CN203858336U - Lane change test device - Google Patents
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- CN203858336U CN203858336U CN201420275087.9U CN201420275087U CN203858336U CN 203858336 U CN203858336 U CN 203858336U CN 201420275087 U CN201420275087 U CN 201420275087U CN 203858336 U CN203858336 U CN 203858336U
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- 238000012360 testing method Methods 0.000 title claims abstract description 109
- 239000004065 semiconductor Substances 0.000 claims abstract description 52
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Abstract
Description
技术领域technical field
本实用新型是有关于一种测试装置,特别关于一种用于光学测试电路板的换道式测试装置。The utility model relates to a test device, in particular to a lane-changing test device for optical test circuit boards.
背景技术Background technique
随着科技的发展,电子产品已成为生活与工作的必要配备,例如手机、电脑、平板等,而其中的主机板,是手机、电脑、平板不可或缺的重要组成元件,在主机板的生产过程中,需要对主机板上的各个元件进行测试以确定其功能是否正常。With the development of science and technology, electronic products have become necessary equipment for life and work, such as mobile phones, computers, tablets, etc., and the motherboard is an indispensable and important component of mobile phones, computers, and tablets. During the process, each component on the motherboard needs to be tested to determine whether it is functioning properly.
一般主机板上的各个元件需进行各种测试,因而需要通过输送带将待测试的主机板运送至特定的位置进行测试,接着再运送至下一个位置进行加工,然而所述输送带皆在同一个平面传输所述主机板,若输送带的路径越长则占据空间越大,主机板必须在所述空间中移动,造成后一片主机板需等待前一片主机板测试完成才能继续由输送带传输移动的情形,输送带的中途停顿将对影响其测试的速度。Generally, each component on the motherboard needs to undergo various tests, so the motherboard to be tested needs to be transported to a specific location for testing through a conveyor belt, and then transported to the next location for processing. However, the conveyor belts are all in the same One plane transports the main board, if the path of the conveyor belt is longer, it takes up more space, and the main board must move in the space, causing the latter board to wait for the test of the previous board to be completed before continuing to be transported by the conveyor belt. In some cases, the stoppage of the conveyor belt will affect the speed of its test.
因此,主机板在进行测试的过程中,所使用的测试装置非常重要,所述测试装置的好坏与否关系到主机板测试的速度,若使用的测试装置操作及流程复杂,而导致量测速度过慢,则会影响出货的时间而付出较大的成本。Therefore, in the process of testing the motherboard, the test device used is very important. The quality of the test device is related to the speed of the test of the motherboard. If the operation and process of the test device used are complicated, the measurement If the speed is too slow, it will affect the delivery time and pay a large cost.
故,有必要提供一种改良型的换道式测试装置,以解决现有技术所存在的问题。Therefore, it is necessary to provide an improved lane-changing test device to solve the problems existing in the prior art.
实用新型内容Utility model content
有鉴于此,本实用新型提供一种换道式测试装置,以解决现有的测试装置操作及流程复杂而导致量测速度过慢的问题。In view of this, the utility model provides a lane-changing test device to solve the problem of too slow measurement speed caused by the complicated operation and process of the existing test device.
本实用新型的主要目的在于提供一种换道式测试装置,利用上、下二层输送道的设计,缩减占用空间,可避免输送道中途停顿而缩短测试速度。The main purpose of the utility model is to provide a lane-changing testing device, which uses the design of the upper and lower two-layer conveying lanes to reduce the occupied space and avoid the stoppage of the conveying lanes to shorten the test speed.
