TWI413890B - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes two heat sinks and a heat pipe sandwiched between the two heat sinks. Each of the two heat sinks includes a heat conducting body and a plurality of fins extending from the heat conducting body. The heat pipe is sandwiched between the heat conducting bodies of the two heat sinks and has a same configuration with the heat conducting bodies of the two heat sinks.

Description

Heat sink

The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component.

High-power electronic components such as computer central processing units, north bridge chips, and graphics cards generate a large amount of heat during operation. If the heat cannot be effectively dissipated, it will directly cause a sharp rise in temperature, which seriously affects the normal operation of electronic components. To this end, a heat sink is required to dissipate the electronic components.

Conventional heat sinks generally include a substrate mounted on an electronic component, a plurality of heat sink fins disposed on the substrate, and a plurality of heat pipes connecting the substrate and the heat sink fins. A plurality of grooves are formed on the surface of the substrate, and a plurality of through holes are formed in the heat dissipation fins. Each heat pipe is curved and includes a heat absorbing end and a heat releasing end. The heat absorbing end is received in a corresponding groove of the substrate, and the heat releasing end passes through a passage formed by a corresponding through hole on the heat dissipating fin. Since the contact area between the heat pipe and the heat sink fin is limited, the connection strength between the heat pipe and the heat sink fin is affected, and the heat pipe and the heat sink fin may be in contact with each other for a long time, which may affect the heat dissipation effect of the entire heat sink.

In addition, in the heat dissipating device, a recess is formed in the substrate, and a through hole is formed in the heat dissipating fin, which not only makes the manufacturing process of the heat dissipating device redundant, but also increases the difficulty of manufacturing the heat dissipating device, and also causes great waste of raw materials. , thereby improving the entire dispersion Manufacturing cost of the thermal device.

In view of this, it is necessary to provide a heat sink having stable heat dissipation performance, simple manufacture, and low cost.

A heat dissipating device includes a heat sink and a heat pipe disposed between the two heat sinks. Each heat sink includes a heat conductor and a plurality of heat radiating fins extending from the heat conductor. The heat pipe clamp is disposed on the second heat sink. Between the heat conductors, the heat conductors of the two heat sinks have the same shape as the heat pipes.

Compared with the prior art, in the above heat dissipating device, since the heat conductor of the heat sink has the same shape as the heat pipe, the heat pipe is sandwiched between the heat conductors of the two heat sinks, so that the contact area between the heat sink and the heat pipe is large, which can ensure its The connection strength provides a stable heat dissipation effect. In addition, due to the simple structure of the heat sink, the manufacture of the heat sink and the assembly of the entire heat sink are also convenient, so that the manufacturing cost of the entire heat sink is low.

10‧‧‧Electronic components

20‧‧‧First radiator

22, 32‧‧‧ Thermal Conductor

221‧‧‧heating section

222‧‧‧First heat transfer section

223‧‧‧second heat transfer section

224‧‧‧First heat release section

225‧‧‧Separate heat release section

241‧‧‧First fin set

242‧‧‧second fin set

243‧‧‧ Third fin set

244‧‧‧Fourth fin group

245‧‧‧Fifth fin group

246‧‧‧ sixth fin set

30‧‧‧second radiator

40‧‧‧ Third radiator

50‧‧‧First heat pipe

51‧‧‧Evaporation section

52‧‧‧First intermediate section

53‧‧‧second intermediate section

54‧‧‧First Condensation Section

55‧‧‧Second condensation section

60‧‧‧ second heat pipe

70‧‧‧Substrate

1 is an exploded view of a preferred embodiment of a heat sink of the present invention.

2 is a combination diagram of the heat sink device of FIG. 1.

1 and 2 show a preferred embodiment of the heat sink of the present invention. The heat sink is used to dissipate heat from an electronic component 10 such as a CPU. The heat sink includes a substrate 70 attached to the electronic component 10, first, second, and third heat sinks 20, 30, 40 disposed on the substrate 70, and first and second heat pipes 50, 60. The first heat pipe 50 is sandwiched between the first and second heat sinks 20, 30. The second heat pipe 60 is sandwiched between the second and third heats Between the heaters 30, 40.

In this embodiment, the first and second heat pipes 50 and 60 are flat heat pipes, and a capillary structure and a working liquid are disposed therein. The first and second heat pipes 50, 60 are disposed as flat heat pipes for the purpose of making planar contact between the first and second heat pipes 50, 60 and the first, second, and third heat sinks 20, 30, 40, thereby The contact area between the first and second heat pipes 50, 60 and the first, second, and third heat sinks 20, 30, 40 is increased. The first heat pipe 50 has the same structure and function as the second heat pipe 60. The structure of the first heat pipe 50 will be specifically described below as an example. The first heat pipe 50 is generally G-shaped and includes an evaporation section 51, first and second condensation sections 54, 55 parallel to the evaporation section 51, and a first intermediate section 52 connecting the evaporation section 51 and the first condensation section 54. And connecting the evaporation section 51 and the second intermediate section 53 of one of the second condensation sections 55. The evaporation section 51, the first and second intermediate sections 22, 23, and the first and second condensation sections 54, 55 are coplanar.

