烷基、甲氧基、乙氧基、鹵素、OH、COOH、NH2
或SH;a各自獨立為0-4之整數;b各自獨立為0-4之整數;及R18
為共價鍵或選自下列之基團:-O-、-S-、-CH2
-、-S(O)2
-、伸茀基、、
其中,c和d各自獨立為0-20之整數;R17
與a如上述所定義;R19
為-S(O)2
-、-C(O)-、共價鍵或直鏈或支鏈C1
-C18
烷基;R20
各自獨立為H、甲基、乙基或苯基;R21
各自獨立為C1
-C20
之烷基或環狀烷基;m各自獨立為1-20之整數;及e及f各自獨立為大於0之整數。
更佳地,B係各別選自由下列基團所構成群組之二價有機基團:
其中:a各自獨立為0-4之整數;及Z各自獨立為氫、甲基、三氟甲基或鹵素。
若要讓聚醯亞胺具有較佳的溶解度,且固化後不容易產生黃變,根據本發明之一具體實施例,B係各別選自由下列基團所構成群組之二價有機基團:
於上述式(I)中,n係1至100之整數,較佳為10至50之整數。
本發明之聚醯亞胺可藉本發明所屬技術領域中具有通常知識者所習知的製備方法獲得,例如可藉由包含下列步驟之方法製得:
(a)於溶劑中使一具下式(1)之過量二酸酐單體與具式(2)之二胺單體進行反應,形成具下式(3-1)之化合物。或使具式(2)之過量二胺單體與具下式(1)之二酸酐單體進行反應形成具下式(3-2)之化合物:
(b)接著將式(3-1)之化合物以加熱脫水閉環或以化學環化法閉環,形成具下式(4)之化合物:
(c)或於上式(3-2)之化合物中添加其他具下式(5)或(6)之二酸酐單體,以加熱脫水閉環或以化學環化法閉環形成具下式(7)之化合物:
(d)接著使式(4)或式(7)之化合物進行開環,形成具下式(8)或(9)之化合物:
上述步驟中二酸酐單體與二胺單體之總莫耳數比為1:0.99~1:0.66。其中,A、B、C、E及n係如前所定義者。
於上述製備方法中,所使用之二酸酐,一般可為脂肪族或芳香族者,若需耐化性較佳者,較佳為芳香族二酸酐,其實例包括(但不限於)均苯四甲酸二酐(pyromellitic dianhydride,PMDA)、3,3',4,4'-聯苯四羧酸二酐(3,3',4,4'-Biphenyltetracarboxylic dianhydride,S-BPDA)、4,4'-二酞酸二酐、4,4'-六氟亞異丙基-2,2-雙(酞酸酐)(4,4'-
hexafluoroisopropylidene-2,2-bis-(phthalic acid anhydride),6FDA)、1-(三氟甲基)-2,3,5,6-苯四羧酸二酐(P3FDA)、二苯甲酮-四羧酸二酐(BTDA)、3,3',4,4'-二苯醚四羧酸二酐(ODPA)、1,4-雙(三氟甲基)-2,3,5,6-苯四羧酸二酐(P6FDA)、1-(3',4'-二羧基苯基)-1,3,3-三甲基茚滿-5,6-二羧酸二酐、1-(3',4'-二羧基苯基)-1,3,3-三甲基茚滿-6,7-二羧酸二酐、1-(3',4'-二羧基苯基)-3-甲基茚滿-5,6-二羧酸二酐、1-(3',4'-二羧基苯基)-3-甲基茚滿-6,7-二羧酸二酐、2,3,9,10-二萘嵌苯四羧酸二酐、1,4,5,8-萘四羧酸二酐、2,6-二氯萘-1,4,5,8-四羧酸二酐、2,7-二氯萘-1,4,5,8-四羧酸二酐、2,3,6,7-四氯萘-2,4,5,8-四羧酸二酐、菲-1,8,9,10-四羧酸二酐、3,3',4,4'-二苯甲酮四羧酸二酐、1,2',3,3'-二苯甲酮四羧酸二酐、3,3',4,4'-二苯甲酮四羧酸二酐、2,2',3,3'-聯苯四羧酸二酐、4,4'-亞異丙基二酞酸二酐、3,3'-亞異丙基二酞酸二酐、4,4'-氧基二酞酸二酐、4,4'-磺醯基二酞酸二酐、3,3'-氧基二酞酸二酐、4,4'-亞甲基二酞酸二酐、4,4'-硫基二酞酸二酐、4,4'-亞乙基二酞酸二酐、2,3,6,7-萘四羧酸二酐、1,2,4,5-萘四羧酸二酐、1,2,5,6-萘四羧酸二酐、苯-1,2,3,4-四羧酸二酐、吡啶-2,3,5,6-四羧酸二酐、1,2,3,4-環丁烷四羧酸二酐(1,2,3,4-cyclobutanetetracarboxylic