为达成本实用新型的前述目的,本实用新型一实施例提供一种换道式测试装置,用以测试至少一半导体载板,所述换道式测试装置包括至少一第一输送道、至少一第二输送道、一承载器、至少一承载升降座、至少一测试升降座及至少一测试器,所述第二输送道设置在所述第一输送道上方,所述承载器位于所述第一输送道及第二输送道之间,用以输入、输出、夹持及水平移动所述半导体载板,所述承载升降座设置在所述第一输送道中,用以升降所述半导体载板,以匹配于所述承载器或第一输送道的水平高度,所述测试升降座设置在所述第一输送道的一侧,用以升降所述半导体载板,以匹配于所述第一输送道或第二输送道的水平高度,所述测试器设置在所述测试升降座上方。In order to achieve the aforementioned purpose of the utility model, an embodiment of the utility model provides a lane-changing test device for testing at least one semiconductor carrier board, the lane-changing test device includes at least one first conveying lane, at least one A second conveying path, a carrier, at least one carrying lifting seat, at least one testing lifting seat and at least one tester, the second conveying path is arranged above the first conveying path, and the carrier is located on the second conveying path Between the first conveying lane and the second conveying lane, it is used for inputting, outputting, clamping and horizontally moving the semiconductor carrier board, and the load lifting seat is arranged in the first conveying lane for lifting and lowering the semiconductor carrier board , to match the level of the carrier or the first conveying lane, the test lifting seat is arranged on one side of the first conveying lane, and is used to lift the semiconductor carrier to match the first The horizontal height of the conveying path or the second conveying path, the tester is arranged above the test lifting seat.
在本实用新型的一实施例中,所述换道式测试装置包含二个左右并列的所述第一输送道、二个左右并列的所述第二输送道及二个所述测试器,其中所述两第一输送道及所述两第二输送道皆位于所述两测试器之间。In an embodiment of the present utility model, the lane-changing testing device includes two left-right paralleled first conveying lanes, two left-right paralleled said second conveying lanes, and two testers, wherein The two first conveying lanes and the two second conveying lanes are located between the two testers.
在本实用新型的一实施例中,所述换道式测试装置包含二个所述承载升降座及二个所述测试升降座,其中所述承载升降座分别设置在每一所述第一输送道中,所述测试升降座分别设置在每一所述第一输送道的一侧。In one embodiment of the present utility model, the lane-changing test device includes two load lifting seats and two test lift seats, wherein the load lift seats are respectively arranged on each of the first conveying In the lanes, the test lifting seats are respectively arranged on one side of each of the first conveying lanes.
在本实用新型的一实施例中,所述换道式测试装置还包含至少一限位座,对应设置于所述测试升降座上方,用以将所述测试升降座阻挡固定在一最高位置。In an embodiment of the present invention, the lane-changing test device further includes at least one position-limiting seat, which is correspondingly arranged above the test lifting seat, and is used to block and fix the test lifting seat at a highest position.
在本实用新型的一实施例中,所述限位座具有二挡片及二卡槽,所述卡槽分别形成在所述两挡片上,用以卡合在所述半导体载板的二侧缘。In an embodiment of the present utility model, the limit seat has two blocking pieces and two locking slots, and the locking slots are respectively formed on the two blocking pieces, and are used for locking on the two sides of the semiconductor carrier board. edge.
在本实用新型的一实施例中,所述测试器具有一前后移动模组、一横向移动模组及一光学测试模组,所述前后移动模组及横向移动模组分别用以带动所述光学测试模组前后移动及横向移动。In one embodiment of the present utility model, the tester has a forward and backward movement module, a lateral movement module and an optical test module, the front and rear movement modules and the transverse movement module are respectively used to drive the optical The test module moves back and forth and laterally.
在本实用新型的一实施例中,所述测试升降座上具有一对辅助输送带,用以水平移动所述半导体载板至所述第二输送道。In an embodiment of the present invention, the test lifting base has a pair of auxiliary conveying belts for horizontally moving the semiconductor carrier to the second conveying lane.
在本实用新型的一实施例中,所述换道式测试装置还包含一横移传送带,用以带动所述承载器在所述第一输送道及第二输送道之间进行水平移动。In an embodiment of the present invention, the lane-changing testing device further includes a traversing conveyor belt for driving the carrier to move horizontally between the first conveying lane and the second conveying lane.
在本实用新型的一实施例中,所述承载器具有二个承载座,所述两承载座用以夹持所述半导体载板。In an embodiment of the present invention, the carrier has two bearing seats, and the two bearing seats are used to clamp the semiconductor carrier.