The evaporation section 51 is placed horizontally above the substrate 70. The first and second intermediate sections 52, 53 respectively extend vertically upward from both ends of the evaporation section 51. The first and second condensation sections 54, 55 are formed by extending inwardly from the top ends of the first and second intermediate sections 22, 23, respectively. The second intermediate section 23 is longer than the first intermediate section 22 such that the second condensation section 55 is remote from the evaporation section 51 than the first condensation section 54, i.e., the first condensation section 54 is located between the evaporation section 51 and the second condensation section 55.

The first, second, and third heat sinks 20, 30, and 40 are all extruded heat sinks, and are integrally formed of a metal having a high thermal conductivity (such as aluminum or the like). The first heat sink 20 has the same structure as the third heat sink 40. The structural features of the first heat sink 20 will be specifically described below. The first heat sink 20 includes a heat conductor 22 and a plurality of heat sink fins extending from the heat conductor 22.

The heat conductor 22 has the same shape as the first and second heat pipes 50, 60, and is also G-shaped as a whole, but the width of each part of the heat conductor 22 is wider than the width of the first and second heat pipes 50, 60 in the side view direction ( The minimum diameter is large, that is, the heat conductor 22 has the same configuration as the first and second heat pipes 50, 60 in the side view direction, and the thickness of each part of the heat conductor 22 is the largest of the first and second heat pipes 50, 60. The pipe diameter is equivalent. The heat conductor 22 includes a heat absorption section 221, first and second heat release sections 224 and 225 parallel to the heat absorption section 221, a first heat transfer section 222 connecting the heat absorption section 221 and the first heat radiation section 224, and a connection heat absorption section 221 and The second heat transfer section 223 is one of the second heat release sections 225. The heat absorption section 221 of the heat conductor 22, the first and second heat transfer sections 222, 223, and the first and second heat release sections 224, 225 and the evaporation section 51 of the first and second heat pipes 50, 60, respectively, the first The two intermediate sections 52, 53 correspond to the first and second condensation sections 54, 55. The heat absorption section 221, the first and second heat transfer sections 222, 223, and the first and second heat release sections 224, 225 are each substantially rectangular. The side of the heat conductor 22 is a smooth plane for contact with the first heat pipe 50 (or the second heat pipe 60). The bottom surface of the heat absorption section 221 of the heat conductor 22 is in contact with the substrate 70.

The heat dissipation fins extending from the heat conductor 22 have the same width as the heat conductor 22. The heat dissipation fins include a first fin set 241 , a second fin set 242 , a third fin set 243 , a fourth fin set 244 , a fifth fin set 245 , and a sixth fin set 246 . The first fin group 241 is formed by vertically extending from the top surface of the heat absorption portion 221 of the heat conductor 22, and the second fin group 242 is vertically extended downward from the bottom surface of the first heat release portion 224, and The two fin sets 242 extend downward into the first fin set 241. The third fin group 243 is vertically upwardly extended from the top surface of the first heat releasing portion 224, and the fourth fin group 244 is vertically extended from the top surface of the second heat releasing portion 225. The first, second, third, and fourth fin groups 241, 242, 243, and 244 are parallel to each other. Fifth and sixth fin sets 245 and 246 are horizontally extended outward from the outer surfaces of the first and second heat transfer sections 222 and 223, that is, respectively toward the front and rear ends of the heat conductor 20. The fifth fin set 245 extends in the same direction as the second heat release section 225, and the sixth fin set 246 extends in the same direction as the first heat release section 224. The fifth and sixth fin sets 245, 246 are parallel to each other and perpendicular to the first, second, third, and fourth fin sets 241, 242, 243, and 244.

The second heat sink 30 is similar in structure to the first heat sink 20, and includes a G-shaped heat conductor 32 and a plurality of heat sink fins extending from the heat conductor 32. The only difference is that the heat conductor 32 of the second heat sink 30 and its heat dissipation fins have a smaller width than the heat conductor 22 of the first heat sink 20 and its heat dissipation fins. Therefore, the structure of the second heat sink 30 will not be described in detail.

Referring to FIG. 2 again, after the heat dissipating device is assembled, the first heat pipe 50 is sandwiched between the heat conductors 22 and 32 of the first and second heat sinks 20 and 30, and the evaporation section 51 and the first and second heat sinks are disposed. The heat absorbing sections 221 of the heat conductors 22 and 32 of 20 and 30 are attached, and the first and second intermediate sections 52 and 53 are bonded to the first and second heat transfer sections 222 and 223 of the heat conductors 22 and 32, respectively. 1. The second condensation section 54, 55 is bonded to the first and second heat release sections 224, 224 of the heat conductors 22, 32. The second heat pipe 60 is interposed between the heat conductors 32, 22 of the second and third heat sinks 30, 40. The heat absorption sections 221 of the heat conductors 22, 32 of the first, second, and third heat sinks 20, 30, 40 are attached to the substrate 70 together with the evaporation sections 51 of the first and second heat pipes 50, 60 to the electronic components. The heat transferred to the substrate 70 is dissipated.

The heat sink has a large contact area with the heat pipe and has a stable heat dissipation effect. In addition, the heat sink is simple to manufacture, and the assembly of the entire heat sink is convenient, so that the manufacturing cost of the entire heat sink is low.

It can be understood that the width of the second heat sink 30 in the heat sink can also be the same as that of the first heat sink 20. At the same time, the number of heat sinks and heat pipes can also be changed according to the number of electronic components or the need for heat dissipation. For example, when there are two or more electronic components, more heat pipes and heat sinks can be disposed to be assembled and assembled at intervals.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧Electronic components

20‧‧‧First radiator

22, 32‧‧‧ Thermal Conductor

221‧‧‧heating section

222‧‧‧First heat transfer section

223‧‧‧second heat transfer section

224‧‧‧First heat release section

225‧‧‧Separate heat release section

241‧‧‧First fin set

242‧‧‧second fin set

243‧‧‧ Third fin set

244‧‧‧Fourth fin group

245‧‧‧Fifth fin group

246‧‧‧ sixth fin set

30‧‧‧second radiator

40‧‧‧ Third radiator

50‧‧‧First heat pipe

51‧‧‧Evaporation section

52‧‧‧First intermediate section

53‧‧‧second intermediate section

54‧‧‧First Condensation Section

55‧‧‧Second condensation section

60‧‧‧ second heat pipe

70‧‧‧Substrate

Claims (8)

A heat dissipating device comprising a heat sink and a heat pipe disposed between the two heat sinks, wherein the heat sink comprises a heat conductor and a plurality of heat radiating fins extending from the heat conductor, the heat pipe clip being placed The heat conductor of the two heat sinks has the same shape as the heat pipe, and the heat pipe includes an evaporation section and a first condensation section and a second condensation section which are mutually parallel and extend from both ends of the evaporation section. The heat conductor of each heat sink includes a heat absorption section that is in contact with the evaporation section of the heat pipe, and a first heat release section and a second heat release section that are parallel to each other and extend from both ends of the heat absorption section, the first heat release section, the first heat release section The two heat-dissipating segments are respectively respectively affixed to the first condensation section and the second condensation section of the heat pipe, and the heat-dissipating fins comprise a first fin group extending upward from a top surface of the heat conductor, and a bottom surface of the first heat-dissipating section a second fin set extending downwardly, a third fin set extending upward from a top surface of the first heat release section, and a fourth fin set extending upward from a top surface of the second heat release section, First fin set, second fin set, third fin set The fourth fin set parallel to each other. The heat dissipation device of claim 1, wherein the heat dissipation fins are extended from the heat absorption section of the heat conductor and the first heat release section and the second heat release section. The heat sink of claim 1, wherein the second fin set extends downward into the first fin set. The heat dissipating device of claim 1, wherein the heat conductor of each of the heat sinks has a G shape, and further includes a first heat transfer section connecting the heat absorption section and the first heat release section, and a connection heat absorption section and a The second heat transfer section of one of the two heat release sections, the length of the second heat release section being greater than the length of the first heat release section. The heat dissipating device of claim 4, wherein the heat pipe is G-shaped, further comprising a first intermediate section connecting the evaporation section and the first condensation section, and a second connecting the evaporation section and the second condensation section In the intermediate section, the first intermediate section is in contact with the first heat transfer section of the heat conductor, and the second intermediate section is in contact with the second heat transfer section of the heat conductor. The heat dissipation device of claim 4, wherein the heat dissipation fins further comprise a fifth fin group and a sixth fin extending from the first heat transfer section and the second heat transfer section of the heat conductor. The fifth fin set, the sixth fin set and the first fin set are perpendicular to each other. The heat dissipating device of claim 1, further comprising a substrate disposed under the two heat sinks and the heat pipe, wherein the substrate is in contact with the heat absorption portion of the heat conductor of the two heat sinks and the evaporation portion of the heat pipe. The heat dissipating device according to any one of claims 1 to 7, further comprising another heat sink and another heat pipe, the other heat sink having the same structure as the two heat sinks, the other heat pipe and The heat pipe has the same structure, and the other heat pipe is sandwiched between any one of the two heat sinks and the other heat sink.