dianhydride,CBDA)、5,5'-(9H-茀-9,9-二基)二異苯并呋喃-1,3-二酮(5,5'-(9H-fluorene-9,9-diyl)diisobenzofuran-1,3-dione,BPAF)或其組合。
較佳地,係採用選自以下群組之芳香族二酸酐:均苯四酸二酐(PMDA)、3,3',4,4'-聯苯四羧酸二酐(S-BPDA)、4,4'-二酞酸二酐、4,4'-六氟亞異丙基二酞酸二酐(6FDA)、1-(三氟甲基)-2,3,5,6-苯四羧酸二酐(P3FDA)、1,4-雙(三氟甲基)-2,3,5,6-苯四羧酸二酐(P6FDA)、二苯甲酮-四羧酸二酐(BTDA)、3,3',4,4'-二苯醚四羧酸二酐(ODPA)、1,2,3,4-環丁烷四羧酸二酐(CBDA)、5,5'-(9H-茀-9,9-二基)二異苯并呋喃-1,3-二酮(BPAF)及其混合物。
上述製備方法中,所使用之二胺,並無特殊限制,通常使用芳香族二胺。可用於本發明方法之芳香族二胺,係熟悉此技術領域者所熟知。舉例言之(但不以此為限)可選自以下群組:4,4'-氧化二苯胺(ODA)、對苯二胺(p
PDA)、間二甲基對二胺基聯苯(DMDB)、2,2’-雙(三氟甲基)對聯苯(2,2'-bis(trifluoromethyl)benzidine,TFMB)、鄰二甲基對二胺基聯苯(o
TLD)、4,4'-八氟聯苯胺(OFB)、四氟-對-苯二胺(TFPD)、2,2'-5,5'-四氯聯苯胺(TCB)、3,3'-二氯聯苯胺(DCB)、2,2'-雙(3-胺基苯基)六氟丙烷、2,2'-雙(4-胺基苯基)六氟丙烷、4,4'-氧基-雙[3-(三氟甲基)苯胺、3,5-二胺基三氟甲苯(3,5-diaminobenzotrifluoride)、四氟-1,4-伸苯二胺(tetrafluoro-1,4-phenylene diamine)、四氟-間-伸苯二胺、1,4-雙(4-胺基苯氧基)-2-第三丁基苯(BATB)、2,2'-二甲基-4,4'-雙(4-胺基苯氧基)聯苯(DBAPB)、4,4'-二胺基二環己基甲烷(MDCA)、2,2-雙[4-(4-胺基苯氧基)苯基]六氟丙烷(BAPPH)、2,2'-雙[4-(4-胺基苯氧基)苯基]原冰片烷(BAPN)、5-胺基-1-(4'-胺基苯基)-1,3,3-三甲基茚滿、6-胺基-1-(4'-胺基苯基)-1,3,3-三甲基茚滿、4,4'-亞甲基雙(鄰-氯苯胺)、3,3'-二氯二苯胺、3,3'-磺醯基二苯胺、4,4'-二胺基二苯甲酮、1,5-二胺基萘、雙(4-胺基苯基)二乙基矽烷、雙(4-胺基苯基)二苯基矽烷、雙(4-胺基苯基)乙基膦氧化物、N-(雙(4-胺基苯基))-N-甲基胺、N-(雙(4-胺基苯基))-N-苯基胺、4,4'-亞甲基雙(2-甲基苯胺)、4,4'-亞甲基雙(2-甲氧基苯胺)、5,5'-亞甲基雙(2-胺基苯酚)、4,4'-亞甲基雙(2-甲基苯胺)、4,4'-氧基雙(2-甲氧基苯胺)、4,4'-氧基雙(2-氯苯胺)、2,2'-雙(4-胺基苯酚)、5,5'-氧基雙(2-胺基苯酚)、4,4'-硫基雙(2-甲基苯胺)、4,4'-硫基雙(2-甲氧基苯胺)、4,4'-硫基雙(2-氯苯胺)、4,4'-磺醯基雙(2-甲基苯胺)、4,4'-磺醯基雙(2-乙氧基苯胺)、4,4'-磺醯基雙(2-氯苯胺)、5,5'-磺醯基雙(2-胺基苯酚)、3,3'-二甲基-4,4'-二胺基二苯甲酮、3,3'-二甲氧基-4,4'-二胺基二
