TW200839914A - Support structure for use in input shaft of gear box of agricultural carrier - Google Patents

Abstract

A support structure for use in input shaft of gear box of agricultural carrier comprises a carrier body including a frame provided thereon, the frame including an engine, pulley set, clutch set and a gear box disposed thereon. By way of the engine, the pulley set is actuated, and then by using the clutch set, the pulley set is simultaneously driven to urge an input shaft of the gear box to rotate, such that the power is transmitted to the gear box so as to be convertibly outputted, wherein the body of the gear box includes a support member extendedly mounted thereon and having a mounting hole which is provided with a bearing attached therein, for supporting the input shaft, thereby easily achieving a precise concentricity while in assembly, so as to prevent the carrier's vibration while in use.

Description

200839914 IX. Description of the invention: [Technical field to which the invention pertains] # The invention, in particular, provides a short-term, neutral test of the semiconductor component, and can be optimally performed without affecting the system level test throughput. The circuit (4) configuration, to achieve the test capacity of the open, short-circuit test and system layer, and test the semiconductor component automatic test sorter. 、, 曰 [Prior Art], 士 ^ 'The rain semiconductor components in the test after the completion of the package, the basic electrical test is performed on -A ί, after the basic electrical test is ί too +1⁄2目 Γ 、 、 、 体 体 体 测试 测试 测试 测试 测试 GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR Body = inserted in the actual use of the physical board ^ entity separate level test machine for the combination; ^ - test ^ There are 5 will be the basic electrical test and the public board test number "semi-guided Xu Jian Meng Kaisheng" wide Read Figure 2, which is the patent application for the application of the 93109078 1 且 且 and the automatic test device, the bean work level 2 1 has a test area 1 1 of the brother, and 10 pieces of the basic electrical test. 2, the factory can be on the semiconductor element 1 3 1, and set in the work; to have - test Tan basic electrical test half ^! yuan:, #^弟二收区1 1, another can have several tests on the pass system Public board j" 4l 2 5 = second test unit 14,

The working platform 1 ο, which has the stack of the mouth 10, and immediately adjacent to the 1 5 1 'to provide the test to be tested | the second valley is placed on the conductor carrier disk H H-conductor read, the transport unit 16 is erected于工5 200839914 β 具有 has - can move three degrees on the working platform 1 Q two out two t1 ir placed on the working platform: s Γ = = = Γ Γ 13 13 13 及 及 及 及 及 及 及 及 及 及 及 及When testing semiconductor components, the first semiconductor component to be tested is taken from the supply 舳i 5 i. 先 first = mechanical it61 m^tl r^tTM 181 ^ ^ , buffer socket 18 1 Then, J holds, 191 adsorbs and takes out the surface of the semiconductor component to be tested. === Wang: The semiconductor component to be tested, Ριίθ#. Into the basic electrical test, complete the basic electrical 1 ί P ff V 9 1 ^ Conductor component set 89;: Fang will slow down p will complete the charge + 61 according to the test results 'discard the bad goods classification ί ί ΐ 5 classification E171 If the test result is good, then the machine ϊΐί iH+3 component is transported and transferred to the test board 1 4 1 corresponding to the 掊 ί ί ί ί ί , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The semiconductor component of the test is buffered 181, and the semiconductor component to be tested is placed in the test board 1 for public board test. After the completion of the public board test, the semiconductor component is taken out and tested. The seat 18! then moves mi 1 9 1 below 'by the holding part 1 9 1 the semiconductor tree is completed and placed in the buffer socket 6 200839914 181, the buffer seat 18丨 and then exit the test board ^ 6 1 basis As a result, the semiconductor components that have been tested are classified into 171. The above-mentioned equipment can still be tested and tested on the machine, and there are still the following defects in the structure of the key and the structure of the reduction: pure I In the test area of the platform test, the basic electrical test is added. The test sample measurement :: ^; =, the test electrode of this short time of testing, while the public] == 2S = plate by the group = _ ;;, _ & ====: Order! The production capacity of the type 5 will lead to the completion of the basic electrical test of the semiconductor board test, but must stay in the test 埠 2 卜 ^ ^ electrical test test ====== 芊 construction and public board test Tests are arranged in parallel, so 15 1 ^ ^

