TWI474431B - The anomaly detection module for semiconductor device and transport equipment for semiconductor device - Google Patents
The anomaly detection module for semiconductor device and transport equipment for semiconductor device Download PDFInfo
- Publication number
- TWI474431B TWI474431B TW101145285A TW101145285A TWI474431B TW I474431 B TWI474431 B TW I474431B TW 101145285 A TW101145285 A TW 101145285A TW 101145285 A TW101145285 A TW 101145285A TW I474431 B TWI474431 B TW I474431B
- Authority
- TW
- Taiwan
- Prior art keywords
- carrier
- semiconductor
- component
- abnormality detecting
- detecting module
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 151
- 238000001514 detection method Methods 0.000 title description 7
- 230000005856 abnormality Effects 0.000 claims description 47
- 230000032258 transport Effects 0.000 description 18
- 238000012360 testing method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
本發明是有關於一種半導體元件的異常偵測模組以及半導體元件的運送設備,且特別是有關於一種IC測試分類機的半導體元件的異常偵測模組以及半導體元件運送設備。The present invention relates to an abnormality detecting module for a semiconductor device and a semiconductor device transporting device, and more particularly to an abnormality detecting module for a semiconductor component of an IC test sorting machine and a semiconductor component transporting device.
在現今資訊爆炸的時代,積體電路已與日常生活有密不可分的關係,無論在食衣住行育樂方面,都常會用到積體電路元件所組成之產品。隨著電子科技的不斷演進,更人性化、功能性更複雜之電子產品不斷推陳佈新,然而各種產品無不朝向輕、薄、短、小的趨勢設計,以提供更便利舒適的使用。In today's era of information explosion, integrated circuits have been inextricably linked to daily life, and products such as integrated circuit components are often used in food and clothing. With the continuous evolution of electronic technology, more humanized and more complex electronic products are constantly being introduced. However, various products are designed to be light, thin, short and small, in order to provide more convenient and comfortable use.
在積體電路或半導體元件的製造過程中,不管是在哪一個階段的製程,對積體電路或半導體元件進行電性的測試都是必須的。每一個積體電路不管是在晶圓的型態或是構裝的型態,都必須加以測試以確定其是否為良品以及確定其電性特性。隨著積體電路的產量不斷地提高,積體電路的功能亦日趨強大,並且其結構也日趨複雜,是以高速且精確的測試需求就更加地迫切。In the manufacturing process of an integrated circuit or a semiconductor element, electrical testing of an integrated circuit or a semiconductor element is necessary regardless of the stage of the process. Each integrated circuit, whether in the form of a wafer or the type of construction, must be tested to determine if it is a good product and to determine its electrical properties. As the output of integrated circuits continues to increase, the functions of integrated circuits are becoming more and more powerful, and their structures are becoming more and more complex, which is even more urgent with high-speed and accurate testing requirements.
以IC測試分類機為例,其設有一載盤裝置,用以運送待測試的半導體元件至測試區而來進行測試。在測試完之後,載盤裝置會將測試後的半導體元件運送至收料區。 現有的載盤裝置大多為軌道式運送裝置,故裝有IC的載盤在軌道運送過程中,容易因震動或載盤偏移而造成IC跳出或沒有完全置放在載盤內,也就是說,裝有IC的載盤在運送過程中,IC會因載盤的影響而會沒有在固定的位置上被運送。據此,當載盤被運送至收料區而進行堆疊收納時,跳出或沒有完全置放在載盤內的IC將會受損。此外,即便有透過如偵測元件來偵測出IC被運送時跳出於載盤之外,以讓操作員預先排除這些跳出於載盤的IC。然而,裝有IC的載盤在運送過程中,偵測元件會因為裝有IC的載盤變更高度,而無法正確地偵測出IC被運送時跳出於載盤。Taking the IC test sorting machine as an example, it is provided with a loading device for transporting the semiconductor component to be tested to the test area for testing. After the test, the carrier device transports the tested semiconductor components to the receiving area. Most of the existing carrier devices are rail-type transport devices. Therefore, during the rail transportation process, the IC-equipped carrier is likely to cause the IC to jump out or not completely placed in the carrier during the track transportation. When the IC-equipped carrier is in transit, the IC may not be transported at a fixed location due to the influence of the carrier. Accordingly, when the carrier is transported to the receiving area for stack storage, the IC that is jumped out or not completely placed in the carrier will be damaged. In addition, even if it is detected by the detecting component, the IC is skipped out of the carrier when it is transported, so that the operator can pre-empt the ICs that jump out of the carrier. However, during the transport of the IC-equipped carrier, the detection component will change the height of the carrier with the IC, and it will not be able to correctly detect the jump of the IC when it is transported.