苯甲酮、3,3'-二氯-4,4'-二胺基二苯甲酮、4,4'-二胺基聯苯、間-苯二胺、4,4'-亞甲基二苯胺(MDA)、4,4'-硫基二苯胺、4,4'-磺醯基二苯胺、4,4'-亞異丙基二苯胺、3,3'-二甲氧基聯苯胺、3,3'-二羧基聯苯胺、2,4-甲苯基二胺、2,5-甲苯基二胺、2,6-甲苯基二胺、間-二甲苯基二胺、2,4-二胺基-5-氯甲苯、2,4-二胺基-6-氯甲苯、1,4-二胺基環己烷(1,4-diaminocyclohexane,CHDA)、4-(9-(4-氨基苯基)-9H-茀-9-基)苯胺(4-(9-(4-aminophenyl)-9H-fluoren-9-yl)benzenamine,BAFL)、9-(4-氨基苯基)-9-苯基-9H-茀基-3-胺(9-(4-aminophenyl)-9-phenyl-9H-fluoren-3-amine)、1-(4-氨基苯基)-2,3-二氫-1,3,3-三甲基-1氫-茚-5-胺(1-(4-aminophenyl)-2,3-dihydro-1,3,3-trimethyl-1H-inden-5-amine,TMDA)及其組合。
較佳地,係採用4,4'-氧化二苯胺(ODA)、對苯二胺(p
PDA)、間二甲基對二胺基聯苯(DMDB)、2,2’-雙(三氟甲基)對聯苯(TFMB)、鄰二甲基對二胺基聯苯(o
TLD)、4,4'-亞甲基二苯胺(MDA)、4,4'-二胺基二環己基甲烷(MDCA)、1,4-二胺基環己烷(CHDA)、(4-(9-(4-氨基苯基)-9H-茀-9-基)苯胺(BAFL)、9-(4-氨基苯基)-9-苯基-9H-茀基-3-胺、1-(4-氨基苯基)-2,3-二氫-1,3,3-三甲基-1氫-茚-5-胺(TMDA)或其混合物。
較佳地,係採用選自以下群組之二胺:
上述製備方法中所使用之溶劑並無特殊限制,例如但不限制於非質子性溶劑、酯類、醚醇類或醚酯類。舉例言之,該非質子性溶劑可選自由以下所組成之群:烷基吡咯酮,例如:N-甲基吡咯酮(NMP)、N-乙基吡咯酮(NEP);二甲基乙醯胺(DMAC)、二甲基甲醯胺(DMF)、二甲基亞碸(DMSO)、甲苯(toluene)、二甲苯(xylene)及其混合物。適用於本發明之酯類溶劑例如但不限於:乙酸異丁酯(IBAC)、乙酸乙酯(EAC)、乙酸丁酯(BAC)、甲酸乙酯、乙酸甲酯、乙酸乙氧基乙酯、乙酸乙氧基丙酯、異丁酸乙酯、單甲基醚丙二醇乙酸酯、乙
酸戊酯、γ-丁內酯(Gamma-butyrolactone,GBL)或其混合物。適用於本發明的醚醇類溶劑例如但不限於:乙二醇丁醚(BCS)、乙二醇乙醚乙酸酯(CAC)、乙二醇乙醚(ECS)、丙二醇甲醚(PGME)、丙二醇甲醚乙酸酯(PMA)、丙二醇單甲醚丙酸酯(PMP)、丁二醇甲醚(DBE)或其混合物。
習知製備聚醯亞胺所需的環化溫度通常高達350℃以上,然而本發明為可溶性聚醯亞胺,已事先於溶劑中閉環,具有較低的熱固化溫度,因此可於不高於270℃的溫度下即可進行固化反應,故可降低操作成本。本發明聚醯亞胺具有較低的熱固化溫度及優異的抗老化、抗裂解的熱安定性。
本發明亦關於一種塗料組合物,其包含上述式(I)聚醯亞胺與具有2至6個可與-COOH反應的官能基之硬化劑。本發明塗料組合物中之該式(I)聚醯亞胺與該具有2至6個可與-COOH反應的官能基之硬化劑反應後,可產生網狀交聯,故而本發明塗料組合物所形成之塗層與膜具備優異的耐化性與熱性質。
本發明塗料組合物中,以組合物總重量計,該式(I)聚醯亞胺之含量係至少1重量%,較佳係介於2.0重量%至20.0重量%。