Internal, 隹---------------------------------------------------- The internal transfer is not too long to be taken out to the far end. When the military and fi cause the mechanical arm 161 to carry the path, 1 'especially the single group robot 161 also needs the transport item of the negative guide, the robot arm 116 transport path! = too long, Will seriously affect the matching problem at the working time. And experience, research and development and production of related industries in the past, after all;:=3⁄4 guide; set, layer, test capacity under 'to optimize the transfer path: This is the sorter to greatly improve the practice Disadvantages, 200839914 [Invention] The main purpose of the invention is to provide a kind of automatic testing and classification of semiconductor components, ugly road test and system level measurement E, empty £, and several receiving materials. And open _:, at the % end of the private σ, respectively, for the open, short-circuit test device, not only can be half-first ^ this: Lee 帛 纟 纟 纟 纟 纟 纟 , , , , , , 纟 纟 纟 纟 纟Into the basic electrical test semiconductor components can be carried out in sequence according to the sequence of 2 to make the capacity of the basic electrical test.仃糸, 仃糸 level test, to ensure that the test is arranged in a number of system level test and test equipment, after the machine is separated, short-circuit test 奘 ,, Ding #一,h '[This] used in front of the machine Another object of the present invention is to provide a test semiconductor component automatic test sorting machine, wherein the two system level materials E, the miscellaneous, the plurality of materials E, and the open and short circuits are separately provided with a plurality of system levels. After the end of the Qing ^ part of the self-supplied transfer to the open, short-circuit test device, tiff will be the semiconductor element = after the completion of the basic electrical job, the defective product to = test, and after the system level test, then the semiconductor element: After the completion of the semiconductor components, the basic _^\=^= not configuration of the transfer path, to achieve the goal of the implementation of the implementation of the implementation of the implementation of the new step-by-step understanding There are several system level level devices 2, and the transport unit installed on the machine table ^ ^ 200839914 includes a transfer table 28 8 and == before moving to the front and rear areas of the machine before moving to the front end area of the machine. =, rear robot arm 2 9, and can be transported continuously Conductor elements of system-level testing and testing. The invention is based on the machine 2, the defective product receiving ship 2 4 adjacent to the opening and short circuit without reducing the number of the system level test device 26 (, 2 3 'and the semiconductor component into the single, short circuit basic = To achieve the benefits of ensuring the test capacity. Department,, filling, and testing, please refer to Figure 4, 5 'The invention is used for testing, 7 is to supply the semiconductor element 2 3 for the cage Rack 2 3] is equipped with test] 2 3] (2) by == movement and power source 2 3 5 drive the lower pressure head to open, the i road to move backward and lower the semiconductor component to the arm 2 7 The physical board test can be carried out in the test stand 2. On the table 2, the connection, the defective product, the 2 4 and the transfer end, ^ 2 3, can be sighed at the p-bow, the vertical-digan phase (five) When the short-circuit test device is short or short, the product will be placed in the system level test device 26 when the transfer table 28 is opened and short-circuited. 9 200839914

Refer to Figures 7 and 8 for each system level test I body plate 26 1. After the mechanical arm 2 2 6 is installed in the test area with the test piece of the actual 2 6 1 , the lower head 2 R 9 cattle conductor element Transfer to the solid board to make it read with the test board of the solid board 2 61 = press against the semiconductor component, after the test, the lower head 2 6 2 rises again to perform the test of the 层 level 2 6 1 The semiconductor component is taken out in the test socket. After the mechanical arm 2 9 and then the solid board, please refer to Figure 9. After the mechanical arm semiconductor piece, the semiconductor component is taken out of the station, and the other is loaded with the open and short circuit. The body element, so the rear robot arm 29 will take the exchange of the semi-conductor of the good (10), and will complete the (four) layer _ ^ up = the semiconductor component 28, and draw the system level to Department, level device 2 6 . Please refer to Figure 8 for the semiconductor component removed from the 层 level test to the machine 2 〇 二 ί ί layer level test results, the finished material element t (four) it 不仅 month can not only open the semiconductor components first Under the capacity of the short-circuit basic electricity 2nd 2 county system level test, to optimize the configuration of the transfer road position, to ensure the efficiency of _ capacity, the actual - practical and progressive design, No identical products and publications were disclosed, so that the application requirements were issued and the application was made according to law. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram showing the structure of the patent application No. 91210786 "Conveying device for 1C detector". Figure 2: Schematic diagram of the application for the patent application No. 93109078, "Automated Test of Semiconductor Components". Figure 3: Schematic diagram of the architecture of the present invention. Figure 4: Schematic diagram of the action of the present invention (1). 10 200839914 Fig. 5: Schematic diagram of the open and short test device of the present invention Fig. 6: Schematic diagram of the action of the present invention (2). Figure 7: Schematic diagram of the action of the present invention (3). Fig. 8 is a schematic view showing the system level test apparatus of the present invention. Fig. 9 is a schematic view showing the operation of the present invention (4). Figure 10: Schematic diagram of the operation of the present invention (5). [Main component symbol description] Conventional part: 0 First test area work platform First test unit Second test unit Feed unit Transfer unit Discharge unit Buffer unit Press unit Unit of the invention: 2 0 : Machine 2 3 : Open Short-circuit test device 2 31 : Rack 2 3 2 : Test stand 2 3 4 : Power source 2 3 5 : Power source 2 4 : Defective goods receipt 匣 2 5 : Classification receipt 匣 2 6 : System level test device 2 61: solid plate 2 6 2 : lower pressing head 2 7 : front mechanical arm 2 8 : transfer table 2 9 : rear robot arm 12: second test zone 1415 1 61718 1 9 13 1 14 1 15 1 16 1 17 118 1 19 1 Test 埠 Test slab supply 匣 Robot arm classification 匣 Buffer bearing holder 21: Feed 匣 2 2 : Open 3 2 3 3 : Lower head