在本实用新型的一实施例中,所述承载器更具有二承载传送带,分别设置在所述两承载座上,用以传送所述半导体载板。In an embodiment of the present invention, the carrier further has two carrying conveyor belts, respectively disposed on the two carrying seats, for transferring the semiconductor carrier.
在本实用新型的一实施例中,所述半导体载板具有一电路板及数个封装元件,所述电路板用以放置在所述承载传送带上,所述封装元件设置在所述电路板上。In one embodiment of the present invention, the semiconductor carrier has a circuit board and several packaging components, the circuit board is used to be placed on the carrying conveyor belt, and the packaging components are arranged on the circuit board .
如上所述,本实用新型换道式测试装置,通过所述第一、二输送道的设计,可减少在同一平面所占用的空间,而且利用所述承载升降座及所述测试升降座配合将所述半导体载板适时地安排在所述第一、二输送道,可避免所述半导体载板在所述第一、二发生中途停顿的情形,可有效缩短测试速度。As mentioned above, the lane-changing test device of the present invention can reduce the space occupied on the same plane through the design of the first and second conveying lanes, and utilize the cooperation of the bearing lifting base and the testing lifting base to move the The timely arrangement of the semiconductor carrier on the first and second conveying lanes can avoid the situation that the semiconductor carrier stops in the middle of the first and second conveying lanes, and can effectively shorten the test speed.
附图说明Description of drawings
图1是本实用新型一实施例换道式测试装置的立体图。Fig. 1 is a perspective view of a lane-changing test device according to an embodiment of the present invention.
图2是本实用新型一实施例换道式测试装置的侧视图。Fig. 2 is a side view of a lane-changing test device according to an embodiment of the present invention.
图3是本实用新型一实施例换道式测试装置的另一角度的侧视图。Fig. 3 is a side view from another angle of the lane-changing test device according to an embodiment of the present invention.
图4至13是本实用新型一实施例换道式测试装置的使用状态的示意图。4 to 13 are schematic views of the use state of the lane-changing test device according to an embodiment of the present invention.
具体实施方式Detailed ways
以下各实施例的说明是参考附加的图式,用以例示本实用新型可用以实施的特定实施例。再者,本实用新型所提到的方向用语,例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本实用新型,而非用以限制本实用新型。The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be implemented. Furthermore, the direction terms mentioned in the present utility model, such as up, down, top, bottom, front, back, left, right, inside, outside, side, surrounding, central, horizontal, transverse, vertical, longitudinal, axial , radial direction, the uppermost layer or the lowermost layer, etc., are only directions for referring to the attached drawings. Therefore, the used directional terms are used to illustrate and understand the present invention, but not to limit the present invention.
请参照图1至3所示,本实用新型一实施例的换道式测试装置100,用以测试一个或以上的半导体载板101,所述半导体载板101具有一电路板102及数个封装元件103,所述封装元件103(例如记忆体、封装IC等)设置在所述电路板102上,所述换道式测试装置100包括二第一输送道21、二第二输送道22、一承载器23、二承载升降座24、二测试升降座25、二测试器26、二限位座27及一横移传送带28,其中所述二个第一输送道21、二个第二输送道22、二个承载升降座24、二个测试升降座25、二个测试器26及二个限位座27在图2及4(图4省略部分元件)为左右并列设置,但也可仅设置为一个,其元件设置的数量并不以本实施例所局限,本实用新型将于下文详细说明所述组装设备各元件的细部构造、组装关系及其运作原理。Please refer to FIGS. 1 to 3, a lane-changing test device 100 according to an embodiment of the present invention is used to test one or more semiconductor substrates 101. The semiconductor substrate 101 has a circuit board 102 and several packages. Components 103, the packaging components 103 (such as memory, packaging IC, etc.) are arranged on the circuit board 102, and the lane-changing test device 100 includes two first delivery lanes 21, two second delivery lanes 22, a Carrier 23, two load lifting seats 24, two test lifting seats 25, two testers 26, two limit seats 27 and a traverse conveyor belt 28, wherein the two first conveying lanes 21 and the two second conveying lanes 22. Two load lifting seats 24, two test lifting seats 25, two testers 26 and two limit seats 27 are arranged side by side in Figures 2 and 4 (some components are omitted in Figure 4), but only It is one, and the number of its components is not limited by this embodiment. The utility model will describe the detailed structure, assembly relationship and operating principle of each component of the assembly device in detail below.