上述可與-COOH反應的官能基係選自環氧基、異氰酸酯基(NCO)、唑基(Oxazolyl)、苯并基(benzoxazinyl)、及其混合物所構成群組,其中,各R22
可為相同或不同,各自獨立為-H或C1
-C6
烷基。該硬化劑的官能基的選擇通常取決於所欲得塗料組合物,例如耐化性、低熱膨脹係數、耐黃變、柔韌性佳等性質需求,根據本發明一具體實施例,該可與-COOH反應的
官能基係環氧基、唑基或其中,R22
係如前所
述。
適用於本發明之硬化劑實例可選自以下:2,2'-[9H-茀-9-亞基雙(4,1-亞苯基氧亞甲基)]雙環氧乙烷(2,2'-[9H-fluoren-9-ylidene-bis(4,1-phenyleneoxymethylene)]bis-oxirane)、2,2'-(4,4'-(丙烷-2,2-二基)雙(4,1-亞苯基))雙(氧)雙(亞甲基)雙環氧乙烷(2,2'-(4,4'-(propane-2,2-diyl)bis(4,1-phenylene))bis(oxy)bis(methylene)bis-oxirane)、1,3-二異氰酸苯(1,3-diisocyanatobenzene)、甲苯二異氰酸酯(toluenediisocyanate)、環己烷二異氰酸酯、三甲基環己烷二異氰酸酯、環己烷雙(甲基異氰酸酯)、異佛爾酮二異氰酸酯、二甲苯二異氰酸酯、二苯甲烷二異氰酸酯、(1,3-雙(4,5-二氫唑-2-基)苯)(1,3-bis(4,5-dihydrooxazol-2-yl)benzene)、六(甲基甲醛)三聚氰胺樹脂、六(乙基甲醛)三聚氰胺樹脂、四(甲基甲醛)二胺基三聚氰胺樹脂、四(甲基甲醛)二(丁基甲醛)三聚氰胺樹脂、四(甲基甲醛)二(丙基甲醛)三聚氰胺樹脂、2,4,6-三[双(甲氧基甲基)氨基]-1,3,5-三、N2,N2,N4,N4,N6,N6-六(甲氧基甲基)-1,3,5-三-2,4,6-三胺(N2,N2,N4,N4,N6,N6-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine)或其組合。
根據本發明,該硬化劑之含量以含塗料組合物固形份總重量計為約0.01重量%至約50重量%,較佳為約0.1重量%至約10%。
本發明之塗料組合物可進一步包含溶劑,可用於本發明之溶劑並無特殊限制,可包含極性的非質子性溶劑、酯類、醚醇類或醚酯類或其混合,根據本發明一具體實施例係為醚醇類或醚酯類,此等溶劑之實例係如上述製備方法中所描述之溶劑。該溶劑之含量以組合物總重量計,係介於30重量%至99重量%,較佳係介於70重量%至約95%。
本發明塗料組合物可包含任何習知塗料組合物中所包含之額外
成分,舉例言之(但不以此為限),可包含無機微粒、UV光吸收劑、流平劑、消泡劑、安定劑及硬化劑反應所需的催化劑等。
本發明塗料組合物具有好的儲存安定性與熱穩定性,且本發明塗料組合物中之該式(I)聚醯亞胺與硬化劑反應後,可產生交聯,故而本發明塗料組合物所形成之薄膜具備優異的耐化性和低的熱膨脹係數(coefficient of thermal expansion,CTE),且柔韌性佳,不易脆裂,因此可應用於主(被)動元件、光學材料、觸控面板、銅箔基板、軟性可撓性電子材料或積體電路元件之熱固型低溫硬化保護材料,而且本發明塗料組合物所形成之薄膜具有不易黃變及透明度高的特性,所以也可應用於玻璃薄膜觸控面板(G/F)製程中將玻璃基材取代成聚醯亞胺薄膜基材。
本發明另提供一種軟性元件,其包含係由如上述之塗料組合物所形成之薄膜。上述的軟性元件可為觸控面板、主(被)動元件、光學材料、銅箔基板、軟性可撓性電子材料或積體電路元件。