本發明提供一種半導體元件的運送設備,以降低當變更載板高度時偵測元件所造成半導體元件對位的誤判。The present invention provides a semiconductor device transport apparatus to reduce the misjudgment of the alignment of the semiconductor elements caused by the detecting elements when the height of the carrier is changed.
本發明提出一種半導體元件的異常偵測模組,適用於一半導體元件的運送設備。半導體元件的運送設備用以運送多個半導體元件且包括一機台與一載板。載板活動地連接於機台的兩機架之間且沿一第一方向移動。載板具有多個容置槽。這些半導體元件適於存放於這些容置槽中。半導體元件的異常偵測模組包括一固定座與一偵測元件。固定座適於垂直移動地配置於兩機架。偵測元件配置於固定座。偵測元件適於偵測這些半導體元件與這些容置槽之間的對位。當載板沿一第二方向移動時,固定座適於隨載板 移動,第二方向垂直於第一方向。The invention provides an abnormality detecting module for a semiconductor component, which is suitable for a semiconductor component transporting device. A semiconductor component transport apparatus is used to transport a plurality of semiconductor components and includes a machine table and a carrier. The carrier is movably connected between the two frames of the machine and moves in a first direction. The carrier has a plurality of receiving slots. These semiconductor components are suitable for storage in these accommodating grooves. The abnormality detecting module of the semiconductor component comprises a fixing base and a detecting component. The mount is adapted to be vertically movable and disposed in two racks. The detecting component is disposed on the fixed seat. The detecting component is adapted to detect the alignment between the semiconductor components and the receiving slots. When the carrier moves in a second direction, the mount is adapted to carry the carrier Moving, the second direction is perpendicular to the first direction.
本發明提出一種半導體元件的運送設備,用以運送多個半導體元件。半導體元件的運送設備包括一機台、一載板以及兩半導體元件的異常偵測模組。機台具有兩機架。載板活動地連接於兩機架之間且沿一第一方向移動。載板具有多個容置槽。這些半導體元件適於存放於這些容置槽中。兩半導體元件的異常偵測模組垂直移動地配置於兩機架。各半導體元件的異常偵測模組包括一固定座及一偵測元件。其中偵測元件配置於固定座,且偵測元件用以偵測這些半導體元件與這些容置槽之間的對位。當載板沿一第二方向移動時,固定座隨載板移動,第二方向垂直於第一方向。The present invention proposes a transport device for a semiconductor element for transporting a plurality of semiconductor elements. The semiconductor component transport device includes a machine table, a carrier board, and an abnormality detecting module of the two semiconductor components. The machine has two racks. The carrier is movably coupled between the two frames and moves in a first direction. The carrier has a plurality of receiving slots. These semiconductor components are suitable for storage in these accommodating grooves. The abnormality detecting modules of the two semiconductor components are vertically movably disposed in the two frames. The abnormality detecting module of each semiconductor component includes a fixing base and a detecting component. The detecting component is disposed on the fixing base, and the detecting component is configured to detect the alignment between the semiconductor component and the receiving slots. When the carrier moves in a second direction, the mount moves with the carrier, and the second direction is perpendicular to the first direction.
在本發明之半導體元件的異常偵測模組的一實施例中,上述之半導體元件的異常偵測模組更包括一滑軌。固定座可移動地連接於滑軌。當載板沿第二方向移動時,固定座藉由滑軌而隨著載板沿第二方向移動。In an embodiment of the abnormality detecting module of the semiconductor device of the present invention, the abnormality detecting module of the semiconductor component further includes a slide rail. The mount is movably coupled to the slide rail. When the carrier moves in the second direction, the fixed seat moves along the carrier in the second direction by the slide rail.