续参照图1至3及4所示,各所述第二输送道22设置在相对应的第一输送道21的上方,所述两第一输送道21及所述两第二输送道22皆位于所述两测试器26之间,所述承载升降座24分别设置在每一所述第一输送道21中,所述测试升降座25分别设置在每一所述第一输送道21的一侧。1 to 3 and 4, each of the second conveying lanes 22 is arranged above the corresponding first conveying lane 21, and the two first conveying lanes 21 and the two second conveying lanes 22 are both Located between the two testers 26, the carrying lifting base 24 is respectively arranged in each of the first delivery lanes 21, and the test lifting base 25 is respectively arranged in one of each of the first delivery lanes 21. side.
续参照图1至3及4所示,所述承载器23位于所述第一输送道21及第二输送道22之间,用以输入、输出、夹持及水平移动所述半导体载板101,所述承载器23具有二个承载座231及二承载传送带232,所述两承载座231用以夹持所述半导体载板101,且所述两承载传送带232分别设置在所述两承载座231上,用以传送所述半导体载板101。1 to 3 and 4, the carrier 23 is located between the first conveying lane 21 and the second conveying lane 22, and is used for inputting, outputting, clamping and horizontally moving the semiconductor carrier 101. , the carrier 23 has two carrying seats 231 and two carrying conveyor belts 232, the two carrying seats 231 are used to clamp the semiconductor carrier 101, and the two carrying conveyor belts 232 are respectively arranged on the two carrying seats 231 for transferring the semiconductor carrier 101 .
续参照图1至3及4所示,各所述承载升降座24设置在所述第一输送道21中,通过气压缸升降所述半导体载板101,使所述承载升降座24上升时,匹配于所述承载器23的水平高度,所述承载升降座24下降时,匹配于所述第一输送道21的水平高度。1 to 3 and 4, each of the load lifting seats 24 is arranged in the first conveying path 21, and the semiconductor carrier 101 is lifted and lowered by a pneumatic cylinder, so that when the load lifting seats 24 are raised, It is matched to the level of the carrier 23 , and the level of the first conveying path 21 is matched to the level of the first conveying path 21 when the carrier lifter 24 descends.
续参照图1至3及4所示,各所述测试升降座25设置在所述第一输送道21的一侧,通过气压缸升降所述半导体载板101,使所述测试升降座25上升时,匹配于所述第二输送道22的水平高度,所述测试升降座25下降时,匹配于所述第一输送道21的水平高度。另外,所述测试升降座25具有一对辅助输送带251(图4中因视角仅示其一),用以水平移动所述半导体载板101至所述第二输送道22或所述第一输送道21。1 to 3 and 4, each of the test lifting seats 25 is arranged on one side of the first conveying path 21, and the semiconductor carrier 101 is raised and lowered by a pneumatic cylinder to make the test lifting seats 25 rise. When the test lifting base 25 descends, it matches the horizontal height of the second conveying path 22 . In addition, the test lifting base 25 has a pair of auxiliary conveyor belts 251 (only one of which is shown in FIG. Conveyor Road 21.
续参照图1至3及4所示,各所述测试器26设置在所述测试升降座上方,所述测试器26具有一前后移动模组261、一横向移动模组262及一光学测试模组263,所述前后移动模组261用以带动所述光学测试模组263前后移动,且所述横向移动模组262用以带动所述光学测试模组263横向移动。Continue referring to Fig. 1 to 3 and shown in 4, each described tester 26 is arranged on the top of described test lifting seat, and described tester 26 has a front and rear movement module 261, a lateral movement module 262 and an optical test module. Group 263 , the forward and backward moving module 261 is used to drive the optical testing module 263 to move forward and backward, and the lateral moving module 262 is used to drive the optical testing module 263 to move laterally.
