TWM530014U - Electronic device and heatsink thereof - Google Patents

Description

Electronic device and its radiator

This creation relates to a heat sink, and more particularly to a flat-plate radiation radiator and an electronic device including the same.

The radiation radiator used in the heat dissipation of electronic devices is generally coated on a surface of a substrate (made mostly of metal) or adhered to a heat radiation material; the working mode is to contact the substrate with a heat source in the electronic device. The heat source absorbs the heat energy to the substrate, and the heat energy is radiated to the environment by the radiant heat transfer on the substrate.

The largest source of heat in an electronic device is typically a processor chip that is flat and attached to a circuit board. In addition to the processor chip, the circuit board is provided with a large number of other electronic components. The height of the other electronic components on the circuit board is mostly higher than that of the processor chip, so the substrate will be patched when the processor is attached to the processor chip. Other electronic components. The existing solution is to bend the metal substrate in a sheet metal manner to evade the electronic component. The disadvantage is that the structure of the substrate is complicated and it is difficult to apply the whole surface adhesion method. The heat radiation material is disposed on the substrate, and only the processing method with high processing cost can be selected. . Sheet metal processing must be processed in a single piece, so the cost is high and low efficiency. The substrate can only be made of bendable metal, not for non-bendable materials (such as ceramics).

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

This creation provides a flat-plate radiation radiator.

The present invention provides a heat sink comprising a thermally conductive plate and a heat radiating layer. The heat radiating layer covers a surface of the heat conducting plate. At least one notch penetrating the heat conducting plate is formed on the heat conducting plate.

Preferably, the indentation may be a perforation through the thermally conductive plate. A gap can also be formed at the edge of the thermally conductive plate. The heat radiating layer is attached to the heat conducting plate. The heat radiation layer contains a plurality of heat radiation particles. The heat radiation particles are one of graphene particles, graphene fragments, nanocarbon spheres or boron nitride. The thermally conductive plate can be made of metal. The thermally conductive plate can also be made of ceramic or flake graphene.

The present invention further provides an electronic device comprising a circuit board, a heat conducting plate and a heat radiation layer. A heating element and a plurality of electronic components are disposed on the circuit board. The heat transfer plate is stacked on the circuit board and contacts the heat generating component. The heat radiating layer covers a surface of the heat conducting plate. The heat conducting plate is formed with at least one notch extending through the heat conducting plate, the notch extending through the heat radiating layer, and at least one electronic component is received in the notch.

Preferably, the indentation may be a perforation through the thermally conductive plate. The notch may also be a notch formed at the edge of the heat conducting plate. The heat radiating layer is attached to the heat conducting plate. The heat radiation layer contains a plurality of heat radiation particles. The heat radiation particles are one of graphene particles, graphene fragments, nanocarbon spheres or boron nitride. The height at which an electronic component protrudes on the circuit board is greater than the height at which the heat generating component protrudes on the circuit board. The thermally conductive plate can be made of metal. The thermally conductive plate can also be made of ceramic or flake graphene.

Referring to FIG. 1 to FIG. 3, a preferred embodiment of the present invention provides an electronic device including a circuit board 10 and a heat sink 20.

The circuit board 10 is provided with at least one heat generating component 11 and a plurality of electronic components 12/13. The present invention does not limit the form of the heat generating component 11 and the electronic component 12/13. The electronic component 12/13 which generates heat during operation can also be regarded as the same. Heating element 11. Moreover, the height at which the at least one electronic component 12/13 protrudes on the circuit board 10 is greater than the height at which the heat generating component 11 protrudes on the circuit board 10. In this embodiment, the heating element 11 is preferably a flat body stacked on the circuit board 10, such as a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The present invention does not limit the form of the electronic component 12/13, as shown in the various figures, wherein one electronic component 12 may be a capacitive component (cylinder), and the other electronic component 13 may also be a transformer component (rectangular block). .

The heat sink 20 includes a heat conducting plate 100 and a heat radiating layer 200. In the present embodiment, the heat conducting plate 100 is preferably a metal plate. The plate referred to herein does not have any bent or bent structure. The heat conducting plate 100 may also be other materials having good heat conduction characteristics (for example, The flat plate made of ceramic or flake graphene is not limited to the material. The heat conducting plate 100 is stacked on the circuit board 10 and contacts the heat generating component 11. In the embodiment, the circuit board 10, the heat generating component 11 and the heat conducting flat plate 100 are sequentially stacked, and the heat generating component 11 is clamped on the circuit board 10 and thermally conductive. Between the tablets 100. The heat radiation layer 200 may be attached or adhered to at least one surface of the heat conductive plate 100, and is preferably a surface opposite to the circuit board 10. The edge of the heat radiating layer 200 extends to the edge of the heat conducting flat plate 100, thus completely covering the aforementioned surface on the heat conducting flat plate 100. The heat radiation layer 200 is embedded with a plurality of heat radiation particles, and the heat radiation particles may be graphene particles, graphene fragments, C60 nanocarbon spheres or substances having good heat radiation characteristics such as boron nitride.