在本發明之半導體元件的異常偵測模組的一實施例中,上述之半導體元件的異常偵測模組更包括一滾輪。滾輪配置於固定座,當該載板沿該第二方向移動並接觸至該滾輪時,該滾輪用以帶動該固定座沿該第二方向移動。In an embodiment of the abnormality detecting module of the semiconductor device of the present invention, the abnormality detecting module of the semiconductor component further includes a roller. The roller is disposed on the fixed seat. When the carrier moves in the second direction and contacts the roller, the roller is configured to drive the fixed seat to move in the second direction.
在本發明之半導體元件的異常偵測模組的一實施例中,上述之偵測元件適於偵測這些半導體元件在載板的正投影與這些容置槽的周圍在載板的正投影彼此重疊。In an embodiment of the abnormality detecting module of the semiconductor device of the present invention, the detecting component is adapted to detect an orthographic projection of the semiconductor component on the carrier and an orthographic projection of the semiconductor substrate around the receiving slots overlapping.
在本發明之半導體元件的異常偵測模組的一實施例 中,上述之偵測元件適於偵測這些半導體元件在載板的正投影與這些容置槽的周圍在載板的正投影不彼此重疊。An embodiment of the abnormality detecting module of the semiconductor device of the present invention The detecting component is adapted to detect that the orthographic projection of the semiconductor component on the carrier and the orthographic projection of the carrier around the receiving slots do not overlap each other.
在本發明之半導體元件的運送設備的一實施例中,上述之各半導體元件的異常偵測模組更包括一滑軌。固定座可移動地連接於滑軌。當載板沿第二方向移動時,固定座藉由滑軌而隨著載板沿第二方向移動。In an embodiment of the semiconductor device transport apparatus of the present invention, the abnormality detecting module of each of the semiconductor elements further includes a slide rail. The mount is movably coupled to the slide rail. When the carrier moves in the second direction, the fixed seat moves along the carrier in the second direction by the slide rail.
在本發明之半導體元件的運送設備的一實施例中,上述之各半導體元件的異常偵測模組更包括一滾輪。滾輪配置於固定座。當載板沿第二方向移動並接觸至滾輪時,滾輪用以帶動固定座沿第二方向移動。In an embodiment of the semiconductor device transport apparatus of the present invention, the abnormality detecting module of each of the semiconductor elements further includes a roller. The roller is arranged on the fixed seat. When the carrier moves in the second direction and contacts the roller, the roller is used to drive the fixed seat to move in the second direction.
在本發明之半導體元件的運送設備的一實施例中,上述之偵測元件用以偵測這些半導體元件在載板的正投影與這些容置槽的周圍在載板的正投影彼此重疊。In an embodiment of the semiconductor device carrying device of the present invention, the detecting component is configured to detect that the orthographic projection of the semiconductor component on the carrier and the orthographic projection of the carrier around the receiving slots overlap each other.
在本發明之半導體元件的運送設備的一實施例中,上述之偵測元件用以偵測這些半導體元件在載板的正投影與這些容置槽的周圍在載板的正投影不彼此重疊。In an embodiment of the semiconductor device carrying device of the present invention, the detecting component is configured to detect that the orthographic projection of the semiconductor component on the carrier and the orthographic projection of the carrier around the receiving slots do not overlap each other.
在本發明之半導體元件的運送設備的一實施例中,上述之機台更具有兩軌道。兩軌道連接於兩機架。載板活動地連接兩軌道,以使載板沿第一方向移動。In an embodiment of the transport apparatus for a semiconductor component of the present invention, the above-described machine further has two tracks. The two rails are connected to two racks. The carrier is movably coupled to the two tracks to move the carrier in a first direction.
