201137364 六、發明說明： 【發明所屬之技術領域】 本發明是關於-種封裝測試方法，尤其是一種利用晶片點及標 示點之封裝測試方法。 【先前技術】 ^由於製程技術的進步，每一個長條型電路板(strip)的利用率 ^昇所以母-個長條型電路板以及，每一顆晶粒的好壞與否都與 ^本息息相關。目前而f，現有的封褒結構筛選方式，是利用人力 師選不良產品’逐-檢測晶粒是否設置於每—晶片承載區以及晶 片f載區及晶片是否為良品。此方法非常沒有效率，而且容易造成 錯块’容易將不良產品出貨。因此針對每個長條型電路板的 制是不容忽視。 +因此，如何晶粒設置於每一晶片承載區之檢查自動化，是目前 舄要努力的目標。 【發明内容】 像上目的為提供—麵裝戦方法，錢齡判聰取影 ml及標福，其中歧行晶片點之判別以確晶片承載單 =载再進行標示點的判定，以判定晶片及晶 依據本發明之一實施例，—種封裝測試方法包括：提供一 置，其具有複數個晶片承載單元陣列設置於其上，其中:一 a曰 之一 _像;由擷取影像依序辨識晶片承= 之母4轉早元；定義擷取影像上每—日日日片承鮮元之一= 201137364 點，其係定義為擷取影像上晶片位於晶片承載單元之相對位置；以 及藉由晶片點之顏色比對每一晶片承載單元是否具有晶片，其中若 為疋，則識別標示點，以判別晶片或晶片承載單元是否為良品。 本發明上述及其他態樣、特性及優勢可由關及實施例之說明 而可更加了解。 【實施方式】 S青參照圖1，其為流程圖顯示本發明之封裂測試方法，包括下 列步驟，首先在步驟S卜提供-晶片承載裝置，例如為封裝基板、 軟性基板(flexible printed Circuit film)或是導線架。請一併參 照圖2，其為示意圖顯示一種晶片承載裝置丨。晶片承載裝置1具有 複數個晶#承載單元2陣列設置於其上。每m载單元2具有 -相對應的標示點4 ’用以標示晶片承載單元2及/或_設置於晶片 承載單元2之晶片3的良劣狀態。標示點4可設置於晶片承載裝曰^】 之邊緣或晶片承鮮元2之上》標示點4之標示可隨封裝過程修改。 舉例而言’在未進行晶粒黏著之前，標示點4可由販紐商標示晶 片承載裝置1 +侧aaa>{承鮮元2的良劣獅，制是可對品質 有問題的晶片承載單元2加以標示以便區別。而在晶粒黏著過程之 中或是之後’可針對黏著之晶粒進行測試並標示於此標示點4，以記 錄晶片3的良劣情形。標示點4標示晶片3及/或晶片承載單元^ 方式可能包含但不限於顏色、形狀等。 接著在步驟S2，利用一影像擷取裝置取得晶片承載裝置丨之 一擷取影像。請一併參照圖3 ’其為示意圖顯示一種本發明之封裝測 試裝置，其中影像擷取裝置7舉例而言為一電荷耦合元件(CCD， Charge-coupled Device)或互補金屬氧化物半導體（CM〇s, complementary metal-oxide semiconductor)等。此外，為 了不讓外來 的光源影響到結果，以具汽缸連結之光源71，當取像時具汽缸連結 之光源71自動降下及貼近長條型電路板(Strip)，以使隔絕外來的光 源、同時強調每一部分的光線可照射均勻，在此可為影像擷取裝置7 201137364 可提供較好的成像及攝影機平行的照明，因此 高擁取速度之要求，可設置兩台解析度及/或 接下來，則進行影像之分析及 主一 步=，由擷取影像依序辨識晶_裝二二：在 c位點6，以界定每一晶片==3 大小的矩开》’以界定每一晶片承載單元2。接著在牛驟 :二_取影像上每一晶片承載單元2之_晶片點5，二： nT_ 色決 =如果；3已轉於⑼承载單元2，那: ，應晶片3的顏色;相反地’如果晶片3未 ’那麼摘取影像上的晶片點5則會反應晶片承載單^的顏色。 因此，藉由上述方法’可以在步驟S5，藉由晶片點5之顏色 =別母-晶片承載單元2是否具有晶片，其中朝別晶片承載單元2 上並無晶片3 ’則結果決定為無晶片(n。屻，並且不需進行進一 + 判定。舉例而言’圖2中所示的A仙列之封裝單柳判定為/ 片。其中行(a，b，c，d)及列(Ι,Π，ΠΙ〜νπι)僅為標示用途，而非用、: 限制本發明之範圍。如果判別晶片承載單元2上具有晶片3，則進一 步利用上述的標示點4 3及/或晶片承載單元2是否為良 品，在示意圖例圖2之中，標示點填滿則代表為不良品。其中= 果晶片3及晶片承載單元2皆為良品’則判定包含此晶片及晶片承 載單元2之封裝單元為良好(good die)，以供出貨，例如圖2中所示 的A行I列之封裝單元；如果晶片3或晶片承載單元2為不良品， 則判定包含此晶片3及晶片承載單元2之封裝單元為不良WGdie)， 201137364201137364 VI. Description of the Invention: [Technical Field] The present invention relates to a package test method, and more particularly to a package test method using a wafer dot and a mark point. [Prior Art] ^ Due to advances in process technology, the utilization rate of each strip-type circuit board is increased, so the mother-strip-type circuit board and each die are good or bad. This is closely related. At present, the existing screening structure screening method is to use a human-engineer to select a defective product, and to detect whether the die is disposed in each wafer carrier area and the wafer load region and whether the wafer is a good product. This method is very inefficient and is prone to error blocks. It is easy to ship bad products. Therefore, the system for each strip type board cannot be ignored. + Therefore, how to automate the inspection of the die placement in each wafer carrier area is currently the goal of hard work. SUMMARY OF THE INVENTION The purpose of the image is to provide a face-mounting method, and the method of discriminating the wafer points is determined by the discriminating wafer point, so as to determine the wafer. According to an embodiment of the present invention, a package testing method includes: providing a device having a plurality of wafer carrier unit arrays disposed thereon, wherein: one of the images is imaged; Identify the mother of the wafer = 4 to the early element; define one of the daily and daily stocks on the captured image = 201137364 points, which is defined as the relative position of the wafer on the wafer bearing unit on the captured image; Whether or not each wafer carrying unit has a wafer is determined by the color of the wafer dots, wherein if it is 疋, the marked points are identified to determine whether the wafer or wafer carrying unit is good. The above and other aspects, features and advantages of the present invention will become more apparent from the description of the embodiments. [Embodiment] Referring to Figure 1, there is shown a flow chart showing a crack test method of the present invention, comprising the following steps. First, in step S, a wafer carrier device, such