.1308685 九、發明說明： 【發明所屬之技術領域】 • 本發明係關於一種散熱器，特別係關於一種熱管散熱器。 【先前技術】 爲有效地散發電子元件如中央處理器(CPU)，在運行過程中産生之熱 量，業界通常在發熱電子元件表面加裝一散熱器辅助其散熱，從而使電子= 件自身溫度保持在正常運行範圍内。 對於散熱器’目前業界越來越多地使用熱管，中國大陸專利申請公開第 φ 2_2_5284·8號揭示一種使用熱管的散熱器，該散熱器包括-散熱體和至 少-熱官’該散熱體包括-本體，本體包括-導熱板和設置於料熱板上之 減，柱體至少-表面延伸有多數散熱片，爲使得所述散熱體具有更強之散 熱能力，該柱體多個表面均設有散熱片，因柱體結構曲折，使得所述本體製 程複雜；所述熱管之吸熱部與放熱部呈9〇。夾角，熱管内工作介質流經該熱 管夾角處受Μ導致傳熱速度下降；另有—種散無結構，如美國專利^開 第2〇01/0018967 Α1號所示，該散熱器的散熱片上開設有通孔，使得熱管可 以貫穿其中，但此種結構製程較爲複雜。 【發明内容】 ® 有胁此’有必純供-種能有效_熱管且雜醉之熱管散熱器。 本發明之散熱ϋ包括-導熱板、二散熱體及至少-錄，該散熱體具 有基座及其延伸而出之複數散熱片，該熱管具有一與導熱板連接之吸熱部 及由吸熱部-端彎折延伸而出並與散熱體連接之放熱部，該熱管放熱部被 夾置於二散熱體基座之間’該放熱部與吸熱部賴處之㈣大於如。。 當所述熱管紅作介·經其吸熱部和放熱部夾祕時，相比流經吸 熱部和放熱部夾角等於9〇。之結構處(如U形管)，該工作介質流動會變得更流 暢，由此使得整個散熱器之散熱效率得到提高。同時，該熱管周圍散熱體 6 1308685 +曰、達、熱^結合’便於形成—整體，無需在散熱片上開孔，由兩散 熱體結合時即將熱管夾置其間，製造更加容易。 " 下面參照關結合實施例對本發明作進-步描述。 . 【實施方式】 第圖及第一圖不出了本發明第一實施例之散熱器4〇 ,該散熱器倾 置於-發熱電子元件(圖未示)上並對其散熱。 該散熱器40包括-導熱板1〇、二v形熱管2〇及四散熱體31、32、％、 • %。導熱板1〇具有一頂面12及與頂面12相對之底面16，頂面12上設有凹槽 14，底面16用以與發熱電子元件接觸。 該熱官2〇包括-吸熱部Μ及從吸熱部％兩端騎延伸而成之兩放熱部 22 ’其中吸熱部24與放熱部22均爲直線形，熱管2〇所在平面與導熱板1〇之 頂面12垂直’吸鱗24與放鱗22$域肖大觀)。，使得熱f 20成V形。 四散熱體31、32、33、34具有相似之結構及功能特徵，以散熱體32爲 例.其包括一平板狀基座320 ’該基座320具有一受熱面326及相反侧一導 • 熱面324，受熱面326上設有凹槽322，用以容置熱管20放熱部22，而導熱面 324上垂直延伸出複數相互平行之散熱片328，用以散發熱量。 該散熱器40裝配時，導熱板1〇頂面凹槽14容置熱管2〇之吸熱部24 ;四 散熱體中每兩散熱體(31與34、32與33)相互以其受熱面相對夾置熱管20放熱 部22。裝配完畢後，導熱板1〇位於熱管20下方，而兩散熱體31、32對稱位 於熱管20内夾角側，另兩散熱體33、34對稱位於熱管20外夾角侧。上述各 元件間結合處可以採用焊接方式連接。 該散熱器40應用時，導熱板10以其底面16與發熱電子元件接觸，吸收 1308685 電子元件産生之熱量後將熱量傳遞給熱管20的吸熱部24，該吸熱部24内工 作液體吸熱變成汽態後流向熱管20的兩放熱部22，工作液體在放熱部22處 - 冷凝變成液態釋放出熱量，其中大部分熱量將傳遞到各散熱體，並藉由各 - 散熱體基座上的散熱片散發出去。 第三圖及第四圖爲本發明之第二實施例之散熱器5〇，該散熱器5〇包括 一導熱板1(Γ，二熱管20'及兩散熱體31、34，從圖中可以看出，散熱器50 實際上係實施例一中散熱器40—半部分，散熱體31、34和導熱板1(Γ之結構 瞻功能特徵及安裝位置與散熱器40中對應元件相同，所不同之處為，所述熱 管20只有一放熱部22'及一吸熱部24、該放熱部22/與吸熱部24/間内夾角 大於90°。 第五圖爲本發明之第三實施例之散熱器6〇，該散熱器6〇包括一導熱板 10、V形熱管20及二散熱體33、34、35。與實施例-中散熱器40所不同之 處為，原來位於熱管20内側之兩散熱體被合併成一散熱體％，該散熱體％ 具有二基座350，該基座35〇之受熱面356上設有凹槽352，用以容置熱管放 >熱部22，該基座350之二導熱面354間延伸出錄相互平行之散熱片视。散 熱器其餘元件結構功能特徵及安裝位置均與實施—例中散熱制晴應元 件相同。 綜上所述，本創作符合發明專利要件，爰依法提出專利申請。惟，以 上所述者僅林_之齡實_，軌縣核聽之人士，在爱依本 發明精神所狀較修飾或變化，皆福蓋於町之巾請專聰圍内。 【圖式簡單說明】 第-圖係本發熱器第―實施例之立體分解示意圖。 8 1308685 第二圖係第一圖之立體組合示意圖。 第三圖係第二圖之立體組合示意圖。 第四圖係本發明熱管散熱裝置之立體組合圖。 第五圖係本發明散熱器第三實施例之立體分解示意圖。 【主要元件符號說明】 導熱板 10，1(Τ 頂面 12 凹槽 14 底面 16 熱管 20,20一 放熱部 22,22' 吸熱部 24,24~ 散熱體 31,32,33,34,35 凹槽 312,322,342,352 導熱面 314,324,354 受熱面 316,326,346,356 基座 320,340,350 散熱片 328,348,358 散熱器 40,50,60.1308685 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat sink, and more particularly to a heat pipe heat sink. [Prior Art] In order to effectively dissipate heat generated by electronic components such as a central processing unit (CPU) during operation, the industry usually installs a heat sink on the surface of the heat-generating electronic component to assist in heat dissipation, so that the temperature of the electronic component itself is maintained. Within the normal operating range. For the heat sink, the heat pipe is being used more and more in the industry. The Chinese Patent Application Publication No. φ 2_2_5284-8 discloses a heat sink using a heat pipe including a heat sink and at least a heat radiator. - a body comprising: a heat conducting plate and a heat sink disposed on the heat plate; the column body has at least a surface extending with a plurality of heat sinks, wherein the heat sink has a stronger heat dissipation capability, and the plurality of surfaces of the column are provided There is a heat sink, which is complicated by the zigzag structure of the column structure; the heat absorbing portion of the heat pipe and the heat releasing portion are 9 inches. The angle between the working medium in the heat pipe flowing through the corner of the heat pipe is reduced due to the enthalpy, and the heat transfer speed is