续参照图1至3及4所示,所述限位座27对应设置于所述测试升降座25上方,用以将所述测试升降座25阻挡固定在一最高位置,各所述限位座27具有二挡片271及二卡槽272,其中所述卡槽272分别形成在所述两挡片271上,用以卡合在所述半导体载板101的电路板102二侧缘。1 to 3 and 4, the limit seat 27 is correspondingly arranged above the test lift seat 25, so as to block and fix the test lift seat 25 at a highest position, and each limit seat 27 has two blocking pieces 271 and two locking slots 272 , wherein the locking slots 272 are respectively formed on the two blocking pieces 271 for locking on two side edges of the circuit board 102 of the semiconductor carrier 101 .
续参照图1至3及4所示,所述横移传送带28设置在所述第一输送道21外侧,用以带动所述承载器23在所述第一输送道21及第二输送道22之间进行水平移动。1 to 3 and 4, the traverse conveyor belt 28 is arranged on the outside of the first conveying path 21 to drive the carrier 23 on the first conveying path 21 and the second conveying path 22. to move horizontally.
依据上述的结构,如图4所示,将所述半导体载板101放置在所述承载器23上,使所述承载传送带232将所述电路板102移动定位,接着所述承载器23被所述横移传送带28带动而往左移动定位;如图5所示,所述承载升降座24会上升至匹配于所述承载器23的水平高度,且所述承载器23会展开所述两承载座231,使所述承载升降座24承载所述半导体载板101,并下降至匹配于所述第一输送道21的水平高度,使所述第一输送道21承载所述半导体载板101;如图6所示,所述第一输送道21将所述半导体载板101传送至所述测试升降座25上,使所述测试升降座25承载所述半导体载板101;如图7所示,所述测试升降座25即上升而匹配于所述第二输送道22的水平高度,并透过所述光学测试模组263对所述半导体载板101的封装元件103进行光学测试,待测试完毕后,所述测试升降座25的辅助输送带251将所述半导体载板101传送至所述第二输送道22,而使所述第二输送道22承载所述半导体载板101;如图8所示,所述半导体载板101受所述第二输送道22带动而往右移动,而将所述半导体载板101传送至所述测试升降座25上,使所述测试升降座25承载所述半导体载板101;如图9所示,利用所述光学测试模组263对所述半导体载板101的封装元件103进行光学测试,待测试完毕后,所述测试升降座25会往下降而匹配于所述第一输送道21的水平高度,此时,所述测试升降座25的辅助输送带251将所述半导体载板101传送至所述第一输送道21,而使所述第一输送道21承载所述半导体载板101;如图10所示,所述半导体载板101受所述第一输送道21带动而往左移动至定位,所述承载升降座24即承载所述半导体载板101并上升而匹配于所述承载器23的水平高度,此时,所述承载器23会收合所述两承载座231,使所述两承载座231夹持所述半导体载板101,同时所述承载升降座24即下降回复原位;最后,所述承载器23会依序移动至如图12、4及13将所述半导体载板101输出,使所述半导体载板101接续进行下一个程序。According to the above-mentioned structure, as shown in FIG. 4, the semiconductor carrier 101 is placed on the carrier 23, so that the carrier conveyor belt 232 moves and positions the circuit board 102, and then the carrier 23 is moved by the carrier 23. Driven by the traversing conveyor belt 28, it moves to the left for positioning; as shown in FIG. Seat 231, making the lifting and lowering seat 24 carry the semiconductor carrier board 101, and descend to a level matching the first conveying path 21, so that the first conveying path 21 carries the semiconductor carrier substrate 101; As shown in FIG. 6, the first conveying lane 21 transfers the semiconductor carrier board 101 to the test lifting base 25, so that the test lifting base 25 carries the semiconductor carrier board 101; as shown in FIG. 7 , the test lifting seat 25 immediately rises to match the level of the second conveying path 22, and performs an optical test on the packaged components 103 of the semiconductor carrier 101 through the optical test module 263, to be tested After completion, the auxiliary conveyor belt 251 of the test lifter 25 will transfer the semiconductor carrier board 101 to the second conveying lane 22, so that the second conveying lane 22 carries the semiconductor carrier board 101; 8, the semiconductor carrier board 101 is moved to the right by the second conveying path 22, and the semiconductor carrier board 101 is transferred to the test lifting base 25, so that the test lifting base 25 carries The semiconductor carrier 101; as shown in FIG. 9 , the optical test module 