以下實施例將對本發明做進一步之說明,唯非用以限制本發明之範圍,任何熟悉本發明技術領域者,在不違背本發明之精神下所得以達成之改質及變化,均屬於本發明之範圍。
以下實例中,所使用之縮寫定義如下:6FDA:4,4'-六氟亞異丙基-2,2-雙(酞酸酐)(4,4'-hexafluoroisopropylidene-2,2-bis-(phthalic acid anhydride)
S-BPDA:3,3',4,4'-聯苯四羧酸二酐(3,3',4,4'-Biphenyltetracarboxylic dianhydride)
CBDA:1,2,3,4-環丁烷四羧酸二酐(1,2,3,4-cyclobutanetetracarboxylic dianhydride)
BPAF:5,5'-(9H-茀-9,9-二基)二異苯并呋喃-1,3-二酮(5,5'-(9H-
fluorene-9,9-diyl)diisobenzofuran-1,3-dione)
TFMB:2,2’-雙(三氟甲基)對二胺基聯苯(2,2'-bis(trifluoromethyl)benzidine)
CHDA:1,4-二胺基環己烷(1,4-diaminocyclohexane)
BAFL:4-(9-(4-氨基苯基)-9H-茀-9-基)苯胺(4-(9-(4-aminophenyl)-9H-fluoren-9-yl)benzenamine)
TMDA:1-(4-氨基苯基)-2,3-二氫-1,3,3-三甲基-1氫-茚-5-胺(1-(4-aminophenyl)-2,3-dihydro-1,3,3-trimethyl-1H-inden-5-amine)
MA:馬來酸酐(maleic anhydride)
PETA:苯乙炔基偏苯三酸酐(phenylethynyl trimellitic anhydride)
FEP:2,2'-[9H-茀-9-亞基雙(4,1-亞苯基氧亞甲基)]雙環氧乙烷(2,2'-[9H-fluoren-9-ylidenebis(4,1-phenyleneoxymethylene)]bis-oxirane)
BPO:(1,3-雙(4,5-二氫唑-2-基)苯(1,3-bis(4,5-dihydrooxazol-2-yl)benzene)
MM1:N2,N2,N4,N4,N6,N6-六(甲氧基甲基)-1,3,5-三-2,4,6-三胺(N2,N2,N4,N4,N6,N6-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine)
DMAc:二甲基乙醯胺(dimethyl acetamide)
NMP:N-甲基咯烷酮(N-methyl pyrrolidone)
秤取97.7328 g(0.22 mol)之6FDA與64.046 g(0.2 mol)之TFMB,加入640 mL NMP,於室溫下攪拌1小時,再升溫至60℃後攪拌4小時。4小時後,加入320 mL二甲苯,在180℃下,以dean-stark裝置除水。待除水完全後,將溶液降至室溫,再加入0.7208 g(0.04 mol)之H2
O。加完後將溶液升溫至80℃,攪拌4小時。即可得PI-A1
。
秤取43.1442 g(0.22 mol)之CBDA與64.046 g(0.2 mol)之TFMB,加入640 mL NMP,於室溫下攪拌1小時,再升溫至60℃後攪拌4小時。4小時後,加入320 mL二甲苯,在180℃下,以dean-stark裝置除水。待除水完全後,將溶液降至室溫,再加入0.7208 g(0.04 mol)之H2
O。加完後將溶液升溫至80℃,攪拌4小時。即可得PI-A2
。