基於上述,在本發明的半導體元件的異常偵測模組以及半導體元件的運送設備中,當半導體元件跳出於容置槽外而使半導體元件沒有與對應的容置槽對位時,半導體元件的異常偵測模組的偵測元件便會偵測出此半導體元件並未對位於對應的容置槽。據此,操作員可以藉此預先挑出 半導體元件或將半導體元件擺放至對應的容置槽,以避免後續運送過程中造成半導體元件受損。此外,操作員更可以藉由偵測元件來判斷半導體元件是否擺放至對應的容置槽,以減少人工判斷對位的錯誤。In the above, in the abnormality detecting module of the semiconductor device of the present invention and the carrying device of the semiconductor element, when the semiconductor element jumps out of the accommodating groove and the semiconductor element is not aligned with the corresponding accommodating groove, the semiconductor element The detecting component of the abnormality detecting module detects that the semiconductor component is not located in the corresponding receiving slot. According to this, the operator can pre-select this The semiconductor component or the semiconductor component is placed in a corresponding accommodating groove to avoid damage to the semiconductor component during subsequent transportation. In addition, the operator can further determine whether the semiconductor component is placed in the corresponding accommodating slot by detecting the component to reduce the error of manually determining the alignment.
進一步來說,由於固定座會隨著載板移動,故偵測元件亦會隨著固定座而移動。據此,當載板的高度(此指第二方向)改變時,半導體元件的異常偵測模組的偵測元件會隨著固定座的移動而移動。此舉不僅不需要透過操作員來手動調整偵測元件的高度,而且能降低偵測元件因變更載板高度所造成半導體元件與這些容置槽之間的對位的誤判。Further, since the mount moves with the carrier, the detecting element also moves with the mount. Accordingly, when the height of the carrier (this refers to the second direction) changes, the detecting element of the abnormality detecting module of the semiconductor component moves with the movement of the fixing seat. This not only does not require the operator to manually adjust the height of the detecting component, but also reduces the misjudgment of the alignment between the semiconductor component and the receiving slots caused by the height of the detecting component.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1為本發明一實施例的半導體元件的異常偵測模組用於半導體元件的運送設備的示意圖。圖2為圖1的半導體元件的異常偵測模組用於半導體元件的運送設備的示意圖。為了便於說明,圖1及圖2是以不同的視角來表示。請參考圖1及圖2,本實施例的半導體元件的運送設備100運送,其應用於IC測試分類機且用以運送多個半導體元件50。本實施例的半導體元件例如為積體電路(Integrated Circuit,IC)。半導體元件的運送設備100包括一機台110、一載板120以及兩半導體元件的異常偵測模組130。FIG. 1 is a schematic diagram of an abnormality detecting module for a semiconductor device used in a semiconductor device transport apparatus according to an embodiment of the present invention. 2 is a schematic diagram of an abnormality detecting module of the semiconductor device of FIG. 1 for a semiconductor device. For convenience of explanation, FIGS. 1 and 2 are represented by different viewing angles. Referring to FIGS. 1 and 2, the semiconductor device transport apparatus 100 of the present embodiment is transported, which is applied to an IC test sorter and used to transport a plurality of semiconductor elements 50. The semiconductor element of this embodiment is, for example, an integrated circuit (IC). The semiconductor device transport device 100 includes a machine 110, a carrier 120, and two semiconductor component anomaly detection modules 130.
詳細而言,機台110的兩側具有兩機架112。載板120活動地連接於兩機架112之間且可沿一第一方向D1移動。載板120具有多個容置槽122。這些半導體元件50適於存放於這些容置槽122中。需說明的是,本實施例並不限制容置槽122的形狀與尺寸,只要可以讓半導體元件50存放即可,換言之,容置槽的形狀與尺寸可隨著實際產品的半導體元件而定,本發明不限於此。In detail, the machine table 110 has two racks 112 on both sides. The carrier 120 is movably coupled between the two frames 112 and movable in a first direction D1. The carrier 120 has a plurality of receiving slots 122. These semiconductor elements 50 are adapted to be stored in these accommodating grooves 122. It should be noted that the shape and size of the accommodating groove 122 are not limited in this embodiment, as long as the semiconductor component 50 can be stored. In other words, the shape and size of the accommodating groove may depend on the semiconductor component of the actual product. The invention is not limited thereto.