decreased; and the other type is scattered and has no structure, as shown in the U.S. Patent No. 2/0118967 Α1, the heat sink of the heat sink A through hole is opened, so that the heat pipe can penetrate therethrough, but the structural process is complicated. [Summary of the Invention] ® has a threat. This is a must-have supply - a heat pipe radiator that is effective. The heat dissipation device of the present invention comprises: a heat conducting plate, two heat dissipating bodies and at least a recording body, the heat dissipating body having a base and a plurality of fins extending therefrom, the heat pipe having a heat absorbing portion connected to the heat conducting plate and the heat absorbing portion - The end bends and extends the heat radiating portion connected to the heat sink, and the heat pipe heat releasing portion is sandwiched between the two heat sink bases. The heat radiating portion and the heat sink portion are (4) larger than the heat sink portion. . When the heat pipe is reddish and sandwiched by the heat absorbing portion and the heat radiating portion, the angle between the heat absorbing portion and the heat radiating portion is equal to 9 〇. At the structure (such as a U-shaped tube), the working medium flow becomes smoother, thereby improving the heat dissipation efficiency of the entire heat sink. At the same time, the heat dissipating body around the heat pipe 6 1308685 + 曰, 达, hot ^ combination 'is convenient to form - the whole, no need to open holes in the heat sink, when the two heat sinks are combined, the heat pipe is sandwiched therebetween, and the manufacturing is easier. " The present invention will be further described below with reference to the embodiments. [Embodiment] The first and first drawings show the heat sink 4 of the first embodiment of the present invention, which is placed on a heat-generating electronic component (not shown) and dissipated therefrom. The heat sink 40 includes a heat conducting plate 1〇, a second v-shaped heat pipe 2〇, and four heat radiating bodies 31, 32, %, %. The heat conducting plate 1 has a top surface 12 and a bottom surface 16 opposite to the top surface 12. The top surface 12 is provided with a recess 14 for contacting the heat generating electronic component. The heat officer 2 includes a heat absorbing portion 两 and two heat releasing portions 22 extending from both ends of the heat absorbing portion. The heat absorbing portion 24 and the heat radiating portion 22 are both linear, and the heat pipe 2 〇 is located on the plane and the heat conducting plate 1〇. The top surface of the 12 vertical 'suck scales 24 and scales 22$ domain Xiao Daguan). So that the heat f 20 is V-shaped. The four heat sinks 31, 32, 33, and 34 have similar structural and functional features, and the heat sink 32 is taken as an example. It includes a flat base 320. The base 320 has a heat receiving surface 326 and an opposite side. The heat receiving surface 326 is provided with a recess 322 for accommodating the heat releasing portion 22 of the heat pipe 20, and the heat conducting surface 324 vertically extends a plurality of heat radiating fins 328 which are parallel to each other for dissipating heat. When the heat sink 40 is assembled, the top surface groove 14 of the heat conducting plate 1 accommodates the heat absorbing portion 24 of the heat pipe 2; each of the heat radiating bodies (31 and 34, 32 and 33) of the four heat radiating bodies are mutually sandwiched by the heat receiving surface thereof. The heat pipe 20 is disposed in the heat releasing portion 22. After the assembly is completed, the heat conducting plate 1 is located below the heat pipe 20, and the two heat radiating