263 is used to perform an optical test on the packaging element 103 of the semiconductor carrier 101. After the test is completed, the test lifter 25 will descend To match the level of the first conveying lane 21, at this time, the auxiliary conveying belt 251 of the test lifting stand 25 will transfer the semiconductor carrier board 101 to the first conveying lane 21, so that the first conveying lane 21 A conveyor 21 carries the semiconductor carrier 101; as shown in FIG. The semiconductor carrier 101 rises to match the level of the carrier 23. At this time, the carrier 23 will fold the two bearing seats 231 so that the two bearing seats 231 clamp the semiconductor carrier. 101, at the same time, the bearing lifting seat 24 is lowered and returned to its original position; finally, the carrier 23 will move in sequence to output the semiconductor carrier board 101 as shown in Figures 12, 4 and 13, so that the semiconductor carrier board 101 Proceed to the next procedure.
另外,在测试的过程中,如图3所示,所述测试升降座25会将所述半导体载板101向上推升至一最高位置而靠抵靠所述两挡片271,此时,所述卡槽272系卡合在所述半导体载板101的电路板102二侧缘,使所述电路板102能够保持水平,以利所述光学测试模组263进行测试。In addition, during the test, as shown in FIG. 3 , the test lifter 25 will push up the semiconductor carrier 101 to a highest position and lean against the two blocking pieces 271. At this time, the The locking slot 272 is engaged with the two side edges of the circuit board 102 of the semiconductor carrier 101 , so that the circuit board 102 can be kept horizontal, so that the optical test module 263 can be tested.
通过上述的设计,所述第一输送道21及第二输送道22的设计,不仅可减少在同一平面所占用的空间,而且利用所述承载升降座24及所述测试升降座25配合将所述半导体载板101适时地安排在所述第一输送道21或第二输送道22,可避免所述半导体载板101在所述第一输送道21或第二输送道22发生中途停顿的情形,可有效缩短测试速度。另外,透过所述限位座27的设计,使所述电路板102能够保持水平,而减少所述光学测试模组263测试失误的发生。Through the above-mentioned design, the design of the first conveying path 21 and the second conveying path 22 can not only reduce the space occupied on the same plane, but also utilize the cooperation of the load lifting seat 24 and the test lifting seat 25 to lift the The semiconductor carrier board 101 is arranged in the first conveying lane 21 or the second conveying lane 22 in a timely manner, which can avoid the situation that the semiconductor carrier board 101 stops midway in the first conveying lane 21 or the second conveying lane 22 , which can effectively shorten the test speed. In addition, through the design of the limit seat 27 , the circuit board 102 can be kept horizontal, thereby reducing the occurrence of test errors of the optical test module 263 .
本实用新型已由上述相关实施例加以描述,然而上述实施例仅为实施本实用新型的范例。必需指出的是,已公开的实施例并未限制本实用新型的范围。相反的,包含于权利要求书的精神及范围的修改及均等设置均包括于本实用新型的范围内。The utility model has been described by the above-mentioned relevant embodiments, but the above-mentioned embodiments are only examples for implementing the utility model. It must be pointed out that the disclosed embodiments do not limit the scope of the present invention. On the contrary, modifications and equivalent arrangements included in the spirit and scope of the claims are included in the scope of the present invention.
Claims (11)
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| CN112816856A (en) * | 2021-02-03 | 2021-05-18 | 深圳市联合东创科技有限公司 | Circuit board detection system |
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