秤取48.8664g(0.11 mol)之6FDA與64.046g(0.2 mol)之TFMB,加入640 mL NMP,於室溫下攪拌1小時,升溫至60℃後攪拌4小時。再加入32.3642g(0.11 mol)之S-BPDA攪拌4小時後,加入320 mL二甲苯,在180℃下,以dean-stark裝置除水。待除水完全後,將溶液降至室溫,再加入0.7208 g(0.04 mol)之H2
O。加完後將溶液升溫至80℃,攪拌4小時。即可得PI-A3
。
秤取97.7328g(0.22 mol)之6FDA與22.8378g(0.2 mol)之CHDA,加入640 mL NMP,於室溫下攪拌1小時,再升溫至70℃後攪拌4小時。4小時後,加入320 mL二甲苯,在180℃下,以dean-stark裝置除水。待除水完全後,將溶液降至室溫,再加入0.7208 g(0.04 mol)之H2
O。加完後將溶液升溫至80℃,攪拌4小時。即可得PI-A4
。
秤取50.4260g(0.11 mol)之BPAF與64.046g(0.2 mol)之TFMB,加入640 mL NMP,於室溫下攪拌1小時,升溫至60℃後攪拌4小時。再加入32.3642g(0.11 mol)之S-BPDA攪拌4小時後,加入320 mL二甲苯,在180℃下,以dean-stark裝置除水。待除水完全後,將溶液降至室溫,再加入0.7208 g(0.04 mol)之H2
O。加完後將溶液升溫至80℃,攪拌4小時。即可得PI-A5
。
秤取48.8664g(0.11 mol)之6FDA、32.026g(0.1 mol)之TFMB與34.8440g(0.1mol)之BAFL,加入640 mL NMP,於室溫下攪拌1小時,升溫至60℃後攪拌4小時。再加入32.3642g(0.11 mol)之S-BPDA攪拌4小時後,加入320 mL二甲苯,在180℃下,以dean-stark裝置除水。待除水完全後,將溶液降至室溫,再加入0.7208 g(0.04 mol)之H2
O。加完後將溶液升溫至80℃,攪拌4小時。即可得PI-A6
。
秤取97.7328g(0.22 mol)之6FDA、32.026g(0.1 mol)之TFMB與26.6381g(0.1mol)之TMDA,加入640 mL NMP,於室溫下攪拌1小時,升溫至60℃後攪拌4小時。再加入320 mL二甲苯,在180℃下,以dean-stark裝置除水。待除水完全後,將溶液降至室溫,再加入0.7208 g(0.04 mol)之H2
O。加完後將溶液升溫至80℃,攪拌4小時。即可得PI-A7
。
秤取88.848g(0.2 mol)之6FDA與70.4506g(0.22 mol)之TFMB,加入640 mL NMP,於室溫下攪拌1小時,再升溫至60℃後攪拌4小時。4小時後,加入320 mL二甲苯,在180℃下,以dean-stark裝置除水。待除水完全後,將溶液降至室溫,再加入3.9224 g(0.04 mol)之MA。加完後將溶液升溫至80℃,攪拌8小時。即可得PI-M1
。
秤取88.848g(0.2 mol)之6FDA與25.1216 g(0.2 2mol)之CHDA,加入640 mL NMP,於室溫下攪拌1小時,再升溫至70℃後攪拌4小時。4小時後,加入320 mL二甲苯,在180℃下,以dean-stark裝置除水。待除水完全後,將溶液降至室溫,再加入3.9224 g(0.04 mol)之MA。加完後將溶液升溫至80℃,攪拌8小時。即可得PI-M2
。