Claims (1)

200839914, the scope of application for patents: • A semiconductor element sorting machine with open and short circuit test and system level test, which includes: ^ Machine table; Feeding material: is installed at the front end of the machine for bearing the test Semiconductor component. Open and short test device: It is installed at the front end of the machine to perform basic electrical test on the semiconductor component; The defective product is received at the front end of the machine to support the basic electrical properties of the open and short circuit. The test result is a semiconductor component of defective products; the knife receiving material is set at the front end of the machine to classify and complete the semiconductor component of the system level ^ test; the system level test device is set at the rear end of the machine to Performing a system level test on the semiconductor component; 2 3 4 Disposing: is disposed on the machine to transfer the semiconductor component to a predetermined position. The automatic test and classification machine for semiconductor components with open and short circuit and system level test described in item 1 of the H patent scope is included in the space at the front end of the machine for the empty tray. = Open, short-circuit test and system level test as described in item 1 of the scope of the patent application: the conductor component automatic test sorter, wherein the feed raft is a tray for the semiconductor component to be tested. Xia Shen ^ Patent scope of the work described in the open, short-circuit test and system level test ^ semiconductor components from the _ test face, its towel, off, short-circuit test on the rack with a test stand for waiting Test the semiconductor component placement and short circuit basic electrical test. = Shen = patent range, the open circuit, short circuit test and system level measurement two = half body component automatic test classification machine, the open and short circuit test device is more above the package seat can be driven by the power source Under the pressure head, after the body component is placed in the test seat, the lower pressure head can lower the semi-conductive yak to perform the open and short circuit basic electric side test. ^ 12 200839914 6 . The semiconductor component automatic test sorting machine with open/short test and system level 5 test described in the scope of patent application, wherein the open head and short circuit test device can be powered by The source drive is moved back and forth to allow the semiconductor component to be tested to be placed in the test socket when removed. 7 · The semiconductor component automatic test sorting machine with open/short test and system level test described in item i of the patent application scope, wherein the secret level test device is equipped with a physical board with a test seat in the test area. For the semiconductor component to be tested to be placed in the test socket for system level testing. 8. Apply for the semiconductor component automatic test sorting machine with open and short circuit and system level 5 as described in Item 7 (4). The system level test device is further equipped with a lower lift head above the test seat. In order to test the semiconductor components = after the test, the lower Qing can be lowered to the lower body level test. T9 · ΪΓίί, (10) Item 1 has an open and short circuit test and a system level test piece automatic test sorting machine, wherein the transport device comprises „, a transfer table and a rear mechanical arm, and can be transported and transported by a half Ί Ω Open and short circuit basic electrical test and system level test. The open and short circuit test and system level two test sorter described in the cofferdam item 'where the front mechanical arm 11 has the open, short circuit and line level Move to the machine 'where' the transfer station is moved 2. The open, short-circuit test and secret level system described in item 9 are moved to the rear end of the machine.