兩半導體元件的異常偵測模組130垂直移動地配置於兩機架112。各半導體元件的異常偵測模組130包括一固定座132及一偵測元件134。偵測元件134配置於固定座132,且偵測元件134用以偵測這些半導體元件50與這些容置槽122之間的對位。如此一來,當裝有半導體元件50的載板120沿第一方向D1移動時,會有如圖1所示跳出於容置槽122外,而沒有與對應的容置槽122對位的半導體元件60。與此同時,偵測元件134便會偵測出此半導體元件60並未對位於對應的容置槽122。據此,操作員可以藉此預先挑出半導體元件60或將半導體元件60擺放至對應的容置槽122,以避免後續運送過程中造成半導體元件60受損。此外,操作員更可以藉由偵測元件134來判斷半導體元件60是否擺放至對應的容置槽122,以減少人工判斷對位的錯誤。The abnormality detecting module 130 of the two semiconductor elements is vertically disposed to be disposed in the two frames 112. The abnormality detecting module 130 of each semiconductor component includes a fixing base 132 and a detecting component 134. The detecting component 134 is disposed on the fixing base 132, and the detecting component 134 is configured to detect the alignment between the semiconductor component 50 and the receiving slots 122. As a result, when the carrier 120 with the semiconductor component 50 is moved in the first direction D1, there will be a semiconductor component that jumps out of the accommodating groove 122 as shown in FIG. 1 and does not align with the corresponding accommodating groove 122. 60. At the same time, the detecting component 134 detects that the semiconductor component 60 is not located in the corresponding receiving slot 122. Accordingly, the operator can thereby pick out the semiconductor component 60 or place the semiconductor component 60 in the corresponding accommodating groove 122 to avoid damage to the semiconductor component 60 during subsequent transportation. In addition, the operator can determine whether the semiconductor component 60 is placed in the corresponding accommodating slot 122 by the detecting component 134 to reduce the error of manually determining the alignment.
當載板120如圖2所示沿一第二方向D2移動時,固定座132隨載板120移動。需說明的是,本實施例的第一方向D1例如是沿機架112的水平方向,而第二方向D2 例如是沿機架112的垂直方向,第二方向D2垂直於第一方向D1。由於固定座132會隨著載板120移動,故偵測元件134亦會隨著固定座132而移動。據此,當載板120的高度(此指第二方向D2,也就是垂直於機架112的方向)改變時,半導體元件的異常偵測模組130的偵測元件134會隨著固定座132的移動而移動。此舉不僅不需要透過操作員來手動調整偵測元件134的高度,而且能降低偵測元件134因變更載板120高度所造成半導體元件50與容置槽122之間的對位的誤判。When the carrier 120 moves in a second direction D2 as shown in FIG. 2, the holder 132 moves with the carrier 120. It should be noted that the first direction D1 of the embodiment is, for example, a horizontal direction along the chassis 112, and the second direction D2. For example, in the vertical direction of the frame 112, the second direction D2 is perpendicular to the first direction D1. Since the mount 132 moves with the carrier 120, the detecting element 134 also moves with the mount 132. Accordingly, when the height of the carrier 120 (this refers to the second direction D2, that is, the direction perpendicular to the chassis 112), the detecting component 134 of the abnormality detecting module 130 of the semiconductor component follows the fixing block 132. Move while moving. This not only eliminates the need for the operator to manually adjust the height of the detecting element 134, but also reduces the misjudgment of the alignment between the semiconductor element 50 and the receiving groove 122 caused by the height of the detecting plate 134 being changed.
在本實施例中,機台110更具有兩軌道114。兩軌道114連接於兩機架112。載板120活動地連接兩軌道114,以使載板120沿第一方向D1移動。此外,半導體元件的運送設備100更包括一氣壓缸140。氣壓缸140連接於馬達並驅動載板120,以使載板120能沿第二方向D2移動。在其他實施例中,載板可以藉由其他適當的機構來達到沿第一方向與第二方向移動,本發明不對此加以限制。In the present embodiment, the machine table 110 further has two tracks 114. Two rails 114 are coupled to the two frames 112. The carrier 120 is movably coupled to the two rails 114 to move the carrier 120 in the first direction D1. Further, the transport device 100 of the semiconductor element further includes a pneumatic cylinder 140. The pneumatic cylinder 140 is coupled to the motor and drives the carrier 120 to move the carrier 120 in the second direction D2. In other embodiments, the carrier can be moved in the first direction and the second direction by other suitable mechanisms, which are not limited by the present invention.