as a package substrate or a flexible printed circuit film, is provided. ) or lead frame. Referring to Figure 2, there is shown a schematic diagram of a wafer carrier device. The wafer carrier device 1 has an array of a plurality of crystal-bearing units 2 disposed thereon. Each m carrier unit 2 has a corresponding marking point 4' for indicating the poor condition of the wafer carrier unit 2 and/or the wafer 3 disposed on the wafer carrier unit 2. The marker point 4 can be placed on the edge of the wafer carrier device or on the wafer holder 2. The indication of the marker point 4 can be modified with the packaging process. For example, 'the mark point 4 can be indicated by the brand name of the wafer carrier 1 + side aaa> before the die attach is performed. The good and bad lion of the fresh-keeping element 2 is a wafer carrier unit 2 which can be problematic for quality. Mark them to distinguish them. The adhesion of the die can be tested and marked for this point 4 during or after the die attach process to record the good condition of the wafer 3. Marking point 4 indicates that wafer 3 and/or wafer carrier unit may include, but is not limited to, color, shape, and the like. Next, in step S2, an image capture device is used to acquire a captured image of the wafer carrier device. Referring to FIG. 3 together, a schematic diagram of a package testing device of the present invention is shown, wherein the image capturing device 7 is, for example, a charge coupled device (CCD) or a complementary metal oxide semiconductor (CM). s, complementary metal-oxide semiconductor), etc. In addition, in order to prevent the external light source from affecting the result, the light source 71 connected by the cylinder is automatically lowered and brought close to the strip-shaped circuit board when the image is taken, so as to isolate the external light source, At the same time, it is emphasized that the light of each part can be evenly illuminated. Here, the image capturing device 7 201137364 can provide better imaging and parallel illumination of the camera. Therefore, the requirements of high acquisition speed can be set to two resolutions and/or connections. Down, the analysis of the image and the main step =, the image is sequentially identified by the captured image_2: at the c-site 6, to define the radius of each wafer ==3" to define each wafer Carrying unit 2. Then in the cow: two images taken on each wafer carrying unit 2 of the wafer point 5, two: nT_ color = = if; 3 has been transferred to (9) carrying unit 2, that:, should be the color of the wafer 3; 'If the wafer 3 is not' then picking up the wafer dot 5 on the image will reflect the color of the wafer carrier. Therefore, by the above method, in step S5, by the color of the wafer dot 5 = whether the other mother-chip carrier unit 2 has a wafer, wherein there is no wafer 3 on the other wafer carrier unit 2, the result is determined to be wafer-free. (n.屻, and does not need to make a further + decision. For example, the package A of the A Xian column shown in Figure 2 is judged as / piece. Among them, the line (a, b, c, d) and column (Ι , Π, ΠΙ~νπι) is for indication purposes only, and is not intended to limit the scope of the invention. If it is discriminated that the wafer carrier unit 2 has a wafer 3, the above-described marking point 43 and/or wafer carrier unit 2 are further utilized. Whether it is a good product or not, in the schematic example of FIG. 2, the marked point is filled to represent a defective product. wherein = the wafer 3 and the wafer carrying unit 2 are both good products, then the packaging unit including the wafer and the wafer carrying unit 2 is determined to be Good die for shipment, such as the package unit of row A and column I shown in FIG. 2; if the wafer 3 or the wafer carrier unit 2 is defective, it is determined that the wafer 3 and the wafer carrier unit 2 are included The package unit is bad WGdie), 201137364
例如圖2中所示的ARIn _ 晶片點及標示點_定結果總結因此可於後續進行處理For example, the ARIn _ wafer point and the labeled point _ result summary shown in Figure 2 can therefore be processed later.