秤取88.848g(0.2 mol)之6FDA與70.4506g(0.22 mol)之TFMB,加入640 mL NMP,於室溫下攪拌1小時,再升溫至60℃後攪拌4小時。4小時後,加入320 mL二甲苯,在180℃下,以dean-stark裝置除水。待除水完全後,將溶液降至室溫,再加入11.0496 g(0.04 mol)之PETA。加完後將溶液升溫至80℃,攪拌8小時。即可得PI-P1
。
秤取88.848 g(0.2 mol)之6FDA與25.1216 g(0.2 2mol)之CHDA,加入640 mL NMP,於室溫下攪拌1小時,再升溫至50℃後攪拌4小時。4小時後,加入320 mL二甲苯,在180℃下,以dean-stark裝置除水。待除水完全後,將溶液降至室溫,再加入11.0496 g(0.04 mol)之PETA之MA。加完後將溶液升溫至80℃,攪拌8小時。即可得PI-P2
。
取100 g PI-A1與0.4 g FEP混合攪拌均勻後即為配方RP-1
。
取100 g PI-A1與0.6 g BPO混合攪拌均勻後即為配方RP-2
。
取100 g PI-A1與0.2 g MM1混合攪拌均勻後即為配方RP-3
。
取100 g PI-A2與0.4 g FEP混合攪拌均勻後即為配方RP-4
。
取100 g PI-A4與0.4 g FEP混合攪拌均勻後即為配方RP-5
。
取100 g PI-A4與0.6 g BPO混合攪拌均勻後即為配方RP-6
。
取100 g PI-A4與0.2 g MM1混合攪拌均勻後即為配方RP-7
。
取100 g PI-A3與0.4 g FEP混合攪拌均勻後即為配方RP-8
。
取100 g PI-A3與0.6 g BPO混合攪拌均勻後即為配方RP-9
。
取100 g PI-A3與0.2 g MM1混合攪拌均勻後即為配方RP-10
。
取100 g PI-A5與0.4 g FEP混合攪拌均勻後即為配方RP-11
。
取100 g PI-A6與0.4 g FEP混合攪拌均勻後即為配方RP-12
。
取100 g PI-A7與0.4 g FEP混合攪拌均勻後即為配方RP-13
。
上述之實施例R-1至R-13均以丙二醇甲醚(PGME)稀釋至固含量10%。
接著將實施例R-1至R-13與比較例A-8至A-11塗佈在石英玻璃上,先80℃軟烤待無黏性後,在高溫(250℃)下硬烤1小時。膜厚固定在10μm。
上述之實施例與比較例硬烤後於空氣中再一次烘烤,觀察烘烤前後的顏色變化;烘烤條件:在空氣下烘烤280℃,30分鐘。顏色無變化標記為「良好」,有黃變則標記為「失敗」。
將上述硬烤後的薄膜取下,對折180度後檢視是否有斷裂的情
況。無斷裂情況標記為「良好」,有斷裂則標記為「失敗」。
以熱機械分析儀(TMA)量測薄膜於20~200℃的熱膨脹係數(CTE值),CTE值越小表示熱性質愈佳。
上述之實施例與比較例硬烤後浸泡在丙二醇甲醚醋酸酯(PGMEA)中4分鐘,溫度25℃,檢視塗膜表面是否有異常。有白霧或溶解情況標記為「失敗」,無異常則標記為「良好」。
上述之測試結果記錄於表1中。
比較例A-8與A-9存在的問題主要是耐化性差,與CTE值過高。而比較例A-10與A-11雖然耐化性佳,但是存在黃變、信賴性可能會有問題與生成的薄膜有變脆的情況發生。
而實施例R-1~R-3與比較例A-8、A-10比較或是由實施例R-5~R-7與比較例A-9、A-11比較可知,在相同二胺與二酐的條件下,以四酸作為末端基團的配方,相較於以雙鍵或三鍵當作末端基團,具有以下優點:1.高溫下的耐黃變特性較佳,2.具有較好的柔韌性,3.熱膨脹係數較低,及4.較好的耐化性。
Claims (12)
- 一種具以下式(I)結構之聚醯亞胺,
其中:A、C及E可為相同或不同,各自獨立為四價有機基團,且若n大於1,各C可為相同或不同之四價有機基團;各B可為相同或不同,各自獨立為二價有機基團;及n為大於0之整數。 - 如請求項1之聚醯亞胺,其中A、C及E係各別選自由下列基團所構成群組之四價有機基團:
其中:X各自獨立為氫、鹵素、直鏈或支鏈C1 -C4 全氟烷基或直鏈或支鏈C1 -C4 烷基;及A1 及B1 各自獨立為共價鍵、直鏈或支鏈C1 -C4 伸烷基、直鏈或支鏈C1 -C4 全氟伸烷基、烷氧基、-SiH2 -、氧、硫、羰基、、磺醯基、伸苯基、伸聯苯基、伸茀基或,其中,J為-O-、-SO2 -、-CH2 -、C(CF3 )2 及C(CH3 )2 ,當A1 及B1 各自獨立為伸甲基或-SiH2 -時,可經-OH單取代或經選自-OH、-CF3 及-Me之基團二取代。 - 如請求項2之聚醯亞胺,其中A、C及E係各別選自由下列基團所構成群組之四價有機基團:
其中,Z為氫或鹵素。 - 如請求項3之聚醯亞胺,其中A、C及E係各別選自由下列基團所構成群組之四價有機基團:
- 如請求項1之聚醯亞胺,其中B係各別選自由下列基團所構成群組之二價有機基團:
其中:R17 各自獨立為H、C1 -C4 烷基、C1 -C4 全氟烷基、甲氧基、乙氧基、鹵素、OH、COOH、NH2 或SH;a各自獨立為0-4之整數;b各自獨立為0-4之整數;及R18 為共價鍵或選自下列之基團: -O-、-S-、-CH2 -、-S(O)2 -、伸茀基、、、-C(CF3 )2 -、-C(O)-、-C(CH3 )2 -、-C(R21 )2 、 其中,c和d各自獨立為0-20之整數;R17 與a如上述所定義;R19 為-S(O)2 -、-C(O)-、共價鍵或直鏈或支鏈C1 -C18 烷基;R20 各自獨立為H、甲基、乙基或苯基;R21 各自獨立為C1 -C20 之烷基或環狀烷基;m各自獨立為1-20之整數;及e及f各自獨立為大於0之整數。 - 如請求項5之聚醯亞胺,其中B係各別選自由下列基團所構成群組之二價有機基團:
其中:a各自獨立為0-4之整數;及Z各自獨立為氫、甲基、三氟甲基或鹵素。 - 如請求項1之聚醯亞胺,其中B係各別選自由下列基團所構成群組之二價有機基團:
- 如請求項1之聚醯亞胺,其中n係1至100之整數。
- 一種塗料組合物,其包含以組合物總重量計,至少1%之如請求項1所述之聚醯亞胺,以及具有2至6個可與-COOH反應的官能基之硬化劑。
- 如請求項9之塗料組合物,其中該硬化劑具有2至6個可與-COOH反應的官能基,該等官能基係選自下列基團所構成群組之官能基:環氧基、異氰酸酯基(NCO)、唑基(oxazolyl)、苯并基 (benzoxazinyl)、及其混合物,其中,各R22 可為相同或不同,各自獨立為-H或C1 -C6 烷基。
- 如請求項10之塗料組合物,其中該硬化劑具有2至6個可與-COOH反應的官能基,該等官能基係選自下列基團所構成群組之官能基:環氧基、唑基(oxazolyl)、及其混合物,其中,各R22 可為相同或不同,各自獨立為-H或C1 -C6 烷基。
- 一種軟性元件,其包含係由如請求項9所述之塗料組合物所形成之薄膜。
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| CN201310244410.6A CN103319714B (zh) | 2013-02-08 | 2013-06-19 | 聚酰亚胺及由此形成的涂料组合物 |
| JP2013268858A JP5808386B2 (ja) | 2013-02-08 | 2013-12-26 | ポリイミド、それから形成されるコーティング組成物、およびそれらの使用 |
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