圖3為圖1的半導體元件的異常偵測模組的示意圖。請參考圖1至圖3。在本實施例中,各半導體元件的異常偵測模組130更包括一滑軌136以及一滾輪138。固定座132可移動地連接於滑軌136而可以沿著第二方向D2來回地移動。滾輪138配置於固定座132。當載板120沿第二方向D2移動並接觸至滾輪138時,滾輪138用以帶動固定座132沿第二方向D2移動,固定座132藉由滑軌136而隨著載板120沿第二方向移動。據此,半導體元件的異 常偵測模組130的偵測元件134會隨著固定座132的移動而移動,以確保偵測元件134處於適當的位置而能夠正確地偵測半導體元件50與容置槽122之間的對位。3 is a schematic diagram of an abnormality detecting module of the semiconductor device of FIG. 1. Please refer to Figure 1 to Figure 3. In this embodiment, the abnormality detecting module 130 of each semiconductor component further includes a sliding rail 136 and a roller 138. The mount 132 is movably coupled to the slide rail 136 and is movable back and forth along the second direction D2. The roller 138 is disposed on the fixing base 132. When the carrier 120 moves in the second direction D2 and contacts the roller 138, the roller 138 is used to drive the fixed seat 132 to move in the second direction D2. The fixed seat 132 is moved along the second direction by the sliding rail 136. mobile. According to this, the difference of semiconductor components The detecting component 134 of the normal detecting module 130 moves along with the movement of the fixing base 132 to ensure that the detecting component 134 is in an appropriate position to correctly detect the pair between the semiconductor component 50 and the receiving slot 122. Bit.
具體而言,上述之偵測元件134用以偵測這些半導體元件50在載板120的正投影與這些容置槽122的周圍在載板120的正投影彼此重疊,以確保這些半導體元件50存放於這些容置槽122。也就是說,偵測元件134用以偵測這些半導體元件60在載板120的正投影與這些容置槽122的周圍在載板120的正投影不彼此重疊,以判斷這些半導體元件60未存放於這些容置槽122。當然,偵測元件134偵測半導體元件50與容置槽122之間的對位的方式不限制於此。在其他實施例中,偵測元件可以經由其他適當的方式來偵測半導體元件與容置槽之間的對位。Specifically, the detecting component 134 is configured to detect that the orthographic projection of the semiconductor component 50 on the carrier 120 and the orthographic projection of the carrier 120 around the receiving trenches 122 overlap each other to ensure that the semiconductor components 50 are stored. In these receiving slots 122. In other words, the detecting component 134 is configured to detect that the orthographic projection of the semiconductor component 60 on the carrier 120 and the orthographic projection of the carrier 120 around the receiving trenches 122 do not overlap each other to determine that the semiconductor components 60 are not stored. In these receiving slots 122. Of course, the manner in which the detecting component 134 detects the alignment between the semiconductor component 50 and the accommodating groove 122 is not limited thereto. In other embodiments, the detecting component can detect the alignment between the semiconductor component and the receiving slot via other suitable means.
需說明的是,上述半導體元件的異常偵測模組130可應用於各種不同的半導體元件的運送設備或其他元件的設備,即,只要是半導體元件50與容置槽122之間的對位的機構,皆可運用本實施例的半導體元件的異常偵測模組130。It should be noted that the abnormality detecting module 130 of the above-mentioned semiconductor component can be applied to devices of various different semiconductor component transportation devices or other components, that is, as long as the alignment between the semiconductor component 50 and the accommodating groove 122 is performed. For the mechanism, the abnormality detecting module 130 of the semiconductor device of the embodiment can be used.