此外’在-較佳實施例之中，可提供-參考影像，其顯示晶片 承載单几2之影像以作為晶片點5及標示點4之標準。也就是說， 利用參考影細示；承鮮元2具有晶肢未具有^ 2的標準 情形’藉以比對齡影像及參考影像以判別每―晶片承載單元2是 否具有U3 ;以及利用參考影像顯示標示點4的標準情況，包含 標示晶片及/或晶片承鮮元2良劣之顏色、形狀或其他顯示方式。 如圖3所示，參考影像可由主機8所提供，而儲存於一應 81或一資料庫82之中。 & 综合上述，本發明之封裝測試方法利用晶片承载裝置之掘取影 像進行晶片點及標示點的圖案比對及位置比對，將實際的封裝單元/ 狀祕換成數位倾’以便提供長條型電路板資料讓後續的製程使 用，因此可防止混料及用錯材料，並可提供日後做分析與追蹤 之資料。 201137364 以上所述之實施例僅是為說明本發明之技術思想及特點，其目 的在使熟習此項技藝之人士能夠瞭解本發明之内容並據以實施，當 不能以之限定本發明之專利範圍，即大凡依本發明所揭示之精神所 作之均等變化或修飾，仍應涵蓋在本發明之專利範圍内。 201137364 【圖式簡單說明】 圖1為流程圖顯示本發明之封裝測試方法。 圖2為示意圖顯示一種晶片承載裝置。 圖3為示意圖顯示一種本發明之封裝測試裝置。 【主要元件符號說明】Further, in the preferred embodiment, a reference image can be provided which displays the image of the wafer carrying a single 2 as the standard for wafer point 5 and marker point 4. That is to say, the reference picture is shown; the fresh element 2 has a standard case where the crystal limb does not have ^ 2, so that the image of the age and the reference image are compared to determine whether each wafer carrier unit 2 has U3; and the reference image is displayed. The standard case of marking point 4 includes marking the color, shape or other display of the wafer and/or wafer. As shown in FIG. 3, the reference image can be provided by the host 8 and stored in a library 81 or a database 82. In summary, the package test method of the present invention utilizes the image capture device of the wafer carrier device to perform pattern comparison and position comparison of the wafer dots and the marked dots, and replaces the actual package unit/shape into a digital tilt to provide a long length. Strip board data is used for subsequent processes, thus preventing mixing and misuse of materials, and providing future analysis and tracking information. The embodiments described above are merely illustrative of the technical spirit and the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention. Equivalent changes or modifications made by the spirit of the present invention should still be included in the scope of the present invention. 201137364 [Simple Description of the Drawings] FIG. 1 is a flow chart showing the packaging testing method of the present invention. Figure 2 is a schematic view showing a wafer carrier. Figure 3 is a schematic view showing a package test apparatus of the present invention. [Main component symbol description]
S1-S5 封裝測試方法之步驟 1 晶片承載裝置 2 晶片承載單元 3 晶片 4 標不點 5 晶片點 6 定位點 7 影像擷取裝置 71 汽缸連結之光源 8 主機 81 應用伺服器 82 資料庫Steps for S1-S5 Package Test Method 1 Wafer Carrying Unit 2 Wafer Carrying Unit 3 Wafer 4 Marking Point 5 Wafer Point 6 Positioning Point 7 Image Pickup Unit 71 Cylinder Linked Light Source 8 Host 81 Application Server 82 Database