bodies 31, 32 are symmetrically located on the angle side of the heat pipe 20, and the other heat radiating bodies 33, 34 are symmetrically located on the outer side of the heat pipe 20. The joint between the above elements can be joined by welding. When the heat sink 40 is applied, the heat conducting plate 10 is in contact with the heat-generating electronic component by the bottom surface 16 thereof, and absorbs heat generated by the 1308685 electronic component to transfer heat to the heat absorbing portion 24 of the heat pipe 20, and the working liquid in the heat absorbing portion 24 absorbs heat to become a vapor state. After flowing to the two heat releasing portions 22 of the heat pipe 20, the working liquid is at the heat radiating portion 22 - the condensation becomes a liquid state to release heat, and most of the heat is transferred to the heat radiating bodies, and is radiated by the heat sinks on the respective heat sink bases. Go out. The third and fourth figures are the heat sink 5 of the second embodiment of the present invention. The heat sink 5 includes a heat conducting plate 1 (Γ, two heat pipes 20' and two heat radiating bodies 31, 34, which can be It can be seen that the heat sink 50 is actually the heat sink 40-half of the first embodiment, the heat sinks 31, 34 and the heat conducting board 1 (the structural features and mounting positions of the heat sink are the same as the corresponding components in the heat sink 40, and are different. The heat pipe 20 has only one heat releasing portion 22' and one heat absorbing portion 24, and the heat radiating portion 22/ and the heat absorbing portion 24/ are at an angle greater than 90°. The fifth figure is the heat dissipation of the third embodiment of the present invention. The heat sink 6 includes a heat conducting plate 10, a V-shaped heat pipe 20 and two heat radiating bodies 33, 34, 35. The difference from the heat sink 40 of the embodiment is that the two are originally located inside the heat pipe 20. The heat sinks are combined into a heat sink body. The heat sink body has two bases 350. The heat receiving surface 356 of the base 35 is provided with a recess 352 for accommodating the heat pipe and the hot portion 22. The heat sink surface 354 of the 350 bis extends between the parallel heat sinks. The functional features and installation positions of the remaining components of the heat sink are In the case of the implementation, the heat-dissipating and smearing components are the same. In summary, the creation meets the requirements of the invention patent, and the patent application is filed according to law. However, the above-mentioned only the forest _ _ _ _ _, the county auditor, In the love of the spirit of the invention, it is more modified or changed. The cover of the house is in the town of Congcong. [Simplified description of the drawing] The first figure is a three-dimensional exploded view of the first embodiment of the heater. 8 1308685 The second figure is a three-dimensional combination diagram of the first figure. The third figure is a three-dimensional combination diagram of the heat pipe of the present invention. The fifth figure is a three-dimensional combination diagram of the heat pipe heat dissipation device of the present invention. Schematic diagram of the three-dimensional decomposition. [Main component symbol description] Thermal plate 10, 1 (Τ Top surface 12 Groove 14 Bottom surface 16 Heat pipe 20, 20 Heat release part 22, 22' Heat absorbing part 24, 24~ Heat sink 31, 32, 33 , 34, 35 grooves 312, 322, 342, 352 heat transfer surfaces 314, 324, 354 heat surface 316, 326, 346, 356 base 320, 340, 350 heat sink 328, 348, 358 heat sink 40, 50, 60