綜上所述,在本發明的半導體元件的異常偵測模組以及半導體元件的運送設備中,當半導體元件跳出於容置槽外而使半導體元件沒有與對應的容置槽對位時,半導體元件的異常偵測模組的偵測元件便會偵測出此半導體元件並未對位於對應的容置槽。據此,操作員可以藉此預先挑出半導體元件或將半導體元件擺放至對應的容置槽,以避免 後續運送過程中造成半導體元件受損。此外,操作員更可以藉由偵測元件來判斷半導體元件是否擺放至對應的容置槽,以減少人工判斷對位的錯誤。In the above, in the abnormality detecting module of the semiconductor device and the semiconductor device carrying device, when the semiconductor device jumps out of the accommodating groove and the semiconductor device does not align with the corresponding accommodating groove, the semiconductor The detecting component of the component abnormality detecting module detects that the semiconductor component is not located in the corresponding receiving slot. According to this, the operator can thereby pick out the semiconductor components in advance or place the semiconductor components in the corresponding accommodating slots to avoid Semiconductor components are damaged during subsequent shipping. In addition, the operator can further determine whether the semiconductor component is placed in the corresponding accommodating slot by detecting the component to reduce the error of manually determining the alignment.
進一步來說,由於固定座會隨著載板移動,故偵測元件亦會隨著固定座而移動。據此,當載板的高度(此指第二方向)改變時,半導體元件的異常偵測模組的偵測元件會隨著固定座的移動而移動。此舉不僅不需要透過操作員來手動調整偵測元件的高度,而且能降低偵測元件因變更載板高度所造成半導體元件與這些容置槽之間的對位的誤判。Further, since the mount moves with the carrier, the detecting element also moves with the mount. Accordingly, when the height of the carrier (this refers to the second direction) changes, the detecting element of the abnormality detecting module of the semiconductor component moves with the movement of the fixing seat. This not only does not require the operator to manually adjust the height of the detecting component, but also reduces the misjudgment of the alignment between the semiconductor component and the receiving slots caused by the height of the detecting component.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
50‧‧‧半導體元件50‧‧‧Semiconductor components
60‧‧‧半導體元件60‧‧‧Semiconductor components
100‧‧‧半導體元件的運送設備100‧‧‧Transport equipment for semiconductor components
110‧‧‧機台110‧‧‧ machine
112‧‧‧機架112‧‧‧Rack
114‧‧‧軌道114‧‧‧ Track
120‧‧‧載板120‧‧‧ Carrier Board
122‧‧‧容置槽122‧‧‧ accommodating slots
130‧‧‧半導體元件的異常偵測模組130‧‧‧Actual component detection module for semiconductor components
132‧‧‧固定座132‧‧‧ fixed seat
134‧‧‧偵測元件134‧‧‧Detection components
136‧‧‧滑軌136‧‧‧rails
138‧‧‧滾輪138‧‧‧Roller
140‧‧‧氣壓缸140‧‧‧ pneumatic cylinder
D1‧‧‧第一方向D1‧‧‧ first direction
D2‧‧‧第二方向D2‧‧‧ second direction
圖1為本發明一實施例的半導體元件的異常偵測模組用於半導體元件的運送設備的示意圖。FIG. 1 is a schematic diagram of an abnormality detecting module for a semiconductor device used in a semiconductor device transport apparatus according to an embodiment of the present invention.
圖2為圖1的半導體元件的異常偵測模組用於半導體元件的運送設備的示意圖。2 is a schematic diagram of an abnormality detecting module of the semiconductor device of FIG. 1 for a semiconductor device.
圖3為圖1的半導體元件的異常偵測模組的示意圖。3 is a schematic diagram of an abnormality detecting module of the semiconductor device of FIG. 1.
120‧‧‧載板120‧‧‧ Carrier Board
130‧‧‧半導體元件的異常偵測模組130‧‧‧Actual component detection module for semiconductor components
132‧‧‧固定座132‧‧‧ fixed seat
134‧‧‧偵測元件134‧‧‧Detection components
136‧‧‧滑軌136‧‧‧rails
138‧‧‧滾輪138‧‧‧Roller
D1‧‧‧第一方向D1‧‧‧ first direction
D2‧‧‧第二方向D2‧‧‧ second direction
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101145285A TWI474431B (en) | 2012-12-03 | 2012-12-03 | The anomaly detection module for semiconductor device and transport equipment for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101145285A TWI474431B (en) | 2012-12-03 | 2012-12-03 | The anomaly detection module for semiconductor device and transport equipment for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201423889A TW201423889A (en) | 2014-06-16 |
| TWI474431B true TWI474431B (en) | 2015-02-21 |
Family
ID=51394130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101145285A TWI474431B (en) | 2012-12-03 | 2012-12-03 | The anomaly detection module for semiconductor device and transport equipment for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI474431B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6066822A (en) * | 1995-07-28 | 2000-05-23 | Advantest Corporation | Semiconductor device testing apparatus and semiconductor device testing system having a plurality of semiconductor device testing apparatus |
| US6293408B1 (en) * | 1997-07-16 | 2001-09-25 | Robotic Vision Systems, Inc. (Rvsi) | Inspection handler apparatus and method |
| TW200839914A (en) * | 2007-03-30 | 2008-10-01 | Hon Tech Inc | Support structure for use in input shaft of gear box of agricultural carrier |
| TW200841015A (en) * | 2007-04-12 | 2008-10-16 | Semiconductor Testing Advanced Res Lab Inc | Method for testing system-in-package devices |
| TW201137364A (en) * | 2010-04-16 | 2011-11-01 | Powertech Technology Inc | Method for testing a package structure |
-
2012
- 2012-12-03 TW TW101145285A patent/TWI474431B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6066822A (en) * | 1995-07-28 | 2000-05-23 | Advantest Corporation | Semiconductor device testing apparatus and semiconductor device testing system having a plurality of semiconductor device testing apparatus |
| US6293408B1 (en) * | 1997-07-16 | 2001-09-25 | Robotic Vision Systems, Inc. (Rvsi) | Inspection handler apparatus and method |
| TW200839914A (en) * | 2007-03-30 | 2008-10-01 | Hon Tech Inc | Support structure for use in input shaft of gear box of agricultural carrier |
| TW200841015A (en) * | 2007-04-12 | 2008-10-16 | Semiconductor Testing Advanced Res Lab Inc | Method for testing system-in-package devices |
| TW201137364A (en) * | 2010-04-16 | 2011-11-01 | Powertech Technology Inc | Method for testing a package structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201423889A (en) | 2014-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102095900B (en) | Detecting system | |
| TWI452643B (en) | Inspection device and inspection method | |
| KR101365097B1 (en) | Substrate inspection apparatus | |
| TW201537197A (en) | Flexible substrate inspecting apparatus | |
| KR20160047803A (en) | Fork robot and methode of calculating inserting distance of a fork | |
| JPWO2017022109A1 (en) | Solder printing machine | |
| TWI474431B (en) | The anomaly detection module for semiconductor device and transport equipment for semiconductor device | |
| TWM448687U (en) | Testing apparatus with turn-over device | |
| TWI638175B (en) | Electronic component conveying device, electronic component inspection device, positioning device for electronic components, and positioning method of electronic component conveying device | |
| CN115258234A (en) | Resonator testing, marking and packaging integrated machine | |
| JP2015228452A (en) | Detection apparatus, detection method, substrate transfer apparatus, substrate processing apparatus | |
| US8901947B2 (en) | Probe out-of-position sensing for automated test equipment | |
| KR20130022126A (en) | Probe unit and apparatus for testing electrical characteristics of an object including the same | |
| TWI584399B (en) | Electronic parts conveyor and electronic parts inspection device | |
| KR102104051B1 (en) | Device handler | |
| CN102874530B (en) | Transport carriage | |
| KR101287236B1 (en) | Cassette stage and apparatus for inspecting light-emitting devices including the same | |
| CN203858336U (en) | Lane change test device | |
| CN112474419A (en) | Semiconductor packaging detection device | |
| CN120072717B (en) | Loading and unloading device and wafer detection system | |
| CN101865972B (en) | detection device | |
| TWI637182B (en) | Inspection device for electronic components, inspection method for electronic components, and inspection program for electronic components | |
| KR20150041682A (en) | Test handler | |
| CN203858312U (en) | test device | |
| JP7687792B2 (en) | Processing device and positioning method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |