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TW200732894A - Heat sink - Google Patents

Heat sink

Info

Publication number
TW200732894A
TW200732894A TW095105475A TW95105475A TW200732894A TW 200732894 A TW200732894 A TW 200732894A TW 095105475 A TW095105475 A TW 095105475A TW 95105475 A TW95105475 A TW 95105475A TW 200732894 A TW200732894 A TW 200732894A
Authority
TW
Taiwan
Prior art keywords
heat
heat sink
dissipating members
base
evaporating
Prior art date
Application number
TW095105475A
Other languages
Chinese (zh)
Other versions
TWI308685B (en
Inventor
Gen-Ping Deng
Yi-Qiang Wu
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95105475A priority Critical patent/TWI308685B/en
Publication of TW200732894A publication Critical patent/TW200732894A/en
Application granted granted Critical
Publication of TWI308685B publication Critical patent/TWI308685B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink comprises a heat spreader, two heat dissipating members, and at least one heat pipe. Each of the dissipating members comprises a base and a plurality of fins extending from the base. The heat pipe comprises an evaporating portion thermally connected with the heat spreader and a condensing portion extending from an end of the evaporating portion. The condensing portion of the heat pipe is sandwiched between the two heat dissipating members. An angle between the evaporating portion and the condensing portion is above 90 degree, whereby the heat sink has an improved heat dissipating effect. Because of the fins without holes, a manufacture process of the heat sink is simple.
TW95105475A 2006-02-17 2006-02-17 Heat sink TWI308685B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95105475A TWI308685B (en) 2006-02-17 2006-02-17 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95105475A TWI308685B (en) 2006-02-17 2006-02-17 Heat sink

Publications (2)

Publication Number Publication Date
TW200732894A true TW200732894A (en) 2007-09-01
TWI308685B TWI308685B (en) 2009-04-11

Family

ID=45071880

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95105475A TWI308685B (en) 2006-02-17 2006-02-17 Heat sink

Country Status (1)

Country Link
TW (1) TWI308685B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398211B (en) * 2007-12-31 2013-06-01 Foxconn Tech Co Ltd Heat dissipation device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI484895B (en) 2010-05-14 2015-05-11 奇鋐科技股份有限公司 Heat dissipation device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398211B (en) * 2007-12-31 2013-06-01 Foxconn Tech Co Ltd Heat dissipation device

Also Published As

Publication number Publication date
TWI308685B (en) 2009-04-11

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