In the embodiment, at least one notch 101/102 is formed on the heat conducting plate 100. The plurality of notches 101/102 are correspondingly disposed in the corresponding electronic components 12/13, and each of the notches 101/102 extends respectively. Thermal radiation layer 200. The present invention does not limit the form of the notch 101/102. As shown in each figure, one of the notches 101 may be a through hole penetrating the heat conducting plate 100, and it is a circular hole corresponding to the capacitor electronic component 12; the other notch 102 may also be formed. A slot in the edge of the heat conducting plate 100, and which is a rectangular slot corresponding to the transformer electronic component 13. Each of the electronic components 12/13 is housed within a corresponding notch 101/102.

The heat conducting plate 100 can transfer the heat energy generated by the heat generating component 11 to the heat radiating layer 200 by heat conduction, and then radiate from the heat radiating layer 200 to the environment by heat radiation.

Referring to FIG. 4, in another embodiment of the present invention, the heat conducting plate 100 of the heat sink 20 is a metal plate, and the heat radiating layer 200 may be attached or adhered to at least one surface of the heat conducting plate 100. The other surface opposite to the heat conducting plate 100 is attached with a thermal diffusion layer 300, which is preferably made of flake graphene. The flake graphene has good planar heat conduction characteristics, thus contributing to The heat energy absorbed by the self-heating element 11 is diffused to the entire heat conduction plate 100. Since the radiant heat transfer efficiency is positively correlated with the radiation area, the diffused heat energy can expand the radiation area of the heat radiation layer 200, thereby improving heat dissipation efficiency. The heat diffusion layer 300 may directly attach the heat generating component 11 or may selectively open the port 301 for the heat generating component 11 to pass through to attach the heat conductive flat plate 100.

In the electronic device of the present invention, the heat sink 20 defines a notch 101/102 in the heat conducting plate 100 for accommodating the electronic components 12/13 protruding from the circuit board 10, thereby facilitating the configuration of the heat sink 20. Compared with the prior art, by bending the heat-conducting flat plate 100 to evade the electronic components 12/13, the flat plate is relatively easy to process the opening and the processing speed is fast, and the film can be further applied to the heat-conducting flat plate 100 made of a material that cannot be bent. .

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patents of the present invention. Other equivalent variations of the patent spirit using the present invention are all within the scope of the patent.

10‧‧‧ boards

11‧‧‧heating components

12/13‧‧‧Electronic components

20‧‧‧ radiator

100‧‧‧thermal plate

101/102‧‧ ‧ gap

200‧‧‧thermal radiation layer

300‧‧‧ Thermal diffusion layer

301‧‧‧ openings

1 is a perspective exploded view of an electronic device in accordance with a preferred embodiment of the present invention.

2 is a perspective view of the electronic device of the preferred embodiment of the present invention.

3 is a cross-sectional view of the electronic device of the preferred embodiment of the present invention.

4 is a schematic diagram of another embodiment of the electronic device of the present invention.

10‧‧‧ boards

11‧‧‧heating components

12/13‧‧‧Electronic components

20‧‧‧ radiator

100‧‧‧thermal plate

101/102‧‧ ‧ gap

200‧‧‧thermal radiation layer

Claims (17)

A heat sink comprising: a heat conducting plate; and a heat radiating layer covering a surface of the heat conducting plate; wherein the heat conducting plate is formed with at least one notch extending through the heat conducting plate. The heat sink of claim 1, wherein the notch is a perforation through the thermally conductive plate. The heat sink of claim 1, wherein the notch is formed at an edge of the thermally conductive plate. The heat sink of claim 1, wherein the heat radiation layer is attached to the heat conducting plate. The heat sink of claim 1, wherein the heat radiation layer contains a plurality of heat radiation particles. The heat sink of claim 5, wherein the heat radiation particles are one of graphene particles, graphene fragments, nanocarbon spheres or boron nitride. The heat sink of claim 1, wherein the heat conducting plate is made of metal. The heat sink of claim 1, wherein the heat conducting plate is made of ceramic or flake graphene. An electronic device comprising: a circuit board having a heat generating component and a plurality of electronic components; a heat conducting plate stacked on the circuit board and contacting the heat generating component; and a heat radiating layer covering the a surface of the heat conducting plate; wherein the heat conducting plate is formed with at least one notch extending through the heat conducting plate, and at least one of the electronic components is received in the notch. The electronic device of claim 9, wherein the notch is a perforation through the thermally conductive plate. The electronic device of claim 9, wherein the notch is a notch formed at an edge of the thermally conductive plate. The electronic device of claim 9, wherein the heat radiation layer is attached to the heat conducting plate. The electronic device of claim 9, wherein the heat radiation layer contains a plurality of heat radiation particles. The electronic device of claim 13, wherein the heat radiation particles are one of graphene particles, graphene fragments, nanocarbon spheres or boron nitride. The electronic device of claim 9, wherein at least one of the electronic components protrudes from the circuit board by a height greater than a height of the heat generating component protruding on the circuit board. The electronic device of claim 9, wherein the thermally conductive plate is made of metal. The electronic device of claim 9, wherein the thermally conductive plate is made of